US8820611B2 - Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste - Google Patents
Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste Download PDFInfo
- Publication number
- US8820611B2 US8820611B2 US13/508,478 US201013508478A US8820611B2 US 8820611 B2 US8820611 B2 US 8820611B2 US 201013508478 A US201013508478 A US 201013508478A US 8820611 B2 US8820611 B2 US 8820611B2
- Authority
- US
- United States
- Prior art keywords
- printing
- substrate
- inspection unit
- screen
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
-
- applying a printing screen onto the substrate,
- printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste,
- separating the printing screen and the substrate by lifting these parts off of each other,
- inserting an optical inspection unit between the printing screen and the substrate,
- checking the printed structure in terms of the printing paste thickness by means of the inspection unit,
- ending the print process when the result of the printing corresponds to at least one preset value.
- 1 Inspection unit
- 2 Printing device
- 3 PCB printer
- 4 Printing car
- 5 Support
- 6 Substrate
- 7 Printed circuit board
- 8 Printing screen
- 9 Film applicator device
- 10 Solder paste
- 11 Printed structure
- 12 Pads
- 13 Vertical distance
- 14 Shifting device
- 15 Viewing direction
- 16 Printing screen underside
- 17 Substrate top side
- 18 Printed side
- 19 Register mark
- 20 Area
- 21 Print application strength
- 22 Height
- 23 Light source
- 24 Light stripe projection
- 25 Line pattern
- 26 Deflection mirror
- 27 Opening on the underside
- 28 Inspection model
- 29 Line pattern generator
- 30 Mirror device
- 31 Semipermeable mirror
- 32 Evaluation beam path
- 33 Screen
- 34 Detector
- 35 Image
- 36 Evaluation device
- 37 Case
- 38 Light stripe projection device
Claims (6)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009053575.6A DE102009053575B4 (en) | 2009-11-06 | 2009-11-06 | Method and device for printing a substrate, in particular a printed circuit board, with a printing paste |
DE102009053575.6 | 2009-11-06 | ||
DE102009053575 | 2009-11-06 | ||
PCT/EP2010/006229 WO2011054432A1 (en) | 2009-11-06 | 2010-10-12 | Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste |
Publications (2)
Publication Number | Publication Date |
---|---|
US20120228364A1 US20120228364A1 (en) | 2012-09-13 |
US8820611B2 true US8820611B2 (en) | 2014-09-02 |
Family
ID=43086710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/508,478 Expired - Fee Related US8820611B2 (en) | 2009-11-06 | 2010-10-12 | Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste |
Country Status (6)
Country | Link |
---|---|
US (1) | US8820611B2 (en) |
EP (1) | EP2497344B1 (en) |
KR (1) | KR101690998B1 (en) |
CN (1) | CN102640574B (en) |
DE (1) | DE102009053575B4 (en) |
WO (1) | WO2011054432A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9243726B2 (en) | 2012-10-03 | 2016-01-26 | Aarne H. Reid | Vacuum insulated structure with end fitting and method of making same |
EP2790473A1 (en) * | 2013-04-09 | 2014-10-15 | ASM Assembly Systems GmbH & Co. KG | Optimizing parameters for printing solder paste onto a PCB |
US9136243B2 (en) | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
DE102014202170A1 (en) * | 2014-02-06 | 2015-08-20 | Ekra Automatisierungssysteme Gmbh | Apparatus and method for printing on substrates |
US9463918B2 (en) | 2014-02-20 | 2016-10-11 | Aarne H. Reid | Vacuum insulated articles and methods of making same |
CN105025653B (en) * | 2015-08-20 | 2018-05-08 | 广东威创视讯科技股份有限公司 | Printed wiring board and preparation method thereof |
US10497908B2 (en) | 2015-08-24 | 2019-12-03 | Concept Group, Llc | Sealed packages for electronic and energy storage devices |
US10065256B2 (en) * | 2015-10-30 | 2018-09-04 | Concept Group Llc | Brazing systems and methods |
JP6655988B2 (en) | 2015-12-25 | 2020-03-04 | キヤノン株式会社 | Adjustment method of imprint apparatus, imprint method, and article manufacturing method |
CN109154641B (en) | 2016-03-04 | 2021-09-17 | 概念集团有限责任公司 | Vacuum insulation article with reflective material enhancement |
MX2019005662A (en) | 2016-11-15 | 2019-11-21 | Concept Group Llc | Enhanced vacuum-insulated articles with microporous insulation. |
EP3541722A4 (en) | 2016-11-15 | 2020-07-08 | Concept Group LLC | Multiply-insulated assemblies |
CN107278048A (en) * | 2017-06-20 | 2017-10-20 | 苏州市狮威电子有限公司 | A kind of SMT typographies and its printing apparatus |
CN107284065B (en) * | 2017-07-03 | 2019-04-05 | 京东方科技集团股份有限公司 | A kind of printing process and printing equipment using printing screen plate |
MX2020002128A (en) | 2017-08-25 | 2020-09-28 | Concept Group Llc | Multiple geometry and multiple material insulated components. |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4119400A1 (en) | 1991-06-10 | 1992-12-17 | Zach Hubert | Viscous medium printing system on circuit carrier with circuit pattern - has printing template held by pivoting frame and observation device with semi-transparent mirror |
US5995232A (en) | 1997-07-14 | 1999-11-30 | U.S. Philips Corporation | Method of and device for inspecting a PCB |
EP1031417A2 (en) | 1999-02-23 | 2000-08-30 | FUJI MACHINE Mfg. Co., Ltd. | Screen inspecting method, screen inspecting apparatus, and screen printing machine |
EP1076480A2 (en) | 1999-08-10 | 2001-02-14 | FUJI MACHINE Mfg. Co., Ltd. | Mask-printing method and mask-printing apparatus |
GB2353759A (en) | 1999-08-30 | 2001-03-07 | Minami Co Ltd | A screen printing apparatus with a camera for checking and inspection |
WO2002005607A1 (en) | 2000-07-11 | 2002-01-17 | Mydata Automation Ab | Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors |
WO2002005608A1 (en) | 2000-07-11 | 2002-01-17 | Mydata Automation Ab | Method, apparatus and use of applying viscous medium on a substrate |
US6549288B1 (en) * | 1998-05-14 | 2003-04-15 | Viewpoint Corp. | Structured-light, triangulation-based three-dimensional digitizer |
FR2845520A1 (en) | 2002-10-04 | 2004-04-09 | Wavecom | Reconditioning of an assembly of conducting elements distributed on the lower surface of an electronic modules, notably to repair flatness, by the addition of material to the free ends of the conducting elements |
WO2004082345A2 (en) | 2003-03-13 | 2004-09-23 | Ekra Eduard Kraft Gmbh | Method and device for aligning a substrate and a printing screen during solder paste printing |
US6847360B2 (en) * | 2001-01-31 | 2005-01-25 | Minolta Co., Ltd. | Three-dimensional measuring method and system |
EP1541002A1 (en) | 2002-07-25 | 2005-06-15 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for inspecting cream solder printed on a substrate |
WO2005083402A1 (en) | 2004-02-20 | 2005-09-09 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
WO2007116848A1 (en) | 2006-03-29 | 2007-10-18 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method |
US20080197170A1 (en) | 2007-02-16 | 2008-08-21 | Prince David P | Single and multi-spectral illumination system and method |
JP2008288515A (en) * | 2007-05-21 | 2008-11-27 | Hitachi Plant Technologies Ltd | Solder ball printing apparatus |
EP2071278A1 (en) | 2006-09-21 | 2009-06-17 | I-Pulse Kabushiki Kaisha | Inspecting apparatus |
US20090220812A1 (en) * | 2006-04-26 | 2009-09-03 | Rikiya Kato | Solder Paste |
-
2009
- 2009-11-06 DE DE102009053575.6A patent/DE102009053575B4/en active Active
-
2010
- 2010-10-12 US US13/508,478 patent/US8820611B2/en not_active Expired - Fee Related
- 2010-10-12 WO PCT/EP2010/006229 patent/WO2011054432A1/en active Application Filing
- 2010-10-12 EP EP10768873.1A patent/EP2497344B1/en not_active Not-in-force
- 2010-10-12 CN CN201080050249.3A patent/CN102640574B/en not_active Expired - Fee Related
- 2010-10-12 KR KR1020127012169A patent/KR101690998B1/en active IP Right Grant
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4119400A1 (en) | 1991-06-10 | 1992-12-17 | Zach Hubert | Viscous medium printing system on circuit carrier with circuit pattern - has printing template held by pivoting frame and observation device with semi-transparent mirror |
US5995232A (en) | 1997-07-14 | 1999-11-30 | U.S. Philips Corporation | Method of and device for inspecting a PCB |
US6549288B1 (en) * | 1998-05-14 | 2003-04-15 | Viewpoint Corp. | Structured-light, triangulation-based three-dimensional digitizer |
EP1031417A2 (en) | 1999-02-23 | 2000-08-30 | FUJI MACHINE Mfg. Co., Ltd. | Screen inspecting method, screen inspecting apparatus, and screen printing machine |
EP1076480A2 (en) | 1999-08-10 | 2001-02-14 | FUJI MACHINE Mfg. Co., Ltd. | Mask-printing method and mask-printing apparatus |
DE60030644T2 (en) | 1999-08-10 | 2007-09-13 | Fuji Machine Mfg. Co., Ltd., Chiryu | Mask printing method and mask printing device |
GB2353759A (en) | 1999-08-30 | 2001-03-07 | Minami Co Ltd | A screen printing apparatus with a camera for checking and inspection |
WO2002005608A1 (en) | 2000-07-11 | 2002-01-17 | Mydata Automation Ab | Method, apparatus and use of applying viscous medium on a substrate |
EP1314342A1 (en) | 2000-07-11 | 2003-05-28 | Mydata Automation AB | Method, apparatus and use of applying viscous medium on a substrate |
WO2002005607A1 (en) | 2000-07-11 | 2002-01-17 | Mydata Automation Ab | Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors |
US7600548B2 (en) | 2000-07-11 | 2009-10-13 | Mydata Automation Ab | Method and apparatus for applying viscous medium onto a substrate |
US6847360B2 (en) * | 2001-01-31 | 2005-01-25 | Minolta Co., Ltd. | Three-dimensional measuring method and system |
EP1541002A1 (en) | 2002-07-25 | 2005-06-15 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for inspecting cream solder printed on a substrate |
FR2845520A1 (en) | 2002-10-04 | 2004-04-09 | Wavecom | Reconditioning of an assembly of conducting elements distributed on the lower surface of an electronic modules, notably to repair flatness, by the addition of material to the free ends of the conducting elements |
WO2004082345A2 (en) | 2003-03-13 | 2004-09-23 | Ekra Eduard Kraft Gmbh | Method and device for aligning a substrate and a printing screen during solder paste printing |
WO2005083402A1 (en) | 2004-02-20 | 2005-09-09 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
WO2007116848A1 (en) | 2006-03-29 | 2007-10-18 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method |
DE112007000342T5 (en) | 2006-03-29 | 2009-01-29 | Matsushita Electric Industrial Co., Ltd., Kadoma-shi | Electronic component mounting system, electronic component placement device and electronic component mounting method |
US20090220812A1 (en) * | 2006-04-26 | 2009-09-03 | Rikiya Kato | Solder Paste |
EP2071278A1 (en) | 2006-09-21 | 2009-06-17 | I-Pulse Kabushiki Kaisha | Inspecting apparatus |
US20080197170A1 (en) | 2007-02-16 | 2008-08-21 | Prince David P | Single and multi-spectral illumination system and method |
JP2008288515A (en) * | 2007-05-21 | 2008-11-27 | Hitachi Plant Technologies Ltd | Solder ball printing apparatus |
Non-Patent Citations (4)
Title |
---|
International Preliminary Examination Report dated Nov. 11, 2011 in related International Application No. PCT/EP2010/006229. |
International Preliminary Report on Patentability in related International Application No. PCT/EP2010/006229 dated Jun. 14, 2012. |
International Search Report dated Mar. 8, 2011 in related International Application No. PCT/EP2010/006229. |
JP 2008288515 A computer english translation 2012. * |
Also Published As
Publication number | Publication date |
---|---|
CN102640574A (en) | 2012-08-15 |
WO2011054432A4 (en) | 2011-07-14 |
DE102009053575B4 (en) | 2016-06-30 |
US20120228364A1 (en) | 2012-09-13 |
KR20120103586A (en) | 2012-09-19 |
EP2497344A1 (en) | 2012-09-12 |
EP2497344B1 (en) | 2013-12-11 |
WO2011054432A1 (en) | 2011-05-12 |
DE102009053575A1 (en) | 2011-05-12 |
CN102640574B (en) | 2015-04-29 |
KR101690998B1 (en) | 2016-12-29 |
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Legal Events
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AS | Assignment |
Owner name: EKRA AUTOMATISIERUNGSSYSTEME GMBH, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:VEGELAHN, TORSTEN;REEL/FRAME:028387/0001 Effective date: 20120521 |
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Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551) Year of fee payment: 4 |
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Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20220902 |