WO1995030200A1 - Temperature management for integrated circuits - Google Patents
Temperature management for integrated circuits Download PDFInfo
- Publication number
- WO1995030200A1 WO1995030200A1 PCT/US1995/004919 US9504919W WO9530200A1 WO 1995030200 A1 WO1995030200 A1 WO 1995030200A1 US 9504919 W US9504919 W US 9504919W WO 9530200 A1 WO9530200 A1 WO 9530200A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- temperature
- clock rate
- package
- functional area
- clock
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 17
- 230000004075 alteration Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 11
- 230000020169 heat generation Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 230000006903 response to temperature Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
- H01L27/0211—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique adapted for requirements of temperature
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/725—Cordless telephones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M3/00—Automatic or semi-automatic exchanges
- H04M3/42—Systems providing special services or facilities to subscribers
- H04M3/42314—Systems providing special services or facilities to subscribers in private branch exchanges
- H04M3/42323—PBX's with CTI arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
- H04N2201/0008—Connection or combination of a still picture apparatus with another apparatus
- H04N2201/0034—Details of the connection, e.g. connector, interface
- H04N2201/0048—Type of connection
- H04N2201/0049—By wire, cable or the like
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
- H04N2201/0008—Connection or combination of a still picture apparatus with another apparatus
- H04N2201/0034—Details of the connection, e.g. connector, interface
- H04N2201/0048—Type of connection
- H04N2201/0051—Card-type connector, e.g. PCMCIA card interface
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
- H04N2201/0008—Connection or combination of a still picture apparatus with another apparatus
- H04N2201/0034—Details of the connection, e.g. connector, interface
- H04N2201/0048—Type of connection
- H04N2201/0053—Optical, e.g. using an infrared link
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Microcomputers (AREA)
- Power Sources (AREA)
- Control Of Temperature (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT95917105T ATE202427T1 (en) | 1994-04-28 | 1995-04-21 | TEMPERATURE MANAGEMENT FOR INTEGRATED CIRCUITS |
EP95917105A EP0757821B1 (en) | 1994-04-28 | 1995-04-21 | Temperature management for integrated circuits |
DE69521426T DE69521426T2 (en) | 1994-04-28 | 1995-04-21 | TEMPERATURE MANAGEMENT FOR INTEGRATED CIRCUITS |
JP52829795A JP3253969B2 (en) | 1994-04-28 | 1995-04-21 | Thermal management for integrated circuits |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/234,344 | 1994-04-28 | ||
US08/234,344 US5502838A (en) | 1994-04-28 | 1994-04-28 | Temperature management for integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1995030200A1 true WO1995030200A1 (en) | 1995-11-09 |
Family
ID=22880978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1995/004919 WO1995030200A1 (en) | 1994-04-28 | 1995-04-21 | Temperature management for integrated circuits |
Country Status (6)
Country | Link |
---|---|
US (1) | US5502838A (en) |
EP (1) | EP0757821B1 (en) |
JP (1) | JP3253969B2 (en) |
AT (1) | ATE202427T1 (en) |
DE (1) | DE69521426T2 (en) |
WO (1) | WO1995030200A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19812921A1 (en) * | 1998-03-24 | 1999-09-30 | Siemens Ag | VLSI circuit with temperature monitoring |
EP0978781A2 (en) * | 1998-08-03 | 2000-02-09 | Lucent Technologies Inc. | Power reduction in a multiprocessor digital signal processor |
DE102005061358A1 (en) * | 2005-12-21 | 2007-07-05 | Siemens Ag | Switching circuit integrated in semiconductor material for measuring signals of sensors assigned to integrated switching circuit, has active components, temperature sensor and circuit |
WO2008132106A2 (en) * | 2007-04-26 | 2008-11-06 | Continental Teves Ag & Co. Ohg | Integrated circuit arrangement for safety critical regulation systems |
Families Citing this family (172)
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Also Published As
Publication number | Publication date |
---|---|
US5502838A (en) | 1996-03-26 |
JPH09512654A (en) | 1997-12-16 |
DE69521426D1 (en) | 2001-07-26 |
JP3253969B2 (en) | 2002-02-04 |
EP0757821B1 (en) | 2001-06-20 |
DE69521426T2 (en) | 2002-05-16 |
ATE202427T1 (en) | 2001-07-15 |
EP0757821A4 (en) | 1997-08-13 |
EP0757821A1 (en) | 1997-02-12 |
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