US7553683B2 - Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices - Google Patents
Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices Download PDFInfo
- Publication number
- US7553683B2 US7553683B2 US10/863,980 US86398004A US7553683B2 US 7553683 B2 US7553683 B2 US 7553683B2 US 86398004 A US86398004 A US 86398004A US 7553683 B2 US7553683 B2 US 7553683B2
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- US
- United States
- Prior art keywords
- wavelength converting
- light emitting
- emitting device
- semiconductor light
- device die
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/16—Microcrystallites, e.g. of optically or electrically active material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (30)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/863,980 US7553683B2 (en) | 2004-06-09 | 2004-06-09 | Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
EP05104674A EP1605526B1 (en) | 2004-06-09 | 2005-05-31 | Semiconductor light emitting device with pre-fabricated wavelenght converting element |
AT05104674T ATE526688T1 (en) | 2004-06-09 | 2005-05-31 | RADIATION EMITTING SEMICONDUCTOR BODY WITH PREFABRICATED WAVELENGTH CONVERSION ELEMENT |
TW094118583A TWI443853B (en) | 2004-06-09 | 2005-06-06 | Semiconductor light emitting device with pre-fabricated wavelength converting element |
JP2005198053A JP5155518B2 (en) | 2004-06-09 | 2005-06-09 | Semiconductor light-emitting device having a prepared wavelength conversion element |
US12/403,926 US8748921B2 (en) | 2004-06-09 | 2009-03-13 | Semiconductor light emitting device with pre-fabricated wavelength converting element |
JP2011287491A JP5608155B2 (en) | 2004-06-09 | 2011-12-28 | Semiconductor light-emitting device having a prepared wavelength conversion element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/863,980 US7553683B2 (en) | 2004-06-09 | 2004-06-09 | Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/403,926 Division US8748921B2 (en) | 2004-06-09 | 2009-03-13 | Semiconductor light emitting device with pre-fabricated wavelength converting element |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050274967A1 US20050274967A1 (en) | 2005-12-15 |
US7553683B2 true US7553683B2 (en) | 2009-06-30 |
Family
ID=34940029
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/863,980 Active 2025-09-25 US7553683B2 (en) | 2004-06-09 | 2004-06-09 | Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
US12/403,926 Active 2026-12-05 US8748921B2 (en) | 2004-06-09 | 2009-03-13 | Semiconductor light emitting device with pre-fabricated wavelength converting element |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/403,926 Active 2026-12-05 US8748921B2 (en) | 2004-06-09 | 2009-03-13 | Semiconductor light emitting device with pre-fabricated wavelength converting element |
Country Status (5)
Country | Link |
---|---|
US (2) | US7553683B2 (en) |
EP (1) | EP1605526B1 (en) |
JP (2) | JP5155518B2 (en) |
AT (1) | ATE526688T1 (en) |
TW (1) | TWI443853B (en) |
Cited By (34)
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US20090057698A1 (en) * | 2005-03-01 | 2009-03-05 | Kabushiki Kaisha Toshiba | Light emission device |
US20090072263A1 (en) * | 2004-11-12 | 2009-03-19 | Philips Lumileds Lighting Company, Llc | Color Control By Alteration of Wavelength Converting Element |
US20100006877A1 (en) * | 2008-07-09 | 2010-01-14 | Himax Display, Inc. | Light-emitting diode package |
US20100019260A1 (en) * | 2008-07-24 | 2010-01-28 | Koninklijke Philips Electronics N.V. | Semiconductor light emitting device including a window layer and a light-directing structure |
US20100264371A1 (en) * | 2009-03-19 | 2010-10-21 | Nick Robert J | Composition including quantum dots, uses of the foregoing, and methods |
US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
US20120138981A1 (en) * | 2010-12-02 | 2012-06-07 | Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense | Light-Emitting Diode Apparatus and Method for Making the Same |
WO2013030718A1 (en) | 2011-08-26 | 2013-03-07 | Koninklijke Philips Electronics N.V. | Method of processing a semiconductor structure |
