US7301755B2 - Architecture for power modules such as power inverters - Google Patents
Architecture for power modules such as power inverters Download PDFInfo
- Publication number
- US7301755B2 US7301755B2 US11/010,561 US1056104A US7301755B2 US 7301755 B2 US7301755 B2 US 7301755B2 US 1056104 A US1056104 A US 1056104A US 7301755 B2 US7301755 B2 US 7301755B2
- Authority
- US
- United States
- Prior art keywords
- housing
- conductive
- base plate
- terminal
- conductive base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/010,561 US7301755B2 (en) | 2003-12-17 | 2004-12-13 | Architecture for power modules such as power inverters |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53044303P | 2003-12-17 | 2003-12-17 | |
US11/010,561 US7301755B2 (en) | 2003-12-17 | 2004-12-13 | Architecture for power modules such as power inverters |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050162875A1 US20050162875A1 (en) | 2005-07-28 |
US7301755B2 true US7301755B2 (en) | 2007-11-27 |
Family
ID=34797962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/010,561 Expired - Fee Related US7301755B2 (en) | 2003-12-17 | 2004-12-13 | Architecture for power modules such as power inverters |
Country Status (1)
Country | Link |
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US (1) | US7301755B2 (en) |
Cited By (37)
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---|---|---|---|---|
US20060220236A1 (en) * | 2005-03-17 | 2006-10-05 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device with power module housed in casing |
US20070205038A1 (en) * | 2006-03-06 | 2007-09-06 | Mitsubishi Electric Corp. | Electric power steering apparatus |
US20070253164A1 (en) * | 2006-04-27 | 2007-11-01 | Takeshi Matsuo | Power inverter |
US20070291160A1 (en) * | 2000-06-05 | 2007-12-20 | Akihisa Yamazaki | Camera, aperture controlling method and apparatus, lens controlling method and apparatus, and edging amount controlling method and apparatus |
US20080023758A1 (en) * | 2004-11-30 | 2008-01-31 | Masaki Shiraishi | Semiconductor device |
US20080063111A1 (en) * | 2006-09-07 | 2008-03-13 | Kabushiki Kaisha Toshiba | Signal coupling apparatus and transmitter including signal coupling apparatus |
US20080198548A1 (en) * | 2007-02-19 | 2008-08-21 | Hitachi, Ltd. | Power Converter |
US20080225487A1 (en) * | 2007-03-15 | 2008-09-18 | Hitachi, Ltd. | Power Inverter |
US20080291609A1 (en) * | 2007-05-23 | 2008-11-27 | Sma Technologie Ag | Inverter |
US20090002956A1 (en) * | 2007-06-22 | 2009-01-01 | Hitachi, Ltd. | Power Converter |
US20090161395A1 (en) * | 2007-12-20 | 2009-06-25 | Guichao Hua | High output current split package a/c adapter |
US20090284923A1 (en) * | 2008-05-13 | 2009-11-19 | Maria Magdalena Rytka | Igbt packaging and cooling using pcm and liquid |
US7824191B1 (en) * | 2009-08-17 | 2010-11-02 | International Development LLC | Connector with conductor piercing prongs for a solar panel |
US20110199800A1 (en) * | 2008-09-30 | 2011-08-18 | Hitachi Automotive Systems, Ltd. | Power Conversion Device |
US20110222244A1 (en) * | 2010-03-15 | 2011-09-15 | Omron Corporation | Power conditioner device and module substrate structure using the same |
US20110292617A1 (en) * | 2010-05-25 | 2011-12-01 | Lear Corporation | Power module with current sensing |
US20110304948A1 (en) * | 2010-06-10 | 2011-12-15 | Kia Motors Corporation | Capacitor for inverter of vehicle |
US20120019985A1 (en) * | 2010-07-20 | 2012-01-26 | Lien Chang Electronic Enterprise Co., Ltd. | Aluminum electrolyte capacitor |
US20130020987A1 (en) * | 2011-07-21 | 2013-01-24 | Yazaki Corporation | Battery pack controller |
US20130223009A1 (en) * | 2006-01-17 | 2013-08-29 | Hitachi, Ltd. | Power Converter |
US8648498B1 (en) * | 2012-11-19 | 2014-02-11 | Renewable Power Conversion, Inc | Photovoltaic power system with distributed photovoltaic string to polyphase AC power converters |
US20140120774A1 (en) * | 2012-11-01 | 2014-05-01 | Samsung Electronics Co., Ltd. | Substrate for power module having uniform parallel switching characteristic and power module including the same |
US20140160684A1 (en) * | 2012-12-06 | 2014-06-12 | Apple Inc. | Cooling for electronic components |
