|Publication number||US5907477 A|
|Application number||US 08/814,206|
|Publication date||25 May 1999|
|Filing date||11 Mar 1997|
|Priority date||19 Sep 1995|
|Also published as||US5612513|
|Publication number||08814206, 814206, US 5907477 A, US 5907477A, US-A-5907477, US5907477 A, US5907477A|
|Inventors||Mark E. Tuttle, Rickie C. Lake, Joe P. Mousseau, Clay L. Cirino|
|Original Assignee||Micron Communications, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (26), Referenced by (197), Classifications (46), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application is a continuation of application Ser. No. 08/530,747 filed Sep. 19, 1995, U.S. Pat. No. 5,612,513.
The present invention relates to electrical circuits and their method of manufacture. More specifically, the present invention relates to an enclosed electrical circuit wherein the circuit components are formed on a flexible substrate and encapsulated with a curable material.
Advancements in semiconductor technology have lead to the production of large scale integrated circuits (e.g., chips) which have brought about a revolution in the electronics industry. Packaged and unpackaged semiconductor dice and associated micro-circuitry are now widely used in the production of a variety of electronic devices (e.g., portable computers, calculators, watches, cordless telephones, radios, tape recorders, security systems, etc.). As the development of such portable electronic devices continues, a need has arisen for advancements in the technology relating to forming and packaging devices which employ micro-circuitry.
One of the problems associated with conventional micro-circuitry is that the components typically are mounted on a rigid substrate such as a printed circuit board. This substrate must be such that its structural integrity is sufficient to support the weight of the components and to protect the components from damage. The resulting structural rigidity is often a detriment. Some applications require some flexibility in the substrate to accommodate odd configurations or to avoid breaking of the substrate upon impact with other objects.
To allow the miniaturization to advance while providing sufficient support and flexibility, enclosed micro-circuits have evolved. In the past, these enclosed micro-circuits were sometimes manufactured using a flexible substrate, for example, polyester. A conductive trace was formed on the substrate and various electronic components were then attached to substrate in electrical communication with the conductive trace to form the micro-circuit. The micro-circuit was enclosed by bonding a second polyester sheet over the top of the circuitry. In this configuration, the micro-circuitry was enclosed by a flexible polyester sheet on either side of the micro-circuit.
The method of manufacturing the micro-circuit by enclosing it within two polyester sheets has been somewhat successful. On the other hand, if the components of the circuit are too large, this method of manufacture does not function satisfactorily. Specifically, in the situation where components are more than 1.0 mm tall, the top, and sometimes both the top and bottom sheet, had to stretch over or around the oversized component. The unequal stretching of the top and bottom sheets resulted in wrinkles in the sheets and misalignment between the sheets. Both the wrinkles and the misalignment are unacceptable.
The unacceptable nature of this design was especially apparent where components approached 2.5 mm or more in thickness. Examples of larger components would be batteries which are often necessary for a self-contained electrical circuit. Likewise, this enclosed micro-circuit failed where components had variable heights and outside configurations. As was the case with individually excessive heights, the unequal heights and unequal configurations resulted in stretching, bunching and misalignment. When manufacturers attempted to build arrays of enclosed micro-circuits, they found that the stretching, bunching and misaligning problems were additive and necessitated even thinner components and more equally spaced and sized components to fall within acceptable production limits.
For some applications, a rugged, completely self-contained micro-circuit capable of receiving information, storing information and transmitting information, without physical connection to other components is necessary. The previously described enclosed circuit design was not able to accommodate this need.
In view of the deficiencies in the prior art, the present invention is directed to an improved micro-circuit design that allows the circuit components to be enclosed in a flexible package. Accordingly, it is an object of the present invention to provide an improved micro-circuit and method of manufacture.
It is a further object of the present invention to provide an enclosed micro-circuit that is inexpensive and easy to manufacture, yet offers a high degree of reliability while minimizing the possibility of damage to the internal components.
It is yet another object of the present invention to provide a micro-circuit that is enclosed using a flexible substrate and an encapsulant that entirely surrounds the components, yet still allows a relatively high degree of flexibility.
It is a still further object of the present invention to provide a micro-circuit that can be manufactured in multiple units and then singulated into individual micro-circuits.
It is a still further object of the present invention to provide a self-contained, enclosed micro-circuit able to receive information, store the information in a memory and transmit information as required.
Other objects, advantages and capabilities of the present invention will become more apparent as the description proceeds.
In accordance with the present invention, an improved micro-circuit and a method for manufacturing the micro-circuit are provided. The micro-circuit is formed on a flexible substrate and is entirely enclosed by an encapsulant. In addition, the micro-circuit includes a conductive trace (or pattern of traces) formed on the flexible substrate and one or more electrical components (e.g., batteries, dies, antennae) mounted to the substrate in electrical communication with the conductive trace. Preferably a conductive adhesive (e.g., silver filled conductive epoxy, z-axis epoxy) is used to attach the components to the substrate and to establish an electrical connection between the components and conductive trace.
Following formation of the conductive trace, and mounting of the components to the flexible substrate, the entire micro-circuit is encapsulated using a curable encapsulant. To accomplish this step, a barrier is formed around the components of the circuit. This barrier can be in the form of a dam which surrounds a single micro-circuit or an entire array of micro-circuits. The barrier can also be in the form of a spacer sheet having a separate cutout for each micro-circuit of an array. The barrier can be attached to the substrate or merely maintained in temporary contact with the substrate to prevent the encapsulant material from leaking out.
With the barrier installed, a single cavity or plurality of separate cavities are formed by the substrate and the barrier. The components of the circuit are located within the cavity (or cavities) and an encapsulant in a viscous form is placed into the cavity (or cavities) such that it completely covers the components and the circuit. The encapsulant is then cured or partially cured. Once the encapsulant has hardened, or partially hardened to a stable non-flowing gel, the barrier can be removed or incorporated as a part of the encapsulated assembly. Preferably the micro-circuits are fabricated and encapsulated in a multiple array and are then singulated into individual micro-circuits using cutting, routering or shearing. If desired, the barrier can be coated or formed with a releasing agent (e.g., Teflon layer) such that the barrier can be more easily separated from the encapsulant and the substrate after the manufacturing process is completed. This would also allow the barrier to be reused multiple times.
Such a packaged micro-circuit can also be formed with a logo, or other graphic material, by utilizing a transparent substrate and printing a reverse image on the substrate prior to formation of the conductive trace. In this case the image is viewed through the substrate and is protected by the substrate.
A method for manufacturing an enclosed micro-circuit, generally stated, includes the steps of: forming a flexible substrate; forming a circuit trace on the substrate; mounting electrical components on the substrate in electrical communication with the circuit trace to form a micro-circuit; attaching a barrier to the substrate to form a cavity around the micro-circuit; and then encapsulating the micro-circuit by depositing a curable encapsulant into the cavity. The barrier can then be removed or incorporated as part of the packaged micro-circuit. Additionally the micro-circuit can be formed as an individual unit or as part of an array that is later singulated into individual units.
