WO1997017820A1 - Piezoelectric transducers - Google Patents
Piezoelectric transducers Download PDFInfo
- Publication number
- WO1997017820A1 WO1997017820A1 PCT/US1996/017602 US9617602W WO9717820A1 WO 1997017820 A1 WO1997017820 A1 WO 1997017820A1 US 9617602 W US9617602 W US 9617602W WO 9717820 A1 WO9717820 A1 WO 9717820A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- ofthe
- piezoelectric element
- loudspeaker
- transducer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 230000033001 locomotion Effects 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000006073 displacement reaction Methods 0.000 claims abstract description 4
- 229910001369 Brass Inorganic materials 0.000 claims description 9
- 239000010951 brass Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 13
- 230000008878 coupling Effects 0.000 description 11
- 238000010168 coupling process Methods 0.000 description 11
- 238000005859 coupling reaction Methods 0.000 description 11
- 238000010276 construction Methods 0.000 description 3
- 239000002305 electric material Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/045—Plane diaphragms using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion
Definitions
- Loudspeakers employing a piezoelectric transducer capable of propagating surface acoustic waves to drive a diaphragm have been proposed as an alternative to moving coil loudspeakers.
- a piezoelectric transducer capable of propagating surface acoustic waves to drive a diaphragm
- Martin's device used a thick glue layer (10 to 50% ofthe carrier plate thickness) between a carrier plate and the piezo ceramic. The adhesive layer served to attenuate resonance. Any displacement in the piezoelectric is directly related to the applied electrical potential.
- piezoelectric materials are as a rule comparatively brittle and do not deform well. Consequently, if one attempts to have piezoelectric materials conform to the curvature of an irregularly shaped diaphragm they may shatter or break, resulting in necessary expense.
- the present invention involves a transducer which is utilized to drive a diaphragm, in particular a comparatively large diaphragm.
- the transducer is comprised of a piezoelectric layer, (or a layer of some other material covered with a layer of piezoelectric material) capable of propagating flexural acoustic waves, which piezoelectric material typically is a flat layer placed on top of a substrate layer which has essentially the same degree of rigidity (as measured by its Young's modulus and thickness) as the piezoelectric electric material, but has more rigidity than the diaphragm material so that when the substrate material is distorted by the motion ofthe piezoelectric material the diaphragm will move accordingly.
- the thickness ofthe substrate may be optimized to the properties ofthe piezoelectric material.
- the substrate will be larger in suiface area than the piezoelectric element in order to impart motion to a larger area ofthe diaphragm.
- the invention also comprises utilizing multiple transducers on a single diaphragm to extend the frequency range. In this case larger transducers would be used to produce low frequencies and smaller transducers would be used to produce higher frequencies.
- the use of multiple transducers serves to increase the motion imparted to the diaphragm and, hence, the volume or loudness ofthe sound.
- Figure 1 illustrates one embodiment of a transducer according to the present invention.
- Figure 2 illustrates possible shapes of piezoelectric elements utilized in the present invention.
- Figure 3 illustrates another embodiment of a transducer ofthe present invention in which the piezoelectric element is utilized in conjunction with motion couplers.
- Figure 4 illustrates a further embodiment of a transducer ofthe present invention in which the piezoelectric element is shown as being utilized in conjunction with motion couplers in another manner.
- Figure 5 illustrates another embodiment ofthe present invention in which two transducers are connected to each other via a mechanical connection.
- Figure 1 illustrates one embodiment of transducer design 10 ofthe present invention.
- a piezoelectric element 11 is placed on top of a substrate 12 which has a larger surface area than the piezoelectric layer.
- the piezoelectric layer may be bonded to the substrate by any suitable material.
- the substrate will have a larger surface area than the piezoelectric element in order to impart motion to a larger area ofthe diaphragm than if the substrate alone was attached to the diaphragm. This will result in cost savings since lesser amounts ofthe costly piezoelectric material need be utilized.
- the substrate will have a rigidity no greater than the rigidity ofthe piezoelectric element but greater than the rigidity of a diaphragm to which the substrate will be attached. Many materials may be advantageously be used for the substrate. These materials include steel, aluminum, brass, copper, and other metals, plastics, composite materials, etc.
- Brass is a preferred material for the substrate because of its low cost, environmental resistance, ease of bondability and because its Young's modulus of elasticity is similar to that of certain piezoelectric materials, such as PZT (lead-zircon-titanate).
