WO1995008844A1 - Cooling device for a power semiconductor module - Google Patents

Cooling device for a power semiconductor module Download PDF

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Publication number
WO1995008844A1
WO1995008844A1 PCT/DE1994/001071 DE9401071W WO9508844A1 WO 1995008844 A1 WO1995008844 A1 WO 1995008844A1 DE 9401071 W DE9401071 W DE 9401071W WO 9508844 A1 WO9508844 A1 WO 9508844A1
Authority
WO
WIPO (PCT)
Prior art keywords
power semiconductor
base plate
semiconductor module
cooling device
cooling component
Prior art date
Application number
PCT/DE1994/001071
Other languages
German (de)
French (fr)
Inventor
Reinhold Kuhnert
Walter Kiffe
Hans-Joachim Knaak
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1995008844A1 publication Critical patent/WO1995008844A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • a liquid-cooled semiconductor rectifier arrangement is known from German utility model 75 39 365, in which rectifier elements are fastened to metallized surface sections of a thermally highly conductive insulating material pane and the insulating material pane is either soldered onto a cooling component made of copper or metallized onto a cooling component made of copper Cooling component made of ceramic z. B. is glued, wherein the cooling component is flowed through by a liquid coolant and thus cooled.
  • the disadvantage here is that no conventional standard modules can be used and the semiconductor rectifier arrangement can only be used sensibly for liquid cooling due to the fixed connection to the cooling component.
  • the cooling component has a high weight and bores to be provided for coolant channels are comparatively complex to produce.
  • the object on which the invention is based is to provide a cooling device for power semiconductor modules which is particularly suitable for commercially available standard power semiconductor modules, in which the power module and the cooling component are detachably connected and which has the lowest possible heat transfer resistance between the power semiconductor module and the coolant .
  • This object is achieved by the features of patent claim 1.
  • Claims 2 to 4 are directed to advantageous embodiments of the invention and claim 5 to a preferred use of the invention.
  • Figure 1 is a sectional view of a cooling device according to the invention.
  • FIG. 2 shows a sectional illustration of a further cooling device according to the invention.
  • FIG. 1 shows a cooling device according to the invention, in which a cooling component KB has a trough-shaped depression W on one side S with an inlet opening E and an outlet opening A for a liquid coolant K, and in which the trough-shaped depression of the cooling component is completely covered by a metallic base plate M of a standard power semiconductor module LHM is completed and the metallic base plate M itself forms part of the cooling device.
  • the power semiconductor module LHM is essentially constructed in such a way that a good heat-conducting insulation layer ISO, for example made of ceramic material, is applied to the metallic base plate M, which has fastening holes, for example, and at least one semiconductor chip CHIP is applied to the insulation layer is, the connection between the semiconductor chip and the insulation layer and the connection between the insulation layer and the metallic base plate being insignificant for the invention.
  • a housing part enclosing the insulation layer ISO and the semiconductor chip CHIP is indicated in FIG.
  • the object of FIG. 2 differs from the object of FIG. 1 by another module LHM ', which has a different base plate M', and by cooling component KB 'without a trough-shaped recess.
  • finger or rib-like structures R are provided in the metallic base plate M ', which is somewhat thicker than in FIG. 1, and which can be linear or undulating in the direction of flow.
  • These rib-like structures R can be produced very easily, for example by milling or embossing the essentially flat base plate M ', and are, for example, approximately 1 mm wide and a few millimeters deep.
  • the cooling component KB ' is shown without a trough-shaped recess and has openings on one end face which enable the channels between the finger-like or rib-like structures to be supplied and disposed of.
  • the finger- or rib-like structures create a cooling duct cooling fin system of high efficiency, in which the heat transfer area is enlarged and a turbulent one
  • the cooling component KB or KB 'can consist, for example, of metal, ceramic or plastic, plastic being particularly advantageous because of its low weight, low sensitivity to breakage and ease of manufacture.
  • a cooling component can be implemented, for example, as a plastic injection molded part.