US20140176272A1 (en) * | 2012-12-12 | 2014-06-26 | Semikron Elektronik Gmbh & Co., Kg | Power Component Device |
US20140185194A1 (en) * | 2011-05-31 | 2014-07-03 | Eaton Corporation | Plug-in composite power distribution assembly and system including same |
US20140254104A1 (en) * | 2013-03-07 | 2014-09-11 | Delta Electronics, Inc. | Heat dissipating module |
US8878483B2 (en) | 2011-01-14 | 2014-11-04 | Lear Corporation | Electronics unit with current sensing |
US20140334105A1 (en) * | 2013-05-09 | 2014-11-13 | Ford Global Technologies, Llc | Integrated Electrical and Thermal Solution for Inverter DC-Link Capacitor Packaging |
US20150122305A1 (en) * | 2009-10-12 | 2015-05-07 | Marco A. Marroquin | Power inverter docking system for photovoltaic modules |
US9059145B2 (en) * | 2011-08-25 | 2015-06-16 | Toyota Jidosha Kabushiki Kaisha | Power module, method for manufacturing power module, and molding die |
US9223167B2 (en) | 2013-06-26 | 2015-12-29 | Apple Inc. | Liquid crystal switching barrier thermal control |
US9389029B2 (en) | 2013-09-30 | 2016-07-12 | Apple Inc. | Heat transfer structure |
US20170036563A1 (en) * | 2015-08-04 | 2017-02-09 | Ford Global Technolgoies, Llc | Busbars for a Power Module Assembly |
CN106605143A (en) * | 2015-03-20 | 2017-04-26 | 乌斯特技术股份公司 | Modular yarn tester |
US9674986B2 (en) | 2015-08-03 | 2017-06-06 | Apple Inc. | Parallel heat spreader |
US11432419B2 (en) * | 2010-06-21 | 2022-08-30 | Hitachi Astemo, Ltd. | Power semiconductor device and power conversion device |
US11476507B2 (en) * | 2020-03-16 | 2022-10-18 | GM Global Technology Operations LLC | Solid-state multi-switch device |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7292451B2 (en) * | 2003-12-17 | 2007-11-06 | Siemens Vdo Automotive Corporation | Architecture for power modules such as power inverters |
US7289343B2 (en) * | 2003-12-17 | 2007-10-30 | Siemens Vdo Automotive Corporation | Architecture for power modules such as power inverters |
JP4284625B2 (en) * | 2005-06-22 | 2009-06-24 | 株式会社デンソー | Three-phase inverter device |
JP4850564B2 (en) | 2006-04-06 | 2012-01-11 | 日立オートモティブシステムズ株式会社 | Power converter |
US8495890B2 (en) * | 2007-01-22 | 2013-07-30 | Johnson Controls Technology Company | Cooling member |
US8149579B2 (en) * | 2008-03-28 | 2012-04-03 | Johnson Controls Technology Company | Cooling member |
US7764041B2 (en) * | 2007-01-22 | 2010-07-27 | Johnson Controls Technology Company | System and method to extend synchronous operation of an active converter in a variable speed drive |
US8611091B2 (en) * | 2011-03-11 | 2013-12-17 | Asia Vital Components Co., Ltd. | Thermal module for solar inverter |
TWI441406B (en) * | 2011-06-21 | 2014-06-11 | Delta Electronics Inc | Modular direct-current power conversion system and direct-current power conversion module thereof |
JP5789576B2 (en) * | 2012-09-14 | 2015-10-07 | 日立オートモティブシステムズ株式会社 | Power converter |
JP2014090030A (en) * | 2012-10-29 | 2014-05-15 | Jtekt Corp | Control device and vehicle steering gear including the same |
US9295184B2 (en) * | 2012-12-14 | 2016-03-22 | GM Global Technology Operations LLC | Scalable and modular approach for power electronic building block design in automotive applications |
WO2015187500A1 (en) * | 2014-06-02 | 2015-12-10 | Enphase Energy, Inc. | Ungrounded inverter enclosure and cabling |
US9893646B2 (en) * | 2015-09-30 | 2018-02-13 | General Electric Company | System for a low profile, low inductance power switching module |
JP6694589B2 (en) * | 2016-06-02 | 2020-05-20 | 株式会社ジェイテクト | Power module |
WO2019146073A1 (en) * | 2018-01-26 | 2019-08-01 | 新電元工業株式会社 | Electronic module |
CN110366817B (en) * | 2018-01-26 | 2021-07-09 | 新电元工业株式会社 | Electronic module |
US11758697B2 (en) * | 2019-09-26 | 2023-09-12 | Ohio State Innovation Foundation | Low inductance power module with vertical power loop structure and insulated baseplates |
KR20220089348A (en) * | 2020-12-21 | 2022-06-28 | 현대자동차주식회사 | Apparatus of driving motor |
KR20230169643A (en) * | 2022-06-09 | 2023-12-18 | 현대자동차주식회사 | Motor driving apparatus |
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US20060007721A1 (en) | 2003-12-17 | 2006-01-12 | Pablo Rodriguez | Architecture for power modules such as power inverters |
