USRE39784E1 - Structure for removable cooler - Google Patents

Structure for removable cooler Download PDF

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Publication number
USRE39784E1
USRE39784E1 US11/041,193 US4119305A USRE39784E US RE39784 E1 USRE39784 E1 US RE39784E1 US 4119305 A US4119305 A US 4119305A US RE39784 E USRE39784 E US RE39784E
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US
United States
Prior art keywords
memory module
heat
module
frame
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US11/041,193
Inventor
Paul Hsueh
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Super Talent Electronics Inc
Original Assignee
MA Laboratories Inc
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Filing date
Publication date
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Priority to US11/041,193 priority Critical patent/USRE39784E1/en
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Publication of USRE39784E1 publication Critical patent/USRE39784E1/en
Assigned to SUPER TALENT ELECTRONICS, INC. reassignment SUPER TALENT ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MA LABORATORIES, INC.
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooler, especially a removable cooler on the memory of a PC.
  • the inventor of the present invention was devoted to finding a solution and accomplished structural improvement for cooler.
  • the main objective for the present invention is to provide a removable cooler on the memory module inside a PC, wherein the PC board is able to attach on the memory module without any modification.
  • the cooler contains a heat sink module and a cooler module.
  • the heat sink module combined by two pieces of heat conduction heat sinks placed oppositely is screwed or tenoned to the memory module so that the heat generated by the memory module is conducted to the extension part of the heat sink and thus stimulates heat exchange.
  • the cooler module could be a fan or heat conduction tube. If it is a fan, it could be buckled on the memory module socket for the extension part of the two oppositely placed heat sinks to absorb the heat of the memory module and drives heat exchange.
  • FIG. 1 is a three-dimensional illustration for better application of a removal cooler in the present invention.
  • FIG. 2 is a three-dimensional illustration for deformation of a removal cooler's heat sink module in the present invention.
  • FIG. 3 is a cross-sectional illustration for a heat sink module placed above the memory module in the present invention.
  • FIG. 4 is a cross-sectional illustration for heat conduction inside heat sink module placed above the memory module in the present invention.
  • FIG. 5 is an illustration for deformation of another heat sink module covered on the memory module in the present invention.
  • FIG. 6 is a three-dimensional illustration for deformation of the removal cooler in the present invention.
  • FIG. 7 is an illustration for formation of the frame buckled on the memory socket in the present invention.
  • FIG. 8 is an illustration for air convection of the frame bucked on the memory socket in the present invention.
  • FIG. 9 is a three-dimensional illustration for better application of a removal cooler in the present invention.
  • the present invention provides a removal cooler for the memory module inside a PC, mainly consisting of a heat sink module 1 and a cooler module 2 .
  • the heat sink module 1 covered on the memory module 3 contains two pieces of heat-conductive heat sinks 11 placed oppositely.
  • a heat conduction interface 4 is used between the chip 31 and the concave 111 for heat conduction (as shown in FIG. 4 ).
  • This heat conduction interface 4 can be heat dispensation ointment or heat dispensation tape.
  • the above cooler module 2 is a fan-style frame that contains a frame 21 and at least one fan 22 (in this case two fans 22 are used).
  • the frame 21 is a ⁇ -shaped frame with two flexible sides.
  • At the inner bottom of the frame's leg 213 on both sides of the frame 21 there is a cavity 214 and the inner bottom of the two frame's legs 213 are bevels 215 .
  • FIGS. 6 through 8 Please refer to FIGS. 6 through 8 .
  • Several memory modules 3 are inserted on the memory socket 7 and fixed by hook 71 .
  • the cavity 214 at the inner bottom of the two frames' legs 213 are stuck onto the hook 71 on both sides of the memory socket 7 , thus secures the frame 21 above the memory socket 7 with the frame's top 211 and the fan 22 placed above the extension part 113 of the oppositely placed heat sinks 11 .
  • the cooler module 2 of the present invention can be a tube combined with a heat-conduction tube 23 and a pair of fans 22 .
  • the heat-conduction tube 23 is screwed or tenoned on top of the extension part 113 of the heat sinks 11 and extends outward with heat dispensation fins 231 at the extended end.
  • the fan 22 is placed on one side of the heat dispensation fins 231 , allowing the air absorbed by the fan 22 to be transmitted to the space above the heat dispensation fins 231 for heat exchange, thus achieves heat dispensation for the memory module 3 and ensures the performance of the memory module 3 .

