The ornamental design disclosed in this application is for a processor and display module for a modular measurement instrument having raised bumper guards at the corners of the module, a bi-level rear surface, an array of raised protrusions on the right and left sides of the display screen, an array of ribs formed on the left side of the instrument and extending onto the top and bottom surfaces with the top surface ribs terminating adjacent to the array of raised protrusions, and array of raised protrusions on the rear surface of the instrument adjacent to the ribs.

FIG. 1 is a perspective view of a processor and display module for a modular measurement instrument;

FIG. 2 is a front elevation view of the processor and display module for a modular measurement instrument;

FIG. 3 is a rear elevation view of the processor and display module for a modular measurement instrument;

FIG. 4 is a left side elevation view of the processor and display module for a modular measurement instrument;

FIG. 5 is a right side elevation view of the processor and display module for a modular measurement instrument.

FIG. 6 is a top plan view of the processor and display module for a modular measurement instrument; and,

FIG. 7 is a bottom plan view of the processor and display module for a modular measurement instrument.