US8405063B2 (en) | 2007-07-23 | 2013-03-26 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
US20130210181A1 (en) * | 2010-08-20 | 2013-08-15 | Osram Opto Semiconductors Gmbh | Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layer |
US8642977B2 (en) | 2006-03-07 | 2014-02-04 | Qd Vision, Inc. | Article including semiconductor nanocrystals |
US8718437B2 (en) | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
US8849087B2 (en) | 2006-03-07 | 2014-09-30 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US8876272B2 (en) | 2007-06-25 | 2014-11-04 | Qd Vision, Inc. | Compositions and methods including depositing nanomaterial |
US8890140B2 (en) | 2010-02-26 | 2014-11-18 | Osram Opto Semiconductor Gmbh | Radiation-emitting component with a semiconductor chip and a conversion element and method for the production thereof |
US9134459B2 (en) | 2009-10-17 | 2015-09-15 | Qd Vision, Inc. | Optical component, products including same, and methods for making same |
US9140844B2 (en) | 2008-05-06 | 2015-09-22 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
US9167659B2 (en) | 2008-05-06 | 2015-10-20 | Qd Vision, Inc. | Solid state lighting devices including quantum confined semiconductor nanoparticles, an optical component for a solid state lighting device, and methods |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
US9303153B2 (en) | 2009-09-09 | 2016-04-05 | Qd Vision, Inc. | Formulations including nanoparticles |
US9365701B2 (en) | 2009-09-09 | 2016-06-14 | Qd Vision, Inc. | Particles including nanoparticles, uses thereof, and methods |
US9534313B2 (en) | 2008-03-04 | 2017-01-03 | Qd Vision, Inc. | Particles including nanoparticles dispersed in solid wax, method and uses thereof |
US9685628B2 (en) | 2013-08-16 | 2017-06-20 | Samsung Electronics Co., Ltd. | Methods for making optical components, optical components, and products including same |
US9735324B2 (en) | 2006-09-04 | 2017-08-15 | Lg Innotek Co., Ltd. | Light emitting device and manufacturing method thereof |
US20180005998A1 (en) * | 2016-06-29 | 2018-01-04 | Sharp Kabushiki Kaisha | Laminated printed color conversion phosphor sheets |
US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
US20180166612A1 (en) * | 2015-03-23 | 2018-06-14 | Lg Innotek Co., Ltd. | Light emitting device package and lighting apparatus including the same |
US10488018B2 (en) | 2015-08-17 | 2019-11-26 | Infinite Arthroscopy, Inc. Limited | Light source |
US10610089B2 (en) | 2017-02-15 | 2020-04-07 | Infinite Arthroscopy, Inc. Limited | Wireless imaging system comprising a head unit and a light cable that comprises an integrated light source |
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JP2012033823A (en) | 2010-08-02 | 2012-02-16 | Stanley Electric Co Ltd | Light emitting device and method for manufacturing the same |
DE102010047476B4 (en) | 2010-10-06 | 2017-01-26 | Schott Ag | A method of contouring wavelength converters for a white or colored light source based on semiconductor light sources |
DE102010042217A1 (en) * | 2010-10-08 | 2012-04-12 | Osram Ag | Optoelectronic semiconductor component and method for its production |
JP2013541220A (en) * | 2010-10-27 | 2013-11-07 | コーニンクレッカ フィリップス エヌ ヴェ | LAMINATED SUPPORT FILM FOR MANUFACTURING LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD |
EP2632868A1 (en) | 2010-10-28 | 2013-09-04 | Corning Incorporated | Phosphor containing glass frit materials for led lighting applications |
US10158057B2 (en) | 2010-10-28 | 2018-12-18 | Corning Incorporated | LED lighting devices |
TWI517452B (en) * | 2011-03-02 | 2016-01-11 | 建準電機工業股份有限公司 | Packaging structure for plural bare chip |
KR101769356B1 (en) * | 2011-03-25 | 2017-08-18 | 삼성전자주식회사 | Method and device for forming phosphor layer in light emitting device |
EP2503606B1 (en) * | 2011-03-25 | 2020-02-26 | Samsung Electronics Co., Ltd. | Light Emitting Diode, Manufacturing Method Thereof, Light Emitting Diode Module, and Manufacturing Method Thereof |
