WO1997024764A1 - Integrated system package - Google Patents
Integrated system package Download PDFInfo
- Publication number
- WO1997024764A1 WO1997024764A1 PCT/GB1997/000008 GB9700008W WO9724764A1 WO 1997024764 A1 WO1997024764 A1 WO 1997024764A1 GB 9700008 W GB9700008 W GB 9700008W WO 9724764 A1 WO9724764 A1 WO 9724764A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- components
- electronic device
- integrated circuit
- electronic
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97900261A EP0812474A1 (en) | 1996-01-02 | 1997-01-02 | Integrated system package |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US947996P | 1996-01-02 | 1996-01-02 | |
US60/009,479 | 1996-01-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997024764A1 true WO1997024764A1 (en) | 1997-07-10 |
Family
ID=21737907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1997/000008 WO1997024764A1 (en) | 1996-01-02 | 1997-01-02 | Integrated system package |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0812474A1 (en) |
WO (1) | WO1997024764A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000021032A1 (en) * | 1998-10-06 | 2000-04-13 | Intermec Ip Corp. | Rfid integrated in electronic assets |
DE102006033175A1 (en) * | 2006-07-18 | 2008-01-24 | Robert Bosch Gmbh | electronics assembly |
EP1765146B1 (en) * | 2004-05-31 | 2009-04-29 | Medigus Ltd. | A reusable miniature camera head |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5989447A (en) * | 1982-11-15 | 1984-05-23 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS6114731A (en) * | 1984-06-29 | 1986-01-22 | Nec Kansai Ltd | Semiconductor device |
WO1994018700A1 (en) * | 1993-02-11 | 1994-08-18 | Indala Corporation | Method of producing a radio frequency transponder with a molded environmentally sealed package |
EP0615285A2 (en) * | 1993-03-11 | 1994-09-14 | Btg International Limited | Attaching an electronic circuit to a substrate |
JPH0766356A (en) * | 1993-08-30 | 1995-03-10 | Nec Corp | Packaging structure of chip component |
DE4410212A1 (en) * | 1994-03-24 | 1995-09-28 | Telefunken Microelectron | Electronic module with semiconductor integrated circuit |
JPH07306264A (en) * | 1994-05-13 | 1995-11-21 | Chikusanyo Denshi Gijutsu Kenkyu Kumiai | Transponder for managing individual |
-
1997
- 1997-01-02 EP EP97900261A patent/EP0812474A1/en not_active Withdrawn
- 1997-01-02 WO PCT/GB1997/000008 patent/WO1997024764A1/en not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5989447A (en) * | 1982-11-15 | 1984-05-23 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS6114731A (en) * | 1984-06-29 | 1986-01-22 | Nec Kansai Ltd | Semiconductor device |
WO1994018700A1 (en) * | 1993-02-11 | 1994-08-18 | Indala Corporation | Method of producing a radio frequency transponder with a molded environmentally sealed package |
EP0615285A2 (en) * | 1993-03-11 | 1994-09-14 | Btg International Limited | Attaching an electronic circuit to a substrate |
JPH0766356A (en) * | 1993-08-30 | 1995-03-10 | Nec Corp | Packaging structure of chip component |
DE4410212A1 (en) * | 1994-03-24 | 1995-09-28 | Telefunken Microelectron | Electronic module with semiconductor integrated circuit |
JPH07306264A (en) * | 1994-05-13 | 1995-11-21 | Chikusanyo Denshi Gijutsu Kenkyu Kumiai | Transponder for managing individual |
Non-Patent Citations (4)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 008, no. 200 (E - 266) 13 September 1984 (1984-09-13) * |
PATENT ABSTRACTS OF JAPAN vol. 010, no. 158 (E - 409) 6 June 1986 (1986-06-06) * |
PATENT ABSTRACTS OF JAPAN vol. 95, no. 006 31 July 1995 (1995-07-31) * |
PATENT ABSTRACTS OF JAPAN vol. 96, no. 03 29 March 1996 (1996-03-29) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6249227B1 (en) | 1998-01-05 | 2001-06-19 | Intermec Ip Corp. | RFID integrated in electronic assets |
WO2000021032A1 (en) * | 1998-10-06 | 2000-04-13 | Intermec Ip Corp. | Rfid integrated in electronic assets |
EP1765146B1 (en) * | 2004-05-31 | 2009-04-29 | Medigus Ltd. | A reusable miniature camera head |
DE102006033175A1 (en) * | 2006-07-18 | 2008-01-24 | Robert Bosch Gmbh | electronics assembly |
Also Published As
Publication number | Publication date |
---|---|
EP0812474A1 (en) | 1997-12-17 |
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