WO1997026109A1 - Method and apparatus for surface treating a plastic strip supporting electronic card modules - Google Patents
Method and apparatus for surface treating a plastic strip supporting electronic card modules Download PDFInfo
- Publication number
- WO1997026109A1 WO1997026109A1 PCT/FR1996/000062 FR9600062W WO9726109A1 WO 1997026109 A1 WO1997026109 A1 WO 1997026109A1 FR 9600062 W FR9600062 W FR 9600062W WO 9726109 A1 WO9726109 A1 WO 9726109A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser beam
- support part
- strip
- order
- speed
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000004033 plastic Substances 0.000 title claims abstract description 15
- 230000001681 protective effect Effects 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 235000019592 roughness Nutrition 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
Definitions
- the present invention relates to a method and an installation for surface treatment of a strip of plastic material, one of the large faces of which has a support portion of predetermined width on which modules for electronic cards are fixed, these modules comprising a microcircuit coated with a protective resin projecting from the support part.
- the modules of the electronic cards are produced on strips of plastic material, then separated from these strips in order to be fixed on the bodies of the electronic cards by means of an adhesive or an adhesive.
- the present invention proposes to provide a solution to this problem and, to do this, it relates to a method for surface treatment of a strip of plastic material, one of the large faces of which has a support portion of predetermined width on which modules for electronic cards are fixed, this process being characterized in that it consists in: - irradiating the support part with a suitable laser beam to form a rectilinear spot extending over the entire width of said support part;
- the method according to the invention ensures complete elimination of all the foreign bodies present on the support part of the strip and consequently allows the production of a solid fixing by bonding of the modules to the card bodies.
- the laser beam used is preferably a C0 2 pulsed TEA laser beam whose pulses have a duration of the order of 10 ⁇ s and which provides a power of the order of 150 to 300 mJ per pulse.
- the frequency of the pulses of the laser beam must be of the order of 10 Hz when the speed of movement of the strip relative to the beam is of the order of 3 cm / s and that the rectilinear spot has a width of the order of 3 mm.
- the present invention also relates to an installation for implementing the method described above, this installation being characterized in that it comprises: - a source for emitting a laser beam;
- an optical system for directing the laser beam onto the support part and shaping it so that it produces a rectilinear spot extending over the entire width of said support part;
- the supporting surface 2 has a footed width which is undermined and extends longitudinally between two marginal parts 4a, 4b each provided with equidistant perforations 5
- modules 3 they have a conventional structure and do not need to be described here. It will simply be indicated that they comprise a microcircuit 6 coated with a protective resin 7 projecting from the support part 2
- a studded wheel 8 intended to drive the strip 1 in the direction F of its length is engaged with one of the perforations 5 of the marginal part 4a, 4
- a second studded wheel (not shown) integral in rotation with the previous one and also intended to drive the strip 1 in the direction F, is in turn engaged with 1 one of the perforations 5 of the marginal part 4b
- the treatment installation according to the invention comprises a laser source 9 designed to emit a pulsed C0 2 laser beam TEA 10 whose pulses have a duration of the order of 10 ⁇ s, an optical system 11 intended to direct the laser beam 10 on ia part suppoit 2 while conforming it so that it drains on the strip 1 a rectilinear spot 12 extending over the entire width of the support part, a motor 13 intended to drive the studded wheels 8 in rotation so that those -this move the strip 1 at a constant speed in the F without and that the rectilinear spot 12 scans the support part 2 longitudinally, means 14 for measuring the speed of movement of the strip 1, and control means 15 designed to adjust the laser source 9 as a function of the speed measured by the means 14, so that the laser beam 10 continuously removes a plastic and protective resin surface film on the support part 2.
- the optical system 11 comprises a mirror 16 and a thick lens 17 of cylindrical shape, the laser beam 10 emitted by the source 9 being reflected by the mirror 16 towards the lens 17 and leaving the latter by converging towards the part support 2 to form on it the straight spot 12.
- the measuring means 14 comprise a toothed wheel engaged with one of the perforations 5 of the marginal part 4a of the strip. They are connected by an electric cable 18 to the control means 15.
