US9442482B2 - System and method for monitoring wafer handling and a wafer handling machine - Google Patents
System and method for monitoring wafer handling and a wafer handling machine Download PDFInfo
- Publication number
- US9442482B2 US9442482B2 US13/872,734 US201313872734A US9442482B2 US 9442482 B2 US9442482 B2 US 9442482B2 US 201313872734 A US201313872734 A US 201313872734A US 9442482 B2 US9442482 B2 US 9442482B2
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- United States
- Prior art keywords
- wafer handling
- sensor
- handling machine
- imaging device
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004891 communication Methods 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 108
- 238000003384 imaging method Methods 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000012795 verification Methods 0.000 claims description 11
- 230000002401 inhibitory effect Effects 0.000 claims description 2
- 230000005764 inhibitory process Effects 0.000 claims 2
- 239000012636 effector Substances 0.000 description 11
- 238000006748 scratching Methods 0.000 description 7
- 230000002393 scratching effect Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000009420 retrofitting Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 230000003442 weekly effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37224—Inspect wafer
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y02P90/04—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/02—Arm motion controller
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/27—Arm part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing And Monitoring For Control Systems (AREA)
Abstract
Description
Claims (17)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/872,734 US9442482B2 (en) | 2013-04-29 | 2013-04-29 | System and method for monitoring wafer handling and a wafer handling machine |
TW102146556A TWI670154B (en) | 2013-04-29 | 2013-12-17 | A system and method for monitoring wafer handling and a wafer handling machine |
KR1020140027372A KR20140128861A (en) | 2013-04-29 | 2014-03-07 | A system and method for monitoring wafer handling and a wafer handling machine |
DE102014204945.8A DE102014204945A1 (en) | 2013-04-29 | 2014-03-18 | System and method for monitoring wafer handling and wafer handling machine |
JP2014085665A JP6325325B2 (en) | 2013-04-29 | 2014-04-17 | System and method for monitoring wafer handling and wafer handling machine |
EP17155850.5A EP3185282B1 (en) | 2013-04-29 | 2014-04-29 | A system and method for monitoring wafer handling and a wafer handling machine |
CN201410178064.0A CN104124189B (en) | 2013-04-29 | 2014-04-29 | Monitor the system and method and wafer-process machine of wafer-process |
EP14166341.9A EP2800132B1 (en) | 2013-04-29 | 2014-04-29 | A system and method for monitoring wafer handling and a wafer handling machine |
US15/223,882 US10593575B2 (en) | 2013-04-29 | 2016-07-29 | System and method for monitoring wafer handling and a wafer handling machine |
KR1020170075038A KR102128995B1 (en) | 2013-04-29 | 2017-06-14 | A system and method for monitoring wafer handling and a wafer handling machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/872,734 US9442482B2 (en) | 2013-04-29 | 2013-04-29 | System and method for monitoring wafer handling and a wafer handling machine |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/223,882 Division US10593575B2 (en) | 2013-04-29 | 2016-07-29 | System and method for monitoring wafer handling and a wafer handling machine |
Publications (2)
Publication Number | Publication Date |
---|---|
US20140324208A1 US20140324208A1 (en) | 2014-10-30 |
US9442482B2 true US9442482B2 (en) | 2016-09-13 |
Family
ID=50819545
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/872,734 Active 2034-10-22 US9442482B2 (en) | 2013-04-29 | 2013-04-29 | System and method for monitoring wafer handling and a wafer handling machine |
US15/223,882 Active US10593575B2 (en) | 2013-04-29 | 2016-07-29 | System and method for monitoring wafer handling and a wafer handling machine |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/223,882 Active US10593575B2 (en) | 2013-04-29 | 2016-07-29 | System and method for monitoring wafer handling and a wafer handling machine |
Country Status (7)
Country | Link |
---|---|
US (2) | US9442482B2 (en) |
EP (2) | EP2800132B1 (en) |
JP (1) | JP6325325B2 (en) |
KR (2) | KR20140128861A (en) |
CN (1) | CN104124189B (en) |
DE (1) | DE102014204945A1 (en) |
TW (1) | TWI670154B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160336206A1 (en) * | 2013-04-29 | 2016-11-17 | GlobalFoundries, Inc. | System and method for monitoring wafer handling and a wafer handling machine |
US10714364B2 (en) | 2017-08-31 | 2020-07-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for inspecting wafer carriers |