  • the power semiconductor module LHM is attached to the cooling component KB using screws S1 and S2, for example.
  • a frame-shaped groove N can advantageously be inserted into the cooling component KB around the trough-shaped recess in the side S facing the metallic base plate M or M ' Seal DI made of elastic material, such as VITON, is introduced.
  • the cooling component KB consists entirely of hard rubber and that the seal DI is taken into account as a sealing lip when shaping the component KB.
  • the component KB can be connected to the power semiconductor module, for example, by metal clips attached to the side.
  • the flow rate of the liquid coolant K is typically between 1 and 10 liters per minute for a power semiconductor module with a base plate dimension of 95 ⁇ 34 mm ⁇ .
  • a cooling device can be used in electric vehicles and mobile electrical systems, such as, for example, computer tomographs, since the properties specified in the task are advantageous here.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The subject of the application pertains to a structure consisting of a cooling component (KB) which has on one side (S) a pan-shaped cavity with an inlet (E) and an outlet (A) for a liquid coolant and on which a metal base plate (M) of the power semiconductor module is mounted so that the metal base plate completely seals off the pan-shaped cavity, with the metal base plate itself forming part of the cooling device. The advantages are primarily those of low weight, low heat transmission resistance between module and coolant despite a detachable connection between module and cooling component and applicability in commercially available standard power semiconductor modules.

Description

Kühlvorrichtung für ein LeistungshalbleitermodulCooling device for a power semiconductor module
Aus dem deutschen Gebrauchsmuster 75 39 365 ist eine flüssig- eitsge ühlte Halbleitergleichrichteranordnung bekannt, bei der Gleichrichterelemente auf metallisierten Flächenabschnit¬ ten einer thermisch gut leitenden Isolierstoffscheibe befe- stigt sind und die IsolierstoffScheibe entweder über metalli¬ sierte Flächen auf ein Kühlbauteil aus Kupfer aufgelötet oder ein Kühlbauteil aus Keramik z. B. aufgeklebt ist, wobei das Kühlbauteil von einem flüssigem Kühlmittel durchströmt und damit abgekühlt wird. Nachteilig ist hierbei, daß keine üb- liehen Standard-Module verwendbar sind und die Halbleiter¬ gleichrichteranordnung infolge der festen Verbindung mit dem Kühlbauteil nur noch sinnvoll für Flüssigkeitskühlung ein¬ setzbar ist. Im Falle eines Kühlbauteils aus Kupfer, weist das Kühlbauteil ein hohes Gewicht auf und hierbei vorzuse- hende Bohrungen für Kühlmittelkanäle sind vergleichsweise aufwendig herzustellen.A liquid-cooled semiconductor rectifier arrangement is known from German utility model 75 39 365, in which rectifier elements are fastened to metallized surface sections of a thermally highly conductive insulating material pane and the insulating material pane is either soldered onto a cooling component made of copper or metallized onto a cooling component made of copper Cooling component made of ceramic z. B. is glued, wherein the cooling component is flowed through by a liquid coolant and thus cooled. The disadvantage here is that no conventional standard modules can be used and the semiconductor rectifier arrangement can only be used sensibly for liquid cooling due to the fixed connection to the cooling component. In the case of a cooling component made of copper, the cooling component has a high weight and bores to be provided for coolant channels are comparatively complex to produce.
Die der Erfindung zugrundeliegende Aufgabe besteht nun darin, eine Kühlvorrichtung für Leistungshalbleitermodule anzugeben, die besonders für handelsübliche Standard-Leistungshalblei- termodule geeignet ist, bei der das Leistungsmodul und das Kühlbauteil lösbar verbunden sind und die einen möglichst kleinen Wärmeübergangswiderstand zwischen Leistungshalblei¬ termodul und Kühlmittel aufweist. Diese Aufgabe wird durch die Merkmale des Patentanspruchs 1 gelöst.The object on which the invention is based is to provide a cooling device for power semiconductor modules which is particularly suitable for commercially available standard power semiconductor modules, in which the power module and the cooling component are detachably connected and which has the lowest possible heat transfer resistance between the power semiconductor module and the coolant . This object is achieved by the features of patent claim 1.
