USD734732S1 - Circuit board material - Google Patents
Circuit board material Download PDFInfo
- Publication number
- USD734732S1 USD734732S1 US29/478,679 US201429478679F USD734732S US D734732 S1 USD734732 S1 US D734732S1 US 201429478679 F US201429478679 F US 201429478679F US D734732 S USD734732 S US D734732S
- Authority
- US
- United States
- Prior art keywords
- circuit board
- board material
- view
- enlarged
- upper layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
The upper layer of the circuit board material is a flat, transparent surface in which an underlying second layer showing a woven structure is visible through the first upper layer.
Dashed-dot-dashed broken lines define the boundary lines of the enlarged portions of the design in FIGS. 1 , 5, and 7-9.
Claims (1)
- The ornamental design for a circuit board material, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2013-15840F JP1497024S (en) | 2013-07-10 | 2013-07-10 | |
JP2013-015840 | 2013-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD734732S1 true USD734732S1 (en) | 2015-07-21 |
Family
ID=53540388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/478,679 Active USD734732S1 (en) | 2013-07-10 | 2014-01-07 | Circuit board material |
Country Status (2)
Country | Link |
---|---|
US (1) | USD734732S1 (en) |
JP (1) | JP1497024S (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD775370S1 (en) * | 2014-02-14 | 2016-12-27 | Omni Decor S.R.L. | Patterned glass |
USD838512S1 (en) | 2014-08-04 | 2019-01-22 | Uncle Grant's LLC | Napkin |
USD845226S1 (en) * | 2015-04-02 | 2019-04-09 | Neo Solar Power Corp. | Electrode of a solar cell substrate |
USD879046S1 (en) * | 2017-10-06 | 2020-03-24 | Laird Technologies, Inc. | Material having edging |
USD881822S1 (en) * | 2017-10-06 | 2020-04-21 | Laird Technologies, Inc. | Material having an edge shape |
USD999405S1 (en) * | 2017-10-06 | 2023-09-19 | Laird Technologies, Inc. | Material having edging |
USD999748S1 (en) * | 2021-12-02 | 2023-09-26 | Ace Technologies Corporation | Printed circuit board |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US835765A (en) * | 1906-05-24 | 1906-11-13 | Paul Richter | Textile covering for walls and other articles. |
US3372310A (en) * | 1965-04-30 | 1968-03-05 | Radiation Inc | Universal modular packages for integrated circuits |
USD246454S (en) * | 1976-09-15 | 1977-11-22 | Milgo Electronic Corporation | Printed circuit cabinet |
USD258281S (en) * | 1977-09-23 | 1981-02-17 | Electronic Molding Corporation | Panel board for integrated circuit packages |
USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD510327S1 (en) * | 2002-02-12 | 2005-10-04 | Smith Donald J | Substrate with surface patterns |
USD544216S1 (en) * | 2006-08-11 | 2007-06-12 | Milliken & Company | Moldable fabric |
USD552048S1 (en) * | 2005-10-26 | 2007-10-02 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
USD605613S1 (en) * | 2008-05-15 | 2009-12-08 | Adc Gmbh | Printed circuit board for electrical connector |
USD613690S1 (en) * | 2008-12-09 | 2010-04-13 | Fujifilm Corporation | Conductive sheet |
USD615927S1 (en) * | 2008-05-09 | 2010-05-18 | Fujifilm Corporation | Conductive sheet |
USD625695S1 (en) * | 2008-10-14 | 2010-10-19 | Stion Corporation | Patterned thin film photovoltaic module |
USD628394S1 (en) * | 2009-06-19 | 2010-12-07 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD641720S1 (en) * | 2010-03-26 | 2011-07-19 | Advanced Micro Devices, Inc. | Circuit package lid |
USD651809S1 (en) * | 2009-06-19 | 2012-01-10 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD655921S1 (en) * | 2009-11-05 | 2012-03-20 | Columbia Sportswear North America, Inc. | Heat reflective material |