US6987670B2 (en) * | 2003-05-16 | 2006-01-17 | Ballard Power Systems Corporation | Dual power module power system architecture |
US7034345B2 (en) * | 2003-03-27 | 2006-04-25 | The Boeing Company | High-power, integrated AC switch module with distributed array of hybrid devices |
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US7180763B2 (en) * | 2004-09-21 | 2007-02-20 | Ballard Power Systems Corporation | Power converter |
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Cited By (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070291160A1 (en) * | 2000-06-05 | 2007-12-20 | Akihisa Yamazaki | Camera, aperture controlling method and apparatus, lens controlling method and apparatus, and edging amount controlling method and apparatus |
US8064235B2 (en) | 2004-11-30 | 2011-11-22 | Renesas Electronics Corporation | Semiconductor device |
US20090207640A1 (en) * | 2004-11-30 | 2009-08-20 | Masaki Shiraishi | Semiconductor device |
US20080023758A1 (en) * | 2004-11-30 | 2008-01-31 | Masaki Shiraishi | Semiconductor device |
US7535741B2 (en) * | 2004-11-30 | 2009-05-19 | Renesas Technology Corp. | Semiconductor device |
US20110037450A1 (en) * | 2004-11-30 | 2011-02-17 | Masaki Shiraishi | Semiconductor device |
US8345458B2 (en) | 2004-11-30 | 2013-01-01 | Renesas Electronics Corporation | Semiconductor device |
US7852651B2 (en) | 2004-11-30 | 2010-12-14 | Renesas Electronics Corporation | Semiconductor device |
US20060220236A1 (en) * | 2005-03-17 | 2006-10-05 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device with power module housed in casing |
US7455553B2 (en) * | 2005-03-17 | 2008-11-25 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device with power module and an insulating member provided between a conductive casing and a non-insulating portion |
US9210834B2 (en) * | 2006-01-17 | 2015-12-08 | Hitachi, Ltd. | Power converter |
US20130223009A1 (en) * | 2006-01-17 | 2013-08-29 | Hitachi, Ltd. | Power Converter |
US7635046B2 (en) * | 2006-03-06 | 2009-12-22 | Mitsubishi Electric Corp. | Electric power steering apparatus |
US20070205038A1 (en) * | 2006-03-06 | 2007-09-06 | Mitsubishi Electric Corp. | Electric power steering apparatus |
US8072760B2 (en) | 2006-04-27 | 2011-12-06 | Hitachi, Ltd. | Power inverter |
US20070253164A1 (en) * | 2006-04-27 | 2007-11-01 | Takeshi Matsuo | Power inverter |
US20110032676A1 (en) * | 2006-04-27 | 2011-02-10 | Takeshi Matsuo | Power inverter |
US7710721B2 (en) * | 2006-04-27 | 2010-05-04 | Hitachi, Ltd. | Power inverter |
US7450399B2 (en) * | 2006-09-07 | 2008-11-11 | Kabushiki Kaisha Toshiba | Signal coupling apparatus and transmitter including signal coupling apparatus |
US20080063111A1 (en) * | 2006-09-07 | 2008-03-13 | Kabushiki Kaisha Toshiba | Signal coupling apparatus and transmitter including signal coupling apparatus |
US7692923B2 (en) * | 2007-02-19 | 2010-04-06 | Hitachi, Ltd. | Power converter |
US20080198548A1 (en) * | 2007-02-19 | 2008-08-21 | Hitachi, Ltd. | Power Converter |
US20080225487A1 (en) * | 2007-03-15 | 2008-09-18 | Hitachi, Ltd. | Power Inverter |
US7719838B2 (en) * | 2007-03-15 | 2010-05-18 | Hitachi, Ltd. | Power inverter |
US20080291609A1 (en) * | 2007-05-23 | 2008-11-27 | Sma Technologie Ag | Inverter |
US7672115B2 (en) * | 2007-05-23 | 2010-03-02 | SMA Technology AG | Inverter |
US20090002956A1 (en) * | 2007-06-22 | 2009-01-01 | Hitachi, Ltd. | Power Converter |
US8054633B2 (en) * | 2007-06-22 | 2011-11-08 | Hitachi, Ltd. | Power converter |
US20090161395A1 (en) * | 2007-12-20 | 2009-06-25 | Guichao Hua | High output current split package a/c adapter |
US8867250B2 (en) * | 2007-12-20 | 2014-10-21 | Inventronics (Hangzhou), Inc. | High output current split package A/C adapter |
US7646606B2 (en) * | 2008-05-13 | 2010-01-12 | Honeywell International Inc. | IGBT packaging and cooling using PCM and liquid |
US20090284923A1 (en) * | 2008-05-13 | 2009-11-19 | Maria Magdalena Rytka | Igbt packaging and cooling using pcm and liquid |
US8228700B2 (en) * | 2008-09-30 | 2012-07-24 | Hitachi Automotive Systems, Ltd. | Power conversion device |
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