US8450759B2 - Light emitting diode package structure - Google Patents

Light emitting diode package structure Download PDF

Info

Publication number
US8450759B2
US8450759B2 US13/017,285 US201113017285A US8450759B2 US 8450759 B2 US8450759 B2 US 8450759B2 US 201113017285 A US201113017285 A US 201113017285A US 8450759 B2 US8450759 B2 US 8450759B2
Authority
US
United States
Prior art keywords
led
enclosure
package
package structure
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US13/017,285
Other versions
US20120098001A1 (en
Inventor
Tzu-Chi Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Intematix Technology Center Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intematix Technology Center Corp filed Critical Intematix Technology Center Corp
Assigned to INTEMATIX TECHNOLOGY CENTER CORPORATION reassignment INTEMATIX TECHNOLOGY CENTER CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, TZU-CHI
Publication of US20120098001A1 publication Critical patent/US20120098001A1/en
Application granted granted Critical
Publication of US8450759B2 publication Critical patent/US8450759B2/en
Assigned to INTERLIGHT OPTOTECH CORPORATION reassignment INTERLIGHT OPTOTECH CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: INTEMATIX TECHNOLOGY CENTER CORP.
Assigned to EAST WEST BANK reassignment EAST WEST BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INTEMATIX CORPORATION, INTEMATIX HONG KONG CO. LIMITED
Assigned to EPISTAR CORPORATION reassignment EPISTAR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INTERLIGHT OPTOTECH CORPORATION
Assigned to INTEMATIX CORPORATION, INTEMATIX HONG KONG CO. LIMITED reassignment INTEMATIX CORPORATION RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: EAST WEST BANK
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the present invention relates to a package structure, and more particularly to a light emitting diode (LED) package structure of a package type in which light emitting elements do not directly contact a fluorescent material.
  • LED light emitting diode
  • LEDs Due to low power consumption, high efficiency, and long life, LEDs are widely used in various application fields, for example, as light sources for backlight modules of notebook computers, monitors, mobile phones, TV sets, and liquid crystal displays (LCDs). Moreover, as more and more researchers work on the research and development of the LEDs, the luminous intensity of the LEDs already reaches a lighting level for daily life at present.
  • the most commonly used white LED modulates and combines red, green, and blue light, in which the LED chips that emit red, green, and blue light are combined in a form of array and packaged. Color lights emitted by the LEDs of the three colors are mixed, so as to obtain a multi-chip LED package device capable of emitting white light.
  • the conventional LED package device uses a package having a phosphor powder added therein to directly cover the LED chips, that is, the LEDs directly contact and join the phosphor powder for refracting the light.
  • the phosphor powder is uniformly mixed into the package of a resin material (referred to as uniform distribution) or a mixing region of the phosphor powder is close to a position of the LED chip (referred to as conformal distribution), so as to improve the light color uniformity of the LEDs.
  • the generated high heat energy will be directly transferred to the package material, and the properties of the phosphor powder change when being heated, resulting in decrease of the overall luminance performance of the LED package device.
  • the current LED package techniques cannot achieve the consistency of the spatial spectral distribution and the illumination brightness of the illuminating light.
  • the electrophoretic coating technique disclosed in Patent '488 has the disadvantage of expensive manufacturing cost, so the cost of the LED cannot be reduced, and thus the LED manufactured through this method does not have a price advantage on the market.
  • the preparation process is complicated as the phosphor coated sheet has to be manufactured additionally; moreover, the step of attaching the phosphor coated sheet must be very accurate, so the yield cannot be controlled, thus resulting in increase of the manufacturing cost.
  • the silicone lens As the package material of the LED, so as to increase the index of refraction of the LED, and thereby improving the luminance performance of the LED.
  • the silicone lens further has excellent properties such as high temperature resistance, high insulation, and high chemical stability, and therefore the silicone lens can be used in the high power LEDs suitably.
  • the silicone lens can endure the high temperature generated during operation of the LED, such that the problem that the conventional package material deteriorates due to high temperature is solved, and the reliability of the LED is significantly improved.
  • the present invention provides an LED package structure, which can solve problems such as bad luminance performance and non-uniform illumination brightness due to a package material having a phosphor powder added therein directly contacts an LED chip in the conventional LED package device and an excessively high manufacturing cost due to the process of the conventional LED package device being complicated.
  • an LED package structure which includes a substrate, a first enclosure, at least one LED, a first package material, a second enclosure, and a second package material.
  • the first enclosure is disposed on a surface of the substrate, and forms a first configuration area on the substrate, and the material of the first enclosure is a transparent material.
  • the LED is disposed in the first configuration area, and is capable of emitting an illuminating light.
  • the first package material is disposed in the first configuration area, and covers the LED, and the material of the first package material is a transparent material.
  • the second enclosure is disposed on the surface of the substrate, and is located outside the first enclosure. A second configuration area is formed between the second enclosure and the first enclosure.
  • the material of the second enclosure is a transparent material.
  • the second package material has a fluorescent material added therein, and the second package material is disposed in the second configuration area, and covers the first enclosure, the LED, and the first package material.
  • an LED package structure which includes a substrate, an enclosure, at least one LED, a first package material, and a second package material.
  • the enclosure is disposed on a surface of the substrate, and forms a configuration area on the substrate, and the material of the enclosure is a transparent material.
  • the LED is disposed in the configuration area, and is capable of emitting the illuminating light.
  • the first package material is disposed in the configuration area, and covers the LED, and a material of the first package material is a transparent material.
  • the second package material has a fluorescent material added therein, and the second package material covers the enclosure, the LED, and the first package material.
  • the present invention has the advantages as follows. Because of the configuration relationship that the LED and the package material having the fluorescent material are separated from each other without direct contact (remote phosphor), a certain distance exists between the LED and the fluorescent material for reflecting the light. Therefore, the overall luminance performance of the LED package structure and the uniformity of the reflected light are improved.