FIG. 1 is a top view of an array of micro-circuits constructed in accordance with the present invention and shown prior to singulation;
FIG. 2 is a cross-section view along line 2--2 in FIG. 1;
FIG. 3 is a top view of an array of micro-circuits constructed in accordance with an alternate embodiment of the invention and shown prior to singulation;
FIG. 4 is a cross-sectional view taken along line 4--4 in FIG. 3;
FIG. 5 is a top view of an array of micro-circuits constructed in accordance with an alternate embodiment of the invention and shown prior to singulation;
FIG. 6 is a cross-sectional view taken along line 6--6 in FIG. 5;
FIG. 7 is a cross-sectional view of an array of micro-circuits constructed in accordance with an alternate embodiment of the invention and shown prior to singulation;
FIG. 8 is a cross-sectional view of an individual micro-circuit constructed in accordance with an alternate embodiment of the invention;
FIG. 9 is a flowchart showing an overview of the method of manufacture of the present invention;
FIG. 10 is a flowchart of the substeps of a portion of the method of manufacture shown in FIG. 9; and
FIG. 11 is a flowchart of the substeps of a portion of the method of manufacture shown in FIG. 9.
Referring initially to FIGS. 1 and 2, a circuit array manufactured according to the present invention is shown and generally designated 10. The circuit array 10 is shown following encapsulation but prior to singulation. Circuit array 10 is comprised of twelve individual circuits 12. However, a particular array can have a fewer or greater number of circuits 12.
The circuit array 10 includes a substrate 14. The substrate 14 can be made of a number of materials which are known in the art. Preferably, to allow the finished product to remain flexible, the substrate 14 should be made of a flexible material such as polyester or PET. However, other suitable materials having the desired characteristics could be used as well. Furthermore, the substrate 14 is preferably very thin which can also contribute to its flexibility. By way of example and not limitation, the substrate 14 can be formed with a thickness of from 0.0009 inches (0.9 mils) to 0.010 inches (10 mil).
Each circuit 12 includes a conductive trace 16 formed on the substrate 14. The conductive trace 16 can be formed as a single trace or as a pattern of conductive traces. The particular pattern or configuration of the conductive traces 16 is not critical for the present invention. Instead, the pattern or configuration of the conductive trace 16 is dependent upon the type of circuit and the types and numbers of components to be used. The conductive traces 16 can likewise be made of a number of materials and compositions, all of which are well known in the art. For example, a conductive ink can be applied to the substrate 14 using a conventional screen printing method. Alternatively, the conductive trace 16 can be a patterned metal layer formed on substrate 14 using a conventional deposition, photopatterning and etching process.
Attached to or mounted on the substrate 14 are one or more electrical components. In the particular embodiment shown in FIGS. 1 and 2, a battery 18 and a semiconductor die 20 are mounted to the substrate 14. Other circuitry and circuit components (e.g., resistors, diodes, antennae) can also be included in the circuit 12 as required. Furthermore, these other circuit components can be separate members attached to the substrate 14 or can be integral components formed by screen printing or other deposition processes.
Preferably the battery 18 is a thin coin cell battery. Furthermore, in order to facilitate the mounting of the battery 18 onto the substrate, the battery 18 is preferably of a type having both the positive and the negative terminals on one side of the battery and substantially co-planar to one another. A suitable battery and contact assembly is described in U.S. Pat. No. 5,558,679 entitled "Improved Battery and Contact Assembly and Method of Manufacture For Mounting A Battery."The disclosure of that patent is hereby incorporated by reference.
The battery 18 and the die 20 are preferably mounted onto the substrate 14 using conductive adhesive such as a silver filled conductive epoxy or a z-axis anisotropic epoxy. The conductive adhesive also establishes an electrical connection with the conductive trace 16. The battery 18 is positioned on substrate 14 such that the positive terminal and the negative terminal of battery 18 make contact with appropriate portions of the conductive trace 16. Likewise, the bond pads of die 20 are placed such that they are in electrical contact with the appropriate portions of conductive trace 16. Constructed as such, the conductive trace 16, the battery 18 and the die 20 form the circuit 12.
Following the formation of the circuits 12 on the substrate 14, a barrier is formed for encapsulating the circuits 12. In the particular embodiment illustrated in FIGS. 1 and 2, the barrier is a compartmental dam 22 that encloses each circuit 12 separately. The compartmental dam 22 is preferably formed of a thin walled rigid material such as stainless steel or hard plastic. The compartmental dam 22 includes an opening 24 for each separate circuit 12. The openings 24 are shown having a substantially square configuration. However, other shapes such as polygonal, round or oval can also be used.
As also shown in FIGS. 1 and 2, the compartmental dam 22 is placed in contact with the substrate 14 to prevent the encapsulating material from leaking out. The dam 22 can be maintained in contact with the substrate under its own weight or by using a clamp or additional weight. With the dam 22 placed in contact with the substrate 14, the openings 24 and the substrate 14 form a cavity 26 for each circuit 12. Each circuit 12 is thus surrounded on four sides by the dam 22 and at the bottom by the substrate 14. The height of the dam 22 is preferably sufficient such that the top surface 28 of the dam 22 is higher than the top of the highest circuit component. The top edge of the dam 22 can also be contoured to conform to the surface topography of the circuit components.
Filling each cavity 26 and completely encapsulating the circuit components is an encapsulant 30. The encapsulant 30 can be made from a variety of materials, any of which can be cured or dried from a viscous or liquid state to a hardened state. Preferably the encapsulant 30 comprises a two-part epoxy and can include pigments or carbon to make the encapsulant opaque. In FIGS. 1 and 2 the encapsulant 30 is shown as transparent to allow viewing of the components. The particular formulations of the epoxy are a design consideration that are dependent on the desired curing times, curing methods, resulting hardness and resulting flexibility of the encapsulant 30. As those skilled in the art will appreciate, the particular formulation can be varied to achieve the particular characteristics desired. In addition, curing can be effected in stages such that a partial cure can be performed to allow removal of the dam 22 followed by a total cure without the dam 22.
Furthermore, while the cavities in FIG. 2 are preferably completely filled by the encapsulant 30, the encapsulant 30 does not need to completely fill the cavity for the present invention. In some situations it is desirable that the encapsulant 30 does not completely cover the components or is deposited with different thicknesses on different portions of the substrate.
Once the encapsulant 30 is cured or hardened to its final state, the circuit array 10 can be singulated to separate the individual enclosed circuits 12. The singulation process can be by routering or shearing or any other method known in the art without departing from the scope and spirit of the present invention. Depending on the desired characteristics of the particular desired enclosed circuit 12, the singulation or separation can result in the particular enclosed circuits having portions of the dam 22 remaining or completely trimmed away. Furthermore, in order to facilitate removal of the dam 22 from the encapsulant 30, it is possible to apply a releasing agent to the dam 22 prior to mounting the dam 22 on the substrate 14 and prior to depositing the encapsulant into each cavity 26. The releasing agent can be an anti-stick material, such as a mold release agent, that is applied to the dam prior to use or a permanently bonded material such as Teflon.
