USRE39195E1 - Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates - Google Patents
Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates Download PDFInfo
- Publication number
- USRE39195E1 USRE39195E1 US10/054,692 US5469201A USRE39195E US RE39195 E1 USRE39195 E1 US RE39195E1 US 5469201 A US5469201 A US 5469201A US RE39195 E USRE39195 E US RE39195E
- Authority
- US
- United States
- Prior art keywords
- pad
- polishing
- ring
- wafer carrier
- refurbishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/18—Wheels of special form
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (71)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/054,692 USRE39195E1 (en) | 1998-02-27 | 2001-12-19 | Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/032,230 US6004196A (en) | 1998-02-27 | 1998-02-27 | Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates |
US10/054,692 USRE39195E1 (en) | 1998-02-27 | 2001-12-19 | Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/032,230 Reissue US6004196A (en) | 1998-02-27 | 1998-02-27 | Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE39195E1 true USRE39195E1 (en) | 2006-07-18 |
Family
ID=21863810
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/032,230 Ceased US6004196A (en) | 1998-02-27 | 1998-02-27 | Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates |
US10/054,692 Expired - Lifetime USRE39195E1 (en) | 1998-02-27 | 2001-12-19 | Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/032,230 Ceased US6004196A (en) | 1998-02-27 | 1998-02-27 | Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates |
Country Status (1)
Country | Link |
---|---|
US (2) | US6004196A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080092734A1 (en) * | 2006-10-07 | 2008-04-24 | Tbw Industries Inc. | Vacuum line clean-out separator system |
US20100257737A1 (en) * | 2009-02-20 | 2010-10-14 | Robert Veldman | Wheel assembly and method for making same |
US20140335767A1 (en) * | 2009-01-29 | 2014-11-13 | Tayyab Ishaq Suratwala | Apparatus and method for deterministic control of surface figure during full aperture pad polishing |
US20150165587A1 (en) * | 2013-12-13 | 2015-06-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Carrier head having abrasive structure on retainer ring |
US20170120414A1 (en) * | 2015-10-30 | 2017-05-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing system and method for polishing wafer |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990081117A (en) | 1998-04-25 | 1999-11-15 | 윤종용 | CMP Pad Conditioning Disc and Conditioner, Manufacturing Method, Regeneration Method and Cleaning Method of the Disc |
FR2780552B1 (en) * | 1998-06-26 | 2000-08-25 | St Microelectronics Sa | METHOD FOR POLISHING WAFERS OF INTEGRATED CIRCUITS |
US6250994B1 (en) * | 1998-10-01 | 2001-06-26 | Micron Technology, Inc. | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
US6271140B1 (en) * | 1998-10-01 | 2001-08-07 | Vanguard International Semiconductor Corporation | Coaxial dressing for chemical mechanical polishing |
EP1125688A4 (en) * | 1998-10-28 | 2006-09-27 | Hitachi Ltd | Polishing apparatus and a semiconductor manufacturing method using the same |
JP2001219376A (en) * | 2000-02-07 | 2001-08-14 | Mitsubishi Materials Corp | Electrodeposition grinding wheel |
US6447374B1 (en) * | 1999-12-17 | 2002-09-10 | Applied Materials, Inc. | Chemical mechanical planarization system |
US6579797B1 (en) * | 2000-01-25 | 2003-06-17 | Agere Systems Inc. | Cleaning brush conditioning apparatus |
US6340326B1 (en) * | 2000-01-28 | 2002-01-22 | Lam Research Corporation | System and method for controlled polishing and planarization of semiconductor wafers |
US6705930B2 (en) | 2000-01-28 | 2004-03-16 | Lam Research Corporation | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
JP2001223190A (en) * | 2000-02-08 | 2001-08-17 | Hitachi Ltd | Method and device for evaluating surface state of polishing pad, and method and device for manufacturing thin-film device |
US6517414B1 (en) | 2000-03-10 | 2003-02-11 | Appied Materials, Inc. | Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus |
US6227948B1 (en) * | 2000-03-21 | 2001-05-08 | International Business Machines Corporation | Polishing pad reconditioning via polishing pad material as conditioner |
US6616513B1 (en) | 2000-04-07 | 2003-09-09 | Applied Materials, Inc. | Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
US6313038B1 (en) | 2000-04-26 | 2001-11-06 | Micron Technology, Inc. | Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates |
US6652764B1 (en) | 2000-08-31 | 2003-11-25 | Micron Technology, Inc. | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
US6932896B2 (en) * | 2001-03-30 | 2005-08-23 | Nutool, Inc. | Method and apparatus for avoiding particle accumulation in electrodeposition |
