WO1997015837A3 - Flexibly suspended heat exchange head for a dut - Google Patents

Flexibly suspended heat exchange head for a dut Download PDF

Info

Publication number
WO1997015837A3
WO1997015837A3 PCT/US1996/016930 US9616930W WO9715837A3 WO 1997015837 A3 WO1997015837 A3 WO 1997015837A3 US 9616930 W US9616930 W US 9616930W WO 9715837 A3 WO9715837 A3 WO 9715837A3
Authority
WO
WIPO (PCT)
Prior art keywords
dut
heat exchange
thermoconductive
module
exchange head
Prior art date
Application number
PCT/US1996/016930
Other languages
French (fr)
Other versions
WO1997015837A2 (en
Inventor
Elmer R Jones
Original Assignee
Aetrium Inc
Elmer R Jones
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aetrium Inc, Elmer R Jones filed Critical Aetrium Inc
Priority to AU74670/96A priority Critical patent/AU7467096A/en
Priority to US09/043,098 priority patent/US6392431B1/en
Priority to EP96936847A priority patent/EP0857304A2/en
Publication of WO1997015837A2 publication Critical patent/WO1997015837A2/en
Publication of WO1997015837A3 publication Critical patent/WO1997015837A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Abstract

A thermoconductive module in which is placed a device under test (DUT). The DUT is placed in a tester and the thermoconductive module engages the DUT. A load is applied to the DUT. A heat exchange fluid flows through the thermoconductive module. The thermoconductive module maintains the temperature of the DUT constant while being tested. The face of the thermoconductive module which contacts the DUT is flexible such that it conforms to the surface of the DUT.
PCT/US1996/016930 1995-10-23 1996-10-23 Flexibly suspended heat exchange head for a dut WO1997015837A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU74670/96A AU7467096A (en) 1995-10-23 1996-10-23 Flexibly suspended heat exchange head for a dut
US09/043,098 US6392431B1 (en) 1996-10-23 1996-10-23 Flexibly suspended heat exchange head for a DUT
EP96936847A EP0857304A2 (en) 1995-10-23 1996-10-23 Flexibly suspended heat exchange head for a dut

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3316895P 1995-10-23 1995-10-23
US60/033,168 1995-10-23

Publications (2)

Publication Number Publication Date
WO1997015837A2 WO1997015837A2 (en) 1997-05-01
WO1997015837A3 true WO1997015837A3 (en) 1997-05-29

Family

ID=21868907

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/016930 WO1997015837A2 (en) 1995-10-23 1996-10-23 Flexibly suspended heat exchange head for a dut

Country Status (3)

Country Link
EP (1) EP0857304A2 (en)
AU (1) AU7467096A (en)
WO (1) WO1997015837A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL135484A0 (en) * 1997-10-07 2001-05-20 Reliability Inc Burn-in board with adaptable heat sink device
US5966940A (en) * 1997-11-18 1999-10-19 Micro Component Technology, Inc. Semiconductor thermal conditioning apparatus and method
US6717115B1 (en) 2000-04-25 2004-04-06 Teradyne, Inc. Semiconductor handler for rapid testing
US6628132B2 (en) 2001-08-10 2003-09-30 Teradyne, Inc. Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques
JP2008159762A (en) * 2006-12-22 2008-07-10 Espec Corp Heating medium supply device and temperature control apparatus
DE102007047679B4 (en) * 2007-10-05 2011-03-10 Multitest Elektronische Systeme Gmbh Plunger for moving electronic components, in particular ICs, with Wärmeleitkörper
DE102007047740B4 (en) 2007-10-05 2010-11-04 Multitest Elektronische Systeme Gmbh Plunger for moving electronic components, in particular IC's

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0341156A1 (en) * 1988-05-06 1989-11-08 Carrier S.A. Device for supporting and thermally regulating a piece and semi-conductor circuit plates testing apparatus comprising such a device
US4918928A (en) * 1987-12-17 1990-04-24 Kabushiki Kaisha Kobe Seikosho Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
US5148003A (en) * 1990-11-28 1992-09-15 International Business Machines Corporation Modular test oven
WO1994022029A1 (en) * 1993-03-19 1994-09-29 Ej Systems, Inc. Burn-in module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
US4918928A (en) * 1987-12-17 1990-04-24 Kabushiki Kaisha Kobe Seikosho Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature
EP0341156A1 (en) * 1988-05-06 1989-11-08 Carrier S.A. Device for supporting and thermally regulating a piece and semi-conductor circuit plates testing apparatus comprising such a device
US5148003A (en) * 1990-11-28 1992-09-15 International Business Machines Corporation Modular test oven
WO1994022029A1 (en) * 1993-03-19 1994-09-29 Ej Systems, Inc. Burn-in module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"MODULE PROBE PACKAGE", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 33, no. 12, May 1991 (1991-05-01), NEW YORK US, pages 85 - 86, XP000121597 *

Also Published As

Publication number Publication date
AU7467096A (en) 1997-05-15
WO1997015837A2 (en) 1997-05-01
EP0857304A2 (en) 1998-08-12

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