  • the fluorescent material is remote from the heat source, that is to say, the fluorescent material does not directly contact the LED, so the reliability of the LED package structure is improved.
  • the LED package structure is applicable in a package structure having multiple LEDs, and the manufacturing cost is greatly reduced at the same time.
  • FIG. 1 is a side cross-sectional view according to a first embodiment of the present invention
  • FIG. 2 is a side cross-sectional view of different aspects according to the first embodiment of the present invention.
  • FIG. 3 is a side cross-sectional view of different aspects according to the first embodiment of the present invention.
  • FIG. 4 is a side cross-sectional view according to a second embodiment of the present invention.
  • FIG. 5 is a side cross-sectional view of different aspects according to the second embodiment of the present invention.
  • FIG. 6 is a side cross-sectional view of different aspects according to the second embodiment of the present invention.
  • FIG. 1 is a side cross-sectional view according to a first embodiment of the present invention.
  • an LED package structure 100 according to the first embodiment of the present invention includes a substrate 110 , a first enclosure 120 , at least one LED 130 , a first package material 140 , a second enclosure 150 , and a second package material 160 .
  • the material of the substrate 110 is, but not limited to, one selected from a metal material, a ceramic material, a diamond material, a diamond-like carbon material or a printed circuit board (PCB).
  • PCB printed circuit board
  • the first enclosure 120 is disposed on a top surface of the substrate 110 , and encloses to form a first configuration area 121 on the surface of the substrate 110 . It should be noted that the first enclosure 120 and the substrate 110 of the present embodiment are approximately perpendicular to each other.
  • the material of the first enclosure 120 is a transparent material, and the shape of the first configuration area 121 formed by the first enclosure 120 of the embodiment is, for example, but not limited to, a rectangle, a circle, or an oval, and persons skilled in the art may design the first configuration area 121 to various geometric shapes according to practical use requirements.
  • the first enclosure 120 may also be designed to be disposed on the substrate 110 at an angle of inclination, or the first enclosure 120 may be designed to be a trapezoid-like structure. Therefore, persons skilled in the art may further design the first enclosure 120 of the present embodiment into forms of various geometric shapes and different placement angles according to practical use requirements.
  • the LED 130 is disposed in the first configuration area 121 , that is, the LED 130 is located inside the first enclosure 120 .
  • the LED 130 is electrically connected to an electrical source, and is driven by the electrical source to emit the illuminating light.
  • the number of the configured LEDs 130 may be varied according to the practical use requirements, but is not limited to the one LED in the embodiment.
  • the color of the light emitted by the LED 130 of the embodiment may be various colors such as cool white, warm white, and white light imitating daylight.
  • the illuminating light has high color rendering property, and the illuminating light of the present embodiment has the total reflection effect of normal reflection and horizontal reflection by means of the first enclosure 120 , thereby avoiding excessive light loss of the illuminating light during refraction.
  • the first package material 140 is filled in the first configuration area 121 , and covers the LED 130 completely.
  • the material of the first package material 140 is a transparent material, for example, but not limited to, a polymer material such as epoxy and silicone.
  • the first package material 140 is, for example, but not limited to, disposed in the first configuration area 121 through a molding process.
  • the second enclosure 150 is disposed on a top surface of the substrate 110 , the second enclosure 150 is located outside the first enclosure 120 , and a distance is defined between the first enclosure 120 and the second enclosure 150 .
  • a second configuration area 151 is formed between the second enclosure 150 and the first enclosure 120 (that is, on the surface of the substrate 110 ). It should be noted that, the second enclosure 150 and the substrate 110 of the present embodiment are approximately perpendicular to each other.
  • the material of the second enclosure 150 is a transparent material, the shape of the second configuration area 151 formed by the second enclosure 150 of the embodiment is, for example, but not limited to, a rectangle, a circle, and an oval, and persons skilled in the art may design the second configuration area 151 to be various geometric shapes.
  • the second enclosure 150 may also be designed to be disposed on the substrate 110 at an angle of inclination or the second enclosure 150 may be designed to be a trapezoid-like structure. Therefore, persons skilled in the art may further design the second enclosure 150 of the present embodiment into forms of various geometric shapes and different placement angles according to practical use requirements.
  • the second package material 160 has a first fluorescent material 161 in a powder form added therein.
  • the second package material 160 is filled in the second configuration area 151 , and covers the first enclosure 120 , the LED 130 and the first package material 140 completely, so as to form the complete LED package structure 100 .
  • the material of the second package material 160 is a transparent material, for example, but not limited to, a polymer material such as epoxy and silicone.
  • the first fluorescent material 161 added in the second package material 160 is one selected from Sr 1-x-y Ba x Ca y SiO 4 :Eu 2+ F, (Sr 1-x-y Eu x Mn y )P 2+z O 7 :Eu 2+ F, (Ba,Sr,Ca)Al 2 O 4 :Eu, ((Ba,Sr,Ca)(Mg,Zn))Si 2 O 7 :Eu, SrGa 2 S 4 :Eu, ((Ba,Sr,Ca) 1-x Eu x )(Mg,Zn) 1-x Mn x ))Al 10 O 17 , Ca 8 Mg(SiO 4 ) 4 Cl 2 :Eu,Mn, ((Ba,Sr,Ca,Mg) 1-x Eu x ) 2 SiO 4 , Ca 2 MgSi 2 O 7 :Cl, SrSi 3 O 8 2SrCl 2 :Eu, B
  • first fluorescent material 161 into the second package material 160 in various forms according to practical fabrication requirements, for example, the first fluorescent material 161 is coated on the top surface of the second package material 160 in the form of colloid.
  • the first fluorescent material 161 mixed in the second package material 160 provides a good reflection effect for the illuminating light.
  • the second package material 160 covers the first enclosure 120 , the LED 130 and the first package material 140 completely.
  • FIGS. 2 and 3 are side cross-sectional views of different aspects according to the first embodiment of the present invention, and the implementation aspects disclosed in FIGS. 2 and 3 substantially have the same structure as the embodiment in FIG. 1 , and only the differences between FIGS. 1 , 2 and 3 would be described below.
  • the LED package structure 100 of the present embodiment further includes a lens 170 .
