US8004095B2 - Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer - Google Patents
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer Download PDFInfo
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- US8004095B2 US8004095B2 US12/822,080 US82208010A US8004095B2 US 8004095 B2 US8004095 B2 US 8004095B2 US 82208010 A US82208010 A US 82208010A US 8004095 B2 US8004095 B2 US 8004095B2
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Abstract
Description
Claims (25)
Priority Applications (8)
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US13/207,633 US9252066B2 (en) | 2007-12-14 | 2011-08-11 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer |
US13/333,739 US8456002B2 (en) | 2007-12-14 | 2011-12-21 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
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US14/274,599 US9087930B2 (en) | 2007-12-14 | 2014-05-09 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
US14/523,556 US9559029B2 (en) | 2007-12-14 | 2014-10-24 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer |
US14/697,352 US9666500B2 (en) | 2007-12-14 | 2015-04-27 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
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US12/822,080 US8004095B2 (en) | 2007-12-14 | 2010-06-23 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer |
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US8826221B2 (en) | 2010-02-16 | 2014-09-02 | Deca Technologies Inc. | Adaptive patterning for panelized packaging |
US9040316B1 (en) | 2014-06-12 | 2015-05-26 | Deca Technologies Inc. | Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping |
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US10573601B2 (en) | 2016-09-19 | 2020-02-25 | Deca Technologies Inc. | Semiconductor device and method of unit specific progressive alignment |
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US8193034B2 (en) | 2006-11-10 | 2012-06-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming vertical interconnect structure using stud bumps |
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Also Published As
Publication number | Publication date |
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US20150061124A1 (en) | 2015-03-05 |
US20120217647A9 (en) | 2012-08-30 |
TW200926323A (en) | 2009-06-16 |
US20090152715A1 (en) | 2009-06-18 |
KR101523383B1 (en) | 2015-05-27 |
US9559029B2 (en) | 2017-01-31 |
KR20090064300A (en) | 2009-06-18 |
TWI508198B (en) | 2015-11-11 |
US7767496B2 (en) | 2010-08-03 |
US20110316171A1 (en) | 2011-12-29 |
US20120286422A1 (en) | 2012-11-15 |
SG153721A1 (en) | 2009-07-29 |
US8846454B2 (en) | 2014-09-30 |
US20100258937A1 (en) | 2010-10-14 |
US9252066B2 (en) | 2016-02-02 |
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