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Publication numberUSRE40137 E1
Publication typeGrant
Application numberUS 10/734,072
Publication date4 Mar 2008
Filing date10 Dec 2003
Priority date1 May 1997
Fee statusPaid
Also published asDE19882361T0, DE19882361T1, US6271801, US6329213, US20010002826, WO1998049653A1
Publication number10734072, 734072, US RE40137 E1, US RE40137E1, US-E1-RE40137, USRE40137 E1, USRE40137E1
InventorsMark E. Tuttle, Rickie C. Lake
Original AssigneeMicron Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Methods for forming integrated circuits within substrates
US RE40137 E1
Abstract
The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an antenna within the recess; and c) providing an integrated circuit chip and a battery in electrical connection with the antenna. In another aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a substrate having a first recess and a second recess formed therein; b) printing a conductive film between the first and second recesses and within the first and second recesses, the conductive film forming electrical interconnects between and within the first and second recesses; c) providing a first electrical component within the first recess and in electrical connection with the electrical interconnets therein; d) providing a second electrical component within the second recess and in electrical connection with the electrical interconnects therein; and e) covering the first electrical component, the second electrical component and the conductive film with at least one protective cover. In another aspect, the invention includes an embedded circuit comprising: a) a substrate having a recess therein, the recess having a bottom surface and a sidewall surface joined to the bottom surface; b) interconnect circuitry formed on the bottom and sidewall surfaces; and c) an integrated circuit chip within the recess and operatively connected to the interconnect circuitry.
Method of forming a radio frequency identification (RFID) device. In one embodiment, a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry. A conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region. A flexible film may be disposed over the recess, the integrated circuit, and the conductive material.
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Claims(58)
1. A method of forming a radio frequency communication device comprising:
providing a recess within a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna; and
wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
2. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
providing substantially an entirety of an antenna within the recess; and
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna.
3. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna; and
wherein the antenna is provided within the recess and on a portion of the substrate outside of the recess.
4. The method of claim 3 wherein the antenna comprises a predominate portion within the recess.
5. The method of claim 3 wherein the antenna comprises a predominate portion outside of the recess.
6. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna; and
wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
7. The method of claim 3 wherein at least one of the battery and the integrated circuit chip are provided at least partially within the recess.
8. The method of claim 3 wherein the battery is bonded to the substrate within the recess.
9. The method of claim 3 wherein the step of providing the antenna comprises printing a conductive film.
10. The method of claim 3 wherein the step of providing the antenna comprises pad printing a conductive film.
11. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
providing at least a portion of a loop antenna within the recess, the loop antenna comprising a bypass where portions of the antenna cross one another, the bypass comprising a dielectric material between the crossing portions of the antenna; and
providing an integrated circuit chip in operative electrical connection with the antenna.
12. The method of claim 11 wherein the portions of the antenna which cross one another are substantially perpendicular to one another.
13. A method of forming an integrated circuit within a substrate comprising:
providing a recess in a substrate;
pad printing a conductive material within the recess to form at least a portion of a conductive circuit within the recess and to form at least a portion of an antenna within the recess;
placing an integrated circuit chip within the recess and bonding the integrated circuit chip to the conductive circuit and the antenna; and
placing a battery within the recess and in electrical connection with the integrated circuit chip.
14. The method of claim 13 wherein the substrate is a card configured for carrying on a person.
15. The method of claim 13 further comprising, after the printing, providing an electroless metal within the recess to selectively plate the conductive circuit.
16. The method of claim 13 further comprising, after bonding the chip to the conductive circuit, filling the recess with a liquid encapsulation material and curing the encapsulation material into a solid mass.
17. The method of claim 13 further comprising, after bonding the chip to the conductive circuit, covering the recess with a protective cover.
18. A method of forming an integrated circuit within a substrate comprising:
providing a substrate having a recess formed therein, said recess having a bottom surface and a sidewall surface joined to the bottom surface;
pad printing a conductive film within the recess to form electrical interconnects within the recess and to form at least a portion of an antenna, the electrical interconnects extending along the bottom surface and the sidewall surface of the recess;
placing an integrated circuit chip within the recess and in electrical connection with the electrical interconnects;
covering the integrated circuit and the conductive film within the recess with a protective cover; and
wherein the integrated circuit comprises radio frequency identification device circuitry, and further comprising placing a battery within the recess and in electrical connection with the radio frequency identification device circuitry through the electrical interconnects.
19. A method of forming a device comprising:
providing a recess within a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna;
wherein the antenna crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the antenna; and
wherein the antenna includes a connection between the integrated circuit and a first antenna portion, the first antenna portion extending from at least partially within the recess to outside the recess, a second connection between the integrated circuit and a second antenna portion, the second antenna portion extending from at least partially within the recess to outside the recess, and a third antenna portion outside of the recess and coupled to the first and second antenna portions.
20. A method comprising:
forming a recess in a plastic substrate, the recess having an approximately planar bottom surface and four sidewall surfaces that slope outward from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
providing a monolithic integrated circuit chip within the recess, the chip comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions, the first and second antenna ports configured to be electrically coupled together via an antenna and, subsequent to the forming of the recess:
providing a first conductive layer coupled to the first antenna port of the chip and extending over at least a portion of a first of the sidewall surfaces; and
providing a second conductive layer coupled to the second antenna port of the chip and extending over at least a portion of a second of the sidewall surfaces.
21. The method of claim 20, wherein providing the first and second conductive layers comprises printing.
22. The method of claim 20, further comprising forming a conductive adhesive between the first conductive layer and the first antenna port and forming a conductive adhesive between the second conductive layer and the second antenna port.
23. The method of claim 20, further comprising:
providing at least a portion of an antenna over the upper surface of the substrate and coupling the antenna to the first and second conductive layers; and
providing a flexible plastic film over the recess, the chip, and the antenna, the flexible plastic film being bonded to the portion of the antenna.
24. The method of claim 20, further comprising:
providing at least a portion of an antenna formed using a first process over the upper surface of the substrate;
coupling the antenna to the first and second conductive layers, the first and second conductive layers having been formed using a second process; and
providing a flexible plastic film over the recess, the chip, and the antenna.
25. A method comprising:
providing a plastic substrate comprising a plurality of recesses, each of the recesses having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