Abstract

A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on the memory module to stimulate heat exchange above the extension part of the heat sinks. The cooler module could be a fan or heat conductive tube. As a fan, it could be buckled on the memory module socket for the extension part of the heat sinks to stimulate heat exchange. As a heat conduction tube screwed or tenoned against the extension part of the heat sinks, it stimulates heat exchange and provides heat dispensation function to assure the performance of the memory module.

Description

FIELD OF THE INVENTION
The present invention relates to a cooler, especially a removable cooler on the memory of a PC.
BACKGROUND OF THE INVENTION
Traditionally, during the run time of a PC, the electronic components inside and memory module generate lots of heat, especially the new memory module required by high-level computers. The temperature of the memory module going up continuously affects operation performance, even causes the memory module to break down. Currently, a cooler designed for such a heat dispensation problem of the memory module is still unavailable.
In view of such the unavailability, the inventor of the present invention was devoted to finding a solution and accomplished structural improvement for cooler.
SUMMARY OF THE INVENTION
The main objective for the present invention is to provide a removable cooler on the memory module inside a PC, wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module combined by two pieces of heat conduction heat sinks placed oppositely is screwed or tenoned to the memory module so that the heat generated by the memory module is conducted to the extension part of the heat sink and thus stimulates heat exchange. The cooler module could be a fan or heat conduction tube. If it is a fan, it could be buckled on the memory module socket for the extension part of the two oppositely placed heat sinks to absorb the heat of the memory module and drives heat exchange. If it is a heat conductive tube screwed or tenoned against the extension of the two oppositely placed heat sinks, it absorbs the heat of the memory conducted to the extension part of the two oppositely placed heat sinks and stimulates heat exchange, thus provides heat dispensation to assure the performance of the memory module.
In the following, the embodiment illustrated is used to describe the detailed structural characteristics and operation action for the present invention
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a three-dimensional illustration for better application of a removal cooler in the present invention.
FIG. 2 is a three-dimensional illustration for deformation of a removal cooler's heat sink module in the present invention.
FIG. 3 is a cross-sectional illustration for a heat sink module placed above the memory module in the present invention.
FIG. 4 is a cross-sectional illustration for heat conduction inside heat sink module placed above the memory module in the present invention.
FIG. 5 is an illustration for deformation of another heat sink module covered on the memory module in the present invention.
FIG. 6 is a three-dimensional illustration for deformation of the removal cooler in the present invention.
FIG. 7 is an illustration for formation of the frame buckled on the memory socket in the present invention.
FIG. 8 is an illustration for air convection of the frame bucked on the memory socket in the present invention.
FIG. 9 is a three-dimensional illustration for better application of a removal cooler in the present invention.
 DETAILED DESCRIPTION OF THE INVENTION
Please refer to FIG. 1. The present invention provides a removal cooler for the memory module inside a PC, mainly consisting of a heat sink module 1 and a cooler module 2. The heat sink module 1 covered on the memory module 3 contains two pieces of heat-conductive heat sinks 11 placed oppositely. There is a concave 111 on the inner side of each heat sink 11 that shelters and contacts against the chips 31 protruding from both sides of the memory module 3 and conducts heat (as shown in FIG. 3). Otherwise, a heat conduction interface 4 is used between the chip 31 and the concave 111 for heat conduction (as shown in FIG. 4). This heat conduction interface 4 can be heat dispensation ointment or heat dispensation tape. On the two heat sinks 11 placed oppositely there are several holes 112 corresponding to the holes 32 on the memory module 3 so that the two heat sinks 11 can be screwed (as shown in FIG. 2) or tenoned (as shown in FIG. 5) to the memory module 3, on the extension part above the heat sink 11 there are several heat dispensation fins 114 (as shown in FIG. 2) or ventilators 115 (as shown in FIG. 5) for ventilation and heat dispensation.
Please refer to FIG. 6. The above cooler module 2 is a fan-style frame that contains a frame 21 and at least one fan 22 (in this case two fans 22 are used). The frame 21 is a π-shaped frame with two flexible sides. On the frame's top 211 there are two holes 212 stretching to the side of the frame. There is a fan 22 placed at different angle on top of the hole, at the bottom of the hole or on one side of the hole (in this case the fan is placed on top of the hole). At the inner bottom of the frame's leg 213 on both sides of the frame 21 there is a cavity 214 and the inner bottom of the two frame's legs 213 are bevels 215.
Please refer to FIGS. 6 through 8. Several memory modules 3 are inserted on the memory socket 7 and fixed by hook 71. In this way, when pushing the frame's legs 213 of the frame 21 outward and pushing the bevel 215 at the inner bottom of the two frame's legs 213 toward the hook 71 on both sides of the memory socket 7, the cavity 214 at the inner bottom of the two frames' legs 213 are stuck onto the hook 71 on both sides of the memory socket 7, thus secures the frame 21 above the memory socket 7 with the frame's top 211 and the fan 22 placed above the extension part 113 of the oppositely placed heat sinks 11. In this way, the heat generated by the chip 31 of each pair of memory module 3 is conducted to the extension part 113 through the two heat sinks 11 and the air absorbed by the fan 22 is transmitted to the space above the extension part 113 for ventilation and heat exchange, thus achieves the heat dispensation of the memory module 3 and ensures the performance of the memory module 3.
Please refer to FIG. 9. The cooler module 2 of the present invention can be a tube combined with a heat-conduction tube 23 and a pair of fans 22. The heat-conduction tube 23 is screwed or tenoned on top of the extension part 113 of the heat sinks 11 and extends outward with heat dispensation fins 231 at the extended end. The fan 22 is placed on one side of the heat dispensation fins 231, allowing the air absorbed by the fan 22 to be transmitted to the space above the heat dispensation fins 231 for heat exchange, thus achieves heat dispensation for the memory module 3 and ensures the performance of the memory module 3.