- the latter which are of conventional design and which need not be described here, are in turn connected to the source 9 by an electric cable 19.
- control means 15 should allow the emission of a laser beam whose pulses have a frequency of the order of 10 Hz and which provides a power of the order of 150 to 300 mJ per pulse when the speed of the strip, measured by the means 14, is of the order of 3 cm / s, and the rectilinear spot 12 has a width of 3 mm .
- the laser beam tends to form on the support part 2 slight roughness which allows better adhesion of the glue or the adhesive used to fix the modules on the card bodies. These roughnesses could possibly make it possible to fix the modules without glue or adhesive. It would indeed suffice to exert a slight pressure on the modules to cause the protective resin to flow and make a resistant connection between said modules and the bodies of the cards.
- 1 forms an angle of 1 to 2 degrees with the perpendicular to the direction of propagation of the laser beam at the exit of the thick lens 17.
- the method and the installation in accordance with the invention are particularly suitable for treating polyimide strips on the surface, whereas this material can currently only be treated by aggressive, polluting or fugitive processes, such as sandblasting, flaming or the corona effect.
Abstract
A method and an apparatus for surface treating a plastic strip (1) of which one side includes a carrier portion (2) with a predetermined width to which electronic card modules (3) are attached, which modules comprise a microcircuit (6) coated with a protective resin (7) projecting from the carrier portion (2). The method and apparatus are suitable for exposing the carrier portion (2) to a laser beam (10) that forms an elongate spot (12) extending fully across the width of the carrier portion; moving the strip (1) relative to the laser beam (10) so that the elongate spot (12) scans the carrier portion (2) lengthwise; measuring the moving speed of the strip relative to the laser beam; and adjusting the power of the laser beam according to the measured speed so that said laser beam continuously removes a surface film of the plastic and the protective resin (7) on the carrier portion (2).
Description
Procédé et installation pour traiter en surface une bande de matière plastique portant des modules pour cartes électroniques Method and installation for surface treatment of a strip of plastic material carrying modules for electronic cards
La présente invention concerne un procédé et une installation pour traiter en surface une bande de matière plastique dont l'une des grandes faces possède une partie support de largeur prédéterminée sur laquelle sont fixés des modules pour cartes électroniques, ces modules comportant un microcircuit enrobé d'une résine de protection faisant saillie sur la partie support.The present invention relates to a method and an installation for surface treatment of a strip of plastic material, one of the large faces of which has a support portion of predetermined width on which modules for electronic cards are fixed, these modules comprising a microcircuit coated with a protective resin projecting from the support part.
Les modules des cartes électroniques sont réalisés sur des bandes de matière plastique, puis séparés de ces bandes en vue d'être fixes sur les corps des cartes électroniques par l'intermédiaire d'une colle ou d'un adhésif.The modules of the electronic cards are produced on strips of plastic material, then separated from these strips in order to be fixed on the bodies of the electronic cards by means of an adhesive or an adhesive.