  • the lens 170 covers the second enclosure 150 and the second package material 160 , and the material of the lens 170 is a transparent material, for example, but not limited to, a polymer material or a glass material.
  • the illuminating light emitted by the LED 130 is reflected to a wall surface of the lens 170 , so the lens 170 can provide a better use of reflecting light.
  • the lens 170 of the present embodiment may further have a second fluorescent material 171 in a powder form added therein, so as to improve the reflection effect of the lens 170 .
  • the second fluorescent material 171 added into the lens 170 is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7:Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4Cl2:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2
  • the second fluorescent material 171 may be added into the lens 170 in various forms according to practical fabrication requirements.
  • the second fluorescent material 171 is coated on the surface of the lens 170 in the form of colloid.
  • the second fluorescent material 171 mixed in the lens 170 provides a better reflection effect for the illuminating light.
  • FIG. 4 is a side cross-sectional view according to a second embodiment of the present invention.
  • an LED package structure 300 according to the second embodiment of the present invention includes a substrate 310 , an enclosure 320 , at least one LED 330 , a first package material 340 , and a second package material 350 .
  • the material of the substrate 310 is, but not limited to, one selected from a metal material, a ceramic material, a diamond material, a diamond-like carbon material or a PCB.
  • the enclosure 320 is disposed on a top surface of the substrate 310 , and encloses to form a configuration area 321 on the surface of the substrate 310 . It should be noted that, the enclosure 320 and the substrate 310 of the embodiment are substantially perpendicular to each other.
  • the material of the enclosure 320 is a transparent material, and the shape of the configuration area 321 formed by the enclosure 320 according to the embodiment is, for example, but not limited to, a rectangle, a circle, and an oval. Persons skilled in the art may design the configuration area 321 to various geometric shapes according to practical use requirements.
  • the enclosure 320 may also be designed to be disposed on the substrate 310 at an angle of inclination, or the enclosure 320 may be designed to be, but not limited to, a trapezoid-like structure. Therefore, persons skilled in the art may further design the enclosure 320 of the present embodiment into forms of various geometric shapes and different placement angles according to practical use requirements.
  • the LED 330 is disposed in the configuration area 321 , that is, the LED 330 is located inside the enclosure 320 .
  • the LED 330 is electrically connected to an electrical source, and is driven by the electrical source to emit the illuminating light.
  • the number of the configured LEDs 330 may be varied according to the practical use requirements, but is not limited to the one LED in the embodiment.
  • the color of the light emitted by the LED 330 according to the embodiment may be various colors, such as cool white, warm white, and white light imitating daylight.
  • the illuminating light has high color rendering property, and the illuminating light of the present embodiment has the total reflection effect of normal reflection and horizontal reflection by means of the first enclosure 320 , so as to avoid excessive light loss of the illuminating light during refraction.
  • the first package material 340 is filled in the first configuration area 321 , and covers the LED 330 completely.
  • the material of the first package material 340 is a transparent material, for example, but not limited to, a polymer material such as epoxy and silicone.
  • the first package material 340 is, for example, but not limited to, disposed in the first configuration area 121 through a molding process.
  • the second package material 350 has a first fluorescent material 351 in the powder form added therein, and the second package material 350 covers the enclosure 320 , the LED 330 and the first package material 340 completely, so as to form the complete LED package structure 300 .
  • the material of the second package material 350 is a transparent material, for example, but not limited to, a polymer material such as epoxy and silicone.
  • the first fluorescent material 351 added into the second package material 350 is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7: Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4C12:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O8 ⁇ 2SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu
  • first fluorescent material 351 into the first second package material 350 in various forms according to practical fabrication requirements, for example, the first fluorescent material 351 is coated on the top surface of the second package material 350 in the form of colloid.
  • the first fluorescent material 351 mixed in the second package material 350 provides a better reflection effect for the illuminating light.
  • FIGS. 5 and 6 are side cross-sectional views of different aspects according to the second embodiment of the present invention, and the implementation aspects disclosed in FIGS. 5 and 6 have substantially the same structure as the embodiment in FIG. 4 , and only the differences between FIGS. 5 and 6 would be described illustrated below.
  • the LED package structure 300 further includes a lens 360 .
  • the lens 360 covers the second package material 350 , and the material of the lens 360 is transparent material, for example, but not limited to, a polymer material and a glass material.
  • the illuminating light emitted by the LED 330 is reflected on a wall surface of the lens 360 , so the lens 360 provides a better use of reflected light.
  • the lens 360 of the present embodiment may further have a second fluorescent material 361 in a powder form added therein, so as to improve the reflection effect of the lens 360 .
  • the second fluorescent material 361 added into the lens 360 is one selected from Sr 1-x-y Ba x Ca y SiO 4 :Eu 2+ F, (Sr 1-x-y Eu x Mn y )P 2+z O 7 :Eu 2+ F, (Ba,Sr,Ca)Al 2 O 4 :Eu, ((Ba,Sr,Ca)(Mg,Zn))Si 2 O 7 :Eu, SrGa 2 S 4 :Eu, ((Ba,Sr,Ca) 1-x Eu x )(Mg,Zn) 1-x Mn x ))Al 10 O 17 , Ca 8 Mg(SiO 4 ) 4 Cl 2 :Eu,Mn, ((Ba,Sr,Ca,Mg)
  • the second fluorescent material 361 may be added into the lens 360 in various forms according to practical fabrication requirements.
  • the second fluorescent material 361 is coated on the surface of the lens 360 in the form of colloid.
  • the second fluorescent material 361 mixed in the lens 360 provides a better reflection effect for the illuminating light.
  • the package structure of the present invention can be applicable in both LED forms including a vertical light emitting type and a horizontal light emitting type.
  • the LED package structure is applicable in a package structure having multiple LEDs, the reliability of the LED package structure is improved.
  • the LED package structure is applicable in a package structure of a plurality of LEDs, and the manufacturing cost is reduced at the same time.
  • the LED package structure of the present invention may further have a lens disposed outside the second package material, so as to further improve the overall luminance performance of the LED package structure.