Die Patentansprüche 2 bis 4 sind auf vorteilhafte Ausgestal¬ tungen der Erfindung und der Patentanspruch 5 auf eine bevor¬ zugte Verwendung der Erfindung gerichtet.Claims 2 to 4 are directed to advantageous embodiments of the invention and claim 5 to a preferred use of the invention.
Di Die Erfindung wird im folgenden anhand der Zeichnung näher erläutert.Tue The invention is explained below with reference to the drawing.
Dabei zeigt:It shows:
Figur 1 eine Schnittdarstellung einer erfindungsgemäßen Kühl¬ vorrichtung undFigure 1 is a sectional view of a cooling device according to the invention and
Figur 2 eine Schnittdarstellung einer weiteren erfindungsge- mäßen Kühlvorrichtung.FIG. 2 shows a sectional illustration of a further cooling device according to the invention.
Figur 1 zeigt eine erfindungsgemäße Kühlvorrichtung, bei der ein Kühlbauteil KB an einer Seite S eine wannenförmige Ver¬ tiefung W mit einer Einlaßöffnung E und einer Auslaßöffnung A für ein flüssiges Kühlmittel K aufweist, und bei der die wannenförmige Vertiefung des Kühlbauteils vollständig durch eine metallische Bodenplatte M eines Standard-Leistungshalb¬ leitermoduls LHM abgeschlossen ist und die metallische Bo¬ denplatte M selbst einen Teil der Kühlvorrichtung bildet. Das Leistungshalbleitermodul LHM ist im wesentlichen so auf¬ gebaut, daß auf der metallischen Bodenplatte M, die bei¬ spielsweise Befestigungsbohrungen aufweist, eine gut wärme¬ leitende Isolationsschicht ISO, beispielsweise aus Keramik¬ material, und auf der Isolationsschicht mindestens ein Halb- leiterchip CHIP aufgebracht ist, wobei die Verbindung zwi¬ schen dem Halbleiterchip und der Isolationsschicht und die Verbindung zwischen der Isolationsschicht und der metalli¬ schen Bodenplatte für die Erfindung unwesentlich sind. In der Figur 1 ist neben der metallischen Bodenplatte ein die Iso- lationsschicht ISO und das Halbleiterchip CHIP umschließender Gehäuseteil in Bruchdarstellung angedeutet.FIG. 1 shows a cooling device according to the invention, in which a cooling component KB has a trough-shaped depression W on one side S with an inlet opening E and an outlet opening A for a liquid coolant K, and in which the trough-shaped depression of the cooling component is completely covered by a metallic base plate M of a standard power semiconductor module LHM is completed and the metallic base plate M itself forms part of the cooling device. The power semiconductor module LHM is essentially constructed in such a way that a good heat-conducting insulation layer ISO, for example made of ceramic material, is applied to the metallic base plate M, which has fastening holes, for example, and at least one semiconductor chip CHIP is applied to the insulation layer is, the connection between the semiconductor chip and the insulation layer and the connection between the insulation layer and the metallic base plate being insignificant for the invention. In addition to the metallic base plate, a housing part enclosing the insulation layer ISO and the semiconductor chip CHIP is indicated in FIG.