KR101212654B1 (en) * | 2011-05-20 | 2012-12-14 | (주)라이타이저코리아 | Package for light emitting diode and method for manufacturing thereof |
DE102011078689A1 (en) * | 2011-07-05 | 2013-01-10 | Osram Ag | Method for producing a conversion element and conversion element |
US8742655B2 (en) * | 2011-07-22 | 2014-06-03 | Guardian Industries Corp. | LED lighting systems with phosphor subassemblies, and/or methods of making the same |
DE102011084316A1 (en) * | 2011-10-12 | 2013-04-18 | Osram Gmbh | Process for producing an optical element |
US9365766B2 (en) * | 2011-10-13 | 2016-06-14 | Intematix Corporation | Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion |
JP2012060192A (en) * | 2011-12-26 | 2012-03-22 | Toshiba Corp | Light emitting device, method for manufacturing the light emitting device, and light emitting device manufacturing apparatus |
JP6044073B2 (en) * | 2011-12-27 | 2016-12-14 | 日亜化学工業株式会社 | Wavelength conversion device and light emitting device using the same |
US9257617B2 (en) | 2012-02-10 | 2016-02-09 | Koninklijke Philips N.V. | Wavelength converted light emitting device |
KR102034575B1 (en) | 2012-03-19 | 2019-10-21 | 루미리즈 홀딩 비.브이. | Singulation of light emitting devices before and after application of phosphor |
CN103367611B (en) | 2012-03-28 | 2017-08-08 | 日亚化学工业株式会社 | Wavelength conversion inorganic formed body and its manufacture method and light-emitting device |
EP2831009B1 (en) | 2012-03-30 | 2017-05-03 | Corning Incorporated | Bismuth borate glass encapsulant for led phosphors |
JP2013219123A (en) * | 2012-04-06 | 2013-10-24 | Nippon Electric Glass Co Ltd | Wavelength conversion member and method for producing the same |
CN103367604B (en) * | 2012-04-06 | 2017-05-03 | 晶元光电股份有限公司 | Light emitting element |
TWI535070B (en) * | 2012-04-06 | 2016-05-21 | 晶元光電股份有限公司 | Light-emitting device |
RU2565324C2 (en) * | 2012-06-11 | 2015-10-20 | Александр Петрович Потемкин | Optical matching device |
KR101964418B1 (en) * | 2012-07-02 | 2019-04-01 | 엘지이노텍 주식회사 | Phosphor composition and lighting device the same |
US10017849B2 (en) | 2012-11-29 | 2018-07-10 | Corning Incorporated | High rate deposition systems and processes for forming hermetic barrier layers |
US9202996B2 (en) | 2012-11-30 | 2015-12-01 | Corning Incorporated | LED lighting devices with quantum dot glass containment plates |
JP6097084B2 (en) | 2013-01-24 | 2017-03-15 | スタンレー電気株式会社 | Semiconductor light emitting device |
US9553230B2 (en) * | 2013-01-31 | 2017-01-24 | Panasonic Intellectual Property Management Co., Ltd. | Method and apparatus for fabricating light emitting apparatus |
US8928219B2 (en) | 2013-03-05 | 2015-01-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Lighting device with spectral converter |
US8876312B2 (en) | 2013-03-05 | 2014-11-04 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Lighting device and apparatus with spectral converter within a casing |
JP6414391B2 (en) * | 2013-04-30 | 2018-10-31 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
CN111509112B (en) * | 2013-07-08 | 2024-04-02 | 亮锐控股有限公司 | Wavelength-converted semiconductor light emitting device |
US20160172554A1 (en) * | 2013-07-19 | 2016-06-16 | Koninklijke Philips N.V. | Pc led with optical element and without ssubstrate carrier |
EP3030626A2 (en) | 2013-08-05 | 2016-06-15 | Corning Incorporated | Luminescent coatings and devices |
JP6438648B2 (en) * | 2013-11-15 | 2018-12-19 | 日亜化学工業株式会社 | Semiconductor light emitting device and manufacturing method thereof |
WO2015104623A1 (en) * | 2014-01-07 | 2015-07-16 | Koninklijke Philips N.V. | Glueless light emitting device with phosphor converter |
EP2953176A1 (en) * | 2014-06-02 | 2015-12-09 | Swarovski Energy GmbH | Lighting device |
KR102203690B1 (en) * | 2014-08-21 | 2021-01-15 | 엘지이노텍 주식회사 | Phosphor plate and manufacturing method thereof |
US9373761B2 (en) * | 2014-09-23 | 2016-06-21 | Osram Sylvania Inc. | Patterned thin-film wavelength converter and method of making same |