Abstract

A light emitting diode (LED) package structure includes a substrate, at least one enclosure made of a transparent material, an LED, a first package material, and a second package material. The enclosure is disposed on a surface of the substrate, and forms a configuration area for disposing the LED therein. The first package material made of a transparent material is disposed in the configuration area and covers the LED. The second package material containing a fluorescent material covers the enclosure, the LED, and the first package material.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 099135824 filed in Taiwan, R.O.C. on Oct. 20, 2010, the entire contents of which are hereby incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of Invention
The present invention relates to a package structure, and more particularly to a light emitting diode (LED) package structure of a package type in which light emitting elements do not directly contact a fluorescent material.
2. Related Art
Due to low power consumption, high efficiency, and long life, LEDs are widely used in various application fields, for example, as light sources for backlight modules of notebook computers, monitors, mobile phones, TV sets, and liquid crystal displays (LCDs). Moreover, as more and more researchers work on the research and development of the LEDs, the luminous intensity of the LEDs already reaches a lighting level for daily life at present.
For example, the most commonly used white LED modulates and combines red, green, and blue light, in which the LED chips that emit red, green, and blue light are combined in a form of array and packaged. Color lights emitted by the LEDs of the three colors are mixed, so as to obtain a multi-chip LED package device capable of emitting white light.
The conventional LED package device uses a package having a phosphor powder added therein to directly cover the LED chips, that is, the LEDs directly contact and join the phosphor powder for refracting the light. In the conventional method, the phosphor powder is uniformly mixed into the package of a resin material (referred to as uniform distribution) or a mixing region of the phosphor powder is close to a position of the LED chip (referred to as conformal distribution), so as to improve the light color uniformity of the LEDs.
Thus, when the LED chip is in operation, the generated high heat energy will be directly transferred to the package material, and the properties of the phosphor powder change when being heated, resulting in decrease of the overall luminance performance of the LED package device. Moreover, the current LED package techniques cannot achieve the consistency of the spatial spectral distribution and the illumination brightness of the illuminating light.
At present, as the luminous efficiency of the conventional LED is still too low, and the manufacturing cost is relatively high, it is a very important subject to significantly improve the luminous efficiency of the LED and reduce the manufacturing cost of the LED for the research and development personnel in the related field, so as to enhance competitiveness of the LED in the future.
Package technique is one of the import facts that affect the performance of the LED, and in order to improve color uniformity of the LED and achieve high lumen output (light flux), the conventional phosphor powder coating method cannot meet the current requirements of the LED. Therefore, manufacturers have developed a phosphor powder coating method different from the conventional method, for example, the technique recorded in U.S. Pat. No. 6,576,488 (referred to as Patent '488 hereinafter), in which the LED is manufactured by depositing a phosphor layer on a conductive substrate/non-conductive substrate (chip) through electrophoretic coating or by directly attaching a phosphor coated sheet on the chip, so as to improve the luminance performance of the LED.
However, the electrophoretic coating technique disclosed in Patent '488 has the disadvantage of expensive manufacturing cost, so the cost of the LED cannot be reduced, and thus the LED manufactured through this method does not have a price advantage on the market. Furthermore, in the method of attaching the phosphor coated sheet on the chip, the preparation process is complicated as the phosphor coated sheet has to be manufactured additionally; moreover, the step of attaching the phosphor coated sheet must be very accurate, so the yield cannot be controlled, thus resulting in increase of the manufacturing cost.
At present, some manufacturers use a silicone lens as the package material of the LED, so as to increase the index of refraction of the LED, and thereby improving the luminance performance of the LED. In addition to the advantages of high light transmission and high index of refraction, the silicone lens further has excellent properties such as high temperature resistance, high insulation, and high chemical stability, and therefore the silicone lens can be used in the high power LEDs suitably. The silicone lens can endure the high temperature generated during operation of the LED, such that the problem that the conventional package material deteriorates due to high temperature is solved, and the reliability of the LED is significantly improved.
SUMMARY OF THE INVENTION
In view of the above problems, the present invention provides an LED package structure, which can solve problems such as bad luminance performance and non-uniform illumination brightness due to a package material having a phosphor powder added therein directly contacts an LED chip in the conventional LED package device and an excessively high manufacturing cost due to the process of the conventional LED package device being complicated.
In an embodiment of the present invention, an LED package structure is provided, which includes a substrate, a first enclosure, at least one LED, a first package material, a second enclosure, and a second package material. The first enclosure is disposed on a surface of the substrate, and forms a first configuration area on the substrate, and the material of the first enclosure is a transparent material. The LED is disposed in the first configuration area, and is capable of emitting an illuminating light. The first package material is disposed in the first configuration area, and covers the LED, and the material of the first package material is a transparent material. The second enclosure is disposed on the surface of the substrate, and is located outside the first enclosure. A second configuration area is formed between the second enclosure and the first enclosure. The material of the second enclosure is a transparent material. The second package material has a fluorescent material added therein, and the second package material is disposed in the second configuration area, and covers the first enclosure, the LED, and the first package material.
In another embodiment of the present invention, an LED package structure is provided, which includes a substrate, an enclosure, at least one LED, a first package material, and a second package material. The enclosure is disposed on a surface of the substrate, and forms a configuration area on the substrate, and the material of the enclosure is a transparent material. The LED is disposed in the configuration area, and is capable of emitting the illuminating light. The first package material is disposed in the configuration area, and covers the LED, and a material of the first package material is a transparent material. The second package material has a fluorescent material added therein, and the second package material covers the enclosure, the LED, and the first package material.
The present invention has the advantages as follows. Because of the configuration relationship that the LED and the package material having the fluorescent material are separated from each other without direct contact (remote phosphor), a certain distance exists between the LED and the fluorescent material for reflecting the light. Therefore, the overall luminance performance of the LED package structure and the uniformity of the reflected light are improved.
In the LED, the fluorescent material is remote from the heat source, that is to say, the fluorescent material does not directly contact the LED, so the reliability of the LED package structure is improved. Thus, the LED package structure is applicable in a package structure having multiple LEDs, and the manufacturing cost is greatly reduced at the same time.
These and other aspects of the present invention will become apparent from the following description of the preferred embodiment taken in conjunction with the following drawings, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings illustrate one or more embodiments of the invention and, together with the written description, serve to explain the principles of the invention.
Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment, and wherein:
FIG. 1 is a side cross-sectional view according to a first embodiment of the present invention;
FIG. 2 is a side cross-sectional view of different aspects according to the first embodiment of the present invention;
FIG. 3 is a side cross-sectional view of different aspects according to the first embodiment of the present invention;
FIG. 4 is a side cross-sectional view according to a second embodiment of the present invention;
FIG. 5 is a side cross-sectional view of different aspects according to the second embodiment of the present invention; and
FIG. 6 is a side cross-sectional view of different aspects according to the second embodiment of the present invention.
 DETAILED DESCRIPTION OF THE INVENTION
The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
FIG. 1 is a side cross-sectional view according to a first embodiment of the present invention. As shown in FIG. 1, an LED package structure 100 according to the first embodiment of the present invention includes a substrate 110, a first enclosure 120, at least one LED 130, a first package material 140, a second enclosure 150, and a second package material 160. The material of the substrate 110 is, but not limited to, one selected from a metal material, a ceramic material, a diamond material, a diamond-like carbon material or a printed circuit board (PCB).
The first enclosure 120 is disposed on a top surface of the substrate 110, and encloses to form a first configuration area 121 on the surface of the substrate 110. It should be noted that the first enclosure 120 and the substrate 110 of the present embodiment are approximately perpendicular to each other. The material of the first enclosure 120 is a transparent material, and the shape of the first configuration area 121 formed by the first enclosure 120 of the embodiment is, for example, but not limited to, a rectangle, a circle, or an oval, and persons skilled in the art may design the first configuration area 121 to various geometric shapes according to practical use requirements.
Furthermore, for optimizing light reflection, the first enclosure 120 may also be designed to be disposed on the substrate 110 at an angle of inclination, or the first enclosure 120 may be designed to be a trapezoid-like structure. Therefore, persons skilled in the art may further design the first enclosure 120 of the present embodiment into forms of various geometric shapes and different placement angles according to practical use requirements.
As shown in FIG. 1, the LED 130 is disposed in the first configuration area 121, that is, the LED 130 is located inside the first enclosure 120. The LED 130 is electrically connected to an electrical source, and is driven by the electrical source to emit the illuminating light. The number of the configured LEDs 130 may be varied according to the practical use requirements, but is not limited to the one LED in the embodiment.
The color of the light emitted by the LED 130 of the embodiment may be various colors such as cool white, warm white, and white light imitating daylight. The illuminating light has high color rendering property, and the illuminating light of the present embodiment has the total reflection effect of normal reflection and horizontal reflection by means of the first enclosure 120, thereby avoiding excessive light loss of the illuminating light during refraction.
Referring to FIG. 1 again, the first package material 140 is filled in the first configuration area 121, and covers the LED 130 completely. The material of the first package material 140 is a transparent material, for example, but not limited to, a polymer material such as epoxy and silicone. Moreover, the first package material 140 is, for example, but not limited to, disposed in the first configuration area 121 through a molding process.
The second enclosure 150 is disposed on a top surface of the substrate 110, the second enclosure 150 is located outside the first enclosure 120, and a distance is defined between the first enclosure 120 and the second enclosure 150. A second configuration area 151 is formed between the second enclosure 150 and the first enclosure 120 (that is, on the surface of the substrate 110). It should be noted that, the second enclosure 150 and the substrate 110 of the present embodiment are approximately perpendicular to each other. The material of the second enclosure 150 is a transparent material, the shape of the second configuration area 151 formed by the second enclosure 150 of the embodiment is, for example, but not limited to, a rectangle, a circle, and an oval, and persons skilled in the art may design the second configuration area 151 to be various geometric shapes.
Furthermore, for optimizing the reflection of the light, the second enclosure 150 may also be designed to be disposed on the substrate 110 at an angle of inclination or the second enclosure 150 may be designed to be a trapezoid-like structure. Therefore, persons skilled in the art may further design the second enclosure 150 of the present embodiment into forms of various geometric shapes and different placement angles according to practical use requirements.
As shown in FIG. 1, the second package material 160 has a first fluorescent material 161 in a powder form added therein. The second package material 160 is filled in the second configuration area 151, and covers the first enclosure 120, the LED 130 and the first package material 140 completely, so as to form the complete LED package structure 100. The material of the second package material 160 is a transparent material, for example, but not limited to, a polymer material such as epoxy and silicone.
The first fluorescent material 161 added in the second package material 160 is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7:Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4Cl2:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O82SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce,Tb, Sr4Al14O25:Eu, YBO3:Ce,Tb, BaMgAl10O17:Eu,Mn, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, Ca2MgSi2O7:Cl,Eu,Mn, (Sr,Ca,Ba,Mg)10(PO4)6Cl2:Eu ZnS:Cu,Al, (Y,Gd,Tb,Lu,Yb)(AlyGa1-y)5O12:Ce, (Sr1-x-y-zBaxCayEuz)2SiO4, and (Sr1-a-bCabBac)SixNyOz:Eua Sr5(PO4)3Cl:Eua, or a mixture material thereof, but the first fluorescent material 161 is not limited thereto, and the form of the first fluorescent material 161 is also not limited to the powder disclosed in the embodiment. Persons skilled in the art may add the first fluorescent material 161 into the second package material 160 in various forms according to practical fabrication requirements, for example, the first fluorescent material 161 is coated on the top surface of the second package material 160 in the form of colloid. When the illuminating light penetrates the second package material 160, the first fluorescent material 161 mixed in the second package material 160 provides a good reflection effect for the illuminating light.
Referring to FIG. 1, as the height size of the second enclosure 150 is substantially greater than that of the first enclosure 120, when the second package material 160 is filled in the second configuration area 151, and the second package material 160 and the second enclosure 150 have the same height, the second package material 160 covers the first enclosure 120, the LED 130 and the first package material 140 completely.
FIGS. 2 and 3 are side cross-sectional views of different aspects according to the first embodiment of the present invention, and the implementation aspects disclosed in FIGS. 2 and 3 substantially have the same structure as the embodiment in FIG. 1, and only the differences between FIGS. 1, 2 and 3 would be described below.
As shown in FIG. 2, in addition to the substrate 110, the first enclosure 120, the LED 130, the first package material 140, the second enclosure 150, and the second package material 160, the LED package structure 100 of the present embodiment further includes a lens 170. The lens 170 covers the second enclosure 150 and the second package material 160, and the material of the lens 170 is a transparent material, for example, but not limited to, a polymer material or a glass material. The illuminating light emitted by the LED 130 is reflected to a wall surface of the lens 170, so the lens 170 can provide a better use of reflecting light.
Furthermore, as shown in FIG. 3, the lens 170 of the present embodiment may further have a second fluorescent material 171 in a powder form added therein, so as to improve the reflection effect of the lens 170. The second fluorescent material 171 added into the lens 170 is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7:Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4Cl2:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O8·2SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce,Tb, Sr4Al14O25:Eu, YBO3:Ce,Tb, BaMgAl10O17:Eu,Mn, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, Ca2MgSi2O7:Cl,Eu,Mn, (Sr,Ca,Ba,Mg)10(PO4)6Cl2:Eu ZnS:Cu,Al, (Y,Gd,Tb,Lu,Yb)(AlyGal-y)5O12:Ce, (Sr1-x-y-zBaxCayEuz)2SiO4, and (Sr1-a-bCabBac)SixNyOz:Eua Sr5(PO4)3Cl:Eua, or a mixture material thereof, but the material of the second fluorescent material 171 is not limited thereto, and the form of the second fluorescent material 171 is not limited to the powder disclosed in the embodiment. Persons skilled in the art may add the second fluorescent material 171 into the lens 170 in various forms according to practical fabrication requirements. For example, the second fluorescent material 171 is coated on the surface of the lens 170 in the form of colloid. When the illuminating light penetrates the lens 170, the second fluorescent material 171 mixed in the lens 170 provides a better reflection effect for the illuminating light.