Der Gegenstand von Figur 2 unterscheidet sich gegenüber dem Gegenstand von Figur 1 durch ein anderes Modul LHM', das eine andere Bodenplatte M' aufweist, und durch Kühlbauteil KB' ohne wannenförmiger Vertiefung. Hierbei sind in der etwas dicker als bei Fig. 1 ausgeführten metallischen Bodenplatte M' finger- oder rippenartige Struk¬ turen R vorgesehen, die in Flußrichtung linear oder wellen¬ förmig ausgeführt sein können. Diese rippenartigen Strukturen R sind beispielsweise durch Fräsen oder Prägen der metalli¬ schen im wesentlichen ebenen Bodenplatte M' sehr einfach her¬ stellbar und sind beispielsweise ca. 1 mm breit und einige Millimeter tief. Bei der Modul-Herstellung ergibt sich kein nennenswerter Unterschied, da nur strukturierte Bodenplatten an Stelle von unstrukturierten Standard-Bodenplatten Verwen¬ dung finden.The object of FIG. 2 differs from the object of FIG. 1 by another module LHM ', which has a different base plate M', and by cooling component KB 'without a trough-shaped recess. In this case, finger or rib-like structures R are provided in the metallic base plate M ', which is somewhat thicker than in FIG. 1, and which can be linear or undulating in the direction of flow. These rib-like structures R can be produced very easily, for example by milling or embossing the essentially flat base plate M ', and are, for example, approximately 1 mm wide and a few millimeters deep. There is no significant difference in module production, since only structured floor plates are used instead of unstructured standard floor plates.
Das Kühlbauteil KB' ist in diesem Fall ohne wannenförmige Vertiefung angeführt, und weist an einer Stirnseite Öffnungen auf, die eine Ver- und Entsorgung der Kanäle zwischen den finger- oder rippenartigen Strukturen ermöglichen.In this case, the cooling component KB 'is shown without a trough-shaped recess and has openings on one end face which enable the channels between the finger-like or rib-like structures to be supplied and disposed of.
Durch die finger- oder rippenartigen Strukturen entsteht ein Kühlkanal-Kühlrippensystem von hoher Effizienz, bei dem die Wärmeübertrittsfläche vergrößert ist und eine turbolenteThe finger- or rib-like structures create a cooling duct cooling fin system of high efficiency, in which the heat transfer area is enlarged and a turbulent one
Strömung bereits bei kleiner Strömungsgeschwindigkeit erzielt wird.Flow is achieved even at low flow speeds.
Ferner sind beispielsweise Ausgestaltungen der Erfindung denkbar, bei denen die finger- oder rippenartigen Strukturen R erhaben sind und in die wannenförmige Vertiefung W hinein¬ ragen.Furthermore, for example, embodiments of the invention are conceivable in which the finger-like or rib-like structures R are raised and protrude into the trough-shaped depression W.
Das Kühlbauteil KB bzw. KB' kann dabei beispielsweise aus Me- tall, Keramik oder Kunststoff bestehen, wobei Kunststoff we¬ gen des geringen Gewichts, der geringen Bruchempfindlichkeit und der einfachen Herstellbarkeit besonders vorteilhaft ist. Ein solches Kühlbauteil ist beispielsweise als Kunst¬ stoffspritzgußteil ausführbar. Eine Befestigung des Leistungshalbleitermoduls LHM auf dem Kühlbauteil KB erfolgt beispielsweise mit Hilfe von Schrauben Sl und S2.The cooling component KB or KB 'can consist, for example, of metal, ceramic or plastic, plastic being particularly advantageous because of its low weight, low sensitivity to breakage and ease of manufacture. Such a cooling component can be implemented, for example, as a plastic injection molded part. The power semiconductor module LHM is attached to the cooling component KB using screws S1 and S2, for example.
Um eine Abdichtung zwischen dem Leistungshalbleitermodul LHM und dem Kühlbauteil KB zu erzielen, kann vorteilhafter Weise um die wannenförmige Vertiefung in die der metallischen Bo¬ denplatte M bzw. M' zugewandten Seite S eine rahmenförmige Nut N in das Kühlbauteil KB eingelassen sein, in die eine Dichtung DI aus elastischem Material, beispielsweise VITON, eingebracht ist.In order to achieve a seal between the power semiconductor module LHM and the cooling component KB, a frame-shaped groove N can advantageously be inserted into the cooling component KB around the trough-shaped recess in the side S facing the metallic base plate M or M ' Seal DI made of elastic material, such as VITON, is introduced.