An alternate embodiment of the present invention is shown in FIGS. 3 and 4. In FIGS. 3 and 4, the circuit array of enclosed circuits is generally designated 40. As was the case for the circuit array shown in FIGS. 1 and 2, circuit array comprises an array of twelve enclosed circuits 42. The alternate embodiment is substantially similar to the embodiment shown in FIGS. 1 and 2 except that a barrier for encapsulation is formed as a perimeter dam 54.
The circuit array 40 has as its foundation, a substrate 44. The substrate 44 can be made of any of a number of materials, but is preferably made of a flexible polyester material or PET to allow the final product to remain flexible. Additionally, using a flexible polyester or PET allows the substrate to have a minimal thickness while maintaining sufficient strength.
A conductive trace 46 is formed on the substrate 44. The conductive trace 46 can be formed as previously described. Mounted on the substrate 44 are a variety of electrical components. As was the case in the prior embodiment, a battery 48 and a die 50 are mounted onto the substrate 44. Preferably, these components are attached to the substrate 44 and electrically connected to the conductive trace 46 using a conductive adhesive and preferably a silver filled epoxy adhesive as previously described.
A portion of the trace 46 is formed as an antenna 52. The antenna 52 could also be formed as a separate component mounted onto the substrate. By including the antenna 52, each circuit 42 can communicate with the outside world using RF signals instead of requiring a hard-wired connection. In addition, information transmitted to the antenna 52 can be stored within the die 50. The circuits 42 can thus be used to receive information, store information and transmit information.
The perimeter dam 54 is mounted or attached to the substrate 44 substantially as previously described. The perimeter dam 54 is mounted onto substrate 44 such that it encompasses the periphery of the twelve enclosed circuits 42. The height of the perimeter dam 54 is such that the top surface 56 of the dam 54 is higher than the tallest component utilized within the circuits 42. The perimeter dam 54 in combination with the substrate 44, provides a single cavity 58 containing all twelve enclosed circuits 42. During an encapsulation step the cavity 58 is filled with an encapsulant 60. As with the prior embodiment, the encapsulant 60 can be made of any of a variety of materials (e.g., two part room temperature curing epoxy) which can be cured or hardened from a liquid state to a hardened state.
Once the encapsulant 60 is in its hardened state, the individual enclosed circuits 42 can be singulated or separated from each other by cutting, routering or shearing or other methods known in the art. If desired, the perimeter dam 54 can be trimmed from the particular individual circuits 42 by similar methods. Additionally in order to facilitate separation of the perimeter dam 54 from the encapsulant 60 and the substrate 44, a releasing agent can be applied to the perimeter dam 54 prior to mounting the dam to the substrate 44 and prior to filling the cavity 58 with encapsulant 60. Preferably, sufficient encapsulant 60 is utilized to give each enclosed circuit 42 a substantially flat top surface. As can be seen, the resulting circuit is completely encapsulated between the encapsulant 60 and substrate 44. On the other hand, because of the flexible nature of the substrate as well as the encapsulant, some flexing can still be possible.
Still another enclosed circuit array according to the present invention is shown in FIGS. 5-6 and is generally designated 70. Circuit array 70 as shown includes 12 individual enclosed circuits 72 prior to singulation. The alternate embodiment is substantially similar to the embodiment shown in FIGS. 1 and 2 except that a barrier for encapsulation is formed as a spacer sheet 84 having a cut out for each circuit 72.
As was the case for previously described embodiments, a substrate 74 is included in the array 70. In this embodiment, the substrate 74 is flexible and substantially transparent. Preferably the substrate 74 is made of polyester or PET and is approximately 0.9 mils (0.0009 in.) to 10 mils (0.010 in.) thick. Other materials and thicknesses can be used without departing from the scope and spirit of the present invention.
An ink layer 75 (FIG. 6) is applied to the substrate 74. The ink layer 75 permits the formation of numbering, letter logos, graphic designs and the like on the inside surface of substrate 74. The ink layer 75 can comprise multiple colors of ink and can be applied using known screen printing methods or other comparable methods. Because the lettering, numbers logos or graphic designs are to visible and viewed through the substrate 74, the images can be applied in a reversed orientation.
Mounted onto substrate 74 and ink layer 75 are a variety of electrical components. As was the case in the prior embodiments, a conductive trace 76, a battery 78 and a die 80 are mounted onto substrate 74. The conductive trace 76 is preferably formed as described above by screen printing or etching. Also, the battery 78 and die 80 are preferably attached to the substrate 44 using a conductive adhesive as previously described. In addition as before, a portion of the trace 76 is formed as an antenna 82.
Mounted to the substrate 74 is a barrier formed as a spacer sheet 84. The spacer sheet 84 is preferably made of a flexible material like polycarbonate. The spacer sheet 84 is formed with a plurality of openings 85 (or cutouts) having a shape that closely matches the peripheral shape of the circuits 72. The openings 85 form a cavity 88 for encapsulating each circuit 72. The height or thickness of sheet 84 is such that the top surface 86 of the sheet 84 is higher than the tallest component utilized within the circuit.
The encapsulant 90 is poured into the cavity 88 for each circuit 72. As before, the encapsulant 90 can be made of any of a variety of materials which can be cured or hardened from a liquid state to a hardened state.
Once the encapsulant 90 is in its hardened state, the individual enclosed circuits 72 can be singulated or separated from each other by routering or shearing or other methods known in the art. In this embodiment portions of the spacer sheet 84 become a permanent part of the enclosed circuit 72. Preferably, sufficient encapsulant 90 is utilized to give each enclosed circuit 72 a substantially flat top surface. As can be seen, the resulting circuit is completely encapsulated between the encapsulant 90, spacer sheet 84 and the substrate 74.
In the completed configuration, each circuit 72 will include the ink layer 75 visible through the substrate 74. Because the ink layer 75 is on the protected side of the substrate 74, it will have substantially improved wear characteristics. Additionally, the markings will be virtually tamper-proof and would be useful as an anti-counterfeiting measure.
In some situations it may be preferable for an additional flexible cover to be placed over the circuit array prior to singulation. One such circuit array is shown in FIG. 7. Similar to the previous embodiments, circuit array 100 includes a substrate 104 on which a conductive trace 106 is formed. Mounted onto the substrate 104 is a battery 108 and a die 110. As before, a portion of the conductive trace 106 is formed as an antenna 112. Still further, a perimeter dam 114 is attached to substrate 104, providing a cavity 116 which is filled by an encapsulant 118. In the view shown in FIG. 7, four enclosed circuits 102 are shown.
To provide for additional stability or additional protection from damage, an additional flexible cover 120 is attached to the top surface of the perimeter dam 114 and the encapsulant 118. The flexible cover 120 can be attached while the encapsulant is still in its liquid state or can be attached to the encapsulant with an adhesive or other suitable bonding means after the encapsulant 118 has hardened. While cover 120 is shown on a circuit array similar to that shown in FIGS. 3-4, it could be used on other similar circuits or circuit arrays like that shown in FIGS. 1-2 or FIGS. 5-6. Additionally while the flexible cover 120 is preferably a flexible material such as polyester or PET, some instances may require additional strength, and harder and less flexible materials may be used.