- the transducer will also include means to apply electric potential to the piezoelectric element, which in the depicted embodiment comprises a connector 13 for a wire harness which is optionally attached to and extends from the edge 14 of substrate 12.
- Figure 1 also illustrates electrical leads 15 from the piezoelectric element 11 to connector 13.
- Substrate 12 will be attached directly, on the side opposite to the side that is attached the piezo element, to a diaphragm (not shown).
- the substrate and perhaps the piezoelectric element may be preformed, or otherwise configured, to conform to the curvature, or other shape, ofthe sound radiating diaphragm to which the substrate is attached.
- both the mechanical and electrical impedances ofthe transducer should be matched. That is, the mechanical impedance ofthe transducer should be matched to that ofthe sound radiating diaphragm while the electrical impedance ofthe amplifier that drives the transducer should be matched to that ofthe transducer when it is radiating sound.
- the transducer may also be covered with a conformal coating to provided electrical insulation and environmental resistance.
- the piezo element may consist of two or more layers arranged on top of one another and electrically connected in an alternating fashion to enhance the motion ofthe piezoelectric element.
- Figure 2 illustrates examples of possible shapes for the piezoelectric element.
- the element may be made in a variety of shapes, such as square, rectangular and round. Irregular shapes may also be used to minimize resonances on the transducer itself and/or to extend the frequency range. To accomplish the latter goal, elliptical, semi-elliptical, truncated rectangular and truncated square shapes, etc. may be used.
- FIG. 3 illustrates another embodiment of a transducer ofthe present invention in which piezoelectric element 20, which in the illustration has a rectangular shape
- any other shaped piezoelectric element (although any other shaped piezoelectric element can be utilized in this embodiment) is coupled on, most preferably, all its sides 21,22, 23 and 24 with motion couplers 25, 26, 27, 28 to further ensure the coupling ofthe motion ofthe piezoelectric element to substrate 29 by provide a coupling transition to the substrate, to which piezoelement 20 is bonded and positioned on top of, in all directions of movement.
- the motion couplers may be attached only to certain sides ofthe piezoelectric element. By providing a coupling transition to the substrate it will be further insured that the motion ofthe piezoelectric element will be coupled to the sound radiating diaphragm (not shown).
- FIG. 4 illustrates a further embodiment of a transducer ofthe present invention in which the piezoelectric element 41 is shown as being utilized in conjunction with motion couplers in another manner.
- the outer perimeter 42 of piezoelectric element 41 is completely surrounded by a single motion coupling plate 43.
- Motion coupling plate 43 has a hole, which in the depicted embodiment is in its center, which is cut out in order to accommodate the presence of piezoelectric element 41.
- Piezoelectric element 41 must fit the hole in motion coupling plate 43 very snugly so that the piezoelectric element 41 will be bonded at its edges 42 to the edges ofthe hole in motion coupling plate 43.
- motion coupling plate 43 should be ofthe same thickness as the piezoelectric element 41.
- Piezoelectric element 41 and motion coupling plate 43 are both bonded to the underlying substrate 45.
- the material ofthe motion coupling plate 43 and the substrate 45 may be ofthe same material or different materials such that the motion ofthe piezoelectric element 41 is not substantially restricted.
- One advantage of this concept is that less parts are involved and hence the transducer is more readily adaptable to being mass produced.
- FIG. 5 illustrates another embodiment ofthe present invention in which more than one integral transducer, in this case a pair of transducers 51 and 52, which are constructed in accordance with the present invention, are attached to the same diaphragm 53. It has been discovered that using more than one transducer in conjunction with the same diaphragm will create a stereo sound image, and will also increase the loudness and/or extend the frequency range. The preferred distance by which the transducers should be separated will depend on the size, material of construction and configuration ofthe speaker.
- Figure 5 illustrates a further embodiment ofthe present invention, in which transducers 51 and 52 are connected to each other via a mechanical connector 54. It has been shown that, when such a mechanical connection is employed, the quality ofthe stereo effect produced will be enhanced and the overall quality and volume ofthe sound will be improved.
- the mechanical connector was a metal beam of 0.02 inch thick sheet steel and was one inch wide. The length ofthe mechanical connector should be such that some outward force is exerted on the integral transducers. Of course, other materials of construction and/or other dimensions of mechanical connector 54 may be utilized.