Als weitere konstuktive Variante wäre denkbar, daß das Kühl- bauteil KB insgesamt aus Hartgummi besteht und die Dichtung DI als Dichtungslippe bei der Formgebung des Bauteils KB mit berücksichtigt wird. Das Bauteil KB kann dabei beispielsweise durch seitlich angebrachte Metallspangen mit dem Lei¬ stungshalbleitermodul verbunden werden.As a further constructive variant, it would be conceivable that the cooling component KB consists entirely of hard rubber and that the seal DI is taken into account as a sealing lip when shaping the component KB. The component KB can be connected to the power semiconductor module, for example, by metal clips attached to the side.
Bei einer unstrukturierten Modulunterseite liegt die Durch¬ flußmenge des flüssigen Kühlmittels K typischerweise zwischen 1 und 10 Liter pro Minute für ein Leistungshalbleitermodul mit einer Bodenplattenabmessung von 95 x 34 mm^.In the case of an unstructured module underside, the flow rate of the liquid coolant K is typically between 1 and 10 liters per minute for a power semiconductor module with a base plate dimension of 95 × 34 mm ^.
Eine Kühlvorrichtung nach der Erfindung kann erfindungsgemäß in Elektrofahrzeugen und mobilen elektrischen Anlagen, wie beispielsweise Computertomographen, Verwendung finden, da die in der Aufgabenstellung näher spezifizierter Eigenschaften hierbei von Vorteil sind. According to the invention, a cooling device according to the invention can be used in electric vehicles and mobile electrical systems, such as, for example, computer tomographs, since the properties specified in the task are advantageous here.

Claims

Patentansprüche: Claims:
1. Kühlvorrichtung für ein handelsübliches Standard-Lei¬ stungshalbleitermodul (LHM) , mit einem Kühlbauteil (KB) , das an einer Seite eine wannenförmige Vertiefung (W) mit einer Einlaß- und einer Auslaßöffnung (E, A) für ein flüssiges Kühlmittel (K) aufweist, das mit dem Standard-Leistungshalb¬ leitermodul lösbar verbunden ist, und auf das eine metalli¬ sche Bodenplatte (M) des Leistungshalbleitermoduls derart aufgebracht ist, daß die metallische Bodenplatte die wannen¬ förmige Vertiefung völlig abschließt, wobei die metallische Bodenplatte selbst einen Teil der Kühlvorrichtung bildet.1. Cooling device for a commercially available standard power semiconductor module (LHM), with a cooling component (KB), which has on one side a trough-shaped recess (W) with an inlet and an outlet opening (E, A) for a liquid coolant (K ), which is detachably connected to the standard power semiconductor module, and to which a metallic base plate (M) of the power semiconductor module is applied in such a way that the metallic base plate completely closes off the trough-shaped recess, the metallic base plate itself Forms part of the cooling device.
2. Kühlvorrichtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß das Kühlbauteil (K) um die wannenförmige Vertiefung herum eine rahmenförmige Nut (N) aufweist, in die eine Dichtung (DI) aus elastischem Material eingebracht ist und daß das Leistungshalbleitermodul mit seiner metallischen Grundplatte auf das Kühlbauteil mit Hilfe von Schrauben (Sl, S2) befe¬ stigt ist.2. Cooling device according to claim 1, characterized in that the cooling component (K) around the trough-shaped recess has a frame-shaped groove (N) into which a seal (DI) made of elastic material is introduced and that the power semiconductor module with its metallic base plate on the Cooling component is fastened with the aid of screws (S1, S2).
3. Kühlvorrichtung nach Anspruch 1 oder 2 , d a d u r c h g e k e n n z e i c h n e t , daß das Kühlbauteil (KB) aus einem Kunststoffspitzgußteil be¬ steht.3. Cooling device according to claim 1 or 2, so that the cooling component (KB) consists of a plastic injection molded part.