JP6634447B2 (en) * | 2014-10-27 | 2020-01-22 | ルミレッズ ホールディング ベーフェー | Directional light emitting device and method of manufacturing the same |
JP6755090B2 (en) * | 2014-12-11 | 2020-09-16 | シチズン電子株式会社 | Light emitting device and manufacturing method of light emitting device |
US10347798B2 (en) | 2015-06-01 | 2019-07-09 | Intematix Corporation | Photoluminescence material coating of LED chips |
US9816687B2 (en) | 2015-09-24 | 2017-11-14 | Intel Corporation | MEMS LED zoom |
US9746689B2 (en) | 2015-09-24 | 2017-08-29 | Intel Corporation | Magnetic fluid optical image stabilization |
US11307434B2 (en) | 2016-09-01 | 2022-04-19 | 3D Live, Inc. | Stereoscopic display apparatus employing light emitting diodes with polarizing film/lens materials |
DE102017101729A1 (en) * | 2017-01-30 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Radiation-emitting device |
CN107342353B (en) * | 2017-06-06 | 2019-07-05 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | A kind of focusing ultraviolet LED encapsulating structure and preparation method thereof |
JP7022284B2 (en) * | 2019-06-17 | 2022-02-18 | 日亜化学工業株式会社 | Manufacturing method of light emitting device |
US11920068B2 (en) | 2020-07-13 | 2024-03-05 | Nichia Corporation | Method of manufacturing wavelength conversion member and wavelength conversion member |
KR20220045832A (en) | 2020-10-06 | 2022-04-13 | 삼성전자주식회사 | Led package and electronic device including the same |
Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4825084A (en) * | 1986-08-19 | 1989-04-25 | Peter F. Braunlich | Laser readable thermoluminescent radiation dosimeters and methods for producing thereof |
US5376580A (en) | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6084250A (en) * | 1997-03-03 | 2000-07-04 | U.S. Philips Corporation | White light emitting diode |
US6155699A (en) * | 1999-03-15 | 2000-12-05 | Agilent Technologies, Inc. | Efficient phosphor-conversion led structure |
US6194743B1 (en) | 1997-12-15 | 2001-02-27 | Agilent Technologies, Inc. | Nitride semiconductor light emitting device having a silver p-contact |
US6255670B1 (en) * | 1998-02-06 | 2001-07-03 | General Electric Company | Phosphors for light generation from light emitting semiconductors |
US6294800B1 (en) * | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
US20020030194A1 (en) * | 2000-09-12 | 2002-03-14 | Camras Michael D. | Light emitting diodes with improved light extraction efficiency |
US20020084745A1 (en) * | 2000-12-29 | 2002-07-04 | Airma Optoelectronics Corporation | Light emitting diode with light conversion by dielectric phosphor powder |
US6417019B1 (en) * | 2001-04-04 | 2002-07-09 | Lumileds Lighting, U.S., Llc | Phosphor converted light emitting diode |
US20020187571A1 (en) * | 2001-06-11 | 2002-12-12 | Collins William David | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor structure |
US20030003613A1 (en) * | 2001-06-27 | 2003-01-02 | Min-Hsun Hsieh | Light emitting diode having a transparent substrate and a method for manufacturing the same |
US6576930B2 (en) | 1996-06-26 | 2003-06-10 | Osram Opto Semiconductors Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
US20030108820A1 (en) * | 2000-01-17 | 2003-06-12 | Guy Baret | Use of glass capable of recrystallization as mineral binder of an electrode paste for a plasma panel |
US6630691B1 (en) | 1999-09-27 | 2003-10-07 | Lumileds Lighting U.S., Llc | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
US6642618B2 (en) | 2000-12-21 | 2003-11-04 | Lumileds Lighting U.S., Llc | Light-emitting device and production thereof |
US6696703B2 (en) | 1999-09-27 | 2004-02-24 | Lumileds Lighting U.S., Llc | Thin film phosphor-converted light emitting diode device |
US20040145895A1 (en) * | 2003-01-27 | 2004-07-29 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar long pass reflector and method of making |
US20040188639A1 (en) * | 2003-03-25 | 2004-09-30 | Masatsugu Masuda | Electronic equipment, backlight structure and keypad for electronic equipment |
US6800857B2 (en) * | 2000-08-10 | 2004-10-05 | Canon Kabushiki Kaisha | Large-area fiber plate, radiation image pickup apparatus utilizing the same and producing method therefor |