- the mechanical connector may be an integral part ofthe transducers.
- the substrate may be made continuous between the transducers to form the mechanical connection.
- the motion couplers described above may be formed into an integral mechanical connection.
- more than two transducers may be so utilized. When more than two transducers are utilized it is preferred that they be utilized in pairs, preferably with the transducers in each pair being connected to each other by a mechanical connector.
- the piezoelectric material typically is in the form of a plate that is placed on top of a substrate plate which has essentially the same degree of rigidity (as measured by its Young's modulus and thickness) as the piezoelectric electric material.
- K extension stiffness
- E Young's modulus of elasticity
- t thickness ofthe layer, that may be used to match the stiffness or rigidity ofthe piezoelectric material with those ofthe substrate and motion coupler layers.
- the stiffness of all layers should be substantially the same and certainly with an order of magnitude. That is, the extensional stiffness ofthe piezoelectric material under electric stimulation should be substantially equal to the extensional stiffness ofthe substrate and (when utilized) the extensional stiffness ofthe motion couplers.
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980702723A KR100310349B1 (en) | 1995-11-06 | 1996-11-04 | Piezoelectric transducers |
CA002235754A CA2235754C (en) | 1995-11-06 | 1996-11-04 | Piezoelectric transducers |
EP96937877A EP0872158B1 (en) | 1995-11-06 | 1996-11-04 | Piezoelectric transducers |
JP51825497A JP3383314B2 (en) | 1995-11-06 | 1996-11-04 | Piezoelectric transducer |
AT96937877T ATE307472T1 (en) | 1995-11-06 | 1996-11-04 | PIEZOELECTRIC TRANSDUCER |
BR9611417A BR9611417A (en) | 1995-11-06 | 1996-11-04 | Piezoelectric transducers |
DE69635308T DE69635308T2 (en) | 1995-11-06 | 1996-11-04 | PIEZOELECTRIC TRANSFORMER |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/554,049 | 1995-11-06 | ||
US08/554,049 US5838805A (en) | 1995-11-06 | 1995-11-06 | Piezoelectric transducers |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997017820A1 true WO1997017820A1 (en) | 1997-05-15 |
Family
ID=24211850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/017602 WO1997017820A1 (en) | 1995-11-06 | 1996-11-04 | Piezoelectric transducers |
Country Status (11)
Country | Link |
---|---|
US (2) | US5838805A (en) |
EP (1) | EP0872158B1 (en) |
JP (1) | JP3383314B2 (en) |
KR (1) | KR100310349B1 (en) |
AT (1) | ATE307472T1 (en) |
BR (1) | BR9611417A (en) |
CA (1) | CA2235754C (en) |
DE (1) | DE69635308T2 (en) |
ES (1) | ES2249788T3 (en) |
IN (1) | IN192273B (en) |
WO (1) | WO1997017820A1 (en) |
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EP0990271A1 (en) * | 1997-06-19 | 2000-04-05 | NCT Group, Inc. | Loudspeaker assembly |
US9564146B2 (en) | 2014-08-01 | 2017-02-07 | Bongiovi Acoustics Llc | System and method for digital signal processing in deep diving environment |
US9621994B1 (en) | 2015-11-16 | 2017-04-11 | Bongiovi Acoustics Llc | Surface acoustic transducer |
US9615813B2 (en) | 2014-04-16 | 2017-04-11 | Bongiovi Acoustics Llc. | Device for wide-band auscultation |
US9638672B2 (en) | 2015-03-06 | 2017-05-02 | Bongiovi Acoustics Llc | System and method for acquiring acoustic information from a resonating body |
US9741355B2 (en) | 2013-06-12 | 2017-08-22 | Bongiovi Acoustics Llc | System and method for narrow bandwidth digital signal processing |
US9793872B2 (en) | 2006-02-07 | 2017-10-17 | Bongiovi Acoustics Llc | System and method for digital signal processing |