Claims (19)

1. A structure for a removable cooler on a memory module inside a PC, comprising:
a heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on said memory module, stimulating heat exchange by transmitting heat generated by said memory module to space above an extension part of said heat sink;
a cooler module consisting of a frame and at least a pair of fans, on both sides of said frame there are flexible frame's legs and two holes on top of said frame stretching to both sides of said frame for ventilation; one of the at least a pair of fans is placed above each of said frame's holes to enhance ventilation;
thus, several memory modules are inserted separately in memory module sockets of a board and said frame's legs pushed outward are stuck with a hook, allowing a frame's top and said at least a pair of fans to be placed above said extension part of said heat sinks for ventilation, stimulating heat exchange to said extension parts, thus to provide heat dispensation for said memory module.
2. The removable cooler for a memory module of claim 1, wherein a cavity and a bevel are set at inner bottom of two frame's legs.
3. The removable cooler on a memory module of claim 1, wherein said bevels on both frame's legs are pushed toward a hook on both sides of said memory module to have said cavity inside said frame's legs stuck on said hook and secure said frame above said memory module socket.
4. The removable cooler on a memory module of claim 1, wherein there is a concave on said heat sink's opposite side that protects and contacts with a chip protruding from said memory module for direct heat conduction.
5. The removable cooler on a memory module of claim 1, wherein a plurality of chips of said memory module and a concave provide heat conduction through a heat conduction interface and said heat conduction interface is one of a heat dispensation ointment and a heat dispensation tape.
6. The removable cooler on a memory module of claim 1, wherein there are holes on said heat sinks corresponding to holes on said memory module so as to be screwed or tenoned and secure two heat sinks on said memory module.
7. The removable cooler on a memory module of claim 1, wherein there are one of heat dispensation fins and ventilators on said extension part of said heat sinks for ventilation and heat dispensation.
8. The removable cooler on a memory module of claim 1, wherein a fan of said frame is placed on a location selected from said frame's top, bottom and two sides for ventilation.
9. The removable cooler on a memory module of claim 1, wherein said cooler module is a heat conduction tube; said heat conduction tube is located against said extension part of said heat sink and has heat dispensation fins at an extended end so as to transmit heat of said extension part of said heat sinks; on one side of said heat dispensation fins there is a fan to stimulate heat exchange above said heat dispensation fins, thus provide heat dispensation for said memory module.
10. A removable cooler module for a memory module, the memory module being mounted in a memory socket that is secured to a printed circuit board such that a plane of the memory module extends perpendicular to the printed circuit board, the cooler module comprising:
a frame including parallel side legs and an upper section extending perpendicular to the parallel side legs and attached to upper ends of the side legs, wherein a lower end of each of the side legs includes an engaging structure, and wherein the upper section defines at least one opening; and
at least one fan mounted on the frame,
wherein, when the cooler module is mounted on the memory socket over the memory module, the engagement structures engage the memory socket, and the side legs extend perpendicular to the printed circuit board and the upper section of the frame is maintained over an upper edge of the memory module and parallel to the printed circuit board, whereby the fan is positioned to generate air flow over the memory module, and
wherein the lower end of each of the side legs includes a bevel, and wherein the engaging structure comprises a cavity defined in said each of the side legs adjacent an upper end of a corresponding one of said bevels.
11. The removable cooler module according to claim 10, wherein each of the side legs comprises a flexible material selected such that when the lower ends of the side legs are pressed against the memory socket and the bevels contact hook structures attached to the memory sockets, the side legs flex to accommodate engagement of the hook structures inside corresponding ones of said cavities.
12. The removable cooler according to claim 10, wherein said at least one fan comprises:
a first fan mounted over said at least one opening adjacent a first end of said upper section, and
a second fan mounted over said at least one opening adjacent a second end of said upper section.
13. An assembly comprising:
a module socket mounted on a printed circuit board;
a memory module mounted in the module socket such that a plane of the memory module extends perpendicular to the printed circuit board; and
a cooler module including:
a frame including a plurality of side legs and an upper section extending between upper ends of the side legs, and
at least one fan mounted on the frame,
wherein a lower end of each of the side legs is removably engaged with the module socket,
wherein the upper section is positioned over an upper edge of the memory module, and
wherein the fan is arranged on the frame such that air flow generated by the fan passes along opposing surfaces of the memory module,
wherein the module socket includes a hook that is engaged with a side edge of the memory module,
wherein the lower end of each of the side legs includes an bevel and defines a cavity, and
wherein a portion of the hook is received in the cavity defined by at least one of the side legs of the frame.
14. The assembly according to claim 13, wherein each of the side legs comprises a flexible material selected such that when the lower ends of the side legs are pressed against the module socket and the bevels contact first and second hooks attached to opposite ends of the module sockets, the side legs flex to accommodate engagement of the hook structures inside corresponding ones of said cavities.
15. The assembly according to claim 13, wherein said at least one fan comprises:
a first fan mounted over a first opening defined in said upper section adjacent to a first end of said memory module, and
a second fan mounted over a second opening defined in said upper section adjacent to a second end of said memory module.
16. The assembly according to claim 13, further comprising a heat sink module including first and second conductive heat sinks mounted over said opposing surfaces of the memory module.
17. The assembly according to claim 16, wherein at least one of the first and second conductive heat sinks includes a concave section that contacts a chip protruding from the memory module.
18. The assembly according to claim 16, wherein the memory module comprises a plurality of chips that contact at least one of the first and second conductive heat sinks by way of one of a heat dispensation ointment and a heat dispensation tape.
19. The assembly according to claim 16, wherein the first and second conductive heat sinks define holes that correspond to holes defined on said memory module, and wherein the first and second conductive heat sinks are secured by fasteners that extend through the holes.
US11/041,193 2003-01-08 2005-01-20 Structure for removable cooler Expired - Fee Related USRE39784E1 (en)

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US11/041,193 USRE39784E1 (en) 2003-01-08 2005-01-20 Structure for removable cooler

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070146993A1 (en) * 2005-12-23 2007-06-28 Intel Corporation Method, apparatus and computer system for enhancement of thermal energy transfer
US20070165382A1 (en) * 2006-01-16 2007-07-19 Nanya Technology Corporation Heat sink assembly
US20080041561A1 (en) * 2006-08-18 2008-02-21 Foxconn Technology Co., Ltd. Heat dissipation device
US20080186685A1 (en) * 2007-02-06 2008-08-07 Samsung Electronics Co., Ltd. Printed circuit board and semiconductor memory module using the same
US20080266807A1 (en) * 2007-04-27 2008-10-30 Cray Inc. Electronic assembly with emi shielding heat sink
US20090034189A1 (en) * 2007-07-31 2009-02-05 Gregory Springer Riser card housing
US20090219687A1 (en) * 2008-03-03 2009-09-03 Jui-Nan Lin Memory heat-dissipating mechanism
US20090233537A1 (en) * 2008-03-14 2009-09-17 Inventec Corporation Air baffle and calculation method of deformational stress thereof
US20090290308A1 (en) * 2008-05-23 2009-11-26 Comptake Technology Inc. Heat sink for chips
US20100296240A1 (en) * 2006-01-09 2010-11-25 Ocz Technology Group, Inc. Method and apparatus for thermal management of computer memory modules
US20110228476A1 (en) * 2007-10-24 2011-09-22 Chuan-Hung Lin Memory Cooling Fan Tray
US20130288492A1 (en) * 2011-11-29 2013-10-31 Apple Inc. Folding so-dimm socket
US20180242474A1 (en) * 2017-02-23 2018-08-23 Lsis Co., Ltd. Heat radiation apparatus using modular cooling apparatus
CN111637663B (en) * 2020-05-18 2021-08-27 重庆鑫隆旭机械有限公司 Air energy heating pump