US6809340B2 (en) * | 2001-09-28 | 2004-10-26 | Toyoda Gosei Co., Ltd. | Light emitting element |
US20050023545A1 (en) * | 2003-07-31 | 2005-02-03 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
US20050062140A1 (en) * | 2003-09-18 | 2005-03-24 | Cree, Inc. | Molded chip fabrication method and apparatus |
US6940092B2 (en) * | 2001-10-15 | 2005-09-06 | Fujitsu Limited | Electrically conducting organic compound and electronic device |
US20050253158A1 (en) * | 2002-09-30 | 2005-11-17 | Takemasa Yasukawa | White light emitting device |
US20050266771A1 (en) * | 2001-12-28 | 2005-12-01 | Applied Materials, Inc., A Delaware Corporation | Polishing pad with window |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2857541A (en) * | 1954-03-29 | 1958-10-21 | Westinghouse Electric Corp | Thin sheet of phosphor embedded glass and method of preparing |
US3104339A (en) * | 1960-08-08 | 1963-09-17 | Sylvania Electric Prod | Electroluminescent device |
JP3424061B2 (en) | 1997-01-31 | 2003-07-07 | スタンレー電気株式会社 | Light emitting diode manufacturing method |
JP2947344B2 (en) * | 1997-08-19 | 1999-09-13 | サンケン電気株式会社 | Light emitting diode device |
JP3215665B2 (en) | 1998-06-17 | 2001-10-09 | 株式会社コトブキ | Clamping device |
JP4109756B2 (en) * | 1998-07-07 | 2008-07-02 | スタンレー電気株式会社 | Light emitting diode |
US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
JP2001177145A (en) * | 1999-12-21 | 2001-06-29 | Toshiba Electronic Engineering Corp | Semiconductor light emitting device and method of manufacturing the same |
JP2002041144A (en) | 2000-07-28 | 2002-02-08 | Matsushita Electric Ind Co Ltd | Mobile working robot |
JP2002076434A (en) * | 2000-08-28 | 2002-03-15 | Toyoda Gosei Co Ltd | Light emitting device |
JP2002118292A (en) * | 2000-10-11 | 2002-04-19 | Sanken Electric Co Ltd | Semiconductor light-emitting device |
JP2002141559A (en) * | 2000-10-31 | 2002-05-17 | Sanken Electric Co Ltd | Light emitting semiconductor chip assembly and light emitting semiconductor lead frame |
JP2002241144A (en) * | 2001-02-14 | 2002-08-28 | Konica Corp | Low melting point and high refractive index tellurite glass and optical element |
JP2002246651A (en) | 2001-02-20 | 2002-08-30 | Hitachi Cable Ltd | Light-emitting diode and its manufacturing method |
DE10137641A1 (en) * | 2001-08-03 | 2003-02-20 | Osram Opto Semiconductors Gmbh | Hybrid LED |
JP4447806B2 (en) * | 2001-09-26 | 2010-04-07 | スタンレー電気株式会社 | Light emitting device |
JP4158012B2 (en) * | 2002-03-06 | 2008-10-01 | 日本電気硝子株式会社 | Luminescent color conversion member |
JP2003332622A (en) | 2002-05-13 | 2003-11-21 | Nikko Materials Co Ltd | Light emitting diode and its manufacturing method |
US6870311B2 (en) * | 2002-06-07 | 2005-03-22 | Lumileds Lighting U.S., Llc | Light-emitting devices utilizing nanoparticles |
JP4201167B2 (en) | 2002-09-26 | 2008-12-24 | シチズン電子株式会社 | Manufacturing method of white light emitting device |
EP1668960A2 (en) | 2003-09-08 | 2006-06-14 | Nanocrystal Lighting Corporation | Light efficient packaging configurations for led lamps using high refractive index encapsulants |
US8040039B2 (en) * | 2004-03-18 | 2011-10-18 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Device and method for emitting composite output light using multiple wavelength-conversion mechanisms |
-
2004
- 2004-06-09 US US10/863,980 patent/US7553683B2/en active Active
-
2005
- 2005-05-31 EP EP05104674A patent/EP1605526B1/en active Active
- 2005-05-31 AT AT05104674T patent/ATE526688T1/en not_active IP Right Cessation
- 2005-06-06 TW TW094118583A patent/TWI443853B/en active
- 2005-06-09 JP JP2005198053A patent/JP5155518B2/en active Active
-
2009
- 2009-03-13 US US12/403,926 patent/US8748921B2/en active Active
-
2011
- 2011-12-28 JP JP2011287491A patent/JP5608155B2/en active Active
Patent Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4825084A (en) * | 1986-08-19 | 1989-04-25 | Peter F. Braunlich | Laser readable thermoluminescent radiation dosimeters and methods for producing thereof |
