USD761745S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD761745S1
USD761745S1 US29/476,807 US201329476807F USD761745S US D761745 S1 USD761745 S1 US D761745S1 US 201329476807 F US201329476807 F US 201329476807F US D761745 S USD761745 S US D761745S
Authority
US
United States
Prior art keywords
semiconductor device
view
ornamental design
taken along
along line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/476,807
Inventor
Jiro Shinkai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2013-14730F external-priority patent/JP1493925S/ja
Priority claimed from JPD2013-14732F external-priority patent/JP1500107S/ja
Priority claimed from JPD2013-14731F external-priority patent/JP1493609S/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHINKAI, JIRO
Application granted granted Critical
Publication of USD761745S1 publication Critical patent/USD761745S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front view of a semiconductor device showing my new design;
FIG. 2 is rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a cross sectional view taken along line 7-7 of FIG. 1 thereof;
FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 1 thereof; and,
FIG. 9 is a perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/476,807 2013-06-28 2013-12-17 Semiconductor device Active USD761745S1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2013-014731 2013-01-29
JP2013-014730 2013-06-28
JP2013-014732 2013-06-28
JPD2013-14730F JP1493925S (en) 2013-06-28 2013-06-28
JPD2013-14732F JP1500107S (en) 2013-06-28 2013-06-28
JPD2013-14731F JP1493609S (en) 2013-06-28 2013-06-28

Publications (1)

Publication Number Publication Date
USD761745S1 true USD761745S1 (en) 2016-07-19

Family

ID=56382044

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/476,807 Active USD761745S1 (en) 2013-06-28 2013-12-17 Semiconductor device

Country Status (1)

Country Link
US (1) USD761745S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD778851S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
US10383240B2 (en) 2017-06-13 2019-08-13 Honeywell International Inc. Housing to retain integrated circuit package
US10718640B2 (en) * 2016-05-03 2020-07-21 Continental Teves Ag & Co. Ohg Sensor element for a motor vehicle
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat

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US2789344A (en) * 1951-04-23 1957-04-23 American Radiator & Standard Method of cold shaping tubular steel articles and product
US3579859A (en) * 1968-02-02 1971-05-25 Pierre Malenge Design grid with variable guide
USD273582S (en) * 1981-09-08 1984-04-24 Bolt William S Holding pallet for PC boards
USD273860S (en) * 1981-09-08 1984-05-15 Bolt William S Holding pallet for PC boards
USD390833S (en) * 1996-09-09 1998-02-17 Fujikura Ltd. Piezolectric conversion type semiconductor device
USD436085S1 (en) * 1999-06-18 2001-01-09 Fujikura, Ltd. Piezoelectric conversion type semiconductor device
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US20020066693A1 (en) * 2000-12-01 2002-06-06 Jones Zhu Coded tray for holding packaged semiconductor devices
USD471167S1 (en) * 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
USD493152S1 (en) * 2002-11-27 2004-07-20 International Business Machines Corporation Server blade chassis midplane printed circuit board with cover
USD522471S1 (en) * 2005-05-27 2006-06-06 Danville Automation Holdings Llc Funnel plate
USD526972S1 (en) * 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
US20070086189A1 (en) * 2004-05-18 2007-04-19 Onscreen Technologies, Inc. LED Assembly with Vented Circuit Board
USD554084S1 (en) * 2005-10-31 2007-10-30 Kabushiki Kaisha Toshiba Portion of a semiconductor apparatus mounting-position accuracy measurement jig
USD570307S1 (en) * 2006-11-30 2008-06-03 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD576577S1 (en) * 2006-11-30 2008-09-09 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD579885S1 (en) * 2007-02-20 2008-11-04 Tokyo Electron Limited Upper heat insulating cylinder for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD687788S1 (en) * 2012-01-20 2013-08-13 Lextar Electronics Corp. Light emitting diode module
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD695241S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD724554S1 (en) * 2014-02-19 2015-03-17 Fuji Electric Co., Ltd. Semiconductor module
USD730304S1 (en) * 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2789344A (en) * 1951-04-23 1957-04-23 American Radiator & Standard Method of cold shaping tubular steel articles and product
US3579859A (en) * 1968-02-02 1971-05-25 Pierre Malenge Design grid with variable guide
USD273582S (en) * 1981-09-08 1984-04-24 Bolt William S Holding pallet for PC boards
USD273860S (en) * 1981-09-08 1984-05-15 Bolt William S Holding pallet for PC boards
USD390833S (en) * 1996-09-09 1998-02-17 Fujikura Ltd. Piezolectric conversion type semiconductor device
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
USD436085S1 (en) * 1999-06-18 2001-01-09 Fujikura, Ltd. Piezoelectric conversion type semiconductor device
US20020066693A1 (en) * 2000-12-01 2002-06-06 Jones Zhu Coded tray for holding packaged semiconductor devices
USD471167S1 (en) * 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
USD493152S1 (en) * 2002-11-27 2004-07-20 International Business Machines Corporation Server blade chassis midplane printed circuit board with cover
US20070086189A1 (en) * 2004-05-18 2007-04-19 Onscreen Technologies, Inc. LED Assembly with Vented Circuit Board
USD526972S1 (en) * 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD522471S1 (en) * 2005-05-27 2006-06-06 Danville Automation Holdings Llc Funnel plate
USD554084S1 (en) * 2005-10-31 2007-10-30 Kabushiki Kaisha Toshiba Portion of a semiconductor apparatus mounting-position accuracy measurement jig
USD570307S1 (en) * 2006-11-30 2008-06-03 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD576577S1 (en) * 2006-11-30 2008-09-09 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD579885S1 (en) * 2007-02-20 2008-11-04 Tokyo Electron Limited Upper heat insulating cylinder for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD704155S1 (en) * 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
USD737229S1 (en) * 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD737230S1 (en) * 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD687788S1 (en) * 2012-01-20 2013-08-13 Lextar Electronics Corp. Light emitting diode module
USD695241S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD724554S1 (en) * 2014-02-19 2015-03-17 Fuji Electric Co., Ltd. Semiconductor module
USD730304S1 (en) * 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD778851S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778852S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778850S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
US10718640B2 (en) * 2016-05-03 2020-07-21 Continental Teves Ag & Co. Ohg Sensor element for a motor vehicle
US10383240B2 (en) 2017-06-13 2019-08-13 Honeywell International Inc. Housing to retain integrated circuit package
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat

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