Referring now to FIG. 8, yet another embodiment of an enclosed circuit of the present invention is shown and generally designated 130. Circuit 130 is shown in its completed state post-singulation. The substrate 132 is preferably made of materials as previously described. A conductive trace 134 is formed on the substrate 132. Mounted on the substrate 132 in electrical communication with the conductive trace 134 are a battery 136 and a die 138. Also mounted to the substrate 132 is a barrier 140. The battery 136 and die 138 are within the cavity formed by substrate 132 and barrier 140. Filling the remainder of the cavity is an encapsulant 142.
In this embodiment the contact trace 134 extends out beyond the periphery of the barrier 140. In this manner a portion of contact trace 134 is on the outside of the circuit 130 and forms an edge connector 144 similar to standard circuit board connectors which will be recognized by those skilled in the art. Edge connector 144 could be connected to other circuits and components by physical contact or soldering or by other means known in the art. Enclosed circuit 130 could thus be used in a hard-wired assembly.
A flowchart for the preferred method of manufacture is shown in broad steps in FIG. 9 and is generally designated 210. For method 210, a substrate is initially formed or provided, step 212. Depending on the nature of the qualities desired, the substrate can be made of a number of materials, although it is preferably flexible and, for the preferred embodiment, is normally material like polyester or PET.
After providing the substrate, step 212, the components of the circuit are mounted onto the substrate, step 214, such that a circuit is formed on the substrate. More specifically, for a typical circuit, the mounting components substep 214 is shown in FIG. 10. As shown in FIG. 10, a conductive trace is formed on the substrate, step 216. The conductive trace can be formed on the substrate using a variety of methods, including screen printing, etching and others that are known in the art. Next, a conductive adhesive is applied to the top surface of the substrate and the conductive trace. Preferably, the adhesive is a conductive adhesive. In the preferred configuration, this adhesive is applied in a layer approximately 2 mil. thick.
The electrical components of the circuitry can then be applied and mounted onto the substrate and are held in place by the adhesive. Specifically, for a particular circuit, a die can be placed onto the substrate, step 218. The die is positioned such that its electrical contacts (e.g., bond pads) are immediately adjacent the appropriate locations on the conductive trace. In this manner, utilizing a conductive adhesive, electrical communication is established between the die and conductive trace.
Additionally, for a particular circuit, a battery can be mounted onto the substrate and also held in place by the adhesive, step 220. Both the positive and negative terminals of this battery are placed immediately adjacent the positive and negative contact trace of the conductive trace. In this manner, a circuit is formed between the battery, the die and the conductive trace. Depending on the type of battery, an additional conductive adhesive can be applied around the perimeter of the battery to provide additional electrical contact. This may be necessary where the positive and negative terminals of the batter are not coplanar.
Referring back again to FIG. 9, the final step in the method is to encapsulate the circuit, step 222. The substep of encapsulating the circuit, step 222, is shown in FIG. 11. First, a barrier to contain the encapsulant must be formed. Depending on the process, the barrier can be either a compartmentalized dam or spacer sheet having a number of openings or cut outs, one for each enclosed circuit, or a perimeter dam having a single opening surrounding a number of enclosed circuits.
Furthermore, the individual dam or spacer sheet can be manufactured by a variety of methods. Preferably, an initial piece of stock of, for example, black polycarbonate, is provided. This sheet is then cut to size for the overall dimensions of the individual dam. The individual openings (e.g., 24 or 85) can then be stamped or cut as required.
Alternatively, the sheet can be initially formed with openings (e.g., 24 or 85) such as by molding without departing from the scope of the present invention. Openings can have a standardized shape as is shown for openings 24 or could be designed to conform to the shape of the componentry like opening 85.
In FIG. 11, mounting the barrier onto the substrate is step 224. The barrier itself may be held in contact with the substrate using an adhesive or by bonding or by other means known in the art. Depending on the final desired characteristics of the enclosed circuit, a releasing agent can be applied to the barrier. If desired, the barrier could be applied to the substrate using a releasing agent, or be held in place using other non-permanent means like pressure, a magnetic field, and the like to allow the barrier to be reused.
After the barrier is installed onto the substrate, the cavity, which contains the circuit components, is substantially filled with an encapsulant, step 226. Depending on the type of encapsulant, the encapsulant is then allowed to dry or is cured. Once the encapsulant has hardened, the individual enclosed circuits can be singulated by routering or shearing or other means known in the art. If desired, the remaining portions of the barrier can be removed for reuse, trimmed away or can be left in contact with the individual enclosed circuits.
In some situations it may be preferable to include markings, e.g. lettering, numbering, logos or graphic representations on the enclosed circuit. This is accomplished in the method of the present invention by using a substrate that is substantially transparent. Prior to forming the conductive trace on the substrate, an ink layer is applied to the surface of the substrate by screen printing or other similar means. If multiple colors are desired, multiple layers can be applied. In order to be visible through the substrate, the images are applied in reverse orientation as will be appreciated by those skilled in the art.
If physical contact with the conductive trace is desired, the trace can be formed such that it extends out beyond the barrier to form an edge connector. When singulation is performed, the extension of the substrate including the edge connector is allowed to remain.
In the event additional structural stability or protection is desired, an additional cover can be added to the top of the barrier and the encapsulant prior to singulation. This cover can be a variety of materials, including flexible polyester or PET. It can be attached to the encapsulant while the encapsulant is still in its liquid state or it can be attached after the encapsulant has hardened using an adhesive or bonding or other means known in the art.
