WO1995026676A1 - Pulse oximeter and sensor optimized for low saturation - Google Patents
Pulse oximeter and sensor optimized for low saturation Download PDFInfo
- Publication number
- WO1995026676A1 WO1995026676A1 PCT/US1995/004050 US9504050W WO9526676A1 WO 1995026676 A1 WO1995026676 A1 WO 1995026676A1 US 9504050 W US9504050 W US 9504050W WO 9526676 A1 WO9526676 A1 WO 9526676A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- sensor
- spectrum
- oxygen saturation
- red
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
- A61B5/1464—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters specially adapted for foetal tissue
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/14542—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring blood gases
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0233—Special features of optical sensors or probes classified in A61B5/00
- A61B2562/0242—Special features of optical sensors or probes classified in A61B5/00 for varying or adjusting the optical path length in the tissue
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/72—Signal processing specially adapted for physiological signals or for diagnostic purposes
- A61B5/7203—Signal processing specially adapted for physiological signals or for diagnostic purposes for noise prevention, reduction or removal
- A61B5/7207—Signal processing specially adapted for physiological signals or for diagnostic purposes for noise prevention, reduction or removal of noise induced by motion artifacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- Figs. 26A-B are diagrams of a single package, dual emitter package used in the present invention.
- Fig. 3 illustrates the layers of tissue in a typical fetus location where a sensor may be applied. Typically, there would be a first layer of skin 12, perhaps followed by a layer of fat 14, a layer of muscle 16, and a layer of bone 18. This is a simplified view for illustration purposes only.
- the contours and layers can vary at different locations. For instance, bone would be closer to the surface on the forehead, as opposed to closer muscle on the neck. Such variations in sites can produce the first type of perturbation artifact mentioned in the summary—artifact due to variations in tissue composition.
- LEDs have a spectral width, and are not a single narrowband wavelength device like a laser.
- Fig. 6 illustrates the spectral spread of one preferred wavelength for a sensor according to the present invention, showing the far red wavelength at 735 nm as being the peak wavelength.
- arrow 510 indicates a distribution of wavelengths which can be approximately 25 nm wide at which the intensity level is approximately 50% of that of the peak wavelength.
- this optimum balance occurs with the pairing of wavelengths with a red emitter in the 660 nm band, while at the lower saturations the balance improves with the use of a red emitter in the 730 nm band.
- the variation of the IR LED from 805 to 940 nm does not produce a significant difference in performance.
- the sensitivity of modulation ratio to changes in oxygen saturation i.e., the slope of the curve in, for example, Fig. 1
- the measurement becomes more robust to changes in the tissue characteristics other than oxygen saturation.
- the present invention can be embodied in other specific forms without departing from the essential characteristics thereof.
- the wavelength could be varied while still optimizing in accordance with the present invention.
- light pipes, light fibers, multiple filters, or multiple detectors could be used in accordance with the concepts of the present invention.
- Different sensors than the fulcrum structure as set forth in Fig. 25 could be used, such as a bladder structure for inflating and holding the sensor against the fetus. Accordingly, reference should be made to the appended claims for defining the scope of the invention.
Abstract
Description
Claims
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NZ283905A NZ283905A (en) | 1994-04-01 | 1995-03-31 | Pulse oximeter and sensor: monitoring arterial blood oxygen saturation |
BR9507265A BR9507265A (en) | 1994-04-01 | 1995-03-31 | Pulse oximeter and sensor optimized for low saturation |
DK95915494T DK0754007T3 (en) | 1994-04-01 | 1995-03-31 | Pulse oximetry sensor optimized for low saturation |
JP7525875A JPH10500323A (en) | 1994-04-01 | 1995-03-31 | Pulse oximeter and sensor optimized for low saturation |
CA2186225A CA2186225C (en) | 1994-04-01 | 1995-03-31 | Pulse oximeter and sensor optimized for low saturation |
AU22360/95A AU705934B2 (en) | 1994-04-01 | 1995-03-31 | Pulse oximeter and sensor optimized for low saturation |
DE69518235T DE69518235T2 (en) | 1994-04-01 | 1995-03-31 | SPECIFICALLY OPTIMIZED PULSOXIMETER SAMPLE FOR LOW SATURATION |
AT95915494T ATE195063T1 (en) | 1994-04-01 | 1995-03-31 | PULSE OXIMETER SAMPLE SPECIALLY OPTIMIZED FOR LOW SATURATION |
EP95915494A EP0754007B1 (en) | 1994-04-01 | 1995-03-31 | Pulse oximeter sensor optimized for low saturation |
FI963921A FI963921A (en) | 1994-04-01 | 1996-09-30 | Pulse oximeter and sensor optimized for low saturation |
NO964143A NO964143L (en) | 1994-04-01 | 1996-09-30 | Pulse oximeter and sensor optimized for low metering |
GR20000402400T GR3034711T3 (en) | 1994-04-01 | 2000-10-30 | Pulse oximeter and sensor optimized for low saturation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/221,911 US5421329A (en) | 1994-04-01 | 1994-04-01 | Pulse oximeter sensor optimized for low saturation |
US08/221,911 | 1994-04-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1995026676A1 true WO1995026676A1 (en) | 1995-10-12 |
Family
ID=22829941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1995/004050 WO1995026676A1 (en) | 1994-04-01 | 1995-03-31 | Pulse oximeter and sensor optimized for low saturation |
Country Status (18)
Country | Link |
---|---|
US (3) | US5421329A (en) |
EP (2) | EP0992214B1 (en) |
JP (1) | JPH10500323A (en) |
KR (1) | KR100376649B1 (en) |
CN (1) | CN1100514C (en) |
AT (2) | ATE195063T1 (en) |
AU (1) | AU705934B2 (en) |
BR (1) | BR9507265A (en) |
CA (1) | CA2186225C (en) |
DE (2) | DE69533927T2 (en) |
DK (2) | DK0992214T3 (en) |
ES (2) | ES2237028T3 (en) |
FI (1) | FI963921A (en) |
GR (1) | GR3034711T3 (en) |
NO (1) | NO964143L (en) |
NZ (1) | NZ283905A (en) |
PT (2) | PT992214E (en) |
WO (1) | WO1995026676A1 (en) |
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US8159664B2 (en) | 2004-12-09 | 2012-04-17 | The Science And Technology Facilities Council | Apparatus for depth-selective Raman spectroscopy |
CN103784150A (en) * | 2012-10-30 | 2014-05-14 | 东莞永胜医疗制品有限公司 | Blood oxygen saturation measuring method and instrument |
WO2014188906A1 (en) * | 2013-05-24 | 2014-11-27 | 国立大学法人浜松医科大学 | Near infrared oxygen concentration sensor for palpation |
US8923944B2 (en) | 2007-03-09 | 2014-12-30 | Covidien Lp | Cancellation of light shunting |
US9226645B2 (en) | 2004-12-08 | 2016-01-05 | The General Hospital Corporation | System and method for normalized diffuse emission epi-illumination imaging and normalized diffuse emission transillumination imaging |
US10806355B2 (en) | 2014-07-18 | 2020-10-20 | Well Being Digital Limited | Device and method suitable for monitoring arterial blood in a body part |
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