USB506760I5 - - Google Patents
Info
- Publication number
- USB506760I5 USB506760I5 US50676074A USB506760I5 US B506760 I5 USB506760 I5 US B506760I5 US 50676074 A US50676074 A US 50676074A US B506760 I5 USB506760 I5 US B506760I5
- Authority
- US
- United States
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12188—All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/506,760 US4012835A (en) | 1974-09-17 | 1974-09-17 | Method of forming a dual in-line package |
US05/619,971 US4044201A (en) | 1974-09-17 | 1975-10-06 | Lead frame assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/506,760 US4012835A (en) | 1974-09-17 | 1974-09-17 | Method of forming a dual in-line package |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/619,971 Division US4044201A (en) | 1974-09-17 | 1975-10-06 | Lead frame assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
USB506760I5 true USB506760I5 (en) | 1976-04-13 |
US4012835A US4012835A (en) | 1977-03-22 |
Family
ID=24015908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/506,760 Expired - Lifetime US4012835A (en) | 1974-09-17 | 1974-09-17 | Method of forming a dual in-line package |
Country Status (1)
Country | Link |
---|---|
US (1) | US4012835A (en) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7600236A (en) * | 1976-01-12 | 1977-07-14 | Philips Nv | PROCESS FOR MANUFACTURE OF AN ELECTRICAL PART WITH TERMINAL LIPPS, AND PART MANUFACTURED ACCORDING TO THIS PROCESS. |
US4139726A (en) * | 1978-01-16 | 1979-02-13 | Allen-Bradley Company | Packaged microcircuit and method for assembly thereof |
US4178678A (en) * | 1978-03-28 | 1979-12-18 | Bell Telephone Laboratories, Incorporated | Apparatus and method for affixing bondable finger contacts to a printed circuit board |
US4189085A (en) * | 1978-04-12 | 1980-02-19 | Allen-Bradley Company | Method of assembling a microcircuit with face-mounted leads |
US4232815A (en) * | 1978-11-06 | 1980-11-11 | Kyocera International, Inc. | Integrated circuit lead coupling device and method |
US4214353A (en) * | 1978-12-28 | 1980-07-29 | Western Electric Company, Inc. | Method of assembling heated terminals and rolled film capacitors within plastic boxes |
US4268942A (en) * | 1979-09-04 | 1981-05-26 | Western Electric Company, Inc. | Method and apparatus for manufacturing boxed encapsulated capacitors |
US4333213A (en) * | 1979-09-04 | 1982-06-08 | Western Electric Company, Inc. | Apparatus for bonding leads to capacitor blanks |
JPS5737865A (en) * | 1980-08-20 | 1982-03-02 | Nec Corp | Lead frame for integrated circuit |
US5177032A (en) * | 1990-10-24 | 1993-01-05 | Micron Technology, Inc. | Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape |
US5140404A (en) * | 1990-10-24 | 1992-08-18 | Micron Technology, Inc. | Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape |
US5706952A (en) * | 1996-01-11 | 1998-01-13 | Autosplice Systems Inc. | Continuous carrier for electrical or mechanical components |
US5938038A (en) | 1996-08-02 | 1999-08-17 | Dial Tool Industries, Inc. | Parts carrier strip and apparatus for assembling parts in such a strip |
US6096576A (en) | 1997-09-02 | 2000-08-01 | Silicon Light Machines | Method of producing an electrical interface to an integrated circuit device having high density I/O count |
JP2924898B1 (en) * | 1998-06-19 | 1999-07-26 | 住友電気工業株式会社 | Lead material |
US6303986B1 (en) * | 1998-07-29 | 2001-10-16 | Silicon Light Machines | Method of and apparatus for sealing an hermetic lid to a semiconductor die |
US6872984B1 (en) | 1998-07-29 | 2005-03-29 | Silicon Light Machines Corporation | Method of sealing a hermetic lid to a semiconductor die at an angle |