US6722943B2 (en) | 2001-08-24 | 2004-04-20 | Micron Technology, Inc. | Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
US7037177B2 (en) * | 2001-08-30 | 2006-05-02 | Micron Technology, Inc. | Method and apparatus for conditioning a chemical-mechanical polishing pad |
DE10208414B4 (en) * | 2002-02-27 | 2013-01-10 | Advanced Micro Devices, Inc. | Apparatus with an improved polishing pad conditioner for chemical mechanical polishing |
US7094695B2 (en) | 2002-08-21 | 2006-08-22 | Micron Technology, Inc. | Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization |
US7011566B2 (en) | 2002-08-26 | 2006-03-14 | Micron Technology, Inc. | Methods and systems for conditioning planarizing pads used in planarizing substrates |
US7008299B2 (en) | 2002-08-29 | 2006-03-07 | Micron Technology, Inc. | Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces |
US6852016B2 (en) * | 2002-09-18 | 2005-02-08 | Micron Technology, Inc. | End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces |
US6918301B2 (en) * | 2002-11-12 | 2005-07-19 | Micron Technology, Inc. | Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces |
DE10261465B4 (en) * | 2002-12-31 | 2013-03-21 | Advanced Micro Devices, Inc. | Arrangement for chemical mechanical polishing with an improved conditioning tool |
US6884152B2 (en) | 2003-02-11 | 2005-04-26 | Micron Technology, Inc. | Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
DE10305711B4 (en) * | 2003-02-12 | 2005-09-01 | Infineon Technologies Ag | Gimpelhalter and chemical-mechanical polishing plant with such a Gimpelhalter |
US7077722B2 (en) * | 2004-08-02 | 2006-07-18 | Micron Technology, Inc. | Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces |
US7033253B2 (en) | 2004-08-12 | 2006-04-25 | Micron Technology, Inc. | Polishing pad conditioners having abrasives and brush elements, and associated systems and methods |
US7153191B2 (en) * | 2004-08-20 | 2006-12-26 | Micron Technology, Inc. | Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods |
JP4864402B2 (en) * | 2005-09-29 | 2012-02-01 | 株式会社東芝 | Manufacturing method of semiconductor device |
JP2007144564A (en) * | 2005-11-28 | 2007-06-14 | Ebara Corp | Polishing device |
US7754612B2 (en) * | 2007-03-14 | 2010-07-13 | Micron Technology, Inc. | Methods and apparatuses for removing polysilicon from semiconductor workpieces |
JP5396616B2 (en) * | 2008-10-29 | 2014-01-22 | Sumco Techxiv株式会社 | Seasoning plate, semiconductor polishing apparatus, polishing pad seasoning method |
JP2010194704A (en) * | 2009-01-27 | 2010-09-09 | Shinano Denki Seiren Kk | Grinding wheel for correcting surface plate, polishing device for correcting surface plate, and method for correcting polishing surface plate |
JP2017121672A (en) * | 2016-01-05 | 2017-07-13 | 不二越機械工業株式会社 | Method for polishing workpiece and method for dressing polishing pad |
CN108161711A (en) * | 2017-12-28 | 2018-06-15 | 德淮半导体有限公司 | Grinding wafer device and grinding head |
CN110549242B (en) * | 2018-05-31 | 2020-10-23 | 许栋梁 | Omnidirectional integrated regulating device |
CN112757161B (en) * | 2020-12-31 | 2022-04-19 | 上海超硅半导体股份有限公司 | Trimming method of polishing carrier |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5584751A (en) | 1995-02-28 | 1996-12-17 | Mitsubishi Materials Corporation | Wafer polishing apparatus |
US5595527A (en) | 1994-07-27 | 1997-01-21 | Texas Instruments Incorporated | Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish |
US5664987A (en) | 1994-01-31 | 1997-09-09 | National Semiconductor Corporation | Methods and apparatus for control of polishing pad conditioning for wafer planarization |
US5749771A (en) * | 1994-02-22 | 1998-05-12 | Nec Corporation | Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost |
US5775983A (en) | 1995-05-01 | 1998-07-07 | Applied Materials, Inc. | Apparatus and method for conditioning a chemical mechanical polishing pad |
US5782675A (en) | 1996-10-21 | 1998-07-21 | Micron Technology, Inc. | Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers |
US5785585A (en) | 1995-09-18 | 1998-07-28 | International Business Machines Corporation | Polish pad conditioner with radial compensation |
US5823854A (en) | 1996-05-28 | 1998-10-20 | Industrial Technology Research Institute | Chemical-mechanical polish (CMP) pad conditioner |
US5851138A (en) | 1996-08-15 | 1998-12-22 | Texas Instruments Incorporated | Polishing pad conditioning system and method |
US5857899A (en) * | 1997-04-04 | 1999-01-12 | Ontrak Systems, Inc. | Wafer polishing head with pad dressing element |
US5885137A (en) | 1997-06-27 | 1999-03-23 | Siemens Aktiengesellschaft | Chemical mechanical polishing pad conditioner |
US5885147A (en) | 1997-05-12 | 1999-03-23 | Integrated Process Equipment Corp. | Apparatus for conditioning polishing pads |
US5902173A (en) * | 1996-03-19 | 1999-05-11 | Yamaha Corporation | Polishing machine with efficient polishing and dressing |