Comme les performances de la colle ou de l'adhésif dépendent de l'état de propreté de la surface de contact des modules avec les corps des cartes, les fabricants sont amenés à effectuer des traitements de surface sur les bandes portant ces modules afin de les débarrasser de tous produits et corps étrangers. A l'heure actuelle, les traitements de surface sont réalisés soit mécaniquement, par exemple par brossage ou sablage, soit chimiquement, par exemple par lavage ou traitement par ultra-sons. Ces traitements sont toutefois difficiles à exécuter car de très grandes précautions doivent être prises pour éviter qu'ils agressent les microcircuits et les liaisons électriques associées. La présente invention se propose d'apporter une solution à ce problème et, pour ce faire, elle a pour objet un procédé pour traiter en surface une bande de matière plastique dont l'une des grandes faces possède une partie support de largeur prédéterminée sur laquelle sont fixes des modules pour cartes électroniques, ce procédé étant caractérisé en ce qu'il consiste : - à irradier la partie support avec un faisceau laser adapte pour former un spot rectiligne s'étendant sur toute la largeur de ladite partie support ;As the performance of the glue or the adhesive depends on the state of cleanliness of the contact surface of the modules with the card bodies, the manufacturers are required to perform surface treatments on the strips carrying these modules in order to get rid of all products and foreign bodies. At the present time, surface treatments are carried out either mechanically, for example by brushing or sandblasting, or chemically, for example by washing or treatment by ultrasound. These treatments are however difficult to carry out because very great precautions must be taken to prevent them from attacking the microcircuits and the associated electrical connections. The present invention proposes to provide a solution to this problem and, to do this, it relates to a method for surface treatment of a strip of plastic material, one of the large faces of which has a support portion of predetermined width on which modules for electronic cards are fixed, this process being characterized in that it consists in: - irradiating the support part with a suitable laser beam to form a rectilinear spot extending over the entire width of said support part;
- à déplacer la bande par rapport au faisceau laser pour permettre au spot rectiligne de balayer longitudinalemcnt la partie support ;- To move the strip relative to the laser beam to allow the rectilinear spot to scan longitudinally the support part;
- à mesurer la vitesse de déplacement de la bande par rapport au faisceau laser ; et
- à régler l'émission du faisceau laser en fonction de la vitesse mesurée, afin que ledit faisceau laser enlève en continu une pellicule superficielle de matière plastique et de résine de protection sur la partie support.- measuring the speed of movement of the strip relative to the laser beam; and - To adjust the emission of the laser beam as a function of the speed measured, so that said laser beam continuously removes a surface film of plastic and protective resin on the support part.
Le procédé selon l'invention assure une élimination complète de tous les corps étrangers présents sur la partie support de la bande et permet par conséquent la réalisation d'une fixation solide par collage des modules sur les corps des cartes.The method according to the invention ensures complete elimination of all the foreign bodies present on the support part of the strip and consequently allows the production of a solid fixing by bonding of the modules to the card bodies.
Il crée en outre sur la surface de la résine de protection des modules de fines rugosités qui améliorent le pouvoir d'accrochage de la colle ou de l'adhésif utilisé.It also creates on the surface of the protective resin modules of fine roughness which improve the bonding power of the glue or the adhesive used.
Il a par ailleurs l'avantage de ne pas être agressif vis-à-vis des microcircuits et des liaisons électriques associées.It also has the advantage of not being aggressive vis-à-vis the microcircuits and associated electrical connections.
Le faisceau laser utilise est de préférence un faisceau laser C02 puisé TEA dont les impulsions ont une durée de l'ordre de 10 μs et qui fournit une puissance de l'ordre de 150 à 300 mJ par impulsion.The laser beam used is preferably a C0 2 pulsed TEA laser beam whose pulses have a duration of the order of 10 μs and which provides a power of the order of 150 to 300 mJ per pulse.
Les essais réalisés pour mettre au point le procédé selon l'invention ont montré que la fréquence des impulsions du faisceau laser doit être de l'ordre de 10 Hz lorsque la vitesse de déplacement de la bande par rapport au faisceau est de l'ordre de 3 cm/s et que le spot rectiligne a une largeur de l'ordre de 3 mm.The tests carried out to perfect the method according to the invention have shown that the frequency of the pulses of the laser beam must be of the order of 10 Hz when the speed of movement of the strip relative to the beam is of the order of 3 cm / s and that the rectilinear spot has a width of the order of 3 mm.
La présente invention concerne également une installation pour mettre en oeuvre le procédé décrit ci-dessus, cette installation étant caractérisée en ce qu'elle comprend : - une source pour émettre un faisceau laser ;The present invention also relates to an installation for implementing the method described above, this installation being characterized in that it comprises: - a source for emitting a laser beam;
- un système optique pour diriger le faisceau laser sur la partie support et le conformer pour qu'il produise un spot rectiligne s'étendant sur toute la largeur de ladite partie support ;an optical system for directing the laser beam onto the support part and shaping it so that it produces a rectilinear spot extending over the entire width of said support part;
- des moyens pour déplacer la bande par rapport au faisceau laser afin que le spot rectiligne balaie longitudinalcmcnt la partie support ;- Means for moving the strip relative to the laser beam so that the rectilinear spot sweeps longitudinally cmcnt the support part;
- des moyens pour mesurer la vitesse de déplacement de la bande par rapport au faisceau laser ; et- Means for measuring the speed of movement of the strip relative to the laser beam; and
- des moyens pour commander la source laser en fonction de la vitesse mesurée, afin que le faisceau laser enlève en continu une pellicule superficielle de matière plastique et de résine de protection sur la partie support.