US9883318B2 (en) | 2013-06-12 | 2018-01-30 | Bongiovi Acoustics Llc | System and method for stereo field enhancement in two-channel audio systems |
US9906858B2 (en) | 2013-10-22 | 2018-02-27 | Bongiovi Acoustics Llc | System and method for digital signal processing |
US9906867B2 (en) | 2015-11-16 | 2018-02-27 | Bongiovi Acoustics Llc | Surface acoustic transducer |
US10069471B2 (en) | 2006-02-07 | 2018-09-04 | Bongiovi Acoustics Llc | System and method for digital signal processing |
US10158337B2 (en) | 2004-08-10 | 2018-12-18 | Bongiovi Acoustics Llc | System and method for digital signal processing |
US10639000B2 (en) | 2014-04-16 | 2020-05-05 | Bongiovi Acoustics Llc | Device for wide-band auscultation |
US10701505B2 (en) | 2006-02-07 | 2020-06-30 | Bongiovi Acoustics Llc. | System, method, and apparatus for generating and digitally processing a head related audio transfer function |
US10820883B2 (en) | 2014-04-16 | 2020-11-03 | Bongiovi Acoustics Llc | Noise reduction assembly for auscultation of a body |
US10848867B2 (en) | 2006-02-07 | 2020-11-24 | Bongiovi Acoustics Llc | System and method for digital signal processing |
US10848118B2 (en) | 2004-08-10 | 2020-11-24 | Bongiovi Acoustics Llc | System and method for digital signal processing |
US10959035B2 (en) | 2018-08-02 | 2021-03-23 | Bongiovi Acoustics Llc | System, method, and apparatus for generating and digitally processing a head related audio transfer function |
US11202161B2 (en) | 2006-02-07 | 2021-12-14 | Bongiovi Acoustics Llc | System, method, and apparatus for generating and digitally processing a head related audio transfer function |
US11211043B2 (en) | 2018-04-11 | 2021-12-28 | Bongiovi Acoustics Llc | Audio enhanced hearing protection system |
US11431312B2 (en) | 2004-08-10 | 2022-08-30 | Bongiovi Acoustics Llc | System and method for digital signal processing |
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US5732143A (en) | 1992-10-29 | 1998-03-24 | Andrea Electronics Corp. | Noise cancellation apparatus |
US6031926A (en) * | 1996-09-02 | 2000-02-29 | New Transducers Limited | Panel-form loudspeakers |
US6356641B1 (en) | 1996-09-25 | 2002-03-12 | New Transducers Limited | Vehicular loudspeaker system |
US6363345B1 (en) | 1999-02-18 | 2002-03-26 | Andrea Electronics Corporation | System, method and apparatus for cancelling noise |
US6366675B1 (en) * | 1999-05-21 | 2002-04-02 | Kohji Toda | Sound pressure detecting system |
US6336368B1 (en) * | 1999-09-10 | 2002-01-08 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for energy efficient tacking of resonant devices |
US6438242B1 (en) * | 1999-09-07 | 2002-08-20 | The United States Of America As Represented By The Secretary Of The Navy | Acoustic transducer panel |
JP4136221B2 (en) * | 1999-09-09 | 2008-08-20 | 本田技研工業株式会社 | Speaker built-in helmet and helmet speaker |
US6594367B1 (en) | 1999-10-25 | 2003-07-15 | Andrea Electronics Corporation | Super directional beamforming design and implementation |
JP2003529976A (en) * | 2000-01-07 | 2003-10-07 | アサナス ルイス | Machine-acoustic transducer and multimedia flat film speaker |
TW511391B (en) * | 2000-01-24 | 2002-11-21 | New Transducers Ltd | Transducer |
US7151837B2 (en) * | 2000-01-27 | 2006-12-19 | New Transducers Limited | Loudspeaker |
US6865277B2 (en) | 2000-01-27 | 2005-03-08 | New Transducers Limited | Passenger vehicle |
DE10026474B4 (en) * | 2000-05-27 | 2005-06-09 | Sennheiser Electronic Gmbh & Co. Kg | Transducer with semiconducting membrane |
BE1015150A3 (en) * | 2002-10-21 | 2004-10-05 | Sonitron Nv | Improved transducer |
KR20070038540A (en) * | 2004-08-06 | 2007-04-10 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | Panel-acoustic transducer comprising an actuator for actuating a panel, and sound-generating and/or recording device |