US20220363487A1 (en) * | 2019-10-02 | 2022-11-17 | Ebara Corporation | Conveyance abnormality prediction system |
Families Citing this family (16)
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JP6374156B2 (en) * | 2013-08-09 | 2018-08-15 | 日本電産サンキョー株式会社 | Horizontal articulated robot and method of manufacturing horizontal articulated robot |
US10780586B2 (en) | 2013-08-09 | 2020-09-22 | Nidec Sankyo Corporation | Horizontal articulated robot with bevel gears |
US20150185731A1 (en) * | 2013-12-26 | 2015-07-02 | Hyundai Motor Company | Work-in-process inspection system using motion detection, and method thereof |
TWI639906B (en) * | 2017-06-16 | 2018-11-01 | 中原大學 | Active assembly system, active assembly method and positioning assembly device thereof |
TWI693564B (en) * | 2018-01-05 | 2020-05-11 | 竹陞科技股份有限公司 | Automatic equipment management system and method thereof |
US11247330B2 (en) * | 2018-10-19 | 2022-02-15 | Asm Ip Holding B.V. | Method for teaching a transportation position and alignment jig |
US11094570B2 (en) * | 2019-03-29 | 2021-08-17 | Hirata Corporation | Load port having movable member that abuts a pin |
CN111430265B (en) * | 2019-11-28 | 2023-09-12 | 合肥晶合集成电路股份有限公司 | Shielding device and method for machine window and semiconductor device |
CN111092039B (en) * | 2019-12-30 | 2022-04-15 | 武汉大学 | Wafer transmission system |
CN111107324A (en) * | 2019-12-31 | 2020-05-05 | 上海陛通半导体能源科技股份有限公司 | Monitoring device and monitoring method of wafer transmission system |
US11302545B2 (en) * | 2020-03-20 | 2022-04-12 | Nanya Technology Corporation | System and method for controlling semiconductor manufacturing equipment |
CN111554601B (en) * | 2020-04-27 | 2021-12-28 | 上海果纳半导体技术有限公司 | Wafer front end transfer system |
TWI777213B (en) * | 2020-08-05 | 2022-09-11 | 華邦電子股份有限公司 | Transportation monitoring method and system thereof |
CN114446844A (en) * | 2020-11-03 | 2022-05-06 | 长鑫存储技术有限公司 | Conveying device and semiconductor production equipment |
CN113031669B (en) * | 2021-02-10 | 2022-04-22 | 国机集团科学技术研究院有限公司 | High-quality crystal cultivation key process environment vibration control technical analysis method |
CN114084619B (en) * | 2021-11-24 | 2023-06-20 | 华中科技大学鄂州工业技术研究院 | Intelligent control system and method for production line |
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EP0597637A1 (en) | 1992-11-12 | 1994-05-18 | Applied Materials, Inc. | System and method for automated positioning of a substrate in a processing chamber |
TW451056B (en) | 1999-09-14 | 2001-08-21 | Sony Corp | Mechanism and method for controlling the focal point position of UV light and apparatus and method for inspection |
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-
2013
- 2013-04-29 US US13/872,734 patent/US9442482B2/en active Active
- 2013-12-17 TW TW102146556A patent/TWI670154B/en active
-
2014
- 2014-03-07 KR KR1020140027372A patent/KR20140128861A/en active Search and Examination
- 2014-03-18 DE DE102014204945.8A patent/DE102014204945A1/en not_active Withdrawn
- 2014-04-17 JP JP2014085665A patent/JP6325325B2/en active Active
- 2014-04-29 EP EP14166341.9A patent/EP2800132B1/en active Active
- 2014-04-29 EP EP17155850.5A patent/EP3185282B1/en active Active
- 2014-04-29 CN CN201410178064.0A patent/CN104124189B/en active Active
-
2016
- 2016-07-29 US US15/223,882 patent/US10593575B2/en active Active
-
2017
- 2017-06-14 KR KR1020170075038A patent/KR102128995B1/en active IP Right Grant
Patent Citations (13)
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EP0597637A1 (en) | 1992-11-12 | 1994-05-18 | Applied Materials, Inc. | System and method for automated positioning of a substrate in a processing chamber |
TW451056B (en) | 1999-09-14 | 2001-08-21 | Sony Corp | Mechanism and method for controlling the focal point position of UV light and apparatus and method for inspection |
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US20050276920A1 (en) * | 2004-06-09 | 2005-12-15 | Su-Hyun Kim | Spin-coating apparatus for manufacturing semiconductor device and method of preventing transfer device from improperly positioning a wafer in the apparatus |
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Also Published As
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JP2014216648A (en) | 2014-11-17 |
EP3185282B1 (en) | 2018-08-29 |
US10593575B2 (en) | 2020-03-17 |
KR102128995B1 (en) | 2020-07-02 |
US20160336206A1 (en) | 2016-11-17 |
EP2800132B1 (en) | 2017-06-28 |
CN104124189A (en) | 2014-10-29 |
CN104124189B (en) | 2017-09-12 |
EP3185282A1 (en) | 2017-06-28 |
JP6325325B2 (en) | 2018-05-16 |
KR20140128861A (en) | 2014-11-06 |
TW201440980A (en) | 2014-11-01 |
KR20170072853A (en) | 2017-06-27 |
DE102014204945A1 (en) | 2014-11-13 |
US20140324208A1 (en) | 2014-10-30 |
EP2800132A1 (en) | 2014-11-05 |
TWI670154B (en) | 2019-09-01 |
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