US5931725A (en) * | 1996-07-30 | 1999-08-03 | Tokyo Seimitsu Co., Ltd. | Wafer polishing machine |
US6004193A (en) * | 1997-07-17 | 1999-12-21 | Lsi Logic Corporation | Dual purpose retaining ring and polishing pad conditioner |
US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
US6077155A (en) * | 1995-04-14 | 2000-06-20 | Sony Corporation | Polishing device and correcting method therefor |
US6135868A (en) * | 1998-02-11 | 2000-10-24 | Applied Materials, Inc. | Groove cleaning device for chemical-mechanical polishing |
-
1998
- 1998-02-27 US US09/032,230 patent/US6004196A/en not_active Ceased
-
2001
- 2001-12-19 US US10/054,692 patent/USRE39195E1/en not_active Expired - Lifetime
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5664987A (en) | 1994-01-31 | 1997-09-09 | National Semiconductor Corporation | Methods and apparatus for control of polishing pad conditioning for wafer planarization |
US5749771A (en) * | 1994-02-22 | 1998-05-12 | Nec Corporation | Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost |
US5595527A (en) | 1994-07-27 | 1997-01-21 | Texas Instruments Incorporated | Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish |
US5584751A (en) | 1995-02-28 | 1996-12-17 | Mitsubishi Materials Corporation | Wafer polishing apparatus |
US6077155A (en) * | 1995-04-14 | 2000-06-20 | Sony Corporation | Polishing device and correcting method therefor |
US5775983A (en) | 1995-05-01 | 1998-07-07 | Applied Materials, Inc. | Apparatus and method for conditioning a chemical mechanical polishing pad |
US5785585A (en) | 1995-09-18 | 1998-07-28 | International Business Machines Corporation | Polish pad conditioner with radial compensation |
US5902173A (en) * | 1996-03-19 | 1999-05-11 | Yamaha Corporation | Polishing machine with efficient polishing and dressing |
US5823854A (en) | 1996-05-28 | 1998-10-20 | Industrial Technology Research Institute | Chemical-mechanical polish (CMP) pad conditioner |
US5931725A (en) * | 1996-07-30 | 1999-08-03 | Tokyo Seimitsu Co., Ltd. | Wafer polishing machine |
US5851138A (en) | 1996-08-15 | 1998-12-22 | Texas Instruments Incorporated | Polishing pad conditioning system and method |
US5782675A (en) | 1996-10-21 | 1998-07-21 | Micron Technology, Inc. | Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers |
US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
US5857899A (en) * | 1997-04-04 | 1999-01-12 | Ontrak Systems, Inc. | Wafer polishing head with pad dressing element |
US5885147A (en) | 1997-05-12 | 1999-03-23 | Integrated Process Equipment Corp. | Apparatus for conditioning polishing pads |
US5885137A (en) | 1997-06-27 | 1999-03-23 | Siemens Aktiengesellschaft | Chemical mechanical polishing pad conditioner |
US6004193A (en) * | 1997-07-17 | 1999-12-21 | Lsi Logic Corporation | Dual purpose retaining ring and polishing pad conditioner |
US6135868A (en) * | 1998-02-11 | 2000-10-24 | Applied Materials, Inc. | Groove cleaning device for chemical-mechanical polishing |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080092734A1 (en) * | 2006-10-07 | 2008-04-24 | Tbw Industries Inc. | Vacuum line clean-out separator system |
US7909910B2 (en) | 2006-10-07 | 2011-03-22 | Tbw Industries Inc. | Vacuum line clean-out separator system |
US20140335767A1 (en) * | 2009-01-29 | 2014-11-13 | Tayyab Ishaq Suratwala | Apparatus and method for deterministic control of surface figure during full aperture pad polishing |
US9782871B2 (en) * | 2009-01-29 | 2017-10-10 | Lawrence Livermore National Security, Llc | Apparatus and method for deterministic control of surface figure during full aperture pad polishing |
US20100257737A1 (en) * | 2009-02-20 | 2010-10-14 | Robert Veldman | Wheel assembly and method for making same |
US9120195B2 (en) * | 2009-02-20 | 2015-09-01 | Diversified Machine, Inc. | Wheel assembly and method for making same |
US20150367426A1 (en) * | 2009-02-20 | 2015-12-24 | Diversified Machine, Inc. | Wheel assembly, and apparatus and method for making same |
US20150165587A1 (en) * | 2013-12-13 | 2015-06-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Carrier head having abrasive structure on retainer ring |
US9604340B2 (en) * | 2013-12-13 | 2017-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Carrier head having abrasive structure on retainer ring |
US10300578B2 (en) | 2013-12-13 | 2019-05-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Carrier head having abrasive structure on retainer ring |
US20170120414A1 (en) * | 2015-10-30 | 2017-05-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing system and method for polishing wafer |
US10265829B2 (en) * | 2015-10-30 | 2019-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing system |
Also Published As
Publication number | Publication date |
---|---|
US6004196A (en) | 1999-12-21 |
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