D'autres caractéristiques et avantages de la présente invention ressortiront de la description donnée ci-aprcs, à titre d'exemple nullement limitatif, en référence à la figure annexée qui représente de façon schématique une installation de traitement conforme à l'invention Cette installation a été mise au point pour effectuer un traitement de surface sur une bande 1 dont la face supérieure possède une partie support 2 en matière plastique, sur laquelle sont fixés des modules 3 destinés à être implantés sur des cartes électroniques II va de soi cependant que l'on ne sortirait pas du cadre de la présente invention si on utilisait ladite installation pour tiaiter en surface des bandes destinées à d'autres domaines- Means for controlling the laser source as a function of the measured speed, so that the laser beam continuously removes a surface film of plastic and protective resin on the support part. Other characteristics and advantages of the present invention will emerge from the description given below, by way of nonlimiting example, with reference to the appended figure which schematically represents a treatment installation in accordance with the invention. has been developed to perform a surface treatment on a strip 1, the upper face of which has a support part 2 made of plastic material, on which modules 3 intended to be installed on electronic cards are fixed. It goes without saying, however, that the it would not go beyond the scope of the present invention if said installation were used to tiait on the surface strips intended for other fields
La paitie support 2 a une largeur piedctci minee et s'étend longitudinalement entre deux parties marginales 4a,4b pourvues chacune de perforations 5 équidistantesThe supporting surface 2 has a footed width which is undermined and extends longitudinally between two marginal parts 4a, 4b each provided with equidistant perforations 5
Quant aux modules 3, ils ont une structure classique et ne nécessitent pas d'être décrits ici On indiquera simplement qu'ils comportent un microcircuit 6 enrobé d'une résine de protection 7 faisant saillie sur la partie support 2As for the modules 3, they have a conventional structure and do not need to be described here. It will simply be indicated that they comprise a microcircuit 6 coated with a protective resin 7 projecting from the support part 2
Une roue à picots 8 destinée a entraîner la bande 1 dans le sens F de sa longueur est en prise avec l'une des perforations 5 de la partie marginale 4a, 4 Une seconde roue à picots (non représentée) solidaire en rotation de la précédente et destinée à entraîner elle aussi la bande 1 dans le sens F, est quant à elle en prise avec 1 une des perforations 5 de la partie marginale 4bA studded wheel 8 intended to drive the strip 1 in the direction F of its length is engaged with one of the perforations 5 of the marginal part 4a, 4 A second studded wheel (not shown) integral in rotation with the previous one and also intended to drive the strip 1 in the direction F, is in turn engaged with 1 one of the perforations 5 of the marginal part 4b
L'installation de traitement selon l'invention comprend une source laser 9 conçue pour émettre un faisceau laser C02 puisé TEA 10 dont les impulsions ont une durée de l'ordre de 10 μs, un système optique 11 destiné a diriger le faisceau laser 10 sur ia partie suppoit 2 tout en le conformant pour qu'il pioduise sur la bande 1 un spot rectiligne 12 s'étendant sur toute la largeur de la partie support, un moteur 13 destiné à entraîner les roues à picots 8 en rotation afin que celles-ci déplacent la bande 1 à une vitesse constante dans le sans F et que le spot rectiligne 12 balaie la partie support 2 longitudmalement, des moyens 14 pour mesurer la vitesse de déplacement de la bande 1, et des moyens de commande 15 conçus pour régler la source laser 9 en fonction de la vitesse mesurée par les moyens 14, afin que le faisceau laser 10 enlève en continu une
pellicule superficielle de matière plastique et de résine de protection sur la partie support 2.The treatment installation according to the invention comprises a laser source 9 designed to emit a pulsed C0 2 laser beam TEA 10 whose pulses have a duration of the order of 10 μs, an optical system 11 intended to direct the laser beam 10 on ia part suppoit 2 while conforming it so that it drains on the strip 1 a rectilinear spot 12 extending over the entire width of the support part, a motor 13 intended to drive the studded wheels 8 in rotation so that those -this move the strip 1 at a constant speed in the F without and that the rectilinear spot 12 scans the support part 2 longitudinally, means 14 for measuring the speed of movement of the strip 1, and control means 15 designed to adjust the laser source 9 as a function of the speed measured by the means 14, so that the laser beam 10 continuously removes a plastic and protective resin surface film on the support part 2.