disposing a plurality of integrated circuits within the plurality of recesses such that each of the recesses contains an integrated circuit, each of the integrated circuits comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions, the first and second antenna ports configured to be electrically coupled together via an antenna; and
providing a plurality of continuous conductive films, each of the continuous conductive films having a first portion and a second portion, the first portion being coupled to respective ones of the integrated circuits disposed within the recesses and the second portions extending above the upper surface of the substrate.
26. The method of claim 25, wherein the substrate comprises a plurality of rows of recesses and a plurality of columns of recesses.
27. The method of claim 25, further comprising covering the plurality of integrated circuits and the plurality of continuous conductive films with an insulting material initially provided as a liquid material that is subsequently cured into a non-liquid material, and wherein each of the continuous conductive films is disposed over at least one respective sidewall surface between the first and second portions.
28. The method of claim 25, wherein the continuous conductive films comprise printed films.
29. The method of claim 25, wherein the first portion of each of the continuous conductive films is coupled to respective ones of the integrated circuits using a conductive adhesive.
30. A method comprising:
forming a recess in a plastic substrate, the recess having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
providing an antenna portion disposed outside of the recess;
disposing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions;
disposing a conductive material layer over at least one of the four sidewall surfaces to couple the integrated circuit to the antenna portion outside the recess, wherein the antenna portion is configured to electrically couple the first antenna port to the second antenna port; and
providing a flexible film over the recess, the integrated circuit, and the conductive material layer.
31. The method of claim 30, wherein depositing the conductive material layer comprises printing a film.
32. The method of claim 30, further comprising coupling the integrated circuit to the conductive material layer using a conductive adhesive.
33. The method of claim 32, wherein the conductive material layer is disposed over the bottom surface at a first end and over the upper surface at a second end.
34. The method of claim 33, further comprising covering the conductive material layer with an insulating material and bonding the flexible film directly on at least a portion of the insulating material.
35. The method of claim 34, wherein the antenna comprises a material layer that is different from the conductive material layer.
36. The method of claim 30, further comprising covering the conductive material layer with an insulating material and bonding the flexible film over the insulating material.
37. The method of claim 36, wherein covering the conductive material layer with the insulating material comprises forming the insulting material directly on the conductive material layer and over the upper surface of the substrate.
38. The method of claim 37, wherein covering the conductive material layer with the insulating material includes depositing a liquid material and curing the liquid material to form the insulting material.
39. The method of claim 38, wherein depositing the conductive material layer comprises printing a film.
40. The method of claim 39, wherein the film is less than about one mil in thickness.
41. A method comprising:
providing a plastic substrate comprising a recess, the recess having a bottom surface and sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate, each of the sidewall surfaces sloping outward from the bottom surface toward the upper surface;
providing an antenna, at least a portion of which is a first conductive film disposed above the upper surface;
providing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions;
providing a second conductive film, separate from the first conductive film, having a first region coupled to the integrated circuit and a second region coupled to the portion of the antenna; and
disposing a flexible film above the recess, the antenna, the integrated circuit, and the second conductive film, and electrically coupling the first and second antenna ports together via the antenna.
42. The method of claim 41, wherein the second conductive film comprises a printed film.
43. The method of claim 41, wherein the first region of the second conductive film is disposed above the bottom surface.
44. The method of claim 41, wherein the second conductive film is disposed above at least one of the sidewall surfaces between the first and second regions.
45. The method of claim 41, further comprising bonding a conductive adhesive to the integrated circuit and to the first region of the first conductive film.
46. The method of claim 41, further comprising covering the second conductive film with an insulating material and disposing the flexible film over the insulating material.
47. The method of claim 41, wherein at least one of the sidewall surfaces slopes in at least a generally linear manner from the bottom surface.
48. The method of claim 47, further comprising covering the second conductive film with an insulating material and disposing the flexible film over the insulating material.
49. A method comprising:
providing a plastic substrate comprising a plurality of recesses, each of the recesses having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
disposing a plurality of integrated circuits within the plurality of recesses such that each of the recesses contains no more than a single respective integrated circuit, each respective integrated circuit comprising respective RFID circuitry to provide memory and processing functions, the respective RFID circuitry coupled to respective first and second antenna ports configured to be coupled together via a respective antenna; and
forming a plurality of continuous conductive films, each of the continuous conductive films having a first portion and a second portion, the first portion being coupled to respective ones of the integrated circuits disposed within the recesses and the second portion extending above the upper surface of the substrate.
50. The method of claim 49, wherein the substrate comprises a plurality of rows of recesses and a plurality of columns of recesses, and further comprising dividing the substrate into a plurality of singular substrates after forming the plurality of conductive films, each of the singular substrates comprising a single recess.
51. The method of claim 50, wherein each of the continuous conductive films is disposed above at least one respective sidewall surface between the first and second portions, and each of the singular substrates comprises two continuous conductive films.
52. The method of claim 51, wherein forming the plurality of continuous conductive films comprises printing a conductive material.
53. The method or claim 52, wherein the first portion of each of the continuous conductive films is coupled to respective ones of the integrated circuits using a conductive adhesive.
54. A method comprising:
providing a substrate comprising a recess, the recess having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate, each of the sidewall surfaces sloping outward from the bottom surface toward the upper surface;
providing an antenna, at least a portion of which is a first conductive material disposed above the upper surface;
providing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry to provide memory and processing functions and coupled to first and second antenna ports of the integrated circuit;
providing a second conductive material, separated from the first conductive material, having a first region coupled to the integrated circuit and disposed above the bottom surface, having a second region coupled to the portion of the antenna and disposed above the upper surface, and having a third region between the first and second regions and disposed above one of the sidewall surfaces; and
disposing a flexible film over the recess, the integrated circuit, the antenna, and the second conductive material, wherein the first and second antenna ports are electrically coupled together via the antenna.
55. The method of claim 54, further comprising bonding a conductive adhesive to the integrated circuit and to the first region of the second conductive material.
56. The method of claim 55, wherein providing the second conductive material comprises printing the second conductive material.
57. The method of claim 56, further comprising the second conductive material with an insulating material and disposing the flexible film over the insulating material.
58. The method of claim 57 wherein at least one of the sidewall surfaces slopes in at least a generally linear manner from the bottom surface.
Description