Thus, the invention provides an improved enclosed electrical circuit using an encapsulant. Furthermore, although the method of the invention has been described with reference to certain preferred embodiments and preferred methods, as will be apparent to those skilled in the art, certain changes and modifications can be made without departing from the scope of the invention as defined by the following claims.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US4218701 *||24 Jul 1978||19 Aug 1980||Citizen Watch Co., Ltd.||Package for an integrated circuit having a container with support bars|
|US4502903 *||4 Jun 1984||5 Mar 1985||Polaroid Corporation||Method of making lithium batteries with laminar anodes|
|US4621035 *||20 Jan 1982||4 Nov 1986||Polaroid Corporation||Lithium batteries with laminar anodes|
|US4814943 *||2 Jun 1987||21 Mar 1989||Oki Electric Industry Co., Ltd.||Printed circuit devices using thermoplastic resin cover plate|
|US4903169 *||19 Sep 1988||20 Feb 1990||Matsushita Electric Industrial Co., Ltd.||Shielded high frequency apparatus having partitioned shield case, and method of manufacture thereof|
|US5018005 *||27 Dec 1989||21 May 1991||Motorola Inc.||Thin, molded, surface mount electronic device|
|US5136365 *||27 Sep 1990||4 Aug 1992||Motorola, Inc.||Anisotropic conductive adhesive and encapsulant material|
|US5295044 *||25 Sep 1992||15 Mar 1994||Kabushiki Kaisah Toshiba||Semiconductor device|
|US5321240 *||25 Jan 1993||14 Jun 1994||Mitsubishi Denki Kabushiki Kaisha||Non-contact IC card|
|US5327010 *||17 Jul 1990||5 Jul 1994||Ryoden Kasei Co., Ltd.||IC card having adhesion-preventing sheets|
|US5336931 *||3 Sep 1993||9 Aug 1994||Motorola, Inc.||Anchoring method for flow formed integrated circuit covers|
|US5350645 *||21 Jun 1993||27 Sep 1994||Micron Semiconductor, Inc.||Polymer-lithium batteries and improved methods for manufacturing batteries|
|US5362652 *||22 Nov 1993||8 Nov 1994||Nalco Chemical Company||Spectrophotometric detection of hydroperoxides in hydrocarbons|
|US5386342 *||23 Dec 1993||31 Jan 1995||Lsi Logic Corporation||Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device|
|US5389738 *||4 May 1992||14 Feb 1995||Motorola, Inc.||Tamperproof arrangement for an integrated circuit device|
|US5416358 *||16 Sep 1993||16 May 1995||Mitsubishi Denki Kabushiki Kaisha||IC card including frame with lateral hole for injecting encapsulating resin|
|US5422514 *||11 May 1993||6 Jun 1995||Micromodule Systems, Inc.||Packaging and interconnect system for integrated circuits|
|US5477047 *||21 Oct 1993||19 Dec 1995||Matsushita Electric Industrial Co., Ltd.||Direct-contact type image sensor device, an image sensor unit, and methods for producing the same|
|US5528222 *||9 Sep 1994||18 Jun 1996||International Business Machines Corporation||Radio frequency circuit and memory in thin flexible package|
|US5536466 *||27 Apr 1993||16 Jul 1996||Futaba Denshi Kogyo Kabushiki Kaisha||Process for manufacturing transparent conductive film wiring board|
|US5558679 *||21 Aug 1995||24 Sep 1996||Micron Communications, Inc.||Method for mounting a battery on a substrate|
|US5601941 *||16 Jul 1996||11 Feb 1997||Micron Communications, Inc.||Improved battery assembly|
|US5605547 *||27 Mar 1995||25 Feb 1997||Micron Technology, Inc.||Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor|
|US5612513 *||19 Sep 1995||18 Mar 1997||Micron Communications, Inc.||Article and method of manufacturing an enclosed electrical circuit using an encapsulant|
|US5646828 *||20 Aug 1996||8 Jul 1997||Lucent Technologies Inc.||Thin packaging of multi-chip modules with enhanced thermal/power management|
|US5866441 *||16 Dec 1996||2 Feb 1999||Pace; Benedict G.||Inverted chip bonded module with high packaging efficiency|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US6067025 *||3 Dec 1997||23 May 2000||Stmicroelectronics, Inc.||Apparatus and method for detecting the height above a silicon surface|
|US6085324 *||14 May 1997||4 Jul 2000||Ogram; Mark E.||Monitoring and regulatory system for the internet|
|US6131269 *||18 May 1998||17 Oct 2000||Trw Inc.||Circuit isolation technique for RF and millimeter-wave modules|
|US6243945 *||18 Jun 1999||12 Jun 2001||Murata Manufacturing Co., Ltd.||Method for manufacturing electronic parts|
|US6246010 *||25 Nov 1998||12 Jun 2001||3M Innovative Properties Company||High density electronic package|
|US6256873||12 Mar 1999||10 Jul 2001||Cardxx, Inc.||Method for making smart cards using isotropic thermoset adhesive materials|
|US6356453 *||29 Jun 2000||12 Mar 2002||Amkor Technology, Inc.||Electronic package having flip chip integrated circuit and passive chip component|
|US6445589 *||29 Jul 1999||3 Sep 2002||Delphi Technologies, Inc.||Method of extending life expectancy of surface mount components|
|US6521484 *||5 May 1999||18 Feb 2003||Orient Semiconductor Electronics, Ltd.||Mold injection method for semiconductor device|
|US6546620||29 Jun 2000||15 Apr 2003||Amkor Technology, Inc.||Flip chip integrated circuit and passive chip component package fabrication method|
|US6627997 *||26 Mar 1999||30 Sep 2003||Hitachi, Ltd.||Semiconductor module and method of mounting|
|US6713878 *||28 May 2002||30 Mar 2004||Stmicroelectronics||Electronic element with a shielding|
|US6762502||31 Aug 2000||13 Jul 2004||Micron Technology, Inc.||Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof|
|US6784522||4 Jun 2001||31 Aug 2004||Stmicroelectronics S.R.L.||Electronic semiconductor device having a thermal spreader|
|US6784541||25 Nov 2002||31 Aug 2004||Hitachi, Ltd.||Semiconductor module and mounting method for same|
|US6784844 *||10 Oct 2000||31 Aug 2004||Nokia Mobile Phone Limited||Antenna assembly and method of construction|
|US6794224||21 Feb 2002||21 Sep 2004||Micron Technology, Inc.||Semiconductor device including leads in communication with contact pads thereof and a stereolithographically fabricated package substantially encapsulating the leads and methods for fabricating the same|
|US6886244 *||7 Aug 2002||3 May 2005||Seagate Technology Llc||Segmented pallet for disk-shaped substrate electrical biassing and apparatus comprising same|
|US6897571 *||1 Oct 2002||24 May 2005||Micron Technology, Inc.||Method for sawing wafers employing multiple indexing techniques for multiple die dimensions|
|US6921860 *||18 Mar 2003||26 Jul 2005||Micron Technology, Inc.||Microelectronic component assemblies having exposed contacts|
|US6932077||5 Nov 2003||23 Aug 2005||Micron Technology, Inc.||Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus|
|US6940162||7 May 2004||6 Sep 2005||Renesas Technology Corp.||Semiconductor module and mounting method for same|