KR100610181B1 (en) | 2004-10-27 | 2006-08-09 | 경북대학교 산학협력단 | microphone for an implanted hearing-aids |
GB0510484D0 (en) * | 2005-05-24 | 2005-06-29 | New Transducers Ltd | Acoustic device |
JP5064384B2 (en) * | 2005-05-31 | 2012-10-31 | エモ・ラブズ・インコーポレーテッド | Diaphragm membrane and support structure sensitive to environmental conditions |
US8180065B2 (en) * | 2005-10-13 | 2012-05-15 | Magna Mirrors Of America, Inc. | Acoustical window assembly for vehicle |
US9615189B2 (en) | 2014-08-08 | 2017-04-04 | Bongiovi Acoustics Llc | Artificial ear apparatus and associated methods for generating a head related audio transfer function |
WO2009067669A1 (en) * | 2007-11-21 | 2009-05-28 | Emo Labs, Inc.. | Wireless loudspeaker |
US8189851B2 (en) * | 2009-03-06 | 2012-05-29 | Emo Labs, Inc. | Optically clear diaphragm for an acoustic transducer and method for making same |
WO2011020100A1 (en) * | 2009-08-14 | 2011-02-17 | Emo Labs, Inc | System to generate electrical signals for a loudspeaker |
KR101889727B1 (en) * | 2011-08-08 | 2018-08-20 | 호쿠리쿠 덴키 고교 가부시키가이샤 | Piezoelectric sound element |
US20140270193A1 (en) | 2013-03-15 | 2014-09-18 | Emo Labs, Inc. | Acoustic transducers having a connector between an actuator and a diaphragm |
DE102013105557B4 (en) * | 2013-05-29 | 2015-06-11 | Michael Förg | Piezoelectric actuator |
USD741835S1 (en) | 2013-12-27 | 2015-10-27 | Emo Labs, Inc. | Speaker |
USD733678S1 (en) | 2013-12-27 | 2015-07-07 | Emo Labs, Inc. | Audio speaker |
USD748072S1 (en) | 2014-03-14 | 2016-01-26 | Emo Labs, Inc. | Sound bar audio speaker |
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KR102506301B1 (en) | 2018-09-04 | 2023-03-07 | 카티르가마순다람 수리아쿠마르 | Acoustic transducer and related manufacturing and packaging technology |
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1995
- 1995-11-06 US US08/554,049 patent/US5838805A/en not_active Expired - Fee Related
-
1996
- 1996-10-25 IN IN1868CA1996 patent/IN192273B/en unknown
- 1996-11-04 ES ES96937877T patent/ES2249788T3/en not_active Expired - Lifetime
- 1996-11-04 EP EP96937877A patent/EP0872158B1/en not_active Expired - Lifetime
- 1996-11-04 DE DE69635308T patent/DE69635308T2/en not_active Expired - Fee Related
- 1996-11-04 JP JP51825497A patent/JP3383314B2/en not_active Expired - Fee Related
- 1996-11-04 AT AT96937877T patent/ATE307472T1/en not_active IP Right Cessation
- 1996-11-04 KR KR1019980702723A patent/KR100310349B1/en not_active IP Right Cessation
- 1996-11-04 BR BR9611417A patent/BR9611417A/en not_active IP Right Cessation
- 1996-11-04 WO PCT/US1996/017602 patent/WO1997017820A1/en active IP Right Grant
- 1996-11-04 CA CA002235754A patent/CA2235754C/en not_active Expired - Fee Related
-
1998
- 1998-11-17 US US09/193,468 patent/US6195440B1/en not_active Expired - Fee Related
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Cited By (31)
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Also Published As
Publication number | Publication date |
---|---|
ES2249788T3 (en) | 2006-04-01 |
US5838805A (en) | 1998-11-17 |
US6195440B1 (en) | 2001-02-27 |
BR9611417A (en) | 1999-02-23 |
CA2235754A1 (en) | 1997-05-15 |
ATE307472T1 (en) | 2005-11-15 |
KR100310349B1 (en) | 2001-11-15 |
DE69635308D1 (en) | 2005-11-24 |
JP3383314B2 (en) | 2003-03-04 |
JPH11500294A (en) | 1999-01-06 |
EP0872158A4 (en) | 1999-08-18 |
IN192273B (en) | 2004-03-27 |
DE69635308T2 (en) | 2006-07-20 |
EP0872158A1 (en) | 1998-10-21 |
KR19990064236A (en) | 1999-07-26 |
EP0872158B1 (en) | 2005-10-19 |
CA2235754C (en) | 2002-08-20 |
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