More than one reissue application has been filed for the reissue of U.S. Pat. No. 6,329,213 B1. The reissue applications are application Ser. Nos. 10/734,072 (the present application), 11/302,543, and 11/496,088, all of which are continuation reissues of U.S. Pat. No. 6,329,213 B1.

TECHNICAL FIELD

The invention pertains to methods of forming integrated circuits within substrates, and to embedded circuits. The invention is thought to have particular application towards methods of forming integrated circuits within personal cards, such as personal identification cards and credit cards.

BACKGROUND OF THE INVENTION

Smart cards typically include an integrated circuit providing both memory and processing functions, have words or pictures printed on them, and control who uses information stored in the integrated circuit and how the information is used.

Some smart cards have length and width dimensions corresponding to those of credit cards. The size of such smart cards is determined by an international standard (ISO 7816). ISO 7816 also defines the physical characteristics of the plastic, including temperature tolerance and flexibility. ISO 7816 also defines the position of electrical contacts and their functions, and the protocol for communications between the integrated circuit and readers (vending machines, pay phones, etc.) The term “smart card”, as used herein, is meant to include cards that include microprocessors. Such cards might not conform to ISO 7816.

Several types of plastic are used for the casings or housings of smart cards. PVC and ABS are typical. PVC can be embossed, but is not recyclable. ABS is not readily embossed, but is recyclable.

Smart cards have many different applications. For example, smart cards can be pre-paid cards used instead of money for making purchases from vending machines, gaming machines, gas stations, car washes, photocopiers, laundry machines, cinemas, fast-food restaurants, retail outlets, or anywhere where cash is used. For example, they are commonly used in Europe with public telephones. A timer is used to detect a balance from the card automatically while a conversation continues. Smart cards can be used as food stamps, or for redeeming other government-provided benefits. Because the transaction is electronic, the telephone, vending machine, etc. does not need to store cash, so risk of loss due to theft can be reduced. Change does not need to be stored and disbursed, and received payment can be directly wired to a bank. Pre-paid cards can be a form of advertising, because they can have logos or other information printed on them. The user would typically carry the card for weeks before using up the value on the card.

To authenticate a conventional credit card, a telephone call must be made to verify that sufficient funds are available. Smart cards permit such verification to be performed off-line, thus saving telecommunication charges. Smart cards thus provide an advantage over conventional credit cards. Smart cards can also be used as keys to gain access to restricted areas, such as secure areas of buildings, or to access parking lots.

Radio frequency identification devices (RFIDs) can also be considered smart cards if they include an integrated circuit. RFIDs are described in detail in U.S. patent application Ser. No. 08/705,043, filed Aug. 29, 1996, and incorporated herein by reference. RFIDs comprising integrated circuits may be referred to as intelligent RFIDs or as remote intelligent communication (RIC) devices.

Smart cards will typically contain an integrated circuit, typically provided as a packaged integrated circuit chip (IC chip). The smart card may also comprise electrical interconnects for connecting the IC chip to terminals. In other instances, the electronic interconnects will comprise an antenna, such as, for example, when the integrated circuit comprises radio frequency identification device circuitry. In other instances, an antenna, battery and IC may be inserted into smart cards. As smart cards are intended to be conveniently carried by persons, it is desirable to produce smart cards which are relatively thin, preferably having a size and shape similar to credit cards. This enables the cards to be carried on a person, such as, for example, in a persons's wallet.

SUMMARY OF THE INVENTION

The invention encompasses methods for forming integrated circuits within substrates, and embedded circuits.

In one aspect, the invention encompasses a method of forming an integrated circuit within a substrate. A recess is formed in the substrate, and an antenna is printed within the recess. An integrated circuit chip and a battery are provided in operative electrical connection with the antenna.

In another aspect, the invention encompasses a method of forming a plurality of cards. A substrate sheet is provided and a plurality of recesses are formed within the substrate sheet. The individual recesses have bottom surfaces and sidewall surfaces joined to the bottom surfaces. A conductive film is printed within the recesses to form electrical interconnects within the recesses. The electrical interconnects extend along the bottom surfaces and the sidewall surfaces of the recesses, and also on top surfaces of the substrate sheet. Integrated circuit chips are placed within the recesses and in electrical connection with the electrical interconnects. The integrated circuit chips and the conductive film within the recesses are covered with a protective cover. The substrate sheet is divided into a plurality of cards.

In another aspect, the invention encompasses an embedded circuit. The embedded circuit includes a substrate having a recess therein; a conductive circuit printed within the recess and an integrated circuit chip bonded to the conductive circuit.

In another aspect, the invention encompasses an embedded circuit. The embedded circuit includes a substrate having a recess therein; a conductive circuit provided within the recess; an integrated circuit chip bonded to the conductive circuit; and a battery in electrical connection with the integrated circuit chip.

In accordance with another embodiment, a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry. A conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region. A flexible film may be disposed over the recess, the integrated circuit, and the conductive material.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below with reference to the following accompanying drawings.

FIG. 1 is a schematic perspective view of a card and a printing pad at a preliminary step of a first embodiment method of the present invention.

FIG. 2 is a schematic perspective view of the FIG. 1 card and printing pad shown at a processing step subsequent to that of FIG. 1.

FIG. 3 is a perspective view of the FIG. 1 card shown at a processing step subsequent to that of FIG. 2.

FIG. 4 is a perspective view of the FIG. 1 card shown at a processing step subsequent to that of FIG. 3.

FIG. 5 is a cross-sectional view of the FIG. 4 card taken along line 55 in FIG. 4.

FIG. 6 is a cross-sectional view of the FIG. 1 card taken along line 55 in FIG. 4, and shown at a processing step subsequent to that of FIG. 5.

FIG. 7 is a cross-sectional view of the FIG. 1 card taken alone line 55 in FIG. 4, and shown at a processing step subsequent to that of FIG. 5.

FIG. 8 is a perspective view of a card being produced according to a second embodiment method of the present invention.

FIG. 9 is a cross-sectional view of the FIG. 8 card taken along the line 99 in FIG. 8.

FIG. 10 is a perspective view of a card being produced according to a third embodiment method of the present invention.

FIG. 11 is a cross-sectional view of the FIG. 10 card taken along the line 1111 in FIG. 10.

FIG. 12 is an elevational view of a substrate sheet processed according to a method of the present invention.

FIG. 13 is an elevational view of the sheet of FIG. 12 at a processing step shown subsequent to that of FIG. 12.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8).

A first embodiment method of the present invention is described with reference to FIGS. 1-7. Referring to FIG. 1, a substrate 10 is shown at a preliminary step of the first embodiment method. Substrate 10 is preferably a card substrate in the approximate shape of a credit card. Substrate 10 can comprise any of a number of materials known to persons of ordinary skill in the art, such as for example, PVC or ABS plastic. As will become apparent from the following discussion, substrate 10 might ultimately be used for a radio frequency card, smart card, or other card built with multiple, interconnected composites, including an integrated circuit. Accordingly, substrate 10 preferably comprises a configuration suitable for one or more of the above-discussed ultimate uses.

