USD571810S1 - Module with built-in integrated circuits for use with IC cards - Google Patents

Module with built-in integrated circuits for use with IC cards Download PDF

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Publication number
USD571810S1
USD571810S1 US29/268,869 US26886906F USD571810S US D571810 S1 USD571810 S1 US D571810S1 US 26886906 F US26886906 F US 26886906F US D571810 S USD571810 S US D571810S
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United States
Prior art keywords
built
module
cards
integrated circuits
view
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US29/268,869
Inventor
Hidetaka Ikeda
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Toshiba Corp
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Toshiba Corp
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Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IKEDA, HIDETAKA
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FIG. 1 is a perspective view of a module with built-in integrated circuits for use with IC cards showing my new design,
FIG. 2 is a front elevational view thereof,
FIG. 3 is a rear elevational view thereof,
FIG. 4 is a left side elevational view thereof,
FIG. 5 is a right side elevational view thereof,
FIG. 6 is a top plan view thereof,
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a reduced reference view showing the article in use thereof.
The portions shown in broken lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. We claim the ornamental design for a module with built-in integrated circuits for use with IC cards, as shown and described.
US29/268,869 2006-06-20 2006-11-15 Module with built-in integrated circuits for use with IC cards Expired - Lifetime USD571810S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006016006 2006-06-20

Publications (1)

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USD571810S1 true USD571810S1 (en) 2008-06-24

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US29/268,869 Expired - Lifetime USD571810S1 (en) 2006-06-20 2006-11-15 Module with built-in integrated circuits for use with IC cards

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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD773466S1 (en) * 2015-08-20 2016-12-06 Isaac S. Daniel Combined secure digital memory and subscriber identity module
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
US9769521B2 (en) 2013-03-13 2017-09-19 Nagrastar, Llc Systems and methods for performing transport I/O
USD798868S1 (en) * 2015-08-20 2017-10-03 Isaac S. Daniel Combined subscriber identification module and storage card
USD816135S1 (en) * 2014-12-19 2018-04-24 Myron Walker Spoked solder pad
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD868756S1 (en) * 2016-11-10 2019-12-03 GM Global Technology Operations LLC Vehicle antenna
US10957663B2 (en) 2014-12-19 2021-03-23 Myron Walker Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
USD930000S1 (en) * 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card
USD930001S1 (en) 2018-02-01 2021-09-07 Huawei Technologies Co., Ltd. Card
USD956761S1 (en) * 2020-04-20 2022-07-05 Zwipe As Smart card

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702241S1 (en) * 2012-04-23 2014-04-08 Blackberry Limited UICC apparatus
US9769521B2 (en) 2013-03-13 2017-09-19 Nagrastar, Llc Systems and methods for performing transport I/O
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD949864S1 (en) * 2013-03-13 2022-04-26 Nagrastar Llc Smart card interface
USD780184S1 (en) 2013-03-13 2017-02-28 Nagrastar Llc Smart card interface
US10382816B2 (en) 2013-03-13 2019-08-13 Nagrastar, Llc Systems and methods for performing transport I/O
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD792410S1 (en) 2013-03-13 2017-07-18 Nagrastar Llc Smart card interface
USD792411S1 (en) 2013-03-13 2017-07-18 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9774908B2 (en) 2013-03-13 2017-09-26 Nagrastar, Llc Systems and methods for performing transport I/O
USD840404S1 (en) 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
US10070176B2 (en) 2013-03-13 2018-09-04 Nagrastar, Llc Systems and methods for performing transport I/O
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD816135S1 (en) * 2014-12-19 2018-04-24 Myron Walker Spoked solder pad
US10957663B2 (en) 2014-12-19 2021-03-23 Myron Walker Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
USD845368S1 (en) * 2014-12-19 2019-04-09 Myron Walker Spoked solder pad
USD845369S1 (en) * 2014-12-19 2019-04-09 Myron Walker Spoked solder pad
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD798868S1 (en) * 2015-08-20 2017-10-03 Isaac S. Daniel Combined subscriber identification module and storage card
USD773466S1 (en) * 2015-08-20 2016-12-06 Isaac S. Daniel Combined secure digital memory and subscriber identity module
USD868756S1 (en) * 2016-11-10 2019-12-03 GM Global Technology Operations LLC Vehicle antenna
USD930001S1 (en) 2018-02-01 2021-09-07 Huawei Technologies Co., Ltd. Card
USD951956S1 (en) 2018-02-01 2022-05-17 Huawei Technologies Co., Ltd. Memory card
USD930000S1 (en) * 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card
USD956761S1 (en) * 2020-04-20 2022-07-05 Zwipe As Smart card

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