USH1396H - Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate - Google Patents

Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate Download PDF

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Publication number
USH1396H
USH1396H US08/125,050 US12505093A USH1396H US H1396 H USH1396 H US H1396H US 12505093 A US12505093 A US 12505093A US H1396 H USH1396 H US H1396H
Authority
US
United States
Prior art keywords
substrate
oxide
gold film
thickness
oxide substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US08/125,050
Inventor
John R. Vig
Mary A. Hendrickson
Sally M. Laffey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Department of Army
Original Assignee
US Department of Army
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Department of Army filed Critical US Department of Army
Priority to US08/125,050 priority Critical patent/USH1396H/en
Application granted granted Critical
Publication of USH1396H publication Critical patent/USH1396H/en
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates

Definitions

  • the invention relates in general to the art of coating an oxide surface or substrate with a gold film and in particular to a method of depositing a strongly adhering gold film onto a quartz substrate and to the gold film so deposited.
  • the general object of this invention is to provide a gold film that will strongly adhere to an oxide surface.
  • a more particular object of the invention is to provide such a gold film without an intermediate adhesion layer.
  • a particular object of the invention is to provide such a gold film for a quartz surface or substrate.
  • an adherent gold film can be deposited on an oxide surface or substrate by cleaning the oxide surface so as to remove all organic contaminants and then vacuum depositing onto the clean oxide surface a gold film of up to 40 nanometers in thickness.
  • the surface of a quartz substrate is first cleaned and all organic contaminants removed by standard UV-ozone technique such as described in U.S. Pat. No. 4,028,135 by Vig et al.
  • the cleaned quartz substrate is placed into an ultrahigh vacuum system.
  • a gold film is then vacuum deposited by a clean deposition method such as thermal evaporation or electron beam deposition.
  • the thickness of the film is in the range of 10 to 30 nanometers.
  • the film adheres very strongly as evidenced by the fact that it cannot be removed by the Scotch tape test, or by ultrasonic agitation in water, alcohol or acetone, or by mechanical abrasion with objects such as cleanroom wipes, sponge tips and wooden sticks.
  • quartz one can use any substrate with an oxide surface, such as silicon wafers, glass and aluminum oxide.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

An adherent gold film is deposited onto an oxide substrate by cleaning thexide surface so as to remove all contaminants and then vacuum depositing onto the clean oxide surface a gold film of up to 40 nm in thickness.

Description

GOVERNMENT INTEREST
The invention described herein may be manufactured, used, and licensed by or for the Government for governmental purposes without the payment to us of any royalties thereon.
FIELD OF INVENTION
The invention relates in general to the art of coating an oxide surface or substrate with a gold film and in particular to a method of depositing a strongly adhering gold film onto a quartz substrate and to the gold film so deposited.
BACKGROUND OF THE INVENTION
It has been well known that gold films do not adhere to oxide surfaces, such as quartz. For example, the generally accepted criterion for adhesion between a metal film and an oxide surface or substrate has been that the metal must be oxygen active so as to react chemically with the oxide surface. Since gold does not form a stable oxide under normal conditions, having a heat of oxide formation of +19 kcal/mol it, supposedly, does not adhere to oxide surfaces as, for example, quartz. Adhesion layers, such as chromium or titanium are often used as adhesion layers between the oxide and the gold. In some cases, however, it would be highly desirable to not have to use an intermediate layer.
SUMMARY OF THE INVENTION
The general object of this invention is to provide a gold film that will strongly adhere to an oxide surface. A more particular object of the invention is to provide such a gold film without an intermediate adhesion layer. A particular object of the invention is to provide such a gold film for a quartz surface or substrate.
It has now been found that an adherent gold film can be deposited on an oxide surface or substrate by cleaning the oxide surface so as to remove all organic contaminants and then vacuum depositing onto the clean oxide surface a gold film of up to 40 nanometers in thickness.
Gold films of thickness 10 nm, 20 nm and 30 nm adhere strongly, whereas films of greater than 40 nm thickness adhere very weakly. In this connection, the Scotch tape test readily removes the thicker films but not the thinner ones.
DESCRIPTION OF THE PREFERRED EMBODIMENT
The surface of a quartz substrate is first cleaned and all organic contaminants removed by standard UV-ozone technique such as described in U.S. Pat. No. 4,028,135 by Vig et al.
The cleaned quartz substrate is placed into an ultrahigh vacuum system. A gold film is then vacuum deposited by a clean deposition method such as thermal evaporation or electron beam deposition. The thickness of the film is in the range of 10 to 30 nanometers.
The film adheres very strongly as evidenced by the fact that it cannot be removed by the Scotch tape test, or by ultrasonic agitation in water, alcohol or acetone, or by mechanical abrasion with objects such as cleanroom wipes, sponge tips and wooden sticks. In lieu of quartz one can use any substrate with an oxide surface, such as silicon wafers, glass and aluminum oxide.
We wish it to be understood that we do not desire to be limited to the exact details of construction shown and described for obvious modifications will occur to a person skilled in the art.