US6387723B1 (en) * | 2001-01-19 | 2002-05-14 | Silicon Light Machines | Reduced surface charging in silicon-based devices |
US7177081B2 (en) * | 2001-03-08 | 2007-02-13 | Silicon Light Machines Corporation | High contrast grating light valve type device |
US20030208753A1 (en) * | 2001-04-10 | 2003-11-06 | Silicon Light Machines | Method, system, and display apparatus for encrypted cinema |
US6707591B2 (en) * | 2001-04-10 | 2004-03-16 | Silicon Light Machines | Angled illumination for a single order light modulator based projection system |
US6865346B1 (en) | 2001-06-05 | 2005-03-08 | Silicon Light Machines Corporation | Fiber optic transceiver |
US6747781B2 (en) * | 2001-06-25 | 2004-06-08 | Silicon Light Machines, Inc. | Method, apparatus, and diffuser for reducing laser speckle |
US6782205B2 (en) * | 2001-06-25 | 2004-08-24 | Silicon Light Machines | Method and apparatus for dynamic equalization in wavelength division multiplexing |
US6646778B2 (en) * | 2001-08-01 | 2003-11-11 | Silicon Light Machines | Grating light valve with encapsulated dampening gas |
US6639722B2 (en) * | 2001-08-15 | 2003-10-28 | Silicon Light Machines | Stress tuned blazed grating light valve |
US6829092B2 (en) * | 2001-08-15 | 2004-12-07 | Silicon Light Machines, Inc. | Blazed grating light valve |
US6930364B2 (en) | 2001-09-13 | 2005-08-16 | Silicon Light Machines Corporation | Microelectronic mechanical system and methods |
US6956995B1 (en) | 2001-11-09 | 2005-10-18 | Silicon Light Machines Corporation | Optical communication arrangement |
US6692129B2 (en) * | 2001-11-30 | 2004-02-17 | Silicon Light Machines | Display apparatus including RGB color combiner and 1D light valve relay including schlieren filter |
US6800238B1 (en) | 2002-01-15 | 2004-10-05 | Silicon Light Machines, Inc. | Method for domain patterning in low coercive field ferroelectrics |
US6728023B1 (en) | 2002-05-28 | 2004-04-27 | Silicon Light Machines | Optical device arrays with optimized image resolution |
US6767751B2 (en) * | 2002-05-28 | 2004-07-27 | Silicon Light Machines, Inc. | Integrated driver process flow |
US6839479B2 (en) * | 2002-05-29 | 2005-01-04 | Silicon Light Machines Corporation | Optical switch |
US7054515B1 (en) | 2002-05-30 | 2006-05-30 | Silicon Light Machines Corporation | Diffractive light modulator-based dynamic equalizer with integrated spectral monitor |
US6822797B1 (en) | 2002-05-31 | 2004-11-23 | Silicon Light Machines, Inc. | Light modulator structure for producing high-contrast operation using zero-order light |
US6829258B1 (en) | 2002-06-26 | 2004-12-07 | Silicon Light Machines, Inc. | Rapidly tunable external cavity laser |
US6813059B2 (en) * | 2002-06-28 | 2004-11-02 | Silicon Light Machines, Inc. | Reduced formation of asperities in contact micro-structures |
US6714337B1 (en) | 2002-06-28 | 2004-03-30 | Silicon Light Machines | Method and device for modulating a light beam and having an improved gamma response |
US6908201B2 (en) * | 2002-06-28 | 2005-06-21 | Silicon Light Machines Corporation | Micro-support structures |
US6801354B1 (en) | 2002-08-20 | 2004-10-05 | Silicon Light Machines, Inc. | 2-D diffraction grating for substantially eliminating polarization dependent losses |
US7057795B2 (en) | 2002-08-20 | 2006-06-06 | Silicon Light Machines Corporation | Micro-structures with individually addressable ribbon pairs |
US6712480B1 (en) | 2002-09-27 | 2004-03-30 | Silicon Light Machines | Controlled curvature of stressed micro-structures |
US6928207B1 (en) | 2002-12-12 | 2005-08-09 | Silicon Light Machines Corporation | Apparatus for selectively blocking WDM channels |