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319984B4 (en) * 2003-05-05 2009-09-03 Qimonda Ag Device for cooling memory modules
JP3845408B2 (en) * 2003-10-06 2006-11-15 エルピーダメモリ株式会社 Memory module heat dissipation device
DE102004009055B4 (en) * 2004-02-23 2006-01-26 Infineon Technologies Ag Cooling arrangement for devices with power semiconductors and method for cooling such devices
KR100558065B1 (en) * 2004-03-15 2006-03-10 삼성전자주식회사 Semiconductor module with heat sink
US7079396B2 (en) * 2004-06-14 2006-07-18 Sun Microsystems, Inc. Memory module cooling
US7443023B2 (en) * 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7616452B2 (en) * 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7106595B2 (en) * 2004-09-15 2006-09-12 International Business Machines Corporation Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board
US7768785B2 (en) * 2004-09-29 2010-08-03 Super Talent Electronics, Inc. Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive
US20060146497A1 (en) * 2004-12-30 2006-07-06 Intel Corporation Heat exchanger for memory modules
JP2006221912A (en) * 2005-02-09 2006-08-24 Elpida Memory Inc Semiconductor device
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
TW200701871A (en) * 2005-06-24 2007-01-01 Micro Star Int Co Ltd Heat dissipation device
US7442050B1 (en) 2005-08-29 2008-10-28 Netlist, Inc. Circuit card with flexible connection for memory module with heat spreader
US7907403B2 (en) * 2005-10-25 2011-03-15 Hewlett-Packard Development Company, L.P. Active heat sink with multiple fans
DE102006007303A1 (en) * 2006-02-16 2007-08-30 Infineon Technologies Ag Printed circuit board, has grouting cover element, in which multiple chips connected electrically with printed circuit board, are embedded
TWI317863B (en) * 2006-05-29 2009-12-01 Asustek Comp Inc Electrical device and heat dissipation module thereof
US20080011453A1 (en) * 2006-07-12 2008-01-17 Robert Liang Heat-Dissipating Device For Memory And Method For Manufacturing The Same
US20080024997A1 (en) * 2006-07-28 2008-01-31 Apple Computer, Inc. Staggered memory layout for improved cooling in reduced height enclosure
US7442903B2 (en) * 2006-07-31 2008-10-28 Asia Vital Components Co., Ltd. Heat sink for electronic device
US20080062652A1 (en) * 2006-09-07 2008-03-13 Wayne Lieberman Vapor heat spreader
US7480147B2 (en) * 2006-10-13 2009-01-20 Dell Products L.P. Heat dissipation apparatus utilizing empty component slot
US20080123294A1 (en) * 2006-11-29 2008-05-29 Richard & Ronald International Company, Ltd. Cooling apparatus for memory modules
EP1928023A3 (en) * 2006-12-01 2009-08-26 Richard & Ronald International Company Ltd. Cooling apparatus for memory modules
FR2911848B1 (en) * 2007-01-31 2009-12-25 Hispano Suiza Sa CIRCUIT FOR SUPPLYING ELECTRIC ENERGY IN AN AIRCRAFT FOR ELECTRICAL EQUIPMENT COMPRISING A DEFROST CIRCUIT
US7957134B2 (en) * 2007-04-10 2011-06-07 Hewlett-Packard Development Company, L.P. System and method having evaporative cooling for memory
WO2008148087A1 (en) * 2007-05-25 2008-12-04 Ocz Technology Group, Inc. Method and apparatus for cooling computer memory
TWM323687U (en) * 2007-06-01 2007-12-11 Comptake Technology Inc Auxiliary heat-dissipating apparatus of memory heat-dissipating piece
TWI336233B (en) * 2007-06-04 2011-01-11 Asustek Comp Inc Heat dissipation plate,gap adjusting jig for heat dissipation and main board
US20090002951A1 (en) * 2007-06-29 2009-01-01 Qimonda Ag System having a heat transfer apparatus