Dans cette installation, le système optique 11 comprend un miroir 16 et une lentille épaisse 17 de forme cylindrique, le faisceau laser 10 émis par la source 9 étant réfléchi par le miroir 16 vers la lentille 17 et sortant de cette dernière en convergeant vers la partie support 2 pour former sur elle le spot rectiligne 12.In this installation, the optical system 11 comprises a mirror 16 and a thick lens 17 of cylindrical shape, the laser beam 10 emitted by the source 9 being reflected by the mirror 16 towards the lens 17 and leaving the latter by converging towards the part support 2 to form on it the straight spot 12.
D'une manière connue en soi, les moyens de mesure 14 comprennent une roue dentée en prise avec l'une des perforations 5 de la partie marginale 4a de la bande. Ils sont reliés par un câble électrique 18 aux moyens de commande 15. Ces derniers, qui sont de conception classique et qui n'ont pas à être décrits ici, sont quant à eux reliés à la source 9 par un câble électrique 19.In a manner known per se, the measuring means 14 comprise a toothed wheel engaged with one of the perforations 5 of the marginal part 4a of the strip. They are connected by an electric cable 18 to the control means 15. The latter, which are of conventional design and which need not be described here, are in turn connected to the source 9 by an electric cable 19.
Les essais réalisés pour la mise au point de l'installation conforme à l'invention ont montré que les moyens de commande 15 devaient permettre l'émission d'un faisceau laser dont les impulsions ont une fréquence de l'ordre de 10 Hz et qui fournit une puissance de l'ordre de 150 à 300 mJ par impulsion lorsque la vitesse de la bande, mesurée par les moyens 14, est de l'ordre de 3 cm/s, et que le spot rectiligne 12 a une largeur de 3 mm.The tests carried out for the development of the installation in accordance with the invention have shown that the control means 15 should allow the emission of a laser beam whose pulses have a frequency of the order of 10 Hz and which provides a power of the order of 150 to 300 mJ per pulse when the speed of the strip, measured by the means 14, is of the order of 3 cm / s, and the rectilinear spot 12 has a width of 3 mm .
Le faisceau laser a tendance à former sur la partie support 2 de légères rugosités qui permettent un meilleur accrochage de la colle ou de l'adhésif utilisé pour fixer les modules sur les corps des cartes. Ces rugosités pourraient éventuellement permettre de fixer les modules sans colle ou adhésif. Il suffirait en effet d'exercer une légère pression sur les modules pour faire fluer la résine de protection et réaliser une liaison résistante entre lesdits modules et les corps des cartes.The laser beam tends to form on the support part 2 slight roughness which allows better adhesion of the glue or the adhesive used to fix the modules on the card bodies. These roughnesses could possibly make it possible to fix the modules without glue or adhesive. It would indeed suffice to exert a slight pressure on the modules to cause the protective resin to flow and make a resistant connection between said modules and the bodies of the cards.
