US5930586A - Method and apparatus for in-line measuring backside wafer-level contamination of a semiconductor wafer - Google Patents
Method and apparatus for in-line measuring backside wafer-level contamination of a semiconductor wafer Download PDFInfo
- Publication number
- US5930586A US5930586A US08/887,696 US88769697A US5930586A US 5930586 A US5930586 A US 5930586A US 88769697 A US88769697 A US 88769697A US 5930586 A US5930586 A US 5930586A
- Authority
- US
- United States
- Prior art keywords
- semiconductor wafer
- wafer
- scanning
- contamination
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Abstract
Description
Claims (30)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/887,696 US5930586A (en) | 1997-07-03 | 1997-07-03 | Method and apparatus for in-line measuring backside wafer-level contamination of a semiconductor wafer |
KR1019980026523A KR100562695B1 (en) | 1997-07-03 | 1998-07-02 | Methods for measuring contamination on semiconductor wafers and manufacturing semiconductor wafers using in-line contamination monitoring |
JP20272798A JP4417448B2 (en) | 1997-07-03 | 1998-07-02 | Method and apparatus for measuring contamination on a semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/887,696 US5930586A (en) | 1997-07-03 | 1997-07-03 | Method and apparatus for in-line measuring backside wafer-level contamination of a semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
US5930586A true US5930586A (en) | 1999-07-27 |
Family
ID=25391668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/887,696 Expired - Fee Related US5930586A (en) | 1997-07-03 | 1997-07-03 | Method and apparatus for in-line measuring backside wafer-level contamination of a semiconductor wafer |
Country Status (3)
Country | Link |
---|---|
US (1) | US5930586A (en) |
JP (1) | JP4417448B2 (en) |
KR (1) | KR100562695B1 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6161054A (en) * | 1997-09-22 | 2000-12-12 | On-Line Technologies, Inc. | Cell control method and apparatus |
US6350689B1 (en) | 2001-04-23 | 2002-02-26 | Chartered Semiconductor Manufacturing Ltd. | Method to remove copper contamination by using downstream oxygen and chelating agent plasma |
US6607927B2 (en) | 2001-09-28 | 2003-08-19 | Agere Systems, Inc. | Method and apparatus for monitoring in-line copper contamination |
US20040042877A1 (en) * | 2002-08-27 | 2004-03-04 | Somekh Sasson R. | Buffer station for wafer backside cleaning and inspection |
US20050274805A1 (en) * | 2004-05-26 | 2005-12-15 | Ramappa Deepak A | System for remediating cross contamination in semiconductor manufacturing processes |
US20060216839A1 (en) * | 2005-02-11 | 2006-09-28 | Applied Materials, Israel, Ltd. | Method for monitoring chamber cleanliness |
US20100077839A1 (en) * | 2008-09-30 | 2010-04-01 | Martin Trentzsch | In situ monitoring of metal contamination during microstructure processing |
US20100247745A1 (en) * | 2007-09-12 | 2010-09-30 | Dominik Rudmann | Method for manufacturing a compound film |
CN101241165B (en) * | 2007-02-05 | 2011-06-22 | 三星电子株式会社 | Multi-layer structure defect inspection device |
US8617310B1 (en) | 2005-03-09 | 2013-12-31 | Us Synthetic Corporation | Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume |
US20140211914A1 (en) * | 2013-01-30 | 2014-07-31 | Bruker Axs Gmbh | XRF measurement apparatus for detecting contaminations on the bevel of a wafer |
US8969833B1 (en) | 2011-12-16 | 2015-03-03 | Us Synthetic Corporation | Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume |
US11867646B2 (en) | 2020-12-01 | 2024-01-09 | Rigaku Corporation | Total reflection x-ray fluorescence spectrometer |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100451988B1 (en) * | 2002-07-18 | 2004-10-08 | 주식회사 하이닉스반도체 | A method for monitoring a wafer |
US20080216863A1 (en) * | 2007-03-09 | 2008-09-11 | Applied Materials, Inc. | Methods and apparatus for monitoring the rotation of a substrate during cleaning |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981815A (en) * | 1988-05-09 | 1991-01-01 | Siemens Aktiengesellschaft | Method for rapidly thermally processing a semiconductor wafer by irradiation using semicircular or parabolic reflectors |
US5233191A (en) * | 1990-04-02 | 1993-08-03 | Hitachi, Ltd. | Method and apparatus of inspecting foreign matters during mass production start-up and mass production line in semiconductor production process |
US5463459A (en) * | 1991-04-02 | 1995-10-31 | Hitachi, Ltd. | Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process |
US5483568A (en) * | 1994-11-03 | 1996-01-09 | Kabushiki Kaisha Toshiba | Pad condition and polishing rate monitor using fluorescence |
US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
-
1997
- 1997-07-03 US US08/887,696 patent/US5930586A/en not_active Expired - Fee Related
-
1998
- 1998-07-02 JP JP20272798A patent/JP4417448B2/en not_active Expired - Fee Related
- 1998-07-02 KR KR1019980026523A patent/KR100562695B1/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981815A (en) * | 1988-05-09 | 1991-01-01 | Siemens Aktiengesellschaft | Method for rapidly thermally processing a semiconductor wafer by irradiation using semicircular or parabolic reflectors |
US5233191A (en) * | 1990-04-02 | 1993-08-03 | Hitachi, Ltd. | Method and apparatus of inspecting foreign matters during mass production start-up and mass production line in semiconductor production process |
