US6706621B2 - Wafer integrated rigid support ring - Google Patents
Wafer integrated rigid support ring Download PDFInfo
- Publication number
- US6706621B2 US6706621B2 US10/302,412 US30241202A US6706621B2 US 6706621 B2 US6706621 B2 US 6706621B2 US 30241202 A US30241202 A US 30241202A US 6706621 B2 US6706621 B2 US 6706621B2
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- United States
- Prior art keywords
- wafer
- solder bumps
- chips
- mask
- contacts
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Drying Of Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (12)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/302,412 US6706621B2 (en) | 1999-10-21 | 2002-11-22 | Wafer integrated rigid support ring |
US10/625,635 US7138326B2 (en) | 1999-10-21 | 2003-07-23 | Wafer integrated rigid support ring |
US11/581,771 US20070045830A1 (en) | 1999-10-21 | 2006-10-16 | Wafer integrated rigid support ring |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42269799A | 1999-10-21 | 1999-10-21 | |
US10/302,412 US6706621B2 (en) | 1999-10-21 | 2002-11-22 | Wafer integrated rigid support ring |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US42269799A Division | 1999-10-21 | 1999-10-21 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/625,635 Division US7138326B2 (en) | 1999-10-21 | 2003-07-23 | Wafer integrated rigid support ring |
Publications (2)
Publication Number | Publication Date |
---|---|
US20030071329A1 US20030071329A1 (en) | 2003-04-17 |
US6706621B2 true US6706621B2 (en) | 2004-03-16 |
Family
ID=23675971
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/302,412 Expired - Lifetime US6706621B2 (en) | 1999-10-21 | 2002-11-22 | Wafer integrated rigid support ring |
US10/625,635 Expired - Lifetime US7138326B2 (en) | 1999-10-21 | 2003-07-23 | Wafer integrated rigid support ring |
US11/581,771 Abandoned US20070045830A1 (en) | 1999-10-21 | 2006-10-16 | Wafer integrated rigid support ring |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/625,635 Expired - Lifetime US7138326B2 (en) | 1999-10-21 | 2003-07-23 | Wafer integrated rigid support ring |
US11/581,771 Abandoned US20070045830A1 (en) | 1999-10-21 | 2006-10-16 | Wafer integrated rigid support ring |
Country Status (8)
Country | Link |
---|---|
US (3) | US6706621B2 (en) |
JP (1) | JP3422767B2 (en) |
KR (1) | KR100370294B1 (en) |
CN (1) | CN1199263C (en) |
CA (1) | CA2313551A1 (en) |
MY (1) | MY126982A (en) |
SG (1) | SG96575A1 (en) |
TW (1) | TW505949B (en) |
Cited By (10)
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US20040267373A1 (en) * | 2003-06-25 | 2004-12-30 | Dwyer Kimberly Ann | Assembly tool for modular implants and associated method |
US20050033444A1 (en) * | 2003-06-25 | 2005-02-10 | Jones Michael C. | Assembly tool for modular implants and associated method |
US20050076598A1 (en) * | 2003-10-11 | 2005-04-14 | Matthias Lewark | Panel, in particular floor panel |
US8518050B2 (en) | 2007-10-31 | 2013-08-27 | DePuy Synthes Products, LLC | Modular taper assembly device |
US8998919B2 (en) | 2003-06-25 | 2015-04-07 | DePuy Synthes Products, LLC | Assembly tool for modular implants, kit and associated method |
US9070754B2 (en) * | 2012-02-14 | 2015-06-30 | Renesas Electronics Corporation | Method of manufacturing a semiconductor device and wafer |
US9095452B2 (en) | 2010-09-01 | 2015-08-04 | DePuy Synthes Products, Inc. | Disassembly tool |
US9101495B2 (en) | 2010-06-15 | 2015-08-11 | DePuy Synthes Products, Inc. | Spiral assembly tool |
US9504578B2 (en) | 2011-04-06 | 2016-11-29 | Depuy Synthes Products, Inc | Revision hip prosthesis having an implantable distal stem component |
US9717545B2 (en) | 2007-10-30 | 2017-08-01 | DePuy Synthes Products, Inc. | Taper disengagement tool |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080265445A1 (en) * | 2007-04-30 | 2008-10-30 | International Business Machines Corporation | Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same |
TWI495915B (en) * | 2009-10-21 | 2015-08-11 | Hitachi Chemical Co Ltd | The optical waveguide substrate having a positioning structure, a method of manufacturing the same, and a method of manufacturing the |
KR101234953B1 (en) * | 2011-02-28 | 2013-02-19 | 하이디스 테크놀로지 주식회사 | Shadow mask for making thin film |
CN111584368B (en) * | 2020-04-23 | 2022-12-30 | 中国科学院上海技术物理研究所 | Method for forming concave points at top end of high-density micro indium column array for infrared focal plane device |
US20230282502A1 (en) * | 2022-03-03 | 2023-09-07 | Micron Technology, Inc. | Wafer carrier with reticle template for marking reticle fields on a semiconductor wafer |
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- 2000-07-06 CA CA002313551A patent/CA2313551A1/en not_active Abandoned
- 2000-09-16 CN CNB001338528A patent/CN1199263C/en not_active Expired - Lifetime
- 2000-10-09 SG SG200005736A patent/SG96575A1/en unknown
- 2000-10-11 MY MYPI20004756A patent/MY126982A/en unknown