Pour être complet, on précisera que pour éviter que des réflexions parasites sur la partie support 2 provoquent une rétro-injection de l'énergie du faisceau laser, et que cette rétro-injection détériore le miroir 16 ou la source 9, il est souhaitable que la bandeTo be complete, it will be specified that in order to avoid parasitic reflections on the support part 2 causing a retro-injection of the energy of the laser beam, and that this retro-injection deteriorates the mirror 16 or the source 9, it is desirable that the band
1 forme un angle de 1 à 2 degrés avec la perpendiculaire au sens de propagation du faisceau laser à la sortie de la lentille épaisse 17.1 forms an angle of 1 to 2 degrees with the perpendicular to the direction of propagation of the laser beam at the exit of the thick lens 17.
Enfin, on notera que le procédé et l'installation conformes à l'invention sont particulièrement adaptés pour traiter en surface des bandes en polyimide, alors que ce
matériau ne peut actuellement être traité que par des procédés agressifs, polluants ou fugitifs, tels que le sablage, le flammage ou l'effet corona.
Finally, it will be noted that the method and the installation in accordance with the invention are particularly suitable for treating polyimide strips on the surface, whereas this material can currently only be treated by aggressive, polluting or fugitive processes, such as sandblasting, flaming or the corona effect.
Claims
1. Procédé pour traiter en surface une bande de matière plastique (1) dont l'une des grandes faces possède une partie support (2) de largeur prédéterminée sur laquelle sont fixés des modules (3) pour cartes électroniques, ces modules comportant un microcircuit (6) enrobé d'une résine de protection (7) faisant saillie sur la partie support, caractérisé en ce qu'il consiste :1. Method for surface treatment of a strip of plastic material (1) one of the large faces of which has a support part (2) of predetermined width on which modules (3) for electronic cards are fixed, these modules comprising a microcircuit (6) coated with a protective resin (7) projecting from the support part, characterized in that it consists:
- à irradier la partie support (2) avec un faisceau laser (10) adapté pour former un spot rectiligne (12) s'étendant sur toute la largeur de ladite partie support ;- irradiating the support part (2) with a laser beam (10) adapted to form a rectilinear spot (12) extending over the entire width of said support part;
- à déplacer la bande (1) par rapport au faisceau laser (10) pour permettre au spot rectiligne (11) de balayer longitudinalement la partie support (2) ;- moving the strip (1) relative to the laser beam (10) to allow the rectilinear spot (11) to sweep longitudinally the support part (2);
- à mesurer la vitesse de déplacement de la bande par rapport au faisceau laser ; et- measuring the speed of movement of the strip relative to the laser beam; and
- à régler l'émission du faisceau laser en fonction de la vitesse mesurée, afin que ledit faisceau laser enlève en continu une pellicule superficielle de matière plastique et de résine de protection (7) sur la partie support (2).- To adjust the emission of the laser beam as a function of the measured speed, so that said laser beam continuously removes a surface film of plastic and protective resin (7) on the support part (2).
2. Procédé selon la revendication 1, caractérisé en ce que le faisceau laser (10) est un faisceau laser CO-, puisé TEA dont les impulsions ont une durée de l'ordre de 10 μs et qui fournit une puissance de i'ordre de 150 à 300 mJ par impulsion.2. Method according to claim 1, characterized in that the laser beam (10) is a CO-, pulsed TEA laser beam whose pulses have a duration of the order of 10 μs and which provides a power of the order of 150 to 300 mJ per pulse.
3. Procédé selon la revendication 2, caractérisé en ce que les impulsions du faisceau laser (10) ont une fréquence de l'ordre de 10 Hz tandis que la vitesse de déplacement de la bande (1) par rapport au faisceau est de l'ordre de 3 cm/s et que le spot rectiligne (12) a une largeur de l'ordre de 3 mm.3. Method according to claim 2, characterized in that the pulses of the laser beam (10) have a frequency of the order of 10 Hz while the speed of movement of the strip (1) relative to the beam is of the about 3 cm / s and that the rectilinear spot (12) has a width of about 3 mm.
