US6036099A - Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom - Google Patents
Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom Download PDFInfo
- Publication number
- US6036099A US6036099A US08/918,582 US91858297A US6036099A US 6036099 A US6036099 A US 6036099A US 91858297 A US91858297 A US 91858297A US 6036099 A US6036099 A US 6036099A
- Authority
- US
- United States
- Prior art keywords
- core
- electronic element
- card
- plastic
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
- B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
- B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/342—Chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
- B32B2309/022—Temperature vs pressure profiles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
- B32B2309/025—Temperature vs time profiles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/04—Time
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2327/00—Polyvinylhalogenides
- B32B2327/06—PVC, i.e. polyvinylchloride
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
Abstract
Description
Claims (18)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/918,582 US6036099A (en) | 1995-10-17 | 1997-08-19 | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
US09/368,846 US6514367B1 (en) | 1995-10-17 | 1999-08-05 | Hot lamination process for the manufacture of a combination contact/contactless smart card |
PCT/US2000/021041 WO2001018748A1 (en) | 1996-10-07 | 2000-08-02 | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US568595P | 1995-10-17 | 1995-10-17 | |
US2425596P | 1996-08-21 | 1996-08-21 | |
US08/727,789 US5817207A (en) | 1995-10-17 | 1996-10-07 | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US08/918,582 US6036099A (en) | 1995-10-17 | 1997-08-19 | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/727,789 Continuation-In-Part US5817207A (en) | 1995-10-17 | 1996-10-07 | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/368,846 Continuation US6514367B1 (en) | 1995-10-17 | 1999-08-05 | Hot lamination process for the manufacture of a combination contact/contactless smart card |
Publications (1)
Publication Number | Publication Date |
---|---|
US6036099A true US6036099A (en) | 2000-03-14 |
Family
ID=23453005
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/918,582 Expired - Lifetime US6036099A (en) | 1995-10-17 | 1997-08-19 | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
US09/368,846 Expired - Lifetime US6514367B1 (en) | 1995-10-17 | 1999-08-05 | Hot lamination process for the manufacture of a combination contact/contactless smart card |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/368,846 Expired - Lifetime US6514367B1 (en) | 1995-10-17 | 1999-08-05 | Hot lamination process for the manufacture of a combination contact/contactless smart card |
Country Status (2)
Country | Link |
---|---|
US (2) | US6036099A (en) |
WO (1) | WO2001018748A1 (en) |
Cited By (181)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010034682A1 (en) * | 2000-02-15 | 2001-10-25 | Nigel Knight | International banking system and method |
US6357664B1 (en) | 2001-05-24 | 2002-03-19 | Identicard Systems Incorporated | Identification card utilizing an integrated circuit |
WO2002041084A1 (en) * | 2000-11-17 | 2002-05-23 | General Distribution Limited | Electrical power control system |
US6412701B1 (en) * | 1997-05-19 | 2002-07-02 | Hitachi Maxell, Ltd. | Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module |
WO2002052499A2 (en) * | 2000-12-22 | 2002-07-04 | Digimarc Id Systems, Llc | Improved identification card |
US6441736B1 (en) | 1999-07-01 | 2002-08-27 | Keith R. Leighton | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
WO2002076717A2 (en) * | 2001-03-22 | 2002-10-03 | Beepcard Inc. | Manufacture of self-powered identification devices |
US20020152604A1 (en) * | 2001-04-23 | 2002-10-24 | Debraal John Charles | Method and system for forming electrically conductive pathways |
US20020169608A1 (en) * | 1999-10-04 | 2002-11-14 | Comsense Technologies Ltd. | Sonic/ultrasonic authentication device |
US20020188497A1 (en) * | 2001-06-12 | 2002-12-12 | Cerwin Francis Anthony | System and method for customer knowledge respository |
US6514367B1 (en) * | 1995-10-17 | 2003-02-04 | Keith R. Leighton | Hot lamination process for the manufacture of a combination contact/contactless smart card |
US6517005B1 (en) * | 1997-02-24 | 2003-02-11 | Gemplus | Method for making contactless cards with coiled antenna |
US6522549B2 (en) * | 2000-09-29 | 2003-02-18 | Sony Corporation | Non-contacting type IC card and method for fabricating the same |
US20030061157A1 (en) * | 2001-07-24 | 2003-03-27 | Hirka Jeffrey L. | Multiple account advanced payment card and method of routing card transactions |
US6572021B1 (en) * | 1998-09-10 | 2003-06-03 | Skidata Ag | Card-shaped data carrier and method for producing the same |
US20030105714A1 (en) * | 2001-05-23 | 2003-06-05 | Melissa Alarcon-Luther | System and method for currency selectable stored value instrument |
US20030111527A1 (en) * | 2000-12-06 | 2003-06-19 | George Blossom | Selectable multi-purpose card |