US7057819B1 (en) | 2002-12-17 | 2006-06-06 | Silicon Light Machines Corporation | High contrast tilting ribbon blazed grating |
US6987600B1 (en) * | 2002-12-17 | 2006-01-17 | Silicon Light Machines Corporation | Arbitrary phase profile for better equalization in dynamic gain equalizer |
US6934070B1 (en) | 2002-12-18 | 2005-08-23 | Silicon Light Machines Corporation | Chirped optical MEM device |
US6927891B1 (en) | 2002-12-23 | 2005-08-09 | Silicon Light Machines Corporation | Tilt-able grating plane for improved crosstalk in 1×N blaze switches |
US7068372B1 (en) | 2003-01-28 | 2006-06-27 | Silicon Light Machines Corporation | MEMS interferometer-based reconfigurable optical add-and-drop multiplexor |
US7286764B1 (en) | 2003-02-03 | 2007-10-23 | Silicon Light Machines Corporation | Reconfigurable modulator-based optical add-and-drop multiplexer |
US6947613B1 (en) | 2003-02-11 | 2005-09-20 | Silicon Light Machines Corporation | Wavelength selective switch and equalizer |
US6922272B1 (en) | 2003-02-14 | 2005-07-26 | Silicon Light Machines Corporation | Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices |
US6806997B1 (en) | 2003-02-28 | 2004-10-19 | Silicon Light Machines, Inc. | Patterned diffractive light modulator ribbon for PDL reduction |
US7391973B1 (en) | 2003-02-28 | 2008-06-24 | Silicon Light Machines Corporation | Two-stage gain equalizer |
US6829077B1 (en) | 2003-02-28 | 2004-12-07 | Silicon Light Machines, Inc. | Diffractive light modulator with dynamically rotatable diffraction plane |
US6922273B1 (en) | 2003-02-28 | 2005-07-26 | Silicon Light Machines Corporation | PDL mitigation structure for diffractive MEMS and gratings |
US7027202B1 (en) | 2003-02-28 | 2006-04-11 | Silicon Light Machines Corp | Silicon substrate as a light modulator sacrificial layer |
US7042611B1 (en) | 2003-03-03 | 2006-05-09 | Silicon Light Machines Corporation | Pre-deflected bias ribbons |
US7315917B2 (en) * | 2005-01-20 | 2008-01-01 | Sandisk Corporation | Scheduling of housekeeping operations in flash memory systems |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3280378A (en) * | 1964-07-01 | 1966-10-18 | Cts Corp | Means for anchoring and connecting lead wires in an electrical component |
US3689991A (en) * | 1968-03-01 | 1972-09-12 | Gen Electric | A method of manufacturing a semiconductor device utilizing a flexible carrier |
DE1964481A1 (en) * | 1969-12-23 | 1971-07-01 | Semikron Gleichrichterbau | Process for the production of semiconductor rectifier arrangements |
US3689684A (en) * | 1971-02-05 | 1972-09-05 | Du Pont | Lead frame connector and electronic packages containing same |
US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
US3793714A (en) * | 1971-05-27 | 1974-02-26 | Texas Instruments Inc | Integrated circuit assembly using etched metal patterns of flexible insulating film |
US3750252A (en) * | 1972-05-01 | 1973-08-07 | Du Pont | Solder terminal strip |
US3832480A (en) * | 1972-07-07 | 1974-08-27 | Gte Sylvania Inc | Intermediate package and method for making |
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
-
1974
- 1974-09-17 US US05/506,760 patent/US4012835A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4012835A (en) | 1977-03-22 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CHEMICAL BANK, NEW YORK Free format text: SECURITY INTEREST;ASSIGNOR:BERG TECHNOLOGY, INC.;REEL/FRAME:006497/0231 Effective date: 19930226 |
|
AS | Assignment |
Owner name: BERG TECHNOLOGY, INC., NEVADA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:E.I. DU PONT DE NEMOURS AND COMPANY;REEL/FRAME:008321/0185 Effective date: 19961209 |