US5376580A (en) | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
US5502316A (en) | 1993-03-19 | 1996-03-26 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
US6812500B2 (en) * | 1996-06-26 | 2004-11-02 | Osram Opto Semiconductors Gmbh & Co. Ohg. | Light-radiating semiconductor component with a luminescence conversion element |
US6576930B2 (en) | 1996-06-26 | 2003-06-10 | Osram Opto Semiconductors Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
US6084250A (en) * | 1997-03-03 | 2000-07-04 | U.S. Philips Corporation | White light emitting diode |
US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
US6194743B1 (en) | 1997-12-15 | 2001-02-27 | Agilent Technologies, Inc. | Nitride semiconductor light emitting device having a silver p-contact |
US6255670B1 (en) * | 1998-02-06 | 2001-07-03 | General Electric Company | Phosphors for light generation from light emitting semiconductors |
US6294800B1 (en) * | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6155699A (en) * | 1999-03-15 | 2000-12-05 | Agilent Technologies, Inc. | Efficient phosphor-conversion led structure |
US6630691B1 (en) | 1999-09-27 | 2003-10-07 | Lumileds Lighting U.S., Llc | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
US6696703B2 (en) | 1999-09-27 | 2004-02-24 | Lumileds Lighting U.S., Llc | Thin film phosphor-converted light emitting diode device |
US20030108820A1 (en) * | 2000-01-17 | 2003-06-12 | Guy Baret | Use of glass capable of recrystallization as mineral binder of an electrode paste for a plasma panel |
US6800857B2 (en) * | 2000-08-10 | 2004-10-05 | Canon Kabushiki Kaisha | Large-area fiber plate, radiation image pickup apparatus utilizing the same and producing method therefor |
US20020030194A1 (en) * | 2000-09-12 | 2002-03-14 | Camras Michael D. | Light emitting diodes with improved light extraction efficiency |
US6642618B2 (en) | 2000-12-21 | 2003-11-04 | Lumileds Lighting U.S., Llc | Light-emitting device and production thereof |
US20020084745A1 (en) * | 2000-12-29 | 2002-07-04 | Airma Optoelectronics Corporation | Light emitting diode with light conversion by dielectric phosphor powder |
US6417019B1 (en) * | 2001-04-04 | 2002-07-09 | Lumileds Lighting, U.S., Llc | Phosphor converted light emitting diode |
US20020187571A1 (en) * | 2001-06-11 | 2002-12-12 | Collins William David | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor structure |
US20030003613A1 (en) * | 2001-06-27 | 2003-01-02 | Min-Hsun Hsieh | Light emitting diode having a transparent substrate and a method for manufacturing the same |
US6809340B2 (en) * | 2001-09-28 | 2004-10-26 | Toyoda Gosei Co., Ltd. | Light emitting element |
US6940092B2 (en) * | 2001-10-15 | 2005-09-06 | Fujitsu Limited | Electrically conducting organic compound and electronic device |
US20050266771A1 (en) * | 2001-12-28 | 2005-12-01 | Applied Materials, Inc., A Delaware Corporation | Polishing pad with window |
US20050253158A1 (en) * | 2002-09-30 | 2005-11-17 | Takemasa Yasukawa | White light emitting device |
US20040145895A1 (en) * | 2003-01-27 | 2004-07-29 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar long pass reflector and method of making |
US20040188639A1 (en) * | 2003-03-25 | 2004-09-30 | Masatsugu Masuda | Electronic equipment, backlight structure and keypad for electronic equipment |
US20050023545A1 (en) * | 2003-07-31 | 2005-02-03 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
US20050062140A1 (en) * | 2003-09-18 | 2005-03-24 | Cree, Inc. | Molded chip fabrication method and apparatus |
Non-Patent Citations (1)
Title |
---|
Regina Mueller-Mach et al., "High Power Phosphor-Converted Light Emitting Diodes Based on III-Nitrides", IEEE Journal on Selected Topics in Quantum Electronics, vol. 8, No. 2, Mar./Apr. 2002, pp. 339-345. |
Cited By (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090072263A1 (en) * | 2004-11-12 | 2009-03-19 | Philips Lumileds Lighting Company, Llc | Color Control By Alteration of Wavelength Converting Element |