|US6949822 *||19 Mar 2001||27 Sep 2005||International Rectifier Corporation||Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance|
|US6969637||16 Jul 2004||29 Nov 2005||Stmicroelectronics S.R.L.||Electronic semiconductor device having a thermal spreader|
|US7024762 *||19 Dec 2002||11 Apr 2006||Alza Corporation||Method of making a housing for drug delivery|
|US7028910 *||1 Feb 2002||18 Apr 2006||Schlumberger, Systemes||Portable object with chip and antenna|
|US7123204||24 Apr 2003||17 Oct 2006||Forster Ian J||Energy source communication employing slot antenna|
|US7265027 *||14 Jun 2005||4 Sep 2007||Miradia Inc.||Bond method and structure using selective application of spin on glass|
|US7287319||7 Apr 2005||30 Oct 2007||Alza Corporation||Method of making a housing for drug delivery|
|US7363704 *||9 Dec 2004||29 Apr 2008||Fujitsu Limited||RFID tag and method of manufacturing RFID tag|
|US7365442 *||31 Mar 2003||29 Apr 2008||Osram Opto Semiconductors Gmbh||Encapsulation of thin-film electronic devices|
|US7372418||31 Aug 2006||13 May 2008||Mineral Lassen Llc||Energy source communication employing slot antenna|
|US7387119||25 May 2005||17 Jun 2008||Micron Technology, Inc.||Dicing saw with variable indexing capability|
|US7414589||21 May 2007||19 Aug 2008||Mineral Lassen Llc||Energy source communication employing slot antenna|
|US7548430 *||1 Aug 2006||16 Jun 2009||Amkor Technology, Inc.||Buildup dielectric and metallization process and semiconductor package|
|US7550857||16 Nov 2006||23 Jun 2009||Amkor Technology, Inc.||Stacked redistribution layer (RDL) die assembly package|
|US7629674||17 Nov 2004||8 Dec 2009||Amkor Technology, Inc.||Shielded package having shield fence|
|US7633765||5 Dec 2005||15 Dec 2009||Amkor Technology, Inc.||Semiconductor package including a top-surface metal layer for implementing circuit features|
|US7659604 *||17 Mar 2005||9 Feb 2010||Panasonic Corporation||Module component and method for manufacturing the same|
|US7663214||25 Jul 2005||16 Feb 2010||Kingston Technology Corporation||High-capacity memory card and method of making the same|
|US7671457||9 Nov 2006||2 Mar 2010||Amkor Technology, Inc.||Semiconductor package including top-surface terminals for mounting another semiconductor package|
|US7755556||11 Jul 2008||13 Jul 2010||Forster Ian J||Energy source communication employing slot antenna|
|US7825520||5 May 2009||2 Nov 2010||Amkor Technology, Inc.||Stacked redistribution layer (RDL) die assembly package|
|US7851894||23 Dec 2008||14 Dec 2010||Amkor Technology, Inc.||System and method for shielding of package on package (PoP) assemblies|
|US7898066||25 May 2007||1 Mar 2011||Amkor Technology, Inc.||Semiconductor device having EMI shielding and method therefor|
|US7915715||25 Nov 2008||29 Mar 2011||Amkor Technology, Inc.||System and method to provide RF shielding for a MEMS microphone package|
|US7960827||9 Apr 2009||14 Jun 2011||Amkor Technology, Inc.||Thermal via heat spreader package and method|
|US8012868||15 Dec 2008||6 Sep 2011||Amkor Technology Inc||Semiconductor device having EMI shielding and method therefor|
|US8018068||28 Oct 2009||13 Sep 2011||Amkor Technology, Inc.||Semiconductor package including a top-surface metal layer for implementing circuit features|
|US8026587||10 Jun 2010||27 Sep 2011||Amkor Technology, Inc.||Semiconductor package including top-surface terminals for mounting another semiconductor package|
|US8058714 *||25 Sep 2008||15 Nov 2011||Skyworks Solutions, Inc.||Overmolded semiconductor package with an integrated antenna|
|US8064217 *||5 Sep 2007||22 Nov 2011||Samsung Electro-Mechanics Co., Ltd.||Component embedded printed circuit board|
|US8102032||9 Dec 2008||24 Jan 2012||Amkor Technology, Inc.||System and method for compartmental shielding of stacked packages|
|US8110909||5 Jan 2010||7 Feb 2012||Amkor Technology, Inc.||Semiconductor package including top-surface terminals for mounting another semiconductor package|
|US8129824||3 Dec 2008||6 Mar 2012||Amkor Technology, Inc.||Shielding for a semiconductor package|
|US8199518||18 Feb 2010||12 Jun 2012||Amkor Technology, Inc.||Top feature package and method|
|US8203203||27 Sep 2010||19 Jun 2012||Amkor Technology, Inc.||Stacked redistribution layer (RDL) die assembly package|
|US8216502||2 Dec 2008||10 Jul 2012||Tesla Motors, Inc.||Method for the external application of battery pack encapsulant|
|US8222538||12 Jun 2009||17 Jul 2012||Amkor Technology, Inc.||Stackable via package and method|
|US8227338||1 Aug 2011||24 Jul 2012||Amkor Technology, Inc.||Semiconductor package including a top-surface metal layer for implementing circuit features|
|US8237260 *||26 Nov 2008||7 Aug 2012||Infineon Technologies Ag||Power semiconductor module with segmented base plate|
|US8293393||29 Mar 2012||23 Oct 2012||Tesla Motors, Inc.||Apparatus for the external application of battery pack encapsulant|
|US8294276||27 May 2010||23 Oct 2012||Amkor Technology, Inc.||Semiconductor device and fabricating method thereof|
|US8300423||25 May 2010||30 Oct 2012||Amkor Technology, Inc.||Stackable treated via package and method|
|US8337657||27 Oct 2010||25 Dec 2012||Amkor Technology, Inc.||Mechanical tape separation package and method|
|US8338229||30 Jul 2010||25 Dec 2012||Amkor Technology, Inc.||Stackable plasma cleaned via package and method|
|US8341835||5 May 2009||1 Jan 2013||Amkor Technology, Inc.||Buildup dielectric layer having metallization pattern semiconductor package fabrication method|
|US8362597||23 Oct 2009||29 Jan 2013||Amkor Technology, Inc.||Shielded package having shield lid|
|US8471154||6 Aug 2009||25 Jun 2013||Amkor Technology, Inc.||Stackable variable height via package and method|
|US8482134||1 Nov 2010||9 Jul 2013||Amkor Technology, Inc.||Stackable package and method|
|US8508023||17 Jun 2010||13 Aug 2013||Amkor Technology, Inc.||System and method for lowering contact resistance of the radio frequency (RF) shield to ground|
|US8525318||10 Nov 2010||3 Sep 2013||Amkor Technology, Inc.||Semiconductor device and fabricating method thereof|
|US8535961||9 Dec 2010||17 Sep 2013||Amkor Technology, Inc.||Light emitting diode (LED) package and method|
|US8536462||22 Jan 2010||17 Sep 2013||Amkor Technology, Inc.||Flex circuit package and method|
|US8552539||9 Jan 2013||8 Oct 2013||Amkor Technology, Inc.||Shielded package having shield lid|
|US8557629||3 Dec 2010||15 Oct 2013||Amkor Technology, Inc.||Semiconductor device having overlapped via apertures|
|US8623753||28 May 2009||7 Jan 2014||Amkor Technology, Inc.||Stackable protruding via package and method|