4. Installation pour traiter en surface une bande de matière plastique (1) dont l'une des grandes faces possède une partie support (2) de largeur prédéterminée sur laquelle sont fixés des modules (3) pour cartes électroniques, ces modules comportant un microcircuit (6) enrobé d'une résine de protection (7) faisant saillie sur la partie support, caractérisée en ce qu'elle comprend :4. Installation for surface treatment of a plastic strip (1), one of the large faces of which has a support part (2) of predetermined width on which modules (3) for electronic cards are fixed, these modules comprising a microcircuit (6) coated with a protective resin (7) projecting from the support part, characterized in that it comprises:
- une source (9) pour émettre un faisceau laser (10) ;- a source (9) for emitting a laser beam (10);
- un système optique (1 1) pour diriger le faisceau laser (10) sur la partie support (2) et le conformer pour qu'il produise un spot rectiligne (12) s'étendant sur toute la largeur de ladite partie support ; - des moyens (8,13) pour déplacer la bande (1) par rapport au faisceau laser afin que le spot rectiligne (12) balaie longitudinalement la partie support ;- An optical system (1 1) for directing the laser beam (10) on the support part (2) and conforming it so that it produces a rectilinear spot (12) extending over the entire width of said support part; - Means (8,13) for moving the strip (1) relative to the laser beam so that the rectilinear spot (12) sweeps longitudinally the support part;
- des moyens (14) pour mesurer la vitesse de déplacement de la bande (1) par rapport au faisceau laser (10) ; et - des moyens (15) pour commander la source laser (9) en fonction de la vitesse mesurée, afin que le faisceau laser (10) enlève en continu une pellicule superficielle de matière plastique et de résine de protection sur la partie support (2).- means (14) for measuring the speed of movement of the strip (1) relative to the laser beam (10); and - means (15) for controlling the laser source (9) as a function of the measured speed, so that the laser beam (10) continuously removes a surface film of plastic material and protective resin on the support part (2 ).
5. Installation selon la revendication 4, caractérisée en ce que la source (9) est conçue pour émettre un faisceau laser C02 puisé TEA (10) dont les impulsions ont une durée de l'ordre de 10 μs et qui fournit une puissance de l'ordre de 150 à 300 mJ par impulsion.5. Installation according to claim 4, characterized in that the source (9) is designed to emit a C0 2 pulsed TEA laser beam (10) whose pulses have a duration of the order of 10 μs and which provides a power of in the range of 150 to 300 mJ per pulse.
6. Installation selon la revendication 4 ou 5, caractérisée en ce que les moyens de déplacement (8,13) comprennent au moins une roue à picots (8) en prise avec la bande (1) et solidaire en rotation d'un moteur (13), de façon à entraîner longitudinalement ladite bande à une vitesse constante.6. Installation according to claim 4 or 5, characterized in that the displacement means (8,13) comprise at least one spike wheel (8) engaged with the strip (1) and integral in rotation with a motor ( 13), so as to drive said strip longitudinally at a constant speed.
7. Installation selon l'une quelconque des revendications 4 à 6, caractérisée en ce que les moyens de commande (15) sont aptes à régler les impulsions du faisceau laser (10) à une fréquence de l'ordre de 10 Hz lorsque la vitesse mesurée par les moyens de mesure (14) est de l'ordre de 3 cm/s et que le spot rectiligne (12) a une largeur de l'ordre de 3 mm. 7. Installation according to any one of claims 4 to 6, characterized in that the control means (15) are capable of adjusting the pulses of the laser beam (10) at a frequency of the order of 10 Hz when the speed measured by the measuring means (14) is of the order of 3 cm / s and that the rectilinear spot (12) has a width of the order of 3 mm.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9414463A FR2727780B1 (en) | 1994-12-01 | 1994-12-01 | METHOD AND PLANT FOR SURFACE TREATMENT OF A STRIP OF PLASTIC MATERIAL BEARING MODULES FOR ELECTRONIC BOARDS |