Claims (6)

What is claimed is:
1. An oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate.
2. An oxide substrate according to claim 1 wherein the oxide substrate is selected from the group consisting of a quartz substrate, a silicon wafer, a glass substrate and aluminum oxide.
3. An oxide substrate according to claim 2 wherein the oxide substrate is quartz.
4. An oxide substrate according to claim 2 wherein the oxide substrate is a silicon wafer.
5. An oxide substrate according to claim 2 wherein the oxide substrate is a glass substrate.
6. An oxide substrate according to claim 2 wherein the oxide substrate is aluminum oxide.
US08/125,050 1993-09-21 1993-09-21 Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate Abandoned USH1396H (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US08/125,050 USH1396H (en) 1993-09-21 1993-09-21 Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/125,050 USH1396H (en) 1993-09-21 1993-09-21 Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate

Publications (1)

Publication Number Publication Date
USH1396H true USH1396H (en) 1995-01-03

Family

ID=22417989

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/125,050 Abandoned USH1396H (en) 1993-09-21 1993-09-21 Oxide substrate with a strongly adherent gold film of 10 to 40 nm in thickness on the substrate

Country Status (1)

Country Link
US (1) USH1396H (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653946A (en) * 1969-09-30 1972-04-04 Bell Telephone Labor Inc Method of depositing an adherent gold film on the surfaces of a suitable substrate
US3833410A (en) * 1971-12-30 1974-09-03 Trw Inc High stability thin film alloy resistors
US4005229A (en) * 1975-06-23 1977-01-25 Ppg Industries, Inc. Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures
US4028080A (en) * 1976-06-23 1977-06-07 The United States Of America As Represented By The Secretary Of The Army Method of treating optical waveguide fibers
US4309460A (en) * 1977-11-11 1982-01-05 Bell Telephone Laboratories, Incorporated Process for producing gold films
US4457972A (en) * 1981-12-07 1984-07-03 California Institute Of Technology Enhanced adhesion by high energy bombardment
US4888204A (en) * 1988-09-12 1989-12-19 Hughes Aircraft Company Photochemical deposition of high purity gold films
US4933204A (en) * 1988-09-23 1990-06-12 Rockwell International Corporation Method of producing a gold film
US4959257A (en) * 1987-07-17 1990-09-25 Lucas Industries Public Limited Company Transparencies
US5139856A (en) * 1988-12-20 1992-08-18 Ngk Insulators, Ltd. Plated ceramic or glass substrate having undercoat
US5288558A (en) * 1991-09-13 1994-02-22 Flachglas Aktiengesellschaft Attachment for video screens having dual optical active dereflection layers

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653946A (en) * 1969-09-30 1972-04-04 Bell Telephone Labor Inc Method of depositing an adherent gold film on the surfaces of a suitable substrate
US3833410A (en) * 1971-12-30 1974-09-03 Trw Inc High stability thin film alloy resistors
US4005229A (en) * 1975-06-23 1977-01-25 Ppg Industries, Inc. Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures
US4028080A (en) * 1976-06-23 1977-06-07 The United States Of America As Represented By The Secretary Of The Army Method of treating optical waveguide fibers
US4309460A (en) * 1977-11-11 1982-01-05 Bell Telephone Laboratories, Incorporated Process for producing gold films
US4457972A (en) * 1981-12-07 1984-07-03 California Institute Of Technology Enhanced adhesion by high energy bombardment
US4959257A (en) * 1987-07-17 1990-09-25 Lucas Industries Public Limited Company Transparencies
US4888204A (en) * 1988-09-12 1989-12-19 Hughes Aircraft Company Photochemical deposition of high purity gold films
US4933204A (en) * 1988-09-23 1990-06-12 Rockwell International Corporation Method of producing a gold film
US5139856A (en) * 1988-12-20 1992-08-18 Ngk Insulators, Ltd. Plated ceramic or glass substrate having undercoat
US5288558A (en) * 1991-09-13 1994-02-22 Flachglas Aktiengesellschaft Attachment for video screens having dual optical active dereflection layers

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