US7885063B2 (en) * 2007-08-20 2011-02-08 Nvidia Corporation Circuit board heat exchanger carrier system and method
TWM340493U (en) * 2007-11-09 2008-09-11 Zhi-Yi Zhang Memory heat dissipating device with increasing cooling area
US20090129012A1 (en) * 2007-11-21 2009-05-21 Anton Legen Method and apparatus for heat transfer
US20090154091A1 (en) * 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US7755897B2 (en) * 2007-12-27 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly with heat dissipation device
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
TWI349848B (en) * 2008-06-11 2011-10-01 Asustek Comp Inc Heat-dissipating device for memory module
JP4950968B2 (en) * 2008-09-01 2012-06-13 株式会社日立製作所 Storage device
TWI353510B (en) * 2009-01-23 2011-12-01 Asustek Comp Inc Heat dissipation apparatus
US20100188809A1 (en) * 2009-01-26 2010-07-29 Yung-Lin Hsu Radiator For Computer Memory
CN101861080A (en) * 2009-04-10 2010-10-13 富准精密工业(深圳)有限公司 Heat radiating device
US7821785B1 (en) * 2009-04-20 2010-10-26 Hewlett-Packard Development Company, L.P. Heatsinks and a spring in a baffle slot between adjacent components
US20110032672A1 (en) * 2009-08-10 2011-02-10 Dell Products L.P. Memory Heat Sink System
CN101998808A (en) * 2009-08-25 2011-03-30 富准精密工业(深圳)有限公司 Heat dissipating device
US8248805B2 (en) * 2009-09-24 2012-08-21 International Business Machines Corporation System to improve an in-line memory module
US8767403B2 (en) * 2009-10-30 2014-07-01 Hewlett-Packard Development Company, L.P. Frame having frame blades that participate in cooling memory modules
TW201121395A (en) * 2009-12-03 2011-06-16 Hon Hai Prec Ind Co Ltd Server heat dissipation device and fan module thereof
DE112011100140B4 (en) * 2010-03-08 2019-07-11 International Business Machines Corporation DIMM liquid cooling unit
CN201725266U (en) * 2010-06-17 2011-01-26 深圳富泰宏精密工业有限公司 Memory-bank heat-radiating assembly
CN102562624A (en) * 2010-12-21 2012-07-11 鸿富锦精密工业（深圳）有限公司 Fan combination
CN102595849A (en) * 2011-01-12 2012-07-18 鸿富锦精密工业（深圳）有限公司 Heat radiating device
CN102956251A (en) * 2011-08-25 2013-03-06 鸿富锦精密工业（深圳）有限公司 Solid state disk assembly
CN103034305A (en) * 2011-09-30 2013-04-10 鸿富锦精密工业（深圳）有限公司 Support component and extension card radiator using the same
CN103164002A (en) * 2011-12-16 2013-06-19 鸿富锦精密工业（深圳）有限公司 Memory bank heat dissipation device
CN103176569A (en) * 2011-12-22 2013-06-26 鸿富锦精密工业（深圳）有限公司 Memory bank combination
US8684757B2 (en) * 2012-04-27 2014-04-01 International Business Machines Corporation Memory module connector with air deflection system
JP5619966B2 (en) * 2012-10-11 2014-11-05 アサステック・コンピューター・インコーポレイテッドＡｓｕｓｔｅｋ Ｃｏｍｐｕｔｅｒ Ｉｎｃ． Heat dissipation structure
US20140334091A1 (en) * 2013-05-07 2014-11-13 Nvidia Corporation Counter rotating blower with individual controllable fan speeds
KR102280477B1 (en) * 2015-10-08 2021-07-22 삼성전자주식회사 Heat sink and memory module having the same
IT201600106718A1 (en) * 2016-10-24 2018-04-24 Eurotech S P A REFRIGERATED ELECTRONIC BOARD
US10952352B2 (en) * 2017-10-27 2021-03-16 Micron Technology, Inc. Assemblies including heat dispersing elements and related systems and methods
TWM559045U (en) * 2018-01-05 2018-04-21 Wu Tung Yi Memory heat dissipation unit
US11228126B2 (en) * 2020-01-09 2022-01-18 Intel Corporation Dual in-line memory modules (DIMM) connector towers with removable and/or lay-flat latches