FIG. 4 is a side cross-sectional view according to a second embodiment of the present invention. As shown in FIG. 4, an LED package structure 300 according to the second embodiment of the present invention includes a substrate 310, an enclosure 320, at least one LED 330, a first package material 340, and a second package material 350. The material of the substrate 310 is, but not limited to, one selected from a metal material, a ceramic material, a diamond material, a diamond-like carbon material or a PCB.
The enclosure 320 is disposed on a top surface of the substrate 310, and encloses to form a configuration area 321 on the surface of the substrate 310. It should be noted that, the enclosure 320 and the substrate 310 of the embodiment are substantially perpendicular to each other. The material of the enclosure 320 is a transparent material, and the shape of the configuration area 321 formed by the enclosure 320 according to the embodiment is, for example, but not limited to, a rectangle, a circle, and an oval. Persons skilled in the art may design the configuration area 321 to various geometric shapes according to practical use requirements.
Furthermore, for optimizing the reflection of the light, the enclosure 320 may also be designed to be disposed on the substrate 310 at an angle of inclination, or the enclosure 320 may be designed to be, but not limited to, a trapezoid-like structure. Therefore, persons skilled in the art may further design the enclosure 320 of the present embodiment into forms of various geometric shapes and different placement angles according to practical use requirements.
As shown in FIG. 4, the LED 330 is disposed in the configuration area 321, that is, the LED 330 is located inside the enclosure 320. The LED 330 is electrically connected to an electrical source, and is driven by the electrical source to emit the illuminating light. The number of the configured LEDs 330 may be varied according to the practical use requirements, but is not limited to the one LED in the embodiment.
The color of the light emitted by the LED 330 according to the embodiment may be various colors, such as cool white, warm white, and white light imitating daylight. The illuminating light has high color rendering property, and the illuminating light of the present embodiment has the total reflection effect of normal reflection and horizontal reflection by means of the first enclosure 320, so as to avoid excessive light loss of the illuminating light during refraction.
Referring to FIG. 4 again, the first package material 340 is filled in the first configuration area 321, and covers the LED 330 completely. The material of the first package material 340 is a transparent material, for example, but not limited to, a polymer material such as epoxy and silicone. Moreover, the first package material 340 is, for example, but not limited to, disposed in the first configuration area 121 through a molding process.
The second package material 350 has a first fluorescent material 351 in the powder form added therein, and the second package material 350 covers the enclosure 320, the LED 330 and the first package material 340 completely, so as to form the complete LED package structure 300. The material of the second package material 350 is a transparent material, for example, but not limited to, a polymer material such as epoxy and silicone.
The first fluorescent material 351 added into the second package material 350 is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7: Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4C12:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O8·2SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce,Tb, Sr4Al14O25:Eu, YBO3:Ce,Tb, BaMgAl10O17:Eu,Mn, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, Ca2MgSi2O7:Cl,Eu,Mn, (Sr,Ca,Ba,Mg)10(PO4)6Cl2:Eu ZnS:Cu,Al, (Y,Gd,Tb,Lu,Yb)(AlyGal-y)5O12:Ce, (Sr1-x-y-zBaxCayEuz)2SiO4, and (Sr1-a-bCabBac)SixNyOz:Eua Sr5(PO4)3Cl:Eua, or a mixture material thereof, but the material of the first fluorescent material 351 is not limited thereto, and the form of the first fluorescent material 351 is also not limited to the powder disclosed in the embodiment. Persons skilled in the art may add the first fluorescent material 351 into the first second package material 350 in various forms according to practical fabrication requirements, for example, the first fluorescent material 351 is coated on the top surface of the second package material 350 in the form of colloid. When the illuminating light penetrates the second package material 350, the first fluorescent material 351 mixed in the second package material 350 provides a better reflection effect for the illuminating light.
FIGS. 5 and 6 are side cross-sectional views of different aspects according to the second embodiment of the present invention, and the implementation aspects disclosed in FIGS. 5 and 6 have substantially the same structure as the embodiment in FIG. 4, and only the differences between FIGS. 5 and 6 would be described illustrated below.
As shown in FIG. 5, in addition to the substrate 310, the enclosure 320, the LED 330, the first package material 340, and the second package material 350, the LED package structure 300 further includes a lens 360. The lens 360 covers the second package material 350, and the material of the lens 360 is transparent material, for example, but not limited to, a polymer material and a glass material. The illuminating light emitted by the LED 330 is reflected on a wall surface of the lens 360, so the lens 360 provides a better use of reflected light.
Furthermore, as shown in FIG. 6, the lens 360 of the present embodiment may further have a second fluorescent material 361 in a powder form added therein, so as to improve the reflection effect of the lens 360. The second fluorescent material 361 added into the lens 360 is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7:Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4Cl2:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O8·2SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce,Tb, Sr4Al14O25:Eu, YBO3:Ce,Tb, BaMgAl10O17:Eu,Mn, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, Ca2MgSi2O7:Cl,Eu,Mn, (Sr,Ca,Ba,Mg)10(PO4)6Cl2:Eu ZnS:Cu,Al, (Y,Gd,Tb,Lu,Yb)(AlyGa1-y)5O12:Ce, (Sr1-x-y-zBaxCayEuz)2SiO4, and (Sr1-a-bCabBac)SixNyOz:Eua Sr5(PO4)3Cl:Eua, or a mixture material thereof, but the material of the second fluorescent material 361 is not limited thereto, and the form of the second fluorescent material 361 is not limited to the powder disclosed in the embodiment. Persons skilled in the art may add the second fluorescent material 361 into the lens 360 in various forms according to practical fabrication requirements. For example, the second fluorescent material 361 is coated on the surface of the lens 360 in the form of colloid. When the illuminating light penetrates the lens 360, the second fluorescent material 361 mixed in the lens 360 provides a better reflection effect for the illuminating light.
Because of the configuration relationship that the LED and the package material having the fluorescent material are separated from each other without direct contact (remote phosphor), a certain distance exists between the LED and the fluorescent material for reflecting the light. Therefore, the overall luminance performance of the LED package structure and the uniformity of the reflected light of the LED package structure can be improved. Moreover, the package structure of the present invention can be applicable in both LED forms including a vertical light emitting type and a horizontal light emitting type.
As in the LED the fluorescent material is remote from the heat source, that is to say, the fluorescent material does not directly contact the LED, so the LED package structure is applicable in a package structure having multiple LEDs, the reliability of the LED package structure is improved. Thus, the LED package structure is applicable in a package structure of a plurality of LEDs, and the manufacturing cost is reduced at the same time.
Furthermore, the LED package structure of the present invention may further have a lens disposed outside the second package material, so as to further improve the overall luminance performance of the LED package structure.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.