|US8629546||4 Jun 2012||14 Jan 2014||Amkor Technology, Inc.||Stacked redistribution layer (RDL) die assembly package|
|US8633598||20 Sep 2011||21 Jan 2014||Amkor Technology, Inc.||Underfill contacting stacking balls package fabrication method and structure|
|US8653674||15 Sep 2011||18 Feb 2014||Amkor Technology, Inc.||Electronic component package fabrication method and structure|
|US8683684||5 Oct 2011||1 Apr 2014||Samsung Electro-Mechanics Co., Ltd.||Method of manufacturing component embedded printed circuit board|
|US8698323 *||18 Jun 2012||15 Apr 2014||Invensas Corporation||Microelectronic assembly tolerant to misplacement of microelectronic elements therein|
|US8704368||20 Jun 2012||22 Apr 2014||Amkor Technology, Inc.||Stackable via package and method|
|US8717775||2 Aug 2010||6 May 2014||Amkor Technology, Inc.||Fingerprint sensor package and method|
|US8724339 *||1 Dec 2009||13 May 2014||Apple Inc.||Compact media player|
|US8753730||19 Nov 2012||17 Jun 2014||Amkor Technology, Inc.||Mechanical tape separation package|
|US8796561||5 Oct 2009||5 Aug 2014||Amkor Technology, Inc.||Fan out build up substrate stackable package and method|
|US8837163 *||27 Dec 2011||16 Sep 2014||Apple Inc.||Integrated flex tail circuit packaging|
|US8890329||25 Apr 2012||18 Nov 2014||Amkor Technology, Inc.||Semiconductor device|
|US8890337||10 Jan 2014||18 Nov 2014||Amkor Technology, Inc.||Column and stacking balls package fabrication method and structure|
|US8937381||3 Dec 2009||20 Jan 2015||Amkor Technology, Inc.||Thin stackable package and method|
|US8941250||17 Feb 2014||27 Jan 2015||Amkor Technology, Inc.||Electronic component package fabrication method and structure|
|US8946886||13 May 2010||3 Feb 2015||Amkor Technology, Inc.||Shielded electronic component package and method|
|US9012789||7 Apr 2014||21 Apr 2015||Amkor Technology, Inc.||Stackable via package and method|
|US9013011||11 Mar 2011||21 Apr 2015||Amkor Technology, Inc.||Stacked and staggered die MEMS package and method|
|US9029962||12 Oct 2011||12 May 2015||Amkor Technology, Inc.||Molded cavity substrate MEMS package fabrication method and structure|
|US9123718||9 Sep 2013||1 Sep 2015||Amkor Technology, Inc.||Shielded package having shield lid|
|US9159635||27 May 2012||13 Oct 2015||Mc10, Inc.||Flexible electronic structure|
|US9168094||15 Mar 2013||27 Oct 2015||Mc10, Inc.||Catheter device including flow sensing|
|US9171794||15 Mar 2013||27 Oct 2015||Mc10, Inc.||Embedding thin chips in polymer|
|US9177932||16 Sep 2013||3 Nov 2015||Amkor Technology, Inc.||Semiconductor device having overlapped via apertures|
|US9186060||9 Aug 2013||17 Nov 2015||Mc10, Inc.||Systems, methods and devices having stretchable integrated circuitry for sensing and delivering therapy|
|US9226402||15 Mar 2013||29 Dec 2015||Mc10, Inc.||Strain isolation structures for stretchable electronics|
|US9289132||7 Oct 2009||22 Mar 2016||Mc10, Inc.||Catheter balloon having stretchable integrated circuitry and sensor array|
|US9295842||3 Jan 2014||29 Mar 2016||Mc10, Inc.||Catheter or guidewire device including flow sensing and use thereof|
|US9350079 *||5 May 2014||24 May 2016||Semiconductor Energy Laboratory Co., Ltd.||Wireless chip and electronic device having wireless chip|
|US9372123||5 Aug 2014||21 Jun 2016||Mc10, Inc.||Flexible temperature sensor including conformable electronics|
|US9391043||22 May 2015||12 Jul 2016||Amkor Technology, Inc.||Semiconductor device and manufacturing method thereof|
|US9408305||20 Nov 2015||2 Aug 2016||Mc10, Inc.||Strain isolation structures for stretchable electronics|
|US9433117||18 May 2012||30 Aug 2016||Amkor Technology, Inc.||Shield lid interconnect package and method|
|US9496210||7 Jun 2013||15 Nov 2016||Amkor Technology, Inc.||Stackable package and method|
|US9516758||17 Sep 2014||6 Dec 2016||Mc10, Inc.||Extremely stretchable electronics|
|US9543242||11 Aug 2015||10 Jan 2017||Amkor Technology, Inc.||Semiconductor package and fabricating method thereof|
|US9545216||6 Aug 2012||17 Jan 2017||Mc10, Inc.||Catheter balloon methods and apparatus employing sensing elements|
|US9545285||5 Oct 2012||17 Jan 2017||Mc10, Inc.||Cardiac catheter employing conformal electronics for mapping|
|US9554850||2 Oct 2015||31 Jan 2017||Mc10, Inc.||Catheter device including flow sensing|
|US9564688||16 May 2016||7 Feb 2017||Semiconductor Energy Laboratory Co., Ltd.||Wireless chip and electronic device having wireless chip|
|US9579040||4 Sep 2012||28 Feb 2017||Mc10, Inc.||Electronics for detection of a condition of tissue|
|US9583428||18 Sep 2015||28 Feb 2017||Mc10, Inc.||Embedding thin chips in polymer|
|US9595509 *||8 Sep 2015||14 Mar 2017||Nxp Usa, Inc.||Stacked microelectronic package assemblies and methods for the fabrication thereof|
|US9603287 *||15 Dec 2015||21 Mar 2017||Industrial Technology Research Institute||Integrated power module|
|US9622680||29 May 2015||18 Apr 2017||Mc10, Inc.||Catheter balloon methods and apparatus employing sensing elements|
|US9655560||15 Mar 2013||23 May 2017||Mc10, Inc.||Catheter balloon having stretchable integrated circuitry and sensor array|
|US9662069||27 Oct 2015||30 May 2017||Mc10, Inc.||Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy|
|US9691635||16 Nov 2012||27 Jun 2017||Amkor Technology, Inc.||Buildup dielectric layer having metallization pattern semiconductor package fabrication method|
|US9691734||7 Dec 2009||27 Jun 2017||Amkor Technology, Inc.||Method of forming a plurality of electronic component packages|
|US9702839||9 Mar 2012||11 Jul 2017||Mc10, Inc.||Integrated devices to facilitate quantitative assays and diagnostics|
|US9704747||18 Mar 2014||11 Jul 2017||Amkor Technology, Inc.||Semiconductor device and manufacturing method thereof|
|US9704842||4 Nov 2014||11 Jul 2017||Amkor Technology, Inc.||Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package|
|US9704908||29 Jul 2015||11 Jul 2017||Mc10, Inc.||Methods and applications of non-planar imaging arrays|
|US9721872||16 Feb 2012||1 Aug 2017||Amkor Technology, Inc.||Methods and structures for increasing the allowable die size in TMV packages|
|US9723122||1 Oct 2010||1 Aug 2017||Mc10, Inc.||Protective cases with integrated electronics|
|US9723711||5 Aug 2015||1 Aug 2017||Mc10, Inc.||Method for fabricating a flexible electronic structure and a flexible electronic structure|
|US9728514||11 Jul 2016||8 Aug 2017||Amkor Technology, Inc.||Semiconductor device and manufacturing method thereof|
|US9730327||13 Mar 2015||8 Aug 2017||Amkor Technology, Inc.||Stackable via package and method|
|US9748154||4 Nov 2010||29 Aug 2017||Amkor Technology, Inc.||Wafer level fan out semiconductor device and manufacturing method thereof|
