USD797691S1 - Composite edge ring - Google Patents

Composite edge ring Download PDF

Info

Publication number
USD797691S1
USD797691S1 US29/561,163 US201629561163F USD797691S US D797691 S1 USD797691 S1 US D797691S1 US 201629561163 F US201629561163 F US 201629561163F US D797691 S USD797691 S US D797691S
Authority
US
United States
Prior art keywords
edge ring
composite edge
view
composite
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/561,163
Inventor
Olivier Joubert
Jason A. Kenney
Sunil Srinivasan
James Rogers
Rajinder Dhindsa
Vedapuram S. Achutharaman
Olivier Luere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/561,163 priority Critical patent/USD797691S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SRINIVASAN, SUNIL, LUERE, OLIVIER, ACHUTHARAMAN, VEDAPURAM S., DHINDSA, RAJINDER, JOUBERT, OLIVIER, KENNEY, Jason A., ROGERS, JAMES
Priority to TW105305534F priority patent/TWD187824S/en
Priority to JPD2016-22122F priority patent/JP1575876S/ja
Application granted granted Critical
Publication of USD797691S1 publication Critical patent/USD797691S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of a composite edge ring showing our new design;
FIG. 2 is bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a side elevational view thereof, the opposite side elevation view, the front elevation view, and the rear elevation view being a mirror-image thereof;
FIG. 6 is a cross-sectional view thereof taken along section 6-6 of FIG. 3;
FIG. 7 is an enlarged view of a portion labeled FIG. 7 in FIG. 6; and,
FIG. 8 is an enlarged view of a portion labeled FIG. 8 in FIG. 6 shown in a used condition with a surrounding environment shown in broken lines.
The broken lines in the Figures form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a composite edge ring, as shown and described.
US29/561,163 2016-04-14 2016-04-14 Composite edge ring Active USD797691S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/561,163 USD797691S1 (en) 2016-04-14 2016-04-14 Composite edge ring
TW105305534F TWD187824S (en) 2016-04-14 2016-09-20 A composite edge ring
JPD2016-22122F JP1575876S (en) 2016-04-14 2016-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/561,163 USD797691S1 (en) 2016-04-14 2016-04-14 Composite edge ring

Publications (1)

Publication Number Publication Date
USD797691S1 true USD797691S1 (en) 2017-09-19

Family

ID=58645867

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/561,163 Active USD797691S1 (en) 2016-04-14 2016-04-14 Composite edge ring

Country Status (3)

Country Link
US (1) USD797691S1 (en)
JP (1) JP1575876S (en)
TW (1) TWD187824S (en)

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170256435A1 (en) * 2016-03-04 2017-09-07 Applied Materials, Inc. Universal process kit
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD847982S1 (en) * 2016-02-04 2019-05-07 Atos Medical Ab Heat exchanger base plate
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD889335S1 (en) * 2018-10-03 2020-07-07 Vaughn C Jewell Disc
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
TWD208174S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208178S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208175S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208176S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208177S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
TWD214021S (en) 2020-07-27 2021-09-11 美商應用材料股份有限公司 Edge ring
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942516S1 (en) 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6039836A (en) 1997-12-19 2000-03-21 Lam Research Corporation Focus rings
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
US7025862B2 (en) * 2002-10-22 2006-04-11 Applied Materials Plating uniformity control by contact ring shaping
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6039836A (en) 1997-12-19 2000-03-21 Lam Research Corporation Focus rings
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
US7025862B2 (en) * 2002-10-22 2006-04-11 Applied Materials Plating uniformity control by contact ring shaping
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring

Cited By (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD847982S1 (en) * 2016-02-04 2019-05-07 Atos Medical Ab Heat exchanger base plate
US11049760B2 (en) * 2016-03-04 2021-06-29 Applied Materials, Inc. Universal process kit
US20170256435A1 (en) * 2016-03-04 2017-09-07 Applied Materials, Inc. Universal process kit
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD208176S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208178S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208177S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208174S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208175S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
USD889335S1 (en) * 2018-10-03 2020-07-07 Vaughn C Jewell Disc
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
TWD214021S (en) 2020-07-27 2021-09-11 美商應用材料股份有限公司 Edge ring
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Also Published As

Publication number Publication date
TWD187824S (en) 2018-01-11
JP1575876S (en) 2017-05-08

Similar Documents

Publication Publication Date Title
USD797691S1 (en) Composite edge ring
USD823643S1 (en) Bowl
USD892622S1 (en) Food container
USD859376S1 (en) Antenna
USD870114S1 (en) Adapter
USD793073S1 (en) Shoe upper
USD801011S1 (en) Footwear
USD833124S1 (en) Footwear
USD828158S1 (en) Lid with scoop retainer
USD903496S1 (en) Bottle
USD841934S1 (en) Glove palm
USD886254S1 (en) Toilet seal
USD787830S1 (en) Cap and holder assembly
USD787831S1 (en) Cap and holder assembly
USD804311S1 (en) Bottle base
USD903033S1 (en) Bow string release
USD835394S1 (en) Umbrella top
USD775236S1 (en) Combined displacement pump and displacement pump housing
USD860427S1 (en) Ring fan
USD755896S1 (en) Cardholder stick
USD835448S1 (en) Barbeque
USD818414S1 (en) Vortex propeller
USD816088S1 (en) Keyboard case with extension
USD815782S1 (en) Litter scoop
USD796798S1 (en) Footwear