USD672155S1 (en) * | 2009-06-19 | 2012-12-11 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD672968S1 (en) * | 2009-06-19 | 2012-12-25 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD691817S1 (en) * | 2007-04-26 | 2013-10-22 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
-
2013
- 2013-07-10 JP JPD2013-15840F patent/JP1497024S/ja active Active
-
2014
- 2014-01-07 US US29/478,679 patent/USD734732S1/en active Active
Patent Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US835765A (en) * | 1906-05-24 | 1906-11-13 | Paul Richter | Textile covering for walls and other articles. |
US3372310A (en) * | 1965-04-30 | 1968-03-05 | Radiation Inc | Universal modular packages for integrated circuits |
USD246454S (en) * | 1976-09-15 | 1977-11-22 | Milgo Electronic Corporation | Printed circuit cabinet |
USD258281S (en) * | 1977-09-23 | 1981-02-17 | Electronic Molding Corporation | Panel board for integrated circuit packages |
USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
USD510327S1 (en) * | 2002-02-12 | 2005-10-04 | Smith Donald J | Substrate with surface patterns |
USD552048S1 (en) * | 2005-10-26 | 2007-10-02 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
USD544216S1 (en) * | 2006-08-11 | 2007-06-12 | Milliken & Company | Moldable fabric |
USD691817S1 (en) * | 2007-04-26 | 2013-10-22 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
USD615927S1 (en) * | 2008-05-09 | 2010-05-18 | Fujifilm Corporation | Conductive sheet |
USD605613S1 (en) * | 2008-05-15 | 2009-12-08 | Adc Gmbh | Printed circuit board for electrical connector |
USD625695S1 (en) * | 2008-10-14 | 2010-10-19 | Stion Corporation | Patterned thin film photovoltaic module |
USD613690S1 (en) * | 2008-12-09 | 2010-04-13 | Fujifilm Corporation | Conductive sheet |
USD628394S1 (en) * | 2009-06-19 | 2010-12-07 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD651809S1 (en) * | 2009-06-19 | 2012-01-10 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD672155S1 (en) * | 2009-06-19 | 2012-12-11 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD672968S1 (en) * | 2009-06-19 | 2012-12-25 | Dsm Ip Assets B.V. | Film sheet for use in antiballistic articles |
USD655921S1 (en) * | 2009-11-05 | 2012-03-20 | Columbia Sportswear North America, Inc. | Heat reflective material |
USD641720S1 (en) * | 2010-03-26 | 2011-07-19 | Advanced Micro Devices, Inc. | Circuit package lid |
Non-Patent Citations (3)
Title |
---|
Chukoh Flo, "Copper-Clad Laminates," Chukoh Chemical Industries, Ltd., Nov. 1, 2007, 5 pgs., with English abstract. |
Pillar PC-Clad, "Microwave Copper-Clad Laminates," Release date Unknown but publicly known at least as early as 2008, Nippon Pillar Packing Co., Ltd., 5 pgs., with English abstract. |
Products News 173, "Black colored flexible printed circuit stiffener," http://www.risho.co.jp/rishonews/pn173/productnews.html, Risho Kogyo Co., Ltd., Jul. 10, 2010, 4 pgs., with English abstract. |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD775370S1 (en) * | 2014-02-14 | 2016-12-27 | Omni Decor S.R.L. | Patterned glass |
USD806900S1 (en) | 2014-02-14 | 2018-01-02 | Omni Decor S.R.L. | Patterned glass |
USD838512S1 (en) | 2014-08-04 | 2019-01-22 | Uncle Grant's LLC | Napkin |
USD845226S1 (en) * | 2015-04-02 | 2019-04-09 | Neo Solar Power Corp. | Electrode of a solar cell substrate |
USD879046S1 (en) * | 2017-10-06 | 2020-03-24 | Laird Technologies, Inc. | Material having edging |
USD881822S1 (en) * | 2017-10-06 | 2020-04-21 | Laird Technologies, Inc. | Material having an edge shape |
USD998827S1 (en) * | 2017-10-06 | 2023-09-12 | Laird Technologies, Inc. | Material having edge shape |
USD999405S1 (en) * | 2017-10-06 | 2023-09-19 | Laird Technologies, Inc. | Material having edging |
USD999748S1 (en) * | 2021-12-02 | 2023-09-26 | Ace Technologies Corporation | Printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JP1497024S (en) | 2017-05-01 |
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