|US9750421||18 Feb 2016||5 Sep 2017||Mc10, Inc.||Catheter or guidewire device including flow sensing and use thereof|
|US9757050||15 Mar 2013||12 Sep 2017||Mc10, Inc.||Catheter balloon employing force sensing elements|
|US9801557||18 Feb 2016||31 Oct 2017||Mc10, Inc.||Catheter or guidewire device including flow sensing and use thereof|
|US9810623||12 Mar 2015||7 Nov 2017||Mc10, Inc.||Quantification of a change in assay|
|US9812386||23 Dec 2014||7 Nov 2017||Amkor Technology, Inc.||Encapsulated semiconductor package|
|US20020098623 *||21 Feb 2002||25 Jul 2002||Salman Akram||Semiconductor device including leads in communication with contact pads thereof and a stereolithographically fabricated package substantially encapsulating the leads and methods for fabricating the same|
|US20020130817 *||16 Mar 2001||19 Sep 2002||Forster Ian J.||Communicating with stackable objects using an antenna array|
|US20030030122 *||1 Oct 2002||13 Feb 2003||Salman Akram||Method for sawing wafers employing multiple indexing techniques for multiple die dimensions|
|US20030181846 *||19 Dec 2002||25 Sep 2003||Young Wendy A.||Reservoir housing having a conductive region integrally formed therein|
|US20040036657 *||24 Apr 2003||26 Feb 2004||Forster Ian J.||Energy source communication employing slot antenna|
|US20040080299 *||24 Apr 2003||29 Apr 2004||Forster Ian J.||Energy source recharging device and method|
|US20040089282 *||5 Nov 2003||13 May 2004||Salman Akram||Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus|
|US20040106376 *||24 Apr 2003||3 Jun 2004||Forster Ian J.||Rechargeable interrogation reader device and method|
|US20040129786 *||1 Feb 2002||8 Jul 2004||Yves Reignoux||Portable object with chip and antenna|
|US20040188123 *||18 Mar 2003||30 Sep 2004||Peterson Darin L.||Microelectronic component assemblies having exposed contacts|
|US20040191963 *||31 Mar 2003||30 Sep 2004||Osram Opto Semiconductors Gmbh||Encapsulation of thin-film electronic devices|
|US20040251540 *||7 May 2004||16 Dec 2004||Shuji Eguchi||Semiconductor module and mounting method for same|
|US20040256740 *||13 Jul 2004||23 Dec 2004||Salman Akram||Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof|
|US20050001214 *||21 Oct 2002||6 Jan 2005||Jean Brun||Micro- or nano-electronic component comprising a power source and means for protecting the power source|
|US20050009300 *||16 Jul 2004||13 Jan 2005||Stmicroelectronics S.R.L.||Electronic semiconductor device having a thermal spreader|
|US20050074922 *||24 Sep 2004||7 Apr 2005||Lintec Corporation||Process for producing resin-sealed type electronic device|
|US20050193554 *||7 Apr 2005||8 Sep 2005||Young Wendy A.||Method of making a housing for drug delivery|
|US20050215944 *||7 Apr 2005||29 Sep 2005||Young Wendy A||Reservoir housing having a conductive region integrally formed therein|
|US20050283794 *||16 May 2005||22 Dec 2005||Samsung Electronics Co., Ltd.||Anti-hacking printed circuit board having high-molecular material deposited thereon and deposition method for the same|
|US20060010685 *||9 Dec 2004||19 Jan 2006||Fujitsu Limited||RFID tag and method of manufacturing RFID tag|
|US20060258050 *||17 Mar 2005||16 Nov 2006||Joji Fujiwara||Module component and method for manufacturing the same|
|US20060281227 *||14 Jun 2005||14 Dec 2006||Miradia Inc.||Bond method and structure using selective application of spin on glass|
|US20060290583 *||31 Aug 2006||28 Dec 2006||Mineral Lassen Llc||Energy source communication employing slot antenna|
|US20070018297 *||25 Jul 2005||25 Jan 2007||Kingston Technology Company, Inc.||High-capacity memory card and method of making the same|
|US20070216593 *||21 May 2007||20 Sep 2007||Mineral Lassen Llc||Energy source communication employing slot antenna|
|US20080055863 *||5 Sep 2007||6 Mar 2008||Samsung Electro-Mechanics Co., Ltd.||Method of manufacturing as component embedded printed circuit board|
|US20080086867 *||4 Oct 2007||17 Apr 2008||Kerr Geoffrey H||Circuit component locating apparatus|
|US20080293455 *||11 Jul 2008||27 Nov 2008||Mineral Lassen Llc||Energy source communication employing slot antenna|
|US20100073255 *||25 Sep 2008||25 Mar 2010||Skyworks Solutions, Inc.||Overmolded semiconductor package with an integrated antenna|
|US20100127371 *||26 Nov 2008||27 May 2010||Infineon Technologies Ag||Power semiconductor module with segmented base plate|
|US20100136413 *||2 Dec 2008||3 Jun 2010||Tesla Motors, Inc.||Method and apparatus for the external application of battery pack encapsulant|
|US20110019370 *||27 Jul 2009||27 Jan 2011||Gainteam Holdings Limited||Flexible circuit module|
|US20110128712 *||1 Dec 2009||2 Jun 2011||Prest Christopher D||Compact media player|
|US20110204497 *||14 Feb 2011||25 Aug 2011||Renesas Electronics Corporation||Semiconductor integrated circuit and method for manufacturing the same|
|US20130163210 *||27 Dec 2011||27 Jun 2013||Apple Inc.||Integrated flex tail circuit packaging|
|US20140240175 *||5 May 2014||28 Aug 2014||Semiconductor Energy Laboratory Co., Ltd.||Wireless chip and electronic device having wireless chip|
|US20140240937 *||6 May 2014||28 Aug 2014||Apple Inc.||Compact Media Player|
|US20150008566 *||1 Jul 2014||8 Jan 2015||Texas Instruments Incorporated||Method and structure of panelized packaging of semiconductor devices|
|USD781270||15 Oct 2014||14 Mar 2017||Mc10, Inc.||Electronic device having antenna|
|EP1120823A2 *||21 Dec 2000||1 Aug 2001||Nec Corporation||Semiconductor device substrate and method of manufacturing semiconductor device|
|EP1120823A3 *||21 Dec 2000||2 Jan 2004||NEC Compound Semiconductor Devices, Ltd.||Semiconductor device substrate and method of manufacturing semiconductor device|
|EP1143508A2 *||23 Mar 2001||10 Oct 2001||Infineon Technologies AG||Apparatus for packaging electronic components|
|EP1143508A3 *||23 Mar 2001||23 Jun 2004||Infineon Technologies AG||Apparatus for packaging electronic components|
|EP1162661A1 *||6 Jun 2000||12 Dec 2001||SGS-THOMSON MICROELECTRONICS S.r.l.||Electronic semiconductor device having a heat spreader|
|EP1521304A3 *||21 Sep 2004||11 Oct 2006||LINTEC Corporation||Process for producing resin-sealed type electronic device|
|EP1610598A1 *||21 Jun 2005||28 Dec 2005||Samsung Electronics Co., Ltd.||Anti-hacking printed circuit board having high-molecular material deposited thereon and deposition method for the same|
|EP1937039A1 *||17 Nov 2007||25 Jun 2008||Albea Kunstofftechnik GmbH||Membrane structure with at least one antenna|
|EP2320356A1 *||25 Oct 2010||11 May 2011||Giesecke & Devrient GmbH||Method for manufacturing inlays for