| PCT/FR1996/000062 WO1997026109A1 (en) | 1994-12-01 | 1996-01-15 | Method and apparatus for surface treating a plastic strip supporting electronic card modules |
| AU45433/96A AU4543396A (en) | 1996-01-15 | 1996-01-15 | Method and apparatus for surface treating a plastic strip supporting electronic card modules |
| BR9603594A BR9603594A (en) | 1996-01-15 | 1996-01-15 | Process and installation for treating the surface of a strip of plastic material |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9414463A FR2727780B1 (en) | 1994-12-01 | 1994-12-01 | METHOD AND PLANT FOR SURFACE TREATMENT OF A STRIP OF PLASTIC MATERIAL BEARING MODULES FOR ELECTRONIC BOARDS |
| PCT/FR1996/000062 WO1997026109A1 (en) | 1994-12-01 | 1996-01-15 | Method and apparatus for surface treating a plastic strip supporting electronic card modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1997026109A1 true WO1997026109A1 (en) | 1997-07-24 |
Family
ID=26231580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FR1996/000062 WO1997026109A1 (en) | 1994-12-01 | 1996-01-15 | Method and apparatus for surface treating a plastic strip supporting electronic card modules |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR2727780B1 (en) |
| WO (1) | WO1997026109A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104438230A (en) * | 2014-11-17 | 2015-03-25 | 成都莱普科技有限公司 | Industrial product laser cleaning system and control method thereof |
| CN107695040A (en) * | 2017-10-20 | 2018-02-16 | 大族激光科技产业集团股份有限公司 | Laser cleaning system and method |
| CN110340074A (en) * | 2018-04-03 | 2019-10-18 | 闽台贸易有限公司 | The surface processing device and its surface treatment method of base material |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10737303B2 (en) | 2017-06-23 | 2020-08-11 | Lockheed Martin Corporation | Nutplate preparation laser system |
| CN111151515B (en) * | 2020-01-10 | 2021-08-31 | 广东利元亨智能装备股份有限公司 | Laser cleaning method and device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332957A (en) * | 1986-07-25 | 1988-02-12 | Matsushita Electronics Corp | Manufacture of semiconductor device |
| US5041395A (en) * | 1989-04-07 | 1991-08-20 | Sgs-Thomson Microelectronics S.A. | Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2060455A (en) * | 1979-10-20 | 1981-05-07 | Metal Box Co Ltd | Preparing thin metal sheet for welding |
| FR2638993B1 (en) * | 1988-11-17 | 1991-02-01 | Carnaud Sa | DEVICE FOR STRIPPING TWO EDGES OF WELDED SHEET METAL |
| FR2657803A1 (en) * | 1990-02-02 | 1991-08-09 | Bertin & Cie | LASER MICRO-BEAM MACHINE FOR WORKING ON THIN-FILM OBJECTS, SUCH AS INTEGRATED CIRCUITS. |
| FR2692822B1 (en) * | 1992-06-25 | 1997-08-29 | Bm Ind | LASER SOURCE FOR MULTI-WAVE PHOTON ERADICATION. |
| FR2703618B1 (en) * | 1993-04-08 | 1995-06-09 | France Etat Armement | Laser stripping device. |
-
1994
- 1994-12-01 FR FR9414463A patent/FR2727780B1/en not_active Expired - Fee Related
-
1996
- 1996-01-15 WO PCT/FR1996/000062 patent/WO1997026109A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332957A (en) * | 1986-07-25 | 1988-02-12 | Matsushita Electronics Corp | Manufacture of semiconductor device |
| US5041395A (en) * | 1989-04-07 | 1991-08-20 | Sgs-Thomson Microelectronics S.A. | Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 012, no. 244 (E - 631) 9 July 1988 (1988-07-09) * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104438230A (en) * | 2014-11-17 | 2015-03-25 | 成都莱普科技有限公司 | Industrial product laser cleaning system and control method thereof |
| CN107695040A (en) * | 2017-10-20 | 2018-02-16 | 大族激光科技产业集团股份有限公司 | Laser cleaning system and method |
| CN110340074A (en) * | 2018-04-03 | 2019-10-18 | 闽台贸易有限公司 | The surface processing device and its surface treatment method of base material |
| CN110340074B (en) * | 2018-04-03 | 2020-10-30 | 闽台贸易有限公司 | Surface treatment device and surface treatment method for substrate material |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2727780B1 (en) | 1997-01-10 |
| FR2727780A1 (en) | 1996-06-07 |
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