US6103399A - Method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method - Google Patents
Method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method Download PDFInfo
- Publication number
- US6103399A US6103399A US08/913,232 US91323297A US6103399A US 6103399 A US6103399 A US 6103399A US 91323297 A US91323297 A US 91323297A US 6103399 A US6103399 A US 6103399A
- Authority
- US
- United States
- Prior art keywords
- layer
- substrate
- silicon
- micromachined
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 100
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 22
- 239000010703 silicon Substances 0.000 claims description 22
- 239000011651 chromium Substances 0.000 claims description 18
- 239000010931 gold Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 235000012239 silicon dioxide Nutrition 0.000 claims description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 173
- 239000000463 material Substances 0.000 description 17
- 235000012431 wafers Nutrition 0.000 description 15
- 238000005530 etching Methods 0.000 description 14
- 229920000128 polypyrrole Polymers 0.000 description 14
- 239000000126 substance Substances 0.000 description 11
- 238000005459 micromachining Methods 0.000 description 10
- 238000000151 deposition Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
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- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
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- 239000007787 solid Substances 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000006056 electrooxidation reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
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- 230000009467 reduction Effects 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 241001233242 Lontra Species 0.000 description 1
- 238000001015 X-ray lithography Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
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- 238000004458 analytical method Methods 0.000 description 1
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- 238000010420 art technique Methods 0.000 description 1
- 238000004630 atomic force microscopy Methods 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 229910000355 cerium(IV) sulfate Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 238000002508 contact lithography Methods 0.000 description 1
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- 238000007598 dipping method Methods 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 1
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
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- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
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- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002572 peristaltic effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
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- 238000013519 translation Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
- B81C1/00952—Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
- Y10T428/12396—Discontinuous surface component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
- Y10T428/12549—Adjacent to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9500849A SE9500849D0 (en) | 1995-03-10 | 1995-03-10 | Methods for the manufacture of micromachined structures and micromachined structures manufactured using such methods |
SE9500849 | 1995-03-10 | ||
PCT/SE1996/000308 WO1996028841A1 (en) | 1995-03-10 | 1996-03-08 | A method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method |
Publications (1)
Publication Number | Publication Date |
---|---|
US6103399A true US6103399A (en) | 2000-08-15 |
Family
ID=20397494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/913,232 Expired - Fee Related US6103399A (en) | 1995-03-10 | 1996-03-08 | Method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method |
Country Status (7)
Country | Link |
---|---|
US (1) | US6103399A (en) |
EP (1) | EP0870319B1 (en) |
JP (1) | JP4056559B2 (en) |
AU (1) | AU5017996A (en) |
DE (1) | DE69634010T2 (en) |
SE (1) | SE9500849D0 (en) |
WO (1) | WO1996028841A1 (en) |
Cited By (25)
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US20020163642A1 (en) * | 2000-11-16 | 2002-11-07 | Zoval Jim V. | Optical biodiscs with reflective layers |
DE10133014A1 (en) * | 2001-07-06 | 2003-01-23 | Karlsruhe Forschzent | Production of three-dimensional micro-structured components used in electronics comprises modifying substrate to form areas with high and low adhesion, applying thin layer, and introducing a medium between thin layer and low adhesion areas |
US20030040178A1 (en) * | 2001-08-27 | 2003-02-27 | Neal Rueger | Method and apparatus for micromachining using a magnetic field and plasma etching |
WO2003025991A1 (en) * | 2001-09-17 | 2003-03-27 | Advion Biosciences, Inc. | Fabrication of a microchip-based electrospray device |