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5835347A (en) * 1997-08-01 1998-11-10 Asia Vital Components Co., Ltd. CPU heat dissipating device
US5973921A (en) * 1997-11-03 1999-10-26 Lin; Yu-Chen Fixation structure for the fan of the CPU heat dissipating device
US6269001B1 (en) * 2000-04-20 2001-07-31 International Business Machines Corporation System for enhanced cooling and latching of pluggable electronic component
US6304442B1 (en) * 2000-06-29 2001-10-16 Hewlett-Packard Company Actively cooled daughterboard system
US20020088607A1 (en) * 2001-01-11 2002-07-11 Lo Wei Ta Heat sink assembly
US6435889B1 (en) * 2000-12-29 2002-08-20 Compaq Information Technologies Group, L.P. Reduced complexity hot plug blind mate fan assembly and connector therefor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5835347A (en) * 1997-08-01 1998-11-10 Asia Vital Components Co., Ltd. CPU heat dissipating device
US5973921A (en) * 1997-11-03 1999-10-26 Lin; Yu-Chen Fixation structure for the fan of the CPU heat dissipating device
US6269001B1 (en) * 2000-04-20 2001-07-31 International Business Machines Corporation System for enhanced cooling and latching of pluggable electronic component
US6304442B1 (en) * 2000-06-29 2001-10-16 Hewlett-Packard Company Actively cooled daughterboard system
US6435889B1 (en) * 2000-12-29 2002-08-20 Compaq Information Technologies Group, L.P. Reduced complexity hot plug blind mate fan assembly and connector therefor
US20020088607A1 (en) * 2001-01-11 2002-07-11 Lo Wei Ta Heat sink assembly