US6581747B1 (en) * | 2000-02-15 | 2003-06-24 | Etablissements Bourgogne Et Grasset | Token with an electronic chip and methods for manufacturing the same |
US20030126017A1 (en) * | 2000-08-01 | 2003-07-03 | Rau Scott W. | System and method for transponder-enabled account transactions |
US6588658B1 (en) * | 2000-06-23 | 2003-07-08 | Eric Blank | Transaction card with attached auxiliary member |
US20030150919A1 (en) * | 2000-06-23 | 2003-08-14 | Eric Blank | Transaction card with attached auxiliary portion |
US6622921B2 (en) * | 1998-06-23 | 2003-09-23 | Meto International Gmbh | Identification element |
US20030195849A1 (en) * | 1998-06-22 | 2003-10-16 | Bank One, Delaware, National Association | Debit purchasing of stored value card for use by and/or delivery to others |
US6648232B1 (en) | 2000-10-24 | 2003-11-18 | Moore North America, Inc. | High temperature tag having enclosed transceiver |
US6677186B1 (en) * | 1999-03-12 | 2004-01-13 | Gemplus | Method for making an electronic device such as a contactless card |
US20040009875A1 (en) * | 2002-02-11 | 2004-01-15 | Edizone, Lc | Biaxially stretched polyester as a photo-receptive layer |
US20040024672A1 (en) * | 1998-11-17 | 2004-02-05 | Brake Francis B. | Customer activated multi-value (CAM) card |
US20040031856A1 (en) * | 1998-09-16 | 2004-02-19 | Alon Atsmon | Physical presence digital authentication system |
US6696952B2 (en) | 2000-08-04 | 2004-02-24 | Hei, Inc. | Structures and assembly methods for radio-frequency-identification modules |
US6702185B1 (en) | 2002-11-13 | 2004-03-09 | Identicard Systems, Incorporated | Identification device having an integrated circuit |
US20040061994A1 (en) * | 2002-09-27 | 2004-04-01 | Eastman Kodak Company | Medium having data storage and communication capabilites and method for forming same |
US20040062016A1 (en) * | 2002-09-27 | 2004-04-01 | Eastman Kodak Company | Medium having data storage and communication capabilites and method for forming same |
US20040073497A1 (en) * | 2002-10-15 | 2004-04-15 | Hayes Mark R. | Method and system for automated linkable promotions |
US20040080461A1 (en) * | 2002-07-18 | 2004-04-29 | Rothgeb Scott Brady | Structure for concealing telecommunication antennas |
US20040087128A1 (en) * | 2000-10-24 | 2004-05-06 | Neuhaus Herbert J | Method and materials for printing particle-enhanced electrical contacts |
US20040155114A1 (en) * | 2001-03-22 | 2004-08-12 | Manfred Rietzler | Method for producing a contactless chip card and chip card produced according to said method |
US6779246B2 (en) | 2001-04-23 | 2004-08-24 | Appleton Papers Inc. | Method and system for forming RF reflective pathways |
US20040215505A1 (en) * | 2001-01-18 | 2004-10-28 | Sullivan Kevin M. | System and method for administering a brokerage rebate card program |
US20040232231A1 (en) * | 2000-10-20 | 2004-11-25 | Promega Corporation | Radio frequency identification method and system of distributing products |
US20040236819A1 (en) * | 2001-03-22 | 2004-11-25 | Beepcard Inc. | Method and system for remotely authenticating identification devices |
US20040246099A1 (en) * | 1992-08-12 | 2004-12-09 | Micron Technology, Inc. | Miniature radio frequency transceiver |
US20050040221A1 (en) * | 2001-08-13 | 2005-02-24 | First Usa Bank N.A. | System and method for funding a collective account by use of an electronic tag |
US20050158232A1 (en) * | 2003-03-11 | 2005-07-21 | Robert Dobbs | Method for producing fine silicon carbide particles using multi-carbide grinding media |
US20050158227A1 (en) * | 2003-03-11 | 2005-07-21 | Robert Dobbs | Method for producing fine dehydrided metal particles using multi-carbide grinding media |
US6941279B1 (en) | 2000-02-23 | 2005-09-06 | Banke One Corporation | Mutual fund card method and system |
US20050194437A1 (en) * | 2000-10-20 | 2005-09-08 | Promega Corporation | RF point of sale and delivery method and system using communication with remote computer and having features to read a large number of RF tags |
US20060106703A1 (en) * | 2000-11-02 | 2006-05-18 | First Usa Bank, Na | System and method for aggregate portfolio client support |
US20060144926A1 (en) * | 2005-01-03 | 2006-07-06 | Arthur Blank & Company, Inc. | Method and apparatus for providing multiple transaction cards in assembly |
US20060181423A1 (en) * | 2004-12-30 | 2006-08-17 | Frederick Bleckmann | Label having a cavity for receiving a RFID device and an apparatus and method of making and assembling the same |
US20060277083A1 (en) * | 2000-04-07 | 2006-12-07 | Craig Spielmann | Method and system for managing risk |
US20070085685A1 (en) * | 2005-10-18 | 2007-04-19 | Rf Identics, Inc. | Label with electronic components and method of making same |
US20070171078A1 (en) * | 2005-06-29 | 2007-07-26 | Martin Cotton | Electronic device and method of forming an electronic device |
US20070176007A1 (en) * | 2006-01-31 | 2007-08-02 | Priya Suresh C | Variably sized mini card |
US20070235548A1 (en) * | 2006-04-10 | 2007-10-11 | Innovatier, Inc. | Electronic inlay module used for electronic cards and tags |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
USRE40137E1 (en) * | 1997-05-01 | 2008-03-04 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
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