US8486725B2 (en) | 2004-11-12 | 2013-07-16 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelenght converting element |
US8202742B2 (en) | 2004-11-12 | 2012-06-19 | Koninklijke Philips Electronics N.V. | Color control by alteration of wavelength converting element |
US20110132521A1 (en) * | 2004-11-12 | 2011-06-09 | Koninklijke Philips Electronics N.V. | Color control by alteration of wavelength converting element |
US7902566B2 (en) | 2004-11-12 | 2011-03-08 | Koninklijke Philips Electronics N.V. | Color control by alteration of wavelength converting element |
US7923740B2 (en) * | 2005-03-01 | 2011-04-12 | Kabushiki Kaisha Toshiba | Light emission device |
US20090057698A1 (en) * | 2005-03-01 | 2009-03-05 | Kabushiki Kaisha Toshiba | Light emission device |
US8642977B2 (en) | 2006-03-07 | 2014-02-04 | Qd Vision, Inc. | Article including semiconductor nanocrystals |
US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
US8849087B2 (en) | 2006-03-07 | 2014-09-30 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US10393940B2 (en) | 2006-03-07 | 2019-08-27 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
US8718437B2 (en) | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US10454003B2 (en) | 2006-09-04 | 2019-10-22 | Lg Innotek Co., Ltd. | Light emitting device and manufacturing method thereof |
US9735324B2 (en) | 2006-09-04 | 2017-08-15 | Lg Innotek Co., Ltd. | Light emitting device and manufacturing method thereof |
US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
US8876272B2 (en) | 2007-06-25 | 2014-11-04 | Qd Vision, Inc. | Compositions and methods including depositing nanomaterial |
US8405063B2 (en) | 2007-07-23 | 2013-03-26 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
US10096744B2 (en) | 2007-07-23 | 2018-10-09 | Samsung Electronics Co., Ltd. | Quantum dot light enhancement substrate and lighting device including same |
US9680054B2 (en) | 2007-07-23 | 2017-06-13 | Samsung Electronics Co., Ltd. | Quantum dot light enhancement substrate and lighting device including same |
US9276168B2 (en) | 2007-07-23 | 2016-03-01 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
US8759850B2 (en) | 2007-07-23 | 2014-06-24 | Qd Vision, Inc. | Quantum dot light enhancement substrate |
US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
US9534313B2 (en) | 2008-03-04 | 2017-01-03 | Qd Vision, Inc. | Particles including nanoparticles dispersed in solid wax, method and uses thereof |
US10627561B2 (en) | 2008-05-06 | 2020-04-21 | Samsung Electronics Co., Ltd. | Lighting systems and devices including same |
US9946004B2 (en) | 2008-05-06 | 2018-04-17 | Samsung Electronics Co., Ltd. | Lighting systems and devices including same |
US9140844B2 (en) | 2008-05-06 | 2015-09-22 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
US9167659B2 (en) | 2008-05-06 | 2015-10-20 | Qd Vision, Inc. | Solid state lighting devices including quantum confined semiconductor nanoparticles, an optical component for a solid state lighting device, and methods |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
US10145539B2 (en) | 2008-05-06 | 2018-12-04 | Samsung Electronics Co., Ltd. | Solid state lighting devices including quantum confined semiconductor nanoparticles, an optical component for a solid state lighting device, and methods |
US10359555B2 (en) | 2008-05-06 | 2019-07-23 | Samsung Electronics Co., Ltd. | Lighting systems and devices including same |
US20100006877A1 (en) * | 2008-07-09 | 2010-01-14 | Himax Display, Inc. | Light-emitting diode package |
US7800125B2 (en) * | 2008-07-09 | 2010-09-21 | Himax Display, Inc. | Light-emitting diode package |
US10147843B2 (en) * | 2008-07-24 | 2018-12-04 | Lumileds Llc | Semiconductor light emitting device including a window layer and a light-directing structure |
US20100019260A1 (en) * | 2008-07-24 | 2010-01-28 | Koninklijke Philips Electronics N.V. | Semiconductor light emitting device including a window layer and a light-directing structure |
US20100264371A1 (en) * | 2009-03-19 | 2010-10-21 | Nick Robert J | Composition including quantum dots, uses of the foregoing, and methods |