Claims (18)

What is claimed is:
1. A light emitting diode (LED) package structure, comprising:
a substrate;
a first enclosure, disposed on a surface of the substrate, and enclosing to form a first configuration area on the substrate, and a material of the first enclosure is a transparent material;
at least one LED, disposed in the first configuration area and used for emitting illuminating light;
a first package material, disposed in the first configuration area, and covering the LED, wherein a material of the first package material is a transparent material;
a second enclosure, disposed on the surface of the substrate and outside the first enclosure, and forming a second configuration area with the first enclosure, wherein a material of the second enclosure is a transparent material; and
a second package material, having a first fluorescent material added therein, disposed in the second configuration area, and covering the first enclosure, the LED, and the first package material.
2. The LED package structure according to claim 1, further comprising a lens, covering the second enclosure and the second package material.
3. The LED package structure according to claim 2, wherein a material of the lens is a transparent material.
4. The LED package structure according to claim 2, wherein the lens further comprises a second fluorescent material, and the second fluorescent material is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7:Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4Cl2:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O82SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce,Tb, Sr4Al14O25:Eu, YBO3:Ce,Tb, BaMgAl10O17:Eu,Mn, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, Ca2MgSi2O7:Cl,Eu,Mn, (Sr,Ca,Ba,Mg)10(PO4)6Cl2:Eu ZnS:Cu,Al, (Y,Gd,Tb,Lu,Yb)(AlyGa1-y)5O12:Ce, (Sr1-x-y-zBaxCayEuz)2SiO4, and (Sr1-a-bCabBac)SixNyOz:EuaSr5(PO4)3Cl:Eua or a mixture material thereof.
5. The LED package structure according to claim 1, wherein a height size of the second enclosure is substantially greater than that of the first enclosure.
6. The LED package structure according to claim 1, wherein the first fluorescent material is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7:Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4Cl2:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O82SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce,Tb, Sr4Al14O25:Eu, YBO3:Ce,Tb, BaMgAl10O17:Eu,Mn, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, Ca2MgSi2O7:Cl,Eu,Mn, (Sr,Ca,Ba,Mg)10(PO4)6Cl2:Eu ZnS:Cu,Al, (Y,Gd,Tb,Lu,Yb)(AlyGa1-y)5O12:Ce, (Sr1-x-y-zBaxCayEuz)2SiO4, and (Sr1-a-bCabBac)SixNyOz:EuaSr5(PO4)3Cl:Eua, or a mixture material thereof.
7. The LED package structure according to claim 1, wherein a material of the substrate is one selected from a metal material, a ceramic material, a diamond material, a diamond-like carbon material or a printed circuit board (PCB).
8. The LED package structure according to claim 1, wherein materials of the first package material and the second package material are epoxy or silicone.
9. The LED package structure according to claim 1, wherein a shape of the first configuration area formed by the first enclosure is a rectangle, a circle or an oval.
10. The LED package structure according to claim 1, wherein a shape of the second configuration area formed by the second enclosure is a rectangle, a circle, or an oval.
11. A light emitting diode (LED) package structure, comprising:
a substrate;
an enclosure, disposed on a surface of the substrate, and enclosing to form a configuration area on the substrate, wherein a material of the enclosure is a transparent material;
at least one LED, disposed in the configuration area, and used for emitting an illuminating light;
a first package material, disposed in the configuration area, and covering the LED, wherein a material of the first package material is a transparent material; and
a second package material, having a first fluorescent material added therein, and covering the enclosure, the LED, and the first package material.
12. The LED package structure according to claim 11, further comprising a lens, covering the second package material.
13. The LED package structure according to claim 12, wherein a material of the lens is a transparent material.
14. The LED package structure according to claim 12, wherein the lens further comprises a second fluorescent material, and the second fluorescent material is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7:Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4Cl2:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O82SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce,Tb, Sr4Al14O25:Eu, YBO3:Ce,Tb, BaMgAl10O17:Eu,Mn, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, Ca2MgSi2O7:Cl,Eu,Mn, (Sr,Ca,Ba,Mg)10(PO4)6Cl2:Eu ZnS:Cu,Al, (Y,Gd,Tb,Lu,Yb)(AlyGa1-y)5O12:Ce, (Sr1-x-y-zBaxCayEuz)2SiO4, and (Sr1-a-bCabBac)SixNyOz:EuaSr5(PO4)3Cl:Ea, or a mixture material thereof.
15. The LED package structure according to claim 11, wherein the first fluorescent material is one selected from Sr1-x-yBaxCaySiO4:Eu2+F, (Sr1-x-yEuxMny)P2+zO7:Eu2+F, (Ba,Sr,Ca)Al2O4:Eu, ((Ba,Sr,Ca)(Mg,Zn))Si2O7:Eu, SrGa2S4:Eu, ((Ba,Sr,Ca)1-xEux)(Mg,Zn)1-xMnx))Al10O17, Ca8Mg(SiO4)4Cl2:Eu,Mn, ((Ba,Sr,Ca,Mg)1-xEux)2SiO4, Ca2MgSi2O7:Cl, SrSi3O82SrCl2:Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce,Tb, Sr4Al14O25:Eu, YBO3:Ce,Tb, BaMgAl10O17:Eu,Mn, (Sr,Ca,Ba)(Al,Ga)2S4:Eu, Ca2MgSi2O7:Cl,Eu,Mn, (Sr,Ca,Ba,Mg)10(PO4)6Cl2:Eu ZnS:Cu,Al, (Y,Gd,Tb,Lu,Yb)(AlyGa1-y)5O12:Ce, (Sr1-x-y-zBaxCayEuz)2SiO4, and (Sr1-a-bCabBac)SixNyOz:EuaSr5(PO4)3Cl:Eua, or a mixture material thereof.
16. The LED package structure according to claim 11, wherein a material of the substrate is one selected from a metal material, a ceramic material, a diamond material, a diamond-like carbon material or a printed circuit board (PCB).
17. The LED package structure according to claim 11, wherein materials of the first package material and the second package material are epoxy or silicone.
18. The LED package structure according to claim 11, wherein a shape of the configuration area formed by the enclosure is a rectangle, a circle, or an oval.
US13/017,285 2010-10-20 2011-01-31 Light emitting diode package structure Active 2031-12-28 US8450759B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW99135824A 2010-10-20
TW099135824 2010-10-20
TW099135824A TWI447969B (en) 2010-10-20 2010-10-20 Light-emitting diode package structure

Publications (2)

Publication Number Publication Date
US20120098001A1 US20120098001A1 (en) 2012-04-26
US8450759B2 true US8450759B2 (en) 2013-05-28

Family

ID=45569807

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/017,285 Active 2031-12-28 US8450759B2 (en) 2010-10-20 2011-01-31 Light emitting diode package structure

Country Status (4)

Country Link
US (1) US8450759B2 (en)
EP (1) EP2445020B1 (en)
KR (1) KR20120041100A (en)
TW (1) TWI447969B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10244599B1 (en) 2016-11-10 2019-03-26 Kichler Lighting Llc Warm dim circuit for use with LED lighting fixtures

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5652252B2 (en) * 2011-02-24 2015-01-14 ソニー株式会社 LIGHT EMITTING DEVICE, LIGHTING DEVICE, AND DISPLAY DEVICE
US8436386B2 (en) * 2011-06-03 2013-05-07 Micron Technology, Inc. Solid state lighting devices having side reflectivity and associated methods of manufacture
CN103515367B (en) * 2012-06-25 2016-10-05 青岛玉兰祥商务服务有限公司 Package structure for LED
CN104022213A (en) * 2014-04-11 2014-09-03 深圳市迈克光电子科技有限公司 Remote phosphor COB integrated light source and preparation method thereof
JP6458793B2 (en) 2016-11-21 2019-01-30 日亜化学工業株式会社 Method for manufacturing light emitting device