WO2003055793A1 (en) * | 2001-12-28 | 2003-07-10 | Chalmers Technology Licensing Ab | A method for manufacturing a nanostructure in-situ, and in-situ manufactured nanostructure devices |
US6677225B1 (en) * | 2000-07-14 | 2004-01-13 | Zyvex Corporation | System and method for constraining totally released microcomponents |
US20040016119A1 (en) * | 2002-07-24 | 2004-01-29 | Formfactor, Inc. | Method of making microelectronic spring contact array |
US20040121527A1 (en) * | 2002-12-18 | 2004-06-24 | International Business Machines Corporation | A Method Of Structuring Of A Substrate |
US6762116B1 (en) * | 2002-06-12 | 2004-07-13 | Zyvex Corporation | System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon |
US6777319B2 (en) * | 2001-12-19 | 2004-08-17 | Formfactor, Inc. | Microelectronic spring contact repair |
WO2004092050A1 (en) * | 2003-04-17 | 2004-10-28 | Micromuscle Ab | Method for producing a micromachined layered device |
US6838228B2 (en) * | 2001-05-14 | 2005-01-04 | Fairchild Semiconductor Corporation | System to enable photolithography on severe structure topologies |
US6923669B1 (en) * | 2004-02-13 | 2005-08-02 | Zyvex Corporation | Microconnectors and non-powered microassembly therewith |
US20050181636A1 (en) * | 2004-02-13 | 2005-08-18 | Zyvex Corporation | Sockets for microassembly |
US20050199821A1 (en) * | 2004-03-12 | 2005-09-15 | Zyvex Corporation | Compact microcolumn for automated assembly |
US20050199822A1 (en) * | 2004-03-12 | 2005-09-15 | Zyvex Corporation | Mems based charged particle deflector design |
US20060076693A1 (en) * | 2004-10-07 | 2006-04-13 | Palo Alto Research Center Incorporated | Self-releasing spring structures and methods |
US20060172279A1 (en) * | 2004-08-31 | 2006-08-03 | Elisabeth Smela | Cell-based sensing: biological transduction of chemical stimuli to electrical signals (nose-on-a-chip) |
US7096568B1 (en) | 2003-07-10 | 2006-08-29 | Zyvex Corporation | Method of manufacturing a microcomponent assembly |
DE102006005517B3 (en) * | 2006-02-07 | 2007-03-15 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | Micro valve for use in micro fluid system, has membrane attached on body and including layer made of electro active polymer and is positioned in closed or opened position depending on voltage applied between membrane and counter electrode |
US7314382B2 (en) | 2005-05-18 | 2008-01-01 | Zyvex Labs, Llc | Apparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies |
US20080087841A1 (en) * | 2006-10-17 | 2008-04-17 | Zyvex Corporation | On-chip reflectron and ion optics |
US20080125706A1 (en) * | 2006-08-18 | 2008-05-29 | Derek Sutermeister | Electrically actuated annelid |
US20090021277A1 (en) * | 2007-07-16 | 2009-01-22 | Touchdown Technologies, Inc. | Device and method for reparing a microelectromechanical system |
US20190271287A1 (en) * | 2018-03-01 | 2019-09-05 | Robert Bosch Gmbh | Method for producing an injector |
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US6245444B1 (en) * | 1997-10-02 | 2001-06-12 | New Jersey Institute Of Technology | Micromachined element and method of fabrication thereof |
US6206914B1 (en) | 1998-04-30 | 2001-03-27 | Medtronic, Inc. | Implantable system with drug-eluting cells for on-demand local drug delivery |
US6101371A (en) * | 1998-09-12 | 2000-08-08 | Lucent Technologies, Inc. | Article comprising an inductor |
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US6812217B2 (en) | 2000-12-04 | 2004-11-02 | Medtronic, Inc. | Medical device and methods of use |
US6534249B2 (en) * | 2001-02-09 | 2003-03-18 | Xerox Corporation | Method of making low cost integrated out-of-plane micro-device structures |
CN110643038A (en) * | 2019-09-30 | 2020-01-03 | 天津大学 | Preparation method of polypyrrole-rice paper actuator |
Citations (11)
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US5015906A (en) * | 1989-11-03 | 1991-05-14 | Princeton University | Electrostatic levitation control system for micromechanical devices |
DE4223215A1 (en) * | 1992-07-15 | 1994-01-20 | Bosch Gmbh Robert | Processing silicon@ wafer having deformable micro mechanical structure - comprising adhering foil to lower side of wafer and removing foil after processing |
US5357108A (en) * | 1991-06-11 | 1994-10-18 | Canon Kabushiki Kaisha | Cantilever type displacement element, and scanning tunneling microscope or information processing apparatus using same |
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Also Published As
Publication number | Publication date |
---|---|
JP4056559B2 (en) | 2008-03-05 |
AU5017996A (en) | 1996-10-02 |
DE69634010T2 (en) | 2005-12-15 |
JPH11502061A (en) | 1999-02-16 |
DE69634010D1 (en) | 2005-01-13 |
EP0870319A1 (en) | 1998-10-14 |
EP0870319B1 (en) | 2004-12-08 |
SE9500849D0 (en) | 1995-03-10 |
WO1996028841A1 (en) | 1996-09-19 |
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