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
USPGPUB 2002/0088607 A1, Jul. 11, 2002, Lo. *

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070146993A1 (en) * 2005-12-23 2007-06-28 Intel Corporation Method, apparatus and computer system for enhancement of thermal energy transfer
US20100296240A1 (en) * 2006-01-09 2010-11-25 Ocz Technology Group, Inc. Method and apparatus for thermal management of computer memory modules
US20070165382A1 (en) * 2006-01-16 2007-07-19 Nanya Technology Corporation Heat sink assembly
US7382617B2 (en) * 2006-01-16 2008-06-03 Nanya Technology Corporation Heat sink assembly
US20080041561A1 (en) * 2006-08-18 2008-02-21 Foxconn Technology Co., Ltd. Heat dissipation device
US7753107B2 (en) * 2006-08-18 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080186685A1 (en) * 2007-02-06 2008-08-07 Samsung Electronics Co., Ltd. Printed circuit board and semiconductor memory module using the same
US20080266807A1 (en) * 2007-04-27 2008-10-30 Cray Inc. Electronic assembly with emi shielding heat sink
US20090034189A1 (en) * 2007-07-31 2009-02-05 Gregory Springer Riser card housing
US7539015B2 (en) * 2007-07-31 2009-05-26 Apple Inc. Riser card housing
US8064199B2 (en) * 2007-10-24 2011-11-22 Akust Technology Co., Ltd. Memory cooling fan tray
US20110228476A1 (en) * 2007-10-24 2011-09-22 Chuan-Hung Lin Memory Cooling Fan Tray
US20090219687A1 (en) * 2008-03-03 2009-09-03 Jui-Nan Lin Memory heat-dissipating mechanism
US20090233537A1 (en) * 2008-03-14 2009-09-17 Inventec Corporation Air baffle and calculation method of deformational stress thereof
US20090290308A1 (en) * 2008-05-23 2009-11-26 Comptake Technology Inc. Heat sink for chips
US20130288492A1 (en) * 2011-11-29 2013-10-31 Apple Inc. Folding so-dimm socket
US8968019B2 (en) * 2011-11-29 2015-03-03 Apple Inc. Folding SO-DIMM socket
US20150311609A1 (en) * 2011-11-29 2015-10-29 Apple Inc. Folding so-dimm socket
US9537238B2 (en) * 2011-11-29 2017-01-03 Apple Inc. Folding SO-DIMM socket
US20180242474A1 (en) * 2017-02-23 2018-08-23 Lsis Co., Ltd. Heat radiation apparatus using modular cooling apparatus
US10251319B2 (en) * 2017-02-23 2019-04-02 Lsis Co., Ltd. Heat radiation apparatus using modular cooling apparatus
CN111637663B (en) * 2020-05-18 2021-08-27 重庆鑫隆旭机械有限公司 Air energy heating pump

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