US8602706B2 - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
- Publication number
- US8602706B2 US8602706B2 US12/542,588 US54258809A US8602706B2 US 8602706 B2 US8602706 B2 US 8602706B2 US 54258809 A US54258809 A US 54258809A US 8602706 B2 US8602706 B2 US 8602706B2
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- United States
- Prior art keywords
- chamber
- transport
- module
- substrate
- cart
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/542,588 US8602706B2 (en) | 2009-08-17 | 2009-08-17 | Substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/542,588 US8602706B2 (en) | 2009-08-17 | 2009-08-17 | Substrate processing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
US20110038692A1 US20110038692A1 (en) | 2011-02-17 |
US8602706B2 true US8602706B2 (en) | 2013-12-10 |
Family
ID=43588683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/542,588 Active 2030-10-19 US8602706B2 (en) | 2009-08-17 | 2009-08-17 | Substrate processing apparatus |
Country Status (1)
Country | Link |
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US (1) | US8602706B2 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130051957A1 (en) * | 2010-02-19 | 2013-02-28 | Kyoo Hwan Lee | Substrate Processing System and Substrate Transferring Method |
US20130071208A1 (en) * | 2011-09-16 | 2013-03-21 | Persimmon Technologies Corporation | Wafer transport system |
US20150188399A1 (en) * | 2013-12-30 | 2015-07-02 | Samsung Display Co., Ltd. | Apparatus for transferring substrate |
US20160293472A1 (en) * | 2011-07-04 | 2016-10-06 | Samsung Display Co., Ltd. | Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same |
CN108615697A (en) * | 2016-12-09 | 2018-10-02 | 深圳市矽电半导体设备有限公司 | Automatic chip apparatus up and down |
US20190006216A1 (en) * | 2016-01-18 | 2019-01-03 | Simon Lau | Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber |
US11114321B2 (en) | 2017-08-17 | 2021-09-07 | Tokyo Electron Limited | Apparatus and method for real-time sensing of properties in industrial manufacturing equipment |
US11205583B2 (en) * | 2014-01-21 | 2021-12-21 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
US20210398835A1 (en) * | 2018-11-06 | 2021-12-23 | Murata Machinery, Ltd. | Overhead transport vehicle |
US20220097977A1 (en) * | 2020-09-25 | 2022-03-31 | Ats Automation Tooling Systems Inc. | Linear motor conveyor system for clean/aseptic environments |
US11476139B2 (en) * | 2020-02-20 | 2022-10-18 | Brooks Automation Us, Llc | Substrate process apparatus |
US11646210B2 (en) | 2018-06-18 | 2023-05-09 | Tokyo Electron Limited | Reduced interference, real-time sensing of properties in manufacturing equipment |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8594835B2 (en) | 2009-04-10 | 2013-11-26 | Symbotic, LLC | Control system for storage and retrieval systems |
US8694152B2 (en) | 2010-12-15 | 2014-04-08 | Symbotic, LLC | Maintenance access zones for storage and retrieval systems |
US9008884B2 (en) | 2010-12-15 | 2015-04-14 | Symbotic Llc | Bot position sensing |
US9475649B2 (en) | 2010-12-15 | 2016-10-25 | Symbolic, LLC | Pickface builder for storage and retrieval systems |
US10822168B2 (en) | 2010-12-15 | 2020-11-03 | Symbotic Llc | Warehousing scalable storage structure |
US10096461B2 (en) * | 2011-06-23 | 2018-10-09 | Brooks Automation Germany, GmbH | Semiconductor cleaner systems and methods |
TWI622540B (en) | 2011-09-09 | 2018-05-01 | 辛波提克有限責任公司 | Automated storage and retrieval system |
CN103159402B (en) * | 2011-12-13 | 2015-08-26 | 高侨自动化科技股份有限公司 | Glass substrate carrying device |
US9011069B2 (en) * | 2012-01-23 | 2015-04-21 | Tera Autotech Corporation | Glass substrate transporting apparatus |
KR102188622B1 (en) | 2013-03-15 | 2020-12-08 | 심보틱 엘엘씨 | Automated storage and retrieval system with integral secured personnel access zones and remote rover shutdown |
TWI594933B (en) | 2013-03-15 | 2017-08-11 | 辛波提克有限責任公司 | Automated storage and retrieval system |
TWI642028B (en) | 2013-03-15 | 2018-11-21 | 辛波提克有限責任公司 | Transportation system and automated storage and retrieval system with integral secured personnel access zones and remote rover shutdown |
US20150010381A1 (en) * | 2013-07-08 | 2015-01-08 | United Microelectronics Corp. | Wafer processing chamber and method for transferring wafer in the same |
KR20220166370A (en) | 2013-09-13 | 2022-12-16 | 심보틱 엘엘씨 | Automated storage and retrieval system |
WO2015066624A1 (en) | 2013-11-04 | 2015-05-07 | Applied Materials, Inc | Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods |
JP6634275B2 (en) * | 2015-12-04 | 2020-01-22 | 東京エレクトロン株式会社 | Deposition system |
CA3035963C (en) * | 2016-09-09 | 2023-10-24 | The Procter & Gamble Company | System and method for producing products based upon demand |
US11049740B1 (en) | 2019-12-05 | 2021-06-29 | Applied Materials, Inc. | Reconfigurable mainframe with replaceable interface plate |
US11527424B2 (en) | 2020-03-20 | 2022-12-13 | Applied Materials, Inc. | Substrate transfer systems and methods of use thereof |
DE102020212223A1 (en) * | 2020-09-29 | 2022-03-31 | Robert Bosch Gesellschaft mit beschränkter Haftung | Non-contact conveyor |
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