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6576488B2 (en) 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
US6653661B2 (en) * 2000-12-19 2003-11-25 Sharp Kabushiki Kaisha Chip-type LED and process of manufacturing the same
US20050072981A1 (en) * 2002-02-19 2005-04-07 Ryoma Suenaga Light-emitting device and process for producing thereof
US7301175B2 (en) * 2001-10-12 2007-11-27 Nichia Corporation Light emitting apparatus and method of manufacturing the same
US20100044726A1 (en) * 2008-08-22 2010-02-25 Qing Li Method for Packaging White-Light LED and LED Device Produced Thereby
US7714342B2 (en) * 2006-01-10 2010-05-11 Samsung Electro-Mechanics Co., Ltd. Chip coated light emitting diode package and manufacturing method thereof
US20100164367A1 (en) * 2007-05-22 2010-07-01 Kousuke Shioi Fluorescent substance, method for producing the same, and light-emitting device using the same
US20110037078A1 (en) * 2009-08-14 2011-02-17 Electronics And Telecommunications Research Institute Optical interconnection device
US7906904B2 (en) * 2000-06-20 2011-03-15 Sanken Electric Co., Ltd. Light permeable fluorescent cover for light emitting diode
US8106584B2 (en) * 2004-12-24 2012-01-31 Kyocera Corporation Light emitting device and illumination apparatus
US8207659B2 (en) * 2008-08-29 2012-06-26 Kabushiki Kaisha Toshiba Light emitting device and light emitting apparatus
US8330182B2 (en) * 2009-04-20 2012-12-11 Nichia Corporation Light emitting device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006020529A1 (en) * 2005-08-30 2007-03-01 Osram Opto Semiconductors Gmbh Optoelectronic component has semiconductor body emitting electromagnetic radiation that passes through an optical element comprising wavelength conversion material
TWI266441B (en) * 2005-10-26 2006-11-11 Lustrous Technology Ltd COB-typed LED package with phosphor
US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
JP5089212B2 (en) * 2007-03-23 2012-12-05 シャープ株式会社 LIGHT EMITTING DEVICE, LED LAMP USING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
TWI336966B (en) * 2007-04-27 2011-02-01 Chao Yuan Cheng Led package with uniform color phase
TW200924553A (en) * 2007-11-30 2009-06-01 Gigno Technology Co Ltd Light emitting unit
US20090261708A1 (en) * 2008-04-21 2009-10-22 Motorola, Inc. Glass-phosphor capping structure for leds

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US7906904B2 (en) * 2000-06-20 2011-03-15 Sanken Electric Co., Ltd. Light permeable fluorescent cover for light emitting diode
US6653661B2 (en) * 2000-12-19 2003-11-25 Sharp Kabushiki Kaisha Chip-type LED and process of manufacturing the same
US6576488B2 (en) 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
US7301175B2 (en) * 2001-10-12 2007-11-27 Nichia Corporation Light emitting apparatus and method of manufacturing the same
US20050072981A1 (en) * 2002-02-19 2005-04-07 Ryoma Suenaga Light-emitting device and process for producing thereof
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
US8106584B2 (en) * 2004-12-24 2012-01-31 Kyocera Corporation Light emitting device and illumination apparatus
US8013352B2 (en) * 2006-01-10 2011-09-06 Samsung Led Co., Ltd. Chip coated light emitting diode package and manufacturing method thereof
US7795052B2 (en) * 2006-01-10 2010-09-14 Samsung Led Co., Ltd. Chip coated light emitting diode package and manufacturing method thereof
US7714342B2 (en) * 2006-01-10 2010-05-11 Samsung Electro-Mechanics Co., Ltd. Chip coated light emitting diode package and manufacturing method thereof
US8324646B2 (en) * 2006-01-10 2012-12-04 Samsung Electronics Co., Ltd. Chip coated light emitting diode package and manufacturing method thereof
US20100164367A1 (en) * 2007-05-22 2010-07-01 Kousuke Shioi Fluorescent substance, method for producing the same, and light-emitting device using the same
US20100044726A1 (en) * 2008-08-22 2010-02-25 Qing Li Method for Packaging White-Light LED and LED Device Produced Thereby
US8207659B2 (en) * 2008-08-29 2012-06-26 Kabushiki Kaisha Toshiba Light emitting device and light emitting apparatus
US8330182B2 (en) * 2009-04-20 2012-12-11 Nichia Corporation Light emitting device
US20110037078A1 (en) * 2009-08-14 2011-02-17 Electronics And Telecommunications Research Institute Optical interconnection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10244599B1 (en) 2016-11-10 2019-03-26 Kichler Lighting Llc Warm dim circuit for use with LED lighting fixtures

Also Published As

Publication number Publication date
EP2445020B1 (en) 2017-04-05
EP2445020A2 (en) 2012-04-25
TWI447969B (en) 2014-08-01
US20120098001A1 (en) 2012-04-26
TW201218449A (en) 2012-05-01
KR20120041100A (en) 2012-04-30
EP2445020A3 (en) 2013-07-10

Similar Documents

Publication Publication Date Title
JP5823111B2 (en) LED package structure
JP4648454B2 (en) Backlight panel adopting white light emitting diode having red phosphor and green phosphor
US8317348B2 (en) White light emitting device and white light source module using the same
EP2237326B1 (en) Light-emitting device and display device including the same
KR102140790B1 (en) Light emitting diode module lens and light emitting diode module lighting apparatus
US8450759B2 (en) Light emitting diode package structure
US9960322B2 (en) Solid state lighting devices incorporating notch filtering materials
US20150359050A1 (en) Lighting devices with variable gamut
TWI457418B (en) White light emitting diode device, light emitting apparatus and liquid crystal display device
EP2328190A2 (en) White light emitting device and white light source module using the same
CN102144307A (en) An LED package and a backlight unit comprising said LED package
CN104282828A (en) Light emitting device
JP2008166825A (en) White light-emitting device, and light source module for lcd backlight using same
US8794816B2 (en) LED lighting apparatus
JP2007258620A (en) Light emitting device
CN104851957B (en) Light-emitting diode encapsulation structure
KR101195430B1 (en) White light emitting device and white light source module using the same
CN102270627A (en) Packaging structure of light-emitting diode
KR20090113354A (en) White light emitting device and white light source module using the same
JP2007234817A (en) Light-emitting device
WO2022122013A1 (en) Led bracket, light-emitting unit, and light-emitting assembly

Legal Events

Date Code Title Description
AS Assignment

Owner name: INTEMATIX TECHNOLOGY CENTER CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHENG, TZU-CHI;REEL/FRAME:025721/0272

Effective date: 20110113

STCF Information on status: patent grant

Free format text: PATENTED CASE

AS Assignment

Owner name: INTERLIGHT OPTOTECH CORPORATION, TAIWAN

Free format text: CHANGE OF NAME;ASSIGNOR:INTEMATIX TECHNOLOGY CENTER CORP.;REEL/FRAME:031075/0859

Effective date: 20130624

AS Assignment

Owner name: EAST WEST BANK, CALIFORNIA

Free format text: SECURITY INTEREST;ASSIGNORS:INTEMATIX HONG KONG CO. LIMITED;INTEMATIX CORPORATION;REEL/FRAME:036967/0623

Effective date: 20151022

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: EPISTAR CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INTERLIGHT OPTOTECH CORPORATION;REEL/FRAME:046577/0566

Effective date: 20180403

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2552); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

Year of fee payment: 8

AS Assignment

Owner name: INTEMATIX CORPORATION, CALIFORNIA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:EAST WEST BANK;REEL/FRAME:059910/0304

Effective date: 20220414

Owner name: INTEMATIX HONG KONG CO. LIMITED, CALIFORNIA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:EAST WEST BANK;REEL/FRAME:059910/0304

Effective date: 20220414

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY