USRE40145E1 - Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices - Google Patents
Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices Download PDFInfo
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- USRE40145E1 USRE40145E1 US10/773,810 US77381004A USRE40145E US RE40145 E1 USRE40145 E1 US RE40145E1 US 77381004 A US77381004 A US 77381004A US RE40145 E USRE40145 E US RE40145E
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
- B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
- B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/342—Chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/04—Time
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2327/00—Polyvinylhalogenides
- B32B2327/06—PVC, i.e. polyvinylchloride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2429/00—Carriers for sound or information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/109—Embedding of laminae within face of additional laminae
Definitions
- the present invention relates generally to an ultra-thin flexible durable identification device and the manufacture thereof, and more particularly to radio frequency identification (RFID) devices and the manufacture of RFID devices that can be made in many shapes and sizes and that have superior outer surface matte or glossy such that device may receive dye sublimation printing or the like.
- RFID radio frequency identification
- Identification devices such as cards, badges, tags labels and bracelets have been used for years for all kinds of identification, such as passports, luggage, all kinds of tickets, hospital/pharmacy medical records and access passes, all of which have not been totally free from theft and counterfeit resulting in the loss of thousands of dollars.
- identification devices With the rapid progress in new technology the problems associated with the use of such identification devices are being replaced with a more secure identification device having a RFID smart chip that gives more information such as biometrics and read write technology. Thus this more secure plastic device is very difficult or impossible to fraudulently manipulate.
- the present invention is therefore directed to a ultra-thin flexible durable plastic device made in all shapes and sizes having at least one electronic element embedded therein and to a hot or cold lamination method for the manufacture of plastic devices including at least one electronic element therein.
- the device can be used as cards, tags, badges, bracelets and labels.
- the device is durable and flexible and it can be used as a sticker when adhesive is applied because it is ultra-thin.
- the device has an overall thickness in the range of 0.005 inches to 0.033 inches and comprises a plastic or other substrate core having at least one electronic element embedded therein with at least one of the upper and lower surfaces of the core comprising a coating printed or otherwise applied thereon.
- the hot or cold lamination method of the present invention comprises the steps of providing first and second plastic or other substrate core sheets, positioning at least one electronic element between the first and second core sheets to thus form a core and placing the core in a laminator and closing the lamination without applying laminator ram pressure to the core.
- a heat cycle is applied to the core sheets in the laminator thus liquefying or partially liquefying the sheets.
- the laminator ram pressure is then increased in combination with the heat.
- a cooling cycle is then applied to the core in the laminator preferably with an associated increase in ram pressure, and the core is removed from the laminator.
- the sheets are then cut separating the individual device from the core sheet and this results in a plastic device having a thickness in the range of approximately 0.005 inches-0.033 inches with a surface glossy or matte dependent on customer's request.
- the invention is also directed to a device manufactured in accordance with the above process which results in a plastic device having a thickness in the range of approximately 0.005 inches-0.033 inches with a surface smoothness of at least approximately 0.0005 inches.
- the present invention provides numerous advantages over known plastic devices and known plastic device with electronic elements such as a computer chip embedded therein with a pleasing aesthetic appearance and able to withstand various harsh chemicals and pressures.
- FIG. 1 is a top plan view of a radio frequency device in accordance with the present invention.
- FIG. 2 is a side elevational view of the device shown in FIG. 1 .
- FIGS. 3A-3D are top plan views of various electronic elements that may be embedded in a device in accordance with the present invention.
- FIG. 4 is an exploded schematic view of an electronic element positioned between two plastic core sheets to form a core.
- FIG. 5 is a top plan view of a plurality of electronic elements positioned on a sheet of plastic or other substrate core stock such that they may be covered by a similar sheet or core stock.
- FIG. 6 is a side plan view illustrating top and bottom sheets that may be pre-printed or blank sheets and also a schematic cross sectional view of one or more electronic elements positioned between sheets of plastic or other substrate core stock.
- FIG. 7 schematically illustrates a book comprising the core as it is positioned in a laminator apparatus.
- FIG. 8 schematically illustrates the core as it is being printed on after removal from the laminator using a printing press or similar printing apparatus.
- FIG. 9 is a cross-sectional view schematically illustrating the application of a overlaminate film to at least one side of the core beginning a second lamination step as illustrated in FIG. 10 when necessary to protect the printing.
- FIG. 10 schematically illustrates the core with overlaminate film as it is placed in a laminator for final processing to form a sheet core stock containing electronic devices.
- the present invention relates to a ultra-thin flexible durable plastic device including at least one electronic element embedded therein.
- the present invention also relates to a hot lamination process for the manufacture of plastic devices and more particularly to a hot or cold lamination process for the manufacture of plastic devices that include an electronic element such as a computer chip or other electronic element embedded therein.
- the electronic element may preform a wide variety of functions and take a wide variety of forms.
- RFID radio frequency identification
- the present invention also relates to a ultra-thin durable plastic or other composition device in all shapes and sizes that can withstand harsh chemicals and various pressures that could be used in the are-o-space industry.
- FIG. 1 there can be seen a plastic RFID device 10 manufactured in accordance with the present invention and including an electronic element 20 embedded therein.
- Device 10 includes an upper surface 12 and a lower surface 14 .
- Electronic element 20 may take a wide variety of forms and perform a wide variety of functions.
- electronic element 20 , 20 ′, 20 ′′, 20 ′′′ may be provided by a micro-chip 22 including a wire antenna 24 , connected thereto, a micro-chip 22 ′ and a circuit board antenna 24 ′, a read/write micro-chip 22 ′′ and a wire coil antenna 24 ′′, a printed screen or litho conductive metallic or carbon ink antenna 24 ′′′ or any other suitable electronic element.
- a device in accordance with the present invention has a thickness of approximately in the range of 0.005 inches to 0.033 inches with a surface smoothness of 0.0005 inches. This surface may also have a matte finish on one or more sides.
- one or more devices 10 in accordance with the present invention may be manufactured by positioning an electronic element 20 between first and second sheets of core 30 , 32 to form a core 33 .
- a plurality of devices are manufactured simultaneously, in thus, a plurality of electronic elements 20 are positioned between the first and second sheets of plastic core stock 30 , 32 (only the second sheet 32 being shown in FIG. 5 for clarity).
- electronic elements 20 are properly positioned relative to one another such that a plurality devices may be out from the resulting core stock.
- Plastic core sheets 30 - 32 may be provided by a wide variety of plastics or other substrates, the preferred being polyvinyl chloride (PVC) having a thickness in the range of 0.005 inches to 0.0225 inches. Those skilled in the art will recognize that the thickness of the plastic core sheets will depend upon the thickness of the one or more electronic elements that are to be embedded therebetween.
- PVC polyvinyl chloride
- suitable plastic include polyester, acrylonitrile-butadiene-styrene (ABS), PET or composition of many.
- laminator 40 includes upper and lower platens 42 , 44 for applying ram pressure to an article positioned therebetween.
- laminator 40 is preferably of the type having controlled platens 42 , 44 that provide both heat and chill cycles and preferably includes cycle timer to regulate cycle time.
- Core 33 is positioned between first and second laminating plates 50 , 52 , one of which is preferably matte finished to provide laminated core 33 with at least one textured outer surface.
- First and second laminating pads 60 , 62 are positioned outside of the laminating plates 50 , 52 and first and second steel plates 70 , 72 are likewise positioned outside of pads of 60 , 62 and the entire assembly forms a book 37 for being positioned in laminator 40 between plates 42 , 44 .
- the first lamination cycle is initiated by closing laminator platens 42 , 44 , preferably applying little or no ram pressure to book 37 .
- a laminator heat cycle is initiated bringing the temperature of platens 42 , 44 up to range of 275° F. to 400° F. and most preferably up to a range of 300° F. to 370° F. for a period of greater than 5 minutes and preferably in the range of 7 to 10 minutes.
- the ram pressure of laminator 40 is increased to facilitate the flow of the plastic core sheets 30 , 32 so that the one or more electronic elements 20 are encapsulated thereby, and so that sheets 30 , 32 form a uniform core 33 (seen most clearly in FIGS. 8-10 with upper and lower surfaces 34 , 35 .
- the use of matte finished laminator plates 50 , 52 provides surfaces 34 , 35 with a slightly roughened or textured quality which will facilitate the application of a coating thereto as is discussed below.
- the ram pressure applied during the heat cycle and the length of the heat cycle may vary, depending especially upon the size of sheets 30 , 32 .
- the cycle time may be in the range of 10-15 minutes.
- a ram pressure of 940.135 pounds per square inch (p.s.i.) was applied for 10-15 minutes to form a uniform core 33 , using sheets 30 , 32 , of a size in the range of 12 inches by 24 inches to 24 inches by 36 inches.
- laminator 40 applies a chill cycle to book 37 during which time and ram pressure of the laminator 40 is increased, preferably by approximately 25%, until the platens 42 , 44 have been cooled in approximately 40° F. to 65° F. for approximately 10-15 minutes. Core 33 may then be removed from laminator 40 for additional processing. If a single lamination step is used, a glossy plate might be used at this point of lamination to provide a mirror finish on the device. At this point the sheets will be ready for cutting out the devices separating the plurality of devices from the sheets.
- core 33 is coated on at least one of its upper and lower surfaces 34 , 35 with a layer of printing ink 36 .
- This may be accomplished using a wide variety of printing techniques such as offset printing, letter-press printing, screen printing, roller coating, spray printing, litho-printing and other suitable printing techniques.
- core 33 is fed in the direction indicated with arrow A through a printing press, a lithographic printer or a similar apparatus 80 . This printing step is performed to coat at least one surface 34 , 35 of core 33 with a layer of aesthetically pleasing ink 36 .
- This layer of ink 36 cosmetically hides the one or more electronic elements 20 that are embedded within core 33 and prevents these one or more electronic elements 20 from showing through the relatively thin core 33 . In this manner, the one or more electronic elements 20 encapsulated in core 33 are completely hidden from view without requiring the plastic used in the manufacture core 33 to be excessively thick.
- core 33 which now comprises a layer of ink 36 or the like on at least one surface 34 , 35 thereof, is schematically illustrated.
- a layer of overlaminate film such as clear overlaminate film 38 , 39 is positioned on at least one ink coated surface 34 , 35 of core 33 , and preferably core 33 is positioned between two similar sheets of overlaminate film 38 , 39 as shown.
- Overlaminate film is very thin, for example in the range of 0.0015 inches thick.
- a book 135 is then constructed for insertion into laminator 40 as is schematically illustrated FIG. 10 .
- Book 135 comprising core 33 , including at least one layer of ink 36 and at least one layer of overlamination film 38 , 39 is positioned between laminating plates which are preferably highly polished plates such as mirror finished stainless steel plates 90 , 92 .
- Book 135 also comprises first and second laminating pads 60 , 62 and first and second steel plates 70 , 72 as is discussed above in relation to FIG. 7 .
- the laminator When book 135 is positioned between upper and lower platens 42 , 44 of laminator 40 as shown in FIG. 10 , the laminator is closed and a heat cycle in the range of 175° F. to 300° F. and most preferably in the range of 180° F. to 275° F. is applied to book 135 for a period of 10 to 25 minutes with a ram pressure that varies depending upon sheet size or the ram size of the laminator 40 , but which is typically approximately 1000 p.s.i. with an 18 inch diameter ram.
- the laminator 40 is then caused to execute a chill cycle, preferably with a corresponding increase in ram pressure.
- the chill temperature may be in the range of 40° F. to 65° F. and last for a period of 10 to 25 minutes.
- a ram pressure increase of approximately 25% over the pressure used for the heat cycle has been found to be most preferable.
- a sheet of plastic or other substrate core stock which comprises at least core 33 with at least one surface 34 , 35 thereof covered by a layer of ink 36 and with at least one surface 34 , 35 thereof covered by a layer of overlaminate film 36 , 39 .
- plastic device stock manufactured in accordance with the present invention comprises core 33 covered on both surfaces 34 , 35 with a layer of ink 36 which is positioned between layers of overlaminate film 38 , 39 all of which has been laminated together as described.
- One or more devices 10 then may be cut from the resulting plastic core stock and device 10 will have a thickness of in the range of 0.005 inches to 0.033 inches with variation in overall thickness across the surfaces 12 , 14 thereof being no greater than approximately 0.0005 inches.
- the one or more devices 10 can thus be said to have a surface smoothness of approximately 0.0005 inches or better.
- a device 10 manufactured in accordance with the present invention includes at least one surface 12 , 14 at preferably both surfaces 12 , 14 that are sufficiently smooth and regular to receive dye sublimation printing.
Abstract
Description
Claims (44)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/773,810 USRE40145E1 (en) | 1995-10-17 | 2004-02-06 | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US568595P | 1995-10-17 | 1995-10-17 | |
US08/727,789 US5817207A (en) | 1995-10-17 | 1996-10-07 | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US09/158,290 US6214155B1 (en) | 1995-10-17 | 1998-09-22 | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US09/606,945 US6441736B1 (en) | 1999-07-01 | 2000-06-29 | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
US10/773,810 USRE40145E1 (en) | 1995-10-17 | 2004-02-06 | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/606,945 Reissue US6441736B1 (en) | 1995-10-17 | 2000-06-29 | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
Publications (1)
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USRE40145E1 true USRE40145E1 (en) | 2008-03-11 |
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US08/727,789 Expired - Lifetime US5817207A (en) | 1995-10-17 | 1996-10-07 | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US09/158,290 Expired - Lifetime US6214155B1 (en) | 1995-10-17 | 1998-09-22 | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US10/773,810 Expired - Lifetime USRE40145E1 (en) | 1995-10-17 | 2004-02-06 | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
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US08/727,789 Expired - Lifetime US5817207A (en) | 1995-10-17 | 1996-10-07 | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US09/158,290 Expired - Lifetime US6214155B1 (en) | 1995-10-17 | 1998-09-22 | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
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US20100134291A1 (en) * | 2008-12-01 | 2010-06-03 | Lavedas Thomas G | Radio frequency identification inlay with improved readability |
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Also Published As
Publication number | Publication date |
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AU8498698A (en) | 2000-02-14 |
US5817207A (en) | 1998-10-06 |
US6214155B1 (en) | 2001-04-10 |
WO2000005071A1 (en) | 2000-02-03 |
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