WO1996031905A1 - A solder bump structure for a microelectronic substrate - Google Patents
A solder bump structure for a microelectronic substrate Download PDFInfo
- Publication number
- WO1996031905A1 WO1996031905A1 PCT/US1996/003751 US9603751W WO9631905A1 WO 1996031905 A1 WO1996031905 A1 WO 1996031905A1 US 9603751 W US9603751 W US 9603751W WO 9631905 A1 WO9631905 A1 WO 9631905A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- layer
- under bump
- bump metallurgy
- metallurgy layer
- Prior art date
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT96909782T ATE240586T1 (en) | 1995-04-05 | 1996-03-21 | A SOLDER BUMP STRUCTURE FOR A MICROELECTRONIC SUBSTRATE |
JP53031796A JP3549208B2 (en) | 1995-04-05 | 1996-03-21 | Integrated redistribution routing conductors, solder vipes and methods of forming structures formed thereby |
DE69628161T DE69628161T2 (en) | 1995-04-05 | 1996-03-21 | A SOLDERING STRUCTURE FOR A MICROELECTRONIC SUBSTRATE |
EP96909782A EP0819318B1 (en) | 1995-04-05 | 1996-03-21 | A solder bump structure for a microelectronic substrate |
AU53169/96A AU5316996A (en) | 1995-04-05 | 1996-03-21 | A solder bump structure for a microelectronic substrate |
HK98109292A HK1008266A1 (en) | 1995-04-05 | 1998-07-20 | A solder bump structure for a microelectronic substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41661995A | 1995-04-05 | 1995-04-05 | |
US08/416,619 | 1995-04-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996031905A1 true WO1996031905A1 (en) | 1996-10-10 |
Family
ID=23650663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/003751 WO1996031905A1 (en) | 1995-04-05 | 1996-03-21 | A solder bump structure for a microelectronic substrate |
Country Status (10)
Country | Link |
---|---|
US (3) | US5892179A (en) |
EP (1) | EP0819318B1 (en) |
JP (1) | JP3549208B2 (en) |
KR (2) | KR100425750B1 (en) |
CN (1) | CN1179412C (en) |
AT (1) | ATE240586T1 (en) |
AU (1) | AU5316996A (en) |
DE (1) | DE69628161T2 (en) |
HK (1) | HK1008266A1 (en) |
WO (1) | WO1996031905A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998022979A1 (en) * | 1996-11-21 | 1998-05-28 | Mcnc | Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures |
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US6389691B1 (en) | 1995-04-05 | 2002-05-21 | Unitive International Limited | Methods for forming integrated redistribution routing conductors and solder bumps |
US6329608B1 (en) | 1995-04-05 | 2001-12-11 | Unitive International Limited | Key-shaped solder bumps and under bump metallurgy |
US5902686A (en) * | 1996-11-21 | 1999-05-11 | Mcnc | Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures |
WO1998022979A1 (en) * | 1996-11-21 | 1998-05-28 | Mcnc | Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures |
EP0899787A2 (en) * | 1997-07-25 | 1999-03-03 | Mcnc | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby |
SG99384A1 (en) * | 1997-07-25 | 2003-10-27 | Unitive Int Ltd | Controlled-shaped solder reservoirs for increasing the volume of solders bumps, and structures formed thereby |
EP0899787A3 (en) * | 1997-07-25 | 2001-05-16 | Mcnc | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby |
EP1036414A1 (en) * | 1997-10-20 | 2000-09-20 | Flip Chip Technologies L.L.C. | Chip scale package using large ductile solder balls |
EP1036414A4 (en) * | 1997-10-20 | 2001-11-14 | Flip Chip Technologies L L C | Chip scale package using large ductile solder balls |
EP2053655A3 (en) * | 1997-10-20 | 2009-09-09 | FlipChip International L.L.C. | Chip scale package using large ductile solder balls |
WO1999063795A1 (en) * | 1998-06-02 | 1999-12-09 | Siemens S. A. | Method for producing wirings having solder bumps |
US7834449B2 (en) | 2007-04-30 | 2010-11-16 | Broadcom Corporation | Highly reliable low cost structure for wafer-level ball grid array packaging |
US7872347B2 (en) | 2007-08-09 | 2011-01-18 | Broadcom Corporation | Larger than die size wafer-level redistribution packaging process |
US8643164B2 (en) | 2009-06-11 | 2014-02-04 | Broadcom Corporation | Package-on-package technology for fan-out wafer-level packaging |
Also Published As
Publication number | Publication date |
---|---|
KR19980703571A (en) | 1998-11-05 |
EP0819318B1 (en) | 2003-05-14 |
CN1183169A (en) | 1998-05-27 |
ATE240586T1 (en) | 2003-05-15 |
DE69628161D1 (en) | 2003-06-18 |
HK1008266A1 (en) | 1999-05-07 |
KR19987003571A (en) | 1998-11-05 |
AU5316996A (en) | 1996-10-23 |
US6389691B1 (en) | 2002-05-21 |
JPH11503566A (en) | 1999-03-26 |
JP3549208B2 (en) | 2004-08-04 |
US5892179A (en) | 1999-04-06 |
CN1179412C (en) | 2004-12-08 |
US6329608B1 (en) | 2001-12-11 |
EP0819318A1 (en) | 1998-01-21 |
KR100425750B1 (en) | 2004-07-16 |
DE69628161T2 (en) | 2004-03-25 |
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