US9365701B2 (en) | 2009-09-09 | 2016-06-14 | Qd Vision, Inc. | Particles including nanoparticles, uses thereof, and methods |
US9303153B2 (en) | 2009-09-09 | 2016-04-05 | Qd Vision, Inc. | Formulations including nanoparticles |
US9951273B2 (en) | 2009-09-09 | 2018-04-24 | Samsung Electronics Co., Ltd. | Formulations including nanoparticles |
US9605833B2 (en) | 2009-10-17 | 2017-03-28 | Samsung Electronics Co., Ltd. | Optical component, products including same, and methods for making same |
US9134459B2 (en) | 2009-10-17 | 2015-09-15 | Qd Vision, Inc. | Optical component, products including same, and methods for making same |
US8890140B2 (en) | 2010-02-26 | 2014-11-18 | Osram Opto Semiconductor Gmbh | Radiation-emitting component with a semiconductor chip and a conversion element and method for the production thereof |
US20130210181A1 (en) * | 2010-08-20 | 2013-08-15 | Osram Opto Semiconductors Gmbh | Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layer |
US8748201B2 (en) * | 2010-08-20 | 2014-06-10 | Osram Opto Semiconductors Gmbh | Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layer |
US20120138981A1 (en) * | 2010-12-02 | 2012-06-07 | Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense | Light-Emitting Diode Apparatus and Method for Making the Same |
US10056531B2 (en) | 2011-08-26 | 2018-08-21 | Lumileds Llc | Method of processing a semiconductor structure |
WO2013030718A1 (en) | 2011-08-26 | 2013-03-07 | Koninklijke Philips Electronics N.V. | Method of processing a semiconductor structure |
US9685628B2 (en) | 2013-08-16 | 2017-06-20 | Samsung Electronics Co., Ltd. | Methods for making optical components, optical components, and products including same |
US20180166612A1 (en) * | 2015-03-23 | 2018-06-14 | Lg Innotek Co., Ltd. | Light emitting device package and lighting apparatus including the same |
US10488018B2 (en) | 2015-08-17 | 2019-11-26 | Infinite Arthroscopy, Inc. Limited | Light source |
US11137117B2 (en) | 2015-08-17 | 2021-10-05 | Lazurite Holdings Llc | Light converter |
US11330963B2 (en) | 2015-11-16 | 2022-05-17 | Lazurite Holdings Llc | Wireless medical imaging system |
US10262978B2 (en) * | 2016-06-29 | 2019-04-16 | eLux, Inc. | Method for fabricating an emissive display using laminated printed color conversion phosphor sheets |
US10249599B2 (en) * | 2016-06-29 | 2019-04-02 | eLux, Inc. | Laminated printed color conversion phosphor sheets |
US20180047710A1 (en) * | 2016-06-29 | 2018-02-15 | Sharp Kabushiki Kaisha | Method for Fabricating an Emissive Display using Laminated Printed Color Conversion Phosphor Sheets |
US20180005998A1 (en) * | 2016-06-29 | 2018-01-04 | Sharp Kabushiki Kaisha | Laminated printed color conversion phosphor sheets |
US10610089B2 (en) | 2017-02-15 | 2020-04-07 | Infinite Arthroscopy, Inc. Limited | Wireless imaging system comprising a head unit and a light cable that comprises an integrated light source |
US10932658B2 (en) | 2017-02-15 | 2021-03-02 | Infinite Arthroscopy, Inc. Limited | Wireless imaging system comprising a head unit and a light cable that comprises an integrated light source |
US11889987B2 (en) | 2017-02-15 | 2024-02-06 | Lazurite Holdings Llc | Wireless imaging system |
US11498883B2 (en) | 2019-11-29 | 2022-11-15 | Nichia Corporation | Method for producing ceramic composite |
USD938584S1 (en) | 2020-03-30 | 2021-12-14 | Lazurite Holdings Llc | Hand piece |
USD972176S1 (en) | 2020-08-06 | 2022-12-06 | Lazurite Holdings Llc | Light source |
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US20050274967A1 (en) | 2005-12-15 |
JP2012074739A (en) | 2012-04-12 |
JP5608155B2 (en) | 2014-10-15 |
TWI443853B (en) | 2014-07-01 |
US20090173960A1 (en) | 2009-07-09 |
JP2006037097A (en) | 2006-02-09 |
EP1605526A3 (en) | 2009-12-30 |
US8748921B2 (en) | 2014-06-10 |
ATE526688T1 (en) | 2011-10-15 |
EP1605526A2 (en) | 2005-12-14 |
TW200614544A (en) | 2006-05-01 |
JP5155518B2 (en) | 2013-03-06 |
EP1605526B1 (en) | 2011-09-28 |
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