Substrate 10 comprises a substrate body 13, a front surface 12, and an opposing back surface 11 (shown in FIG. 5). A recess 14 is provided through front surface 12 and into substrate 10. Recess 14 can be formed by conventional methods. Examples include cutting with a blade, grinding wheel or laser. Another example method for forming recess 14 is to form the recess in situ at a time of card creation by injection molding the card in a shape comprising recess 14. Recess 14 has a bottom surface 16 and sidewall surfaces 18 joined to bottom surface 16. As most clearly shown in FIGS. 5-7, sidewall surfaces 18 preferably extend non-perpendicularly from bottom surface 16. Such non-perpendicular orientation of sidewall surfaces 18 relative to bottom surface 16 can simplify a below-discussed printing of a circuit 22 (shown in FIG. 3) over such sidewall surfaces. It is noted, however, that the present invention also encompasses applications in which sidewall surfaces 18 extend perpendicularly from bottom surface 16.

Still referring to FIG. 1, a printing pad 20 is elevated above substrate 10. Printing pad 20 preferably comprises a deformable material, such as for example, foam, sponge, or silicone rubber. A circuit pattern 21 is formed on printing pad 20, and comprises, for example, a conductive film. Circuit pattern 21 can be formed by, for example, pressing pad 20 onto a plate having a shape corresponding to circuit pattern 21 etched within it.

Referring to FIG. 2, printing pad 20 is pressed against substrate 10 to transfer circuit pattern 21 to substrate 10 and thereby print a circuit 22 (shown in FIG. 3) upon substrate 10 and within recess 14. In the shown embodiment, printing pad 20 is configured to print the circuit pattern on bottom surface 16, on two of sidewall surfaces 18, and on upper surf ace 12. In alternate embodiments which are not shown, printing pad 20 can be configured to print on less than all of surfaces 16, 18 and 20. For instance, in such alternate embodiments, printing pad 20 may be configured to print only on bottom surface 16, or only on bottom surface 16 and one of the sidewall surfaces 18. Suitable materials which may be pad printed to form circuit 22 are conductive films, such as, for example, printed thick film (PTFs) comprising silver-filled organic material. It is noted that, although pad printing is shown, the printing can comprise other printing methods known to persons of ordinary skill in the art, including, for example, stencil printing, screen printing spray printing, needle dispense printing etc. After conductive circuit 22 is printed, the circuit can be cured by conventional methods.

After curing, circuit 22 will have a thickness and associated degree of conductivity. If the conductive is lower than desired as may occur if, for example, conductive material of circuit 22 is too thin, or not adequately a low resistance material, the conductivity can be enhanced by providing an electroless plated metal, such as copper or nickel, against substrate 10 and circuit 22. The electroless plated metal selectively plates conductive circuit 22, while not plating non-conductive surfaces of substrate 10. The electroless plating of metal can be accomplished by conventional methods.

Referring to FIG. 3, circuit 22 preferably comprises conductive interconnects 23 and 24, and an antenna 26. Interconnect 23 comprises nodes 25 and 27, interconnect 24 comprises nodes 28 and 30, and antenna 26 comprises nodes 32 and 33. Nodes 25, 27, 28, 30, 32 and 33 are illustrated as being wider than the rest of interconnects 23 and 24, and antenna 26. However, as will be appreciated by persons of ordinary skill in the art, nodes 25, 27, 28, 30, 32 and 33 could also be a same size as the rest of interconnects 23, 24 and antenna 26; or narrower than the rest of interconnects 23, 24 and antenna 26. Note 27 preferably comprises the shown arcuate shape complementary to an outer surface of a battery 36 (shown in FIG. 4), which is to be joined to node 27. In the shown preferred embodiment, antenna 26 is a loop antenna comprising a predominant portion outside of recess 14 and on substrate surface 12. In other embodiments (not shown), antenna 26 could be entirely within recess 14, or comprise a predominate portion within recess 14.

In the preferred embodiment, antenna 26 constitutes a part of, and is formed at the same time as, the other integrated circuitry. It is noted that antenna 26 could be formed in two steps, with a portion of antenna 26 being formed before or after pad printing of circuit 22. For instance, the portion of antenna 26 extending along upper surface 12 could be formed prior to printing circuit 22. Then, a portion of antenna 26 could be printed as part of circuit 22 to create nodes 32 and 33, and to connect the previously formed portion of antenna 26 with nodes 32 and 33. In such circumstances, the portion of antenna 26 which is not formed as part of circuit 22 could be formed by methods other than those utilized to form circuit 22. For instance, if circuit 22 is pad printed, the portion of antenna 26 not formed as part of circuit 22 could be formed by a method other than pad printing. Such other methods will be recognized by persons of ordinary skill in the art.

Referring to FIG. 4, electrical components 36 and 38 are bonded to one or more of nodes 25, 27, 28, 30, 32 and 33 (shown in FIG. 3). By way of example only, electrical component 36 comprises a battery and component 38 comprises a monolithic integrated circuit formed on a chip. Components 36 and 38 may be bonded to nodes 25, 27, 28, 30, 32 and 33 (shown in FIG. 3), utilizing a conductive adhesive 35 which is cured after provision of components 36 and 38. An example conductive adhesive 35 is a conductive epoxy. Battery 36 could alternatively be provided directly bonded to integrated circuit chip 38. In such circumstances, the bonding of battery 36 to integrated circuit 38 can occur either before or after placing integrated circuit 38 and battery 36 within recess 14. Also, as will be recognized by persons of ordinary skill in the art, at least one of the electrical components 36 or 38 could be provided externally of recess 14.

In the illustrated embodiment, interconnects 23 and 24 connect battery 36 to integrated circuit 38, and antenna 26 connects with integrated circuit 38. Battery 36, interconnects 23 and 24, integrated circuit 38 and antenna 26 together form a radio frequency identification device (RFID).

After provision of circuit 22 and one or both of components 36 and 38 within recess 14, a protective cover is ideally formed over circuit 22 and recess 14. FIGS. 6 and 7 illustrate two methods of protectively covering circuit 22 and the components within recess 14. Referring first to FIG. 6, a cap 40 can be adhered over substrate 10 and over recess 14. Cap 40 may be adhered, for example, by adhesive, such as glue, or by mechanical fasteners, such as staples or screws. Example materials for cap 40 include plastic metal, and flexible or rigid adhesive tape. In the shown embodiment, portions of loop antenna 26 are between cap 40 and substrate body 13. Such portions of loop antenna 26 are generally thin enough that they do not interfere with bonding of cap 40 to substrate body 13. To further minimize interference of such portions of loops antenna 26 with bonding of cap 40 to substrate body 13, cap 40 can be formed of a material which conforms over and around loop antenna 26, such as, for example, a deformable material. Also, in embodiments which are not shown, antenna 26 can be formed entirely within recess 14 to minimize interference of antenna 26 with bonding of cap 40 to substrate body 13.

Referring to FIG. 7, circuitry 22 and components 36 and 38 can be covered with an encapsulant 42. Such encapsulant may comprise, for example, a low temperature curing insulating material, such as, for example, a two-part epoxy or urethane. Encapsulant 42 will preferably be provided initially as a liquid material and to overfill recess 14 and overlay antenna 26. Encapsulant 42 can then be cured into a solid mass, and either milled or sanded to form the shown preferred substantially planar upper surface 44.

It is noted that the methods of FIGS. 6 and 7 are merely example methods for covering circuitry proximate and within recess 14. The invention encompasses other methods for covering such circuitry which will be recognized by persons of ordinary skill in the art. The methods of FIGS. 6 and 7 could also be combined. For instance, a recess could be partially filled with an encapsulant and then covered. Such combined methods may have particular application toward sealing cards containing multiple recesses which are discussed below. In such cases, an integrated circuit could be within one recess and a battery within another. The integrated circuit could be covered with encapsulant and/or a cap, and the battery covered only with a removable cap. In such applications the integrated circuit would be well-protected and the battery could be easily replaceable.

After provision of a protective cover over recess 14, the construction of a card is substantially finished. The card may then be covered with a laminating film for cosmetic, printability, or logo reasons. An example laminating film would be a thin (less than about one mil) PVC sheet bonded to substrate 10 with an adhesive.

A second embodiment method of the present invention is described with reference to FIGS. 8 and 9. In describing FIGS. 8 and 9, numbering similar to that utilized above in describing FIGS. 1-7 will be used, with differences indicated by the suffix “a” or by different numerals.

Referring to FIGS. 8 and 9, a substrate 10a is illustrated. Substrate 10a comprises a first recess 52 and a second recess 54. In the illustrated and preferred embodiments, first recess 52 is formed in the substrate and second recess 54 is formed within first recess 52 and essentially constitutes a part thereof. A conductive circuit 22a is formed within recesses 52 and 54 and comprises interconnects 23a and 24, and antenna 26a. Antenna 26a is a loop antenna which extends beyond recesses 52 and 54. Interconnects 23a and 24a connect electrical components 36a and 38a. Interconnects 23a and 24a, and antenna 26a, are preferably formed by printing a conductive film within first and second recesses 52 and 54, utilizing procedures analogous to those discussed above with reference to FIGS. 1-3.

In the illustrated embodiment, components 36a and 38a are each within a recess, with component 36a being within first recess 52 and component 38a being within second recess 54. First recess 52 comprises a bottom surface 56 and sidewall surfaces 58. Second recess 54 comprises a bottom surface 60 and sidewall surfaces 62. Sidewall surfaces 58 and 62 can extend non-perpendicularly form bottom surfaces 56 and 60, respectively, to simply printing of circuit 22a over such sidewall surfaces. First recess 52 is separated from second recess 54 by one of the sidewall surfaces 62. The separating sidewall 62 extends non-perpendicularly from both of bottom surface 56 and bottom surface 60. Interconnects 23a and 24a extend over the separating sidewall surface 62 and along bottom surfaces 60 and 56. Interconnects 23a and 24a thus extend continuously from electrical component 36a to electrical component 38a.

Substrate 10a comprises a front surface 12a and an opposing back surface 11a. Preferably, first recess 52 and second recess 54 both extend through the same of either front surface 12a or back surface 11a. In FIGS. 8 and 9, recesses 52 and 54 are illustrated as both extending through front surface 12a.

Subsequent processing of substrate 10a can be performed in accordance with the processing of either FIG. 6 or FIG. 7 to cover first and second electrical components 36a and 38a, and electrical circuit 22a, with at least one protective cover.

A third embodiment method of the present invention is described with reference to FIGS. 10 and 11. In describing FIGS. 10 and 11, numbering similar to that utilized above in describing FIGS. 1-7 will be used, with differences indicated by the suffix “b” or by different numerals.

A substrate 10b comprises a substrate body 13b, a front surface 12b, and an opposing back surface 11b. A recess 14b is provided through front surface 12b and into substrate 10b. Electrical components 36b and 38b are within recess 14b and connected by interconnects 23b and 24b. A loop antenna 26b is electrically connected with component 38b. Loop antenna 26b extends from component 38b, out of recess 14b, and along surface 12b of substrate 10b. Antenna 26b crosses over itself at a bypass 70. Antenna 26b comprises a first portion 66 and a second portion 68 at bypass 70, with second portion 68 crossing over first portion 66. Bypass 70 comprises an insulative material 72 separating first portion 66 from second portion 68. Insulative material 72 can comprise, for example, silicon dioxide.

Methods for forming antenna 26b will be recognized by persons of ordinary skill in the art. Such methods could include, for example, printing methods similar to those discussed above in discussing FIGS. 1-3, with the exception that two printing steps would be utilized in forming antenna 26b. More particularly, a first printing step would be utilized to form the portion of antenna 26b underlying insulative material 72, and a second printing step would be utilized to form the portion of antenna 26b overlying material 72. Insulative material 72 would be formed between the two printing steps. Insulative material 72 can be formed by conventional methods.

Although the embodiment of FIGS. 10 and 11 is illustrated with only two loops and only one bypass 70, persons of ordinary skill in the art will recognize that alternate embodiments could be formed comprising more than two loops and a plurality of bypasses 70. The utilization of one or more bypasses 70 can advantageously permit relatively long loop antennas to be formed on a card substrate.

It is noted that although antenna second portion 68 is illustrated as being substantially perpendicular to antenna first portion 66 at bypass 70, the invention encompasses other embodiments (not shown) in which an antenna second portion is non-perpendicular to an antenna first portion at a bypass of the antenna portions.

The processing described above with reference to FIGS. 1-11 forms embedded circuits within substrates. Such embedded circuits can comprise, for example, circuitry 22, 22a or 22b, and one or more of components 36,36a,36b,38, 38a and 38b.

Although FIGS. 1-11 illustrate formation of a single card, the invention encompasses methods in which a plurality of cards are formed. Such plurality of cards may be formed by forming a number of recesses within a single sheet, and then dividing the sheet into singulated cards. The division into singulated cards may occur before or after any of the steps illustrated in FIGS. 1-11. For example, the division into singulated cards may occur after printing of conductive circuitry (shown in FIG. 2), and prior to provision of components 36 and 38 within a recess. The division of a large sheet into singulated sheets can be performed by a number of methods known to persons of ordinary skill in the art, including, for example, sawing or cutting mechanically or by a laser.

The formation of a number of individual cards from a single sheet substrate is illustrated in FIGS. 12 and 13. In referring to FIGS. 12 and 13, similar numbering to that utilized above in describing FIGS. 1-7 is utilized, with differences being indicated by the suffix “c” or with different numerals. Referring to FIG. 12, a sheet substrate 50 comprises a plurality of recesses 14c. Referring to FIG. 13, the sheet substrate 50 (shown in FIG. 12) is divided into a number of singular card substrates 10c. The individual card substrates 10c comprise at least one recess 14c. It is noted that the invention encompasses methods in which not all of the individual substrates 10c comprise equal numbers of recesses 14c, and encompasses embodiments in which some of the individual substrates comprise no recess 14c. However, generally at least two of the formed substrates 10c will comprise at least one recess 14c.

In compliance with the statue, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US37013175 Oct 197031 Oct 1972Hiroshi MiyamotoMethod for printing electrical circuits on substrates
US370609426 Feb 197012 Dec 1972Peter Harold ColeElectronic surveillance system
US375016722 Jul 197131 Jul 1973Gen Dynamics CorpPostal tracking system
US378036819 Feb 197118 Dec 1973SvejsecentralenMethod of marking and subsequently localizing, identifying and recording physical objects
US383253019 Jul 197327 Aug 1974Westinghouse Electric CorpObject identifying apparatus
US384963317 Jul 197319 Nov 1974Westinghouse Electric CorpObject identifying apparatus
US398176127 Aug 197321 Sep 1976Nippon Toki Kabushiki KaishaProcess for manufacturing printed substrates and decalcomania compositions used therefor
US404996919 Mar 197020 Sep 1977The United States Of America As Represented By The Secretary Of The Air ForcePassive optical transponder
US407563224 May 197621 Feb 1978The United States Of America As Represented By The United States Department Of EnergyInterrogation, and detection system
US413518431 Aug 197716 Jan 1979Knogo CorporationElectronic theft detection system for monitoring wide passageways
US423251222 Dec 197711 Nov 1980Citizen Watch Co., Ltd.Solid state watch module construction
US433195718 Apr 198025 May 1982Bengt EnanderTransponder for use in locating avalanche victims
US439944119 Jan 198116 Aug 1983Unisearch LimitedApparatus for remote temperature reading
US441235614 Jan 198025 Oct 1983Iowa State University Research Foundation, Inc.Light actuated remote control security system
US44132544 Sep 19811 Nov 1983Sensormatic Electronics CorporationCombined radio and magnetic energy responsive surveillance marker and system
US441841110 Mar 198129 Nov 1983Brown, Boveri & Cif AgMethod and apparatus for generating an equipment reply signal for the automatic identification of objects and/or living beings
US448435511 Apr 198320 Nov 1984Ritron, Inc.Handheld transceiver with frequency synthesizer and sub-audible tone squelch system
US45061484 Nov 198219 Mar 1985Brown, Boveri & Cie AgIdentification card
US45394726 Jan 19843 Sep 1985Horizon Technology, Inc.Data processing card system and method of forming same
US472442718 Jul 19869 Feb 1988B. I. IncorporatedTransponder device
US472756025 Apr 198623 Feb 1988U.S. Philips CorporationCharge-coupled device with reduced signal distortion
US47423404 Dec 19863 May 1988Isomed, Inc.Method and apparatus for detecting counterfeit articles
US474661831 Aug 198724 May 1988Energy Conversion Devices, Inc.Method of continuously forming an array of photovoltaic cells electrically connected in series
US474683014 Mar 198624 May 1988Holland William RElectronic surveillance and identification
US47567179 Feb 198712 Jul 1988Polaroid CorporationLaminar batteries and methods of making the same
US477756328 Apr 198711 Oct 1988Toshiba Battery Co., Ltd.Thin type electronic instrument
US47836464 Mar 19878 Nov 1988Kabushiki Kaisha ToshibaStolen article detection tag sheet, and method for manufacturing the same
US482711011 Jun 19872 May 1989Fluoroware, Inc.Method and apparatus for monitoring the location of wafer disks
US48273956 Apr 19872 May 1989Intelli-Tech CorporationManufacturing monitoring and control systems
US485432823 Mar 19878 Aug 1989Philip PollackAnimal monitoring telltale and information system
US48578938 Feb 198815 Aug 1989Bi Inc.Single chip transponder device
US491121724 Mar 198927 Mar 1990The Goodyear Tire & Rubber CompanyIntegrated circuit transponder in a pneumatic tire for tire identification
US49186311 Sep 198717 Apr 1990Casio Computer Co., Ltd.Compact type electronic information card
US492618229 May 198715 May 1990Sharp Kabushiki KaishaMicrowave data transmission apparatus
US494232726 May 198917 Jul 1990Hitachi, Ltd.Solid state electronic device
US4960983 *23 Jun 19882 Oct 1990Mitsubishi Denki Kabushiki KaishaNoncontact type IC card and system for noncontact transfer of information using the same
US49624156 Feb 19909 Oct 1990Hitachi Maxell, Ltd.IC card
US50087766 Jun 199016 Apr 1991Sgs-Thomson Microelectronics, Inc.Zero power IC module
US502357321 Sep 198911 Jun 1991Westinghouse Electric Corp.Compact frequency selective limiter configuration
US50559683 Jul 19898 Oct 1991Sony CorporationThin electronic device having an integrated circuit chip and a power battery and a method for producing same
US509524013 Nov 198910 Mar 1992X-Cyte, Inc.Inductively coupled saw device and method for making the same
US512478221 Nov 199023 Jun 1992Sgs-Thomson Microelectronics, Inc.Integrated circuit package with molded cell
US51342775 Sep 199028 Jul 1992Australian Meat And Live-Stock CorporationRemote data transfer system with ambient light insensitive circuitry
US514431411 Dec 19911 Sep 1992Allen-Bradley Company, Inc.Programmable object identification transponder system
US514835522 Dec 198915 Sep 1992Technology Applications Company LimitedMethod for making printed circuits
US514850416 Oct 199115 Sep 1992At&T Bell LaboratoriesOptical integrated circuit designed to operate by use of photons
US515371026 Jul 19916 Oct 1992Sgs-Thomson Microelectronics, Inc.Integrated circuit package with laminated backup cell
US51647325 Dec 198917 Nov 1992Eid Electronic Identification Systems Ltd.Highway vehicle identification system with high gain antenna
US516650212 Mar 199224 Nov 1992Trend Plastics, Inc.Gaming chip with implanted programmable identifier means and process for fabricating same
US517541814 Dec 199029 Dec 1992Sony CorporationInformation card system
US5206495 *19 Oct 199027 Apr 1993Angewandte Digital Elektronik GmbhChip card
US52144109 Jul 199025 May 1993CsirLocation of objects
US526692530 Sep 199130 Nov 1993Westinghouse Electric Corp.Electronic identification tag interrogation method
US527422116 Feb 199328 Dec 1993Mitsubishi Denki Kabushiki KaishaNon-contact integrated circuit card
US530295418 Nov 199212 Apr 1994Magellan Corporation (Australia) Pty. Ltd.Identification apparatus and methods
US53132117 Aug 199117 May 1994Sharp Kabushiki KaishaPortable data processing device capable of transmitting processed data on a radio by reflection of unmodulated carrier signal externally applied
US531730921 Sep 199231 May 1994Westinghouse Electric Corp.Dual mode electronic identification system
US533706313 Apr 19929 Aug 1994Mitsubishi Denki Kabushiki KaishaAntenna circuit for non-contact IC card and method of manufacturing the same
US53409685 May 199223 Aug 1994Nippondenso Company, Ltd.Information storage medium with electronic and visual areas
US53472635 Feb 199313 Sep 1994Gnuco Technology CorporationElectronic identifier apparatus and method utilizing a single chip microcontroller and an antenna coil
US540209516 Sep 199228 Mar 1995Itt Composants Et InstrumentsPortable case for an electronic smart card
US541219220 Jul 19932 May 1995American Express CompanyRadio frequency activated charge card
US54144275 Jul 19919 May 1995Gunnarsson; StaffanDevice for information transmission
US542821411 May 199327 Jun 1995N.V. Nederlandsche Apparatenfabriek NedapContactlessly operating electronic responder card
US544811014 Sep 19935 Sep 1995Micron Communications, Inc.Enclosed transceiver
US549714017 Dec 19935 Mar 1996Micron Technology, Inc.Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
US55282229 Sep 199418 Jun 1996International Business Machines CorporationRadio frequency circuit and memory in thin flexible package
US554139930 Sep 199430 Jul 1996Palomar Technologies CorporationRF transponder with resonant crossover antenna coil
US5566441 *11 Mar 199422 Oct 1996British Technology Group LimitedAttaching an electronic circuit to a substrate
US557222611 Apr 19955 Nov 1996Micron Technology, Inc.Spherical antenna pattern(s) from antenna(s) arranged in a two-dimensional plane for use in RFID tags and labels
US559803213 Feb 199528 Jan 1997Gemplus Card InternationalHybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
US560017527 Jul 19944 Feb 1997Texas Instruments IncorporatedApparatus and method for flat circuit assembly
US56214127 Jun 199515 Apr 1997Texas Instruments IncorporatedMulti-stage transponder wake-up, method and structure
US564712214 Jun 199515 Jul 1997U.S. Philips CorporationManufacturing method for an integrated circuit card
US564929619 Jun 199515 Jul 1997Lucent Technologies Inc.Full duplex modulated backscatter system
US571958611 Jan 199617 Feb 1998Micron Communications, Inc.Spherical antenna pattern(s) from antenna(s) arranged in a two-dimensional plane for use in RFID tags and labels
US57290533 Jul 199617 Mar 1998Texas Instruments IncorporatedApparatus and method for flat circuit assembly
US573504019 Sep 19967 Apr 1998Mitsubishi Denki Kabushiki KaishaMethod of making IC card
US57762789 Jan 19977 Jul 1998Micron Communications, Inc.Method of manufacturing an enclosed transceiver
US577983926 Sep 199714 Jul 1998Micron Communications, Inc.Method of manufacturing an enclosed transceiver
US5809633 *5 Mar 199722 Sep 1998Siemens AktiengesellschaftMethod for producing a smart card module for contactless smart cards
US58506908 Jul 199622 Dec 1998De La Rue Cartes Et Systemes SasMethod of manufacturing and assembling an integrated circuit card
US588093429 Oct 19979 Mar 1999Giesecke & Devrient GmbhData carrier having separately provided integrated circuit and induction coil
US58809376 Mar 19979 Mar 1999Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen MbhElectrical circuit arrangement having equipotential surface for reduced high-frequency interference
US595594918 Aug 199721 Sep 1999X-Cyte, Inc.Layered structure for a transponder tag
US598228410 Mar 19989 Nov 1999Avery Dennison CorporationTag or label with laminated thin, flat, flexible device
US6036099 *19 Aug 199714 Mar 2000Leighton; KeithHot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US613060229 Aug 199610 Oct 2000Micron Technology, Inc.Radio frequency data communications device
US626597714 Aug 200024 Jul 2001Motorola, Inc.Radio frequency identification tag apparatus and related method
US62949989 Jun 200025 Sep 2001Intermec Ip Corp.Mask construction for profile correction on an RFID smart label to improve print quality and eliminate detection
US6514367 *5 Aug 19994 Feb 2003Keith R. LeightonHot lamination process for the manufacture of a combination contact/contactless smart card
DE3201065A115 Jan 198228 Jul 1983Schwarzwaelder Elektr WerkeMethod of printing printed circuit boards
DE3824870A121 Jul 198813 Apr 1989Mitsubishi Electric CorpSystem zur kontaktlosen informationsuebertragung zwischen einer ic-karte und einem kartenlese-/-schreibgeraet sowie ic-karte
DE4120265A119 Jun 19919 Jan 1992Mitsubishi Electric CorpData card without contacts - contains battery and interruptable clock circuit supplying signal to CPU
DE4431605A15 Sep 19947 Mar 1996Siemens AgChipkartenmodul für kontaktlose Chipkarten und Verfahren zu seiner Herstellung
EP0595549A221 Oct 19934 May 1994Hughes Microelectronics Europa LimitedRadio frequency baggage tags
EP0682321A210 May 199515 Nov 1995Giesecke & Devrient GmbHRecord carrier with integrated circuit
GB1567784A Title not available
JPH0236476A Title not available
JPH0722831A Title not available
JPH01191082A Title not available
JPH02179794A Title not available
JPH03224799A Title not available
JPH04359183A Title not available
Non-Patent Citations
Reference
1Casson, K., et al., "High Temperature Packaging: Flip Chip on Flexible Laminate", Surface Mount Technology, pp. 19-20 (Jan. 1992).
2Gilleo, K., "Using SM Devices on Flexible Circuitry", ELECTRI-ONICS, pp. 20-23 (Mar. 1986).
3Johnson, R.W., "Polymer Thick Films: Technology and Materials", Circuits Manufacturing (reprint), 4 pages (Jul. 1982).
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7689459 *24 Sep 200330 Mar 2010Industiral Technology Research InstituteCard with embedded bistable display having short and long term information
US774623030 Aug 200729 Jun 2010Round Rock Research, LlcRadio frequency identification device and method
US7761332 *25 Aug 200820 Jul 2010Eastman Kodak CompanyCard with embedded bistable display having short and long term information
US7838976 *25 Jul 200723 Nov 2010Semiconductor Energy Laboratory Co., Ltd.Semiconductor device having a semiconductor chip enclosed by a body structure and a base
US783928529 Aug 200723 Nov 2010Round Rock Resarch, LLCElectronic communication devices, methods of forming electrical communication devices, and communications methods
US792553825 Aug 200812 Apr 2011Industrial Technology Research InstituteCard with embedded bistable display having short and long term information
US794838211 Sep 200624 May 2011Round Rock Research, LlcElectronic communication devices, methods of forming electrical communication devices, and communications methods
US79597697 Nov 200614 Jun 2011Infinite Power Solutions, Inc.Deposition of LiCoO2
US799377321 Aug 20099 Aug 2011Infinite Power Solutions, Inc.Electrochemical apparatus with barrier layer protected substrate
US801834024 Oct 200613 Sep 2011Round Rock Research, LlcSystem and method to track articles at a point of origin and at a point of destination using RFID
US802177823 Aug 200520 Sep 2011Infinite Power Solutions, Inc.Electrochemical apparatus with barrier layer protected substrate
US805403512 Nov 20108 Nov 2011Semiconductor Energy Laboratory Co., Ltd.Power storage device including an antenna
US806270826 Sep 200722 Nov 2011Infinite Power Solutions, Inc.Masking of and material constraint for depositing battery layers on flexible substrates
US81977815 Nov 200712 Jun 2012Infinite Power Solutions, Inc.Sputtering target of Li3PO4 and method for producing same
US823262124 Jul 200731 Jul 2012Semiconductor Energy Laboratory Co., Ltd.Semiconductor device
US823644316 Mar 20077 Aug 2012Infinite Power Solutions, Inc.Metal film encapsulation
US826020310 Sep 20094 Sep 2012Infinite Power Solutions, Inc.Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof
US826848823 Jan 200918 Sep 2012Infinite Power Solutions, Inc.Thin film electrolyte for thin film batteries
US8299925 *25 Jul 200830 Oct 2012Fujitsu LimitedRFID tag and manufacturing method thereof
US83505192 Apr 20098 Jan 2013Infinite Power Solutions, IncPassive over/under voltage control and protection for energy storage devices associated with energy harvesting
US837847323 Nov 201019 Feb 2013Semiconductor Energy Laboratory Co., Ltd.Semiconductor device having semiconductor chip within multilayer substrate
US839452229 Apr 200812 Mar 2013Infinite Power Solutions, Inc.Robust metal film encapsulation
US840437621 Apr 201026 Mar 2013Infinite Power Solutions, Inc.Metal film encapsulation
US843126425 Jul 200830 Apr 2013Infinite Power Solutions, Inc.Hybrid thin-film battery
US844513017 Nov 200621 May 2013Infinite Power Solutions, Inc.Hybrid thin-film battery
US85081937 Oct 200913 Aug 2013Infinite Power Solutions, Inc.Environmentally-powered wireless sensor module
US85185819 Jan 200927 Aug 2013Inifinite Power Solutions, Inc.Thin film encapsulation for thin film batteries and other devices
US853539621 Aug 200917 Sep 2013Infinite Power Solutions, Inc.Electrochemical apparatus with barrier layer protected substrate
US85995721 Sep 20103 Dec 2013Infinite Power Solutions, Inc.Printed circuit board with integrated thin film battery
US86368767 Dec 200528 Jan 2014R. Ernest DemarayDeposition of LiCoO2
US86922494 Nov 20118 Apr 2014Semiconductor Energy Laboratory Co., Ltd.Power storage device
US872828520 May 200420 May 2014Demaray, LlcTransparent conductive oxides
US8786443 *26 Feb 200922 Jul 2014Avery Dennison CorporationRFID tag for direct and indirect food contact
US890652311 Aug 20099 Dec 2014Infinite Power Solutions, Inc.Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
US90705634 Apr 201430 Jun 2015Semiconductor Energy Laboratory Co., Ltd.Power storage device
US933455719 Dec 200810 May 2016Sapurast Research LlcMethod for sputter targets for electrolyte films
US953245315 Nov 201327 Dec 2016Sapurast Research LlcPrinted circuit board with integrated thin film battery
US963429626 Feb 201425 Apr 2017Sapurast Research LlcThin film battery on an integrated circuit or circuit board and method thereof
US97868738 May 201510 Oct 2017Sapurast Research LlcThin film encapsulation for thin film batteries and other devices
US979352321 Aug 200917 Oct 2017Sapurast Research LlcElectrochemical apparatus with barrier layer protected substrate
US20050065884 *24 Sep 200324 Mar 2005Eastman Kodak CompanyCard with embedded bistable display having short and long term information
US20050242964 *5 Jul 20053 Nov 2005Tuttle John RMiniature radio frequency transceiver
US20070103316 *11 Dec 200610 May 2007Tuttle John RRadio frequency identification device and method
US20080023793 *24 Jul 200731 Jan 2008Semiconductor Energy Laboratory Co., Ltd.Semiconductor device
US20080023810 *25 Jul 200731 Jan 2008Semiconductor Energy Laboratory Co., Ltd.Semiconductor device
US20080314976 *25 Aug 200825 Dec 2008Capurso Robert GCard with embedded bistable display having short and long term information
US20080314983 *25 Aug 200825 Dec 2008Capurso Robert GCard with embedded bistable display having short and long term information
US20090109000 *25 Jul 200830 Apr 2009Fujitsu LimitedRfid tag and manufacturing method thereof
US20090212919 *26 Feb 200927 Aug 2009Avery Dennison CorporationRfid tag for direct and indirect food contact
US20110057628 *12 Nov 201010 Mar 2011Semiconductor Energy Laboratory Co., Ltd.Power storage device
US20110068438 *23 Nov 201024 Mar 2011Semiconductor Energy Laboratory Co., Ltd.Semiconductor device
Classifications
U.S. Classification438/19, 257/E21.7, 29/846, 438/126
International ClassificationB42D15/10, G06K19/077, G06K19/07, H01L21/00
Cooperative ClassificationY10T29/49155, H01L2924/01078, H01L2924/15165, H01L2924/15153, H01L2224/16225, G06K19/0775, G06K19/07749
European ClassificationG06K19/077T2, G06K19/077T
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