US5463459A (en) * | 1991-04-02 | 1995-10-31 | Hitachi, Ltd. | Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process |
US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
US5483568A (en) * | 1994-11-03 | 1996-01-09 | Kabushiki Kaisha Toshiba | Pad condition and polishing rate monitor using fluorescence |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6161054A (en) * | 1997-09-22 | 2000-12-12 | On-Line Technologies, Inc. | Cell control method and apparatus |
US6350689B1 (en) | 2001-04-23 | 2002-02-26 | Chartered Semiconductor Manufacturing Ltd. | Method to remove copper contamination by using downstream oxygen and chelating agent plasma |
US6607927B2 (en) | 2001-09-28 | 2003-08-19 | Agere Systems, Inc. | Method and apparatus for monitoring in-line copper contamination |
US20040042877A1 (en) * | 2002-08-27 | 2004-03-04 | Somekh Sasson R. | Buffer station for wafer backside cleaning and inspection |
US6900135B2 (en) * | 2002-08-27 | 2005-05-31 | Applied Materials, Inc. | Buffer station for wafer backside cleaning and inspection |
US20050274805A1 (en) * | 2004-05-26 | 2005-12-15 | Ramappa Deepak A | System for remediating cross contamination in semiconductor manufacturing processes |
US7200498B2 (en) * | 2004-05-26 | 2007-04-03 | Texas Instruments Incorporated | System for remediating cross contamination in semiconductor manufacturing processes |
US8361814B2 (en) * | 2005-02-11 | 2013-01-29 | Applied Materials, Israel, Ltd. | Method for monitoring chamber cleanliness |
US20060216839A1 (en) * | 2005-02-11 | 2006-09-28 | Applied Materials, Israel, Ltd. | Method for monitoring chamber cleanliness |
US9453802B1 (en) | 2005-03-09 | 2016-09-27 | Us Synthetic Corporation | Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume |
US8617310B1 (en) | 2005-03-09 | 2013-12-31 | Us Synthetic Corporation | Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume |
CN101241165B (en) * | 2007-02-05 | 2011-06-22 | 三星电子株式会社 | Multi-layer structure defect inspection device |
US20100247745A1 (en) * | 2007-09-12 | 2010-09-30 | Dominik Rudmann | Method for manufacturing a compound film |
US8927051B2 (en) | 2007-09-12 | 2015-01-06 | Flisom Ag | Method for manufacturing a compound film |
US9666745B2 (en) | 2007-09-12 | 2017-05-30 | Flisom Ag | Method for manufacturing a compound film |
US8158065B2 (en) | 2008-09-30 | 2012-04-17 | Advanced Micro Devices, Inc. | In situ monitoring of metal contamination during microstructure processing |
US20100077839A1 (en) * | 2008-09-30 | 2010-04-01 | Martin Trentzsch | In situ monitoring of metal contamination during microstructure processing |
DE102008049774B4 (en) * | 2008-09-30 | 2017-07-27 | Advanced Micro Devices, Inc. | Process plant and method for in-process monitoring of metal contamination during processing of microstructures |
US8969833B1 (en) | 2011-12-16 | 2015-03-03 | Us Synthetic Corporation | Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume |
US9423364B1 (en) | 2011-12-16 | 2016-08-23 | Us Synthetic Corporation | Method and system for perceiving a boundary between a first region and second region of a superabrasive volume |
US20140211914A1 (en) * | 2013-01-30 | 2014-07-31 | Bruker Axs Gmbh | XRF measurement apparatus for detecting contaminations on the bevel of a wafer |
US9541511B2 (en) * | 2013-01-30 | 2017-01-10 | Bruker Axs Gmbh | XRF measurement apparatus for detecting contaminations on the bevel of a wafer |
US11867646B2 (en) | 2020-12-01 | 2024-01-09 | Rigaku Corporation | Total reflection x-ray fluorescence spectrometer |
Also Published As
Publication number | Publication date |
---|---|
JPH1140632A (en) | 1999-02-12 |
KR19990013525A (en) | 1999-02-25 |
KR100562695B1 (en) | 2006-06-08 |
JP4417448B2 (en) | 2010-02-17 |
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Owner name: MOTOROLA, INC., ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JAIN, AJAY;HANCE, ROBERT L.;REEL/FRAME:008631/0290 Effective date: 19970626 |
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Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOTOROLA, INC.;REEL/FRAME:015698/0657 Effective date: 20040404 Owner name: FREESCALE SEMICONDUCTOR, INC.,TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOTOROLA, INC.;REEL/FRAME:015698/0657 Effective date: 20040404 |
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Owner name: CITIBANK, N.A. AS COLLATERAL AGENT, NEW YORK Free format text: SECURITY AGREEMENT;ASSIGNORS:FREESCALE SEMICONDUCTOR, INC.;FREESCALE ACQUISITION CORPORATION;FREESCALE ACQUISITION HOLDINGS CORP.;AND OTHERS;REEL/FRAME:018855/0129 Effective date: 20061201 Owner name: CITIBANK, N.A. AS COLLATERAL AGENT,NEW YORK Free format text: SECURITY AGREEMENT;ASSIGNORS:FREESCALE SEMICONDUCTOR, INC.;FREESCALE ACQUISITION CORPORATION;FREESCALE ACQUISITION HOLDINGS CORP.;AND OTHERS;REEL/FRAME:018855/0129 Effective date: 20061201 |
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STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS Free format text: PATENT RELEASE;ASSIGNOR:CITIBANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:037354/0225 Effective date: 20151207 Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS Free format text: PATENT RELEASE;ASSIGNOR:CITIBANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:037356/0143 Effective date: 20151207 Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS Free format text: PATENT RELEASE;ASSIGNOR:CITIBANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:037356/0553 Effective date: 20151207 |