- 2000-10-13 KR KR10-2000-0060304A patent/KR100370294B1/en not_active IP Right Cessation
- 2000-10-19 JP JP2000319947A patent/JP3422767B2/en not_active Expired - Fee Related
- 2000-10-19 TW TW089121973A patent/TW505949B/en not_active IP Right Cessation
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2002
- 2002-11-22 US US10/302,412 patent/US6706621B2/en not_active Expired - Lifetime
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2003
- 2003-07-23 US US10/625,635 patent/US7138326B2/en not_active Expired - Lifetime
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Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9381097B2 (en) | 2003-06-25 | 2016-07-05 | DePuy Synthes Products, Inc. | Assembly tool for modular implants, kit and associated method |
US8998919B2 (en) | 2003-06-25 | 2015-04-07 | DePuy Synthes Products, LLC | Assembly tool for modular implants, kit and associated method |
US20040267373A1 (en) * | 2003-06-25 | 2004-12-30 | Dwyer Kimberly Ann | Assembly tool for modular implants and associated method |
US20080091212A1 (en) * | 2003-06-25 | 2008-04-17 | Depuy Products, Inc. | Assembly tool for modular implants and associated method |
US8419799B2 (en) | 2003-06-25 | 2013-04-16 | Depuy Products, Inc. | Assembly tool for modular implants and associated method |
US20050033444A1 (en) * | 2003-06-25 | 2005-02-10 | Jones Michael C. | Assembly tool for modular implants and associated method |
US8685036B2 (en) | 2003-06-25 | 2014-04-01 | Michael C. Jones | Assembly tool for modular implants and associated method |
US20050076598A1 (en) * | 2003-10-11 | 2005-04-14 | Matthias Lewark | Panel, in particular floor panel |
US9717545B2 (en) | 2007-10-30 | 2017-08-01 | DePuy Synthes Products, Inc. | Taper disengagement tool |
US9119601B2 (en) | 2007-10-31 | 2015-09-01 | DePuy Synthes Products, Inc. | Modular taper assembly device |
US8518050B2 (en) | 2007-10-31 | 2013-08-27 | DePuy Synthes Products, LLC | Modular taper assembly device |
US9101495B2 (en) | 2010-06-15 | 2015-08-11 | DePuy Synthes Products, Inc. | Spiral assembly tool |
US10166118B2 (en) | 2010-06-15 | 2019-01-01 | DePuy Synthes Products, Inc. | Spiral assembly tool |
US9867720B2 (en) | 2010-09-01 | 2018-01-16 | DePuy Synthes Products, Inc. | Disassembly tool |
US10292837B2 (en) | 2010-09-01 | 2019-05-21 | Depuy Synthes Products Inc. | Disassembly tool |
US9095452B2 (en) | 2010-09-01 | 2015-08-04 | DePuy Synthes Products, Inc. | Disassembly tool |
US10925739B2 (en) | 2011-04-06 | 2021-02-23 | DePuy Synthes Products, Inc. | Version-replicating instrument and orthopaedic surgical procedure for using the same to implant a revision hip prosthesis |
US9737405B2 (en) | 2011-04-06 | 2017-08-22 | DePuy Synthes Products, Inc. | Orthopaedic surgical procedure for implanting a revision hip prosthesis |
US9949833B2 (en) | 2011-04-06 | 2018-04-24 | DePuy Synthes Products, Inc. | Finishing RASP and orthopaedic surgical procedure for using the same to implant a revision hip prosthesis |
US10064725B2 (en) | 2011-04-06 | 2018-09-04 | DePuy Synthes Products, Inc. | Distal reamer for use during an orthopaedic surgical procedure to implant a revision hip prosthesis |
US10226345B2 (en) | 2011-04-06 | 2019-03-12 | DePuy Synthes Products, Inc. | Version-replicating instrument and orthopaedic surgical procedure for using the same to implant a revision hip prosthesis |
US9597188B2 (en) | 2011-04-06 | 2017-03-21 | DePuy Synthes Products, Inc. | Version-replicating instrument and orthopaedic surgical procedure for using the same to implant a revision hip prosthesis |
US10603173B2 (en) | 2011-04-06 | 2020-03-31 | DePuy Synthes Products, Inc. | Orthopaedic surgical procedure for implanting a revision hip prosthesis |
US10772730B2 (en) | 2011-04-06 | 2020-09-15 | DePuy Synthes Products, Inc. | Finishing rasp and orthopaedic surgical procedure for using the same to implant a revision hip prosthesis |
US10888427B2 (en) | 2011-04-06 | 2021-01-12 | DePuy Synthes Products, Inc. | Distal reamer for use during an orthopaedic surgical procedure to implant a revision hip prosthesis |
US9504578B2 (en) | 2011-04-06 | 2016-11-29 | Depuy Synthes Products, Inc | Revision hip prosthesis having an implantable distal stem component |
US9070754B2 (en) * | 2012-02-14 | 2015-06-30 | Renesas Electronics Corporation | Method of manufacturing a semiconductor device and wafer |
Also Published As
Publication number | Publication date |
---|---|
JP2001118870A (en) | 2001-04-27 |
MY126982A (en) | 2006-11-30 |
US7138326B2 (en) | 2006-11-21 |
JP3422767B2 (en) | 2003-06-30 |
KR20010040082A (en) | 2001-05-15 |
US20040135233A1 (en) | 2004-07-15 |
CA2313551A1 (en) | 2001-04-21 |
US20030071329A1 (en) | 2003-04-17 |
CN1308374A (en) | 2001-08-15 |
US20070045830A1 (en) | 2007-03-01 |
KR100370294B1 (en) | 2003-01-30 |
TW505949B (en) | 2002-10-11 |
CN1199263C (en) | 2005-04-27 |
SG96575A1 (en) | 2003-06-16 |
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