4. Kühlvorrichtung nach einem der Ansprüche 1 bis 3, g e k e n n z e i c h n e t d u r c h die Änderung, daß an- stelle eines handelsüblichen Standard-Leistungshalbleitermo¬ duls ein Leistungshalbleitermodul (LHM1) vorgesehen ist, des¬ sen metallische Bodenplatte (M') eine finger- oder rippenar¬ tige Struktur (R) aufweist, deren Zwischenräume vom Kühlmit¬ tel durchflössen sind, und daß anstelle des Kühlbauteils mit wannenförmiger Vertiefung ein Kühlbauteil (KB1) vorgesehen ist, das an einer Stirnseite lediglich Öffnungen (01, 02) zur Ver- und Entsorgung der Zwischenräume in der Bodenplatte des Leistungshalbleitermoduls mit Kühlmittel aufweist.4. Cooling device according to one of claims 1 to 3, characterized by the change that instead of a commercially available standard power semiconductor module, a power semiconductor module (LHM 1 ) is provided, its metallic base plate (M ') is a finger or ribbed element term structure (R), the gaps through which the coolant flows, and that instead of the cooling component with a trough-shaped depression, a cooling component (KB 1 ) is provided which only has openings (01, 02) on one end face Supply and disposal of the spaces in the base plate of the power semiconductor module with coolant.
5. Kühlvorrichtung nach einem der vorhergehenden Ansprüche, g e k e n n z e i c h n e t d u r c h ihre Verwendung in Elektrofahrzeugen und mobilen elektrischen5. Cooling device according to one of the preceding claims, g e k e n n z e i c h n e t d u r c h their use in electric vehicles and mobile electrical
Anlagen. Investments.
PCT/DE1994/001071 1993-09-21 1994-09-16 Cooling device for a power semiconductor module WO1995008844A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4332077.5 1993-09-21
DE4332077 1993-09-21

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Cited By (14)

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WO1998003997A1 (en) * 1996-07-22 1998-01-29 Northrop Grumman Corporation Closed loop liquid cooling within rf modules
DE19833707A1 (en) * 1998-07-27 2000-02-10 Abb Daimler Benz Transp Cooler for fluid cooling electronic component; has long thin cooling channel with length between twenty and two hundred times its height
FR2786658A1 (en) * 1998-11-27 2000-06-02 Alstom Technology Composite structure for electronic power components including cooling system, comprising channels for passage of coolant in lower conductor or semiconductor layer
EP1253639A2 (en) * 2001-04-27 2002-10-30 Aavid Thermalloy S.r.l. A fluid-cooled heat sink for electronic components
WO2008029858A1 (en) 2006-09-05 2008-03-13 Kabushiki Kaisha Toshiba Semiconductor package and semiconductor package assembly
FR2911247A1 (en) * 2007-01-08 2008-07-11 Sames Technologies Soc Par Act Electronic board, has nozzles traversing projection plate by following projection direction, where projection direction of each nozzle forms specific angle with respect to direction perpendicular to base plate
WO2008089711A1 (en) * 2007-01-22 2008-07-31 Siemens Aktiengesellschaft Device for cooling components
WO2012139196A1 (en) * 2011-04-13 2012-10-18 Tm4 Inc. Cooling device with bypass channel
EP2559964A1 (en) * 2011-08-15 2013-02-20 Pierburg GmbH Cooling device for a thermally loaded component
US9326421B2 (en) 2011-01-14 2016-04-26 Azur Space Solar Power Gmbh Arrangement and method for cooling a support
CN106257656A (en) * 2015-06-17 2016-12-28 Zf腓德烈斯哈芬股份公司 For cooling down the device of power model
CN106304811A (en) * 2016-10-19 2017-01-04 中国科学院光电研究院 A kind of electronic system from radiator structure
EP3324449A1 (en) * 2016-11-21 2018-05-23 Solergy Italia S.r.l. Receiver device for concentrating photovoltaic systems
US10262921B2 (en) 2015-01-15 2019-04-16 Lappeenrannan Teknillinen Yliopisto Semiconductor module

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FR2500215A1 (en) * 1981-02-13 1982-08-20 Thomson Csf Heat sink for encapsulated power semiconductor device - has finned high thermal conductivity base plate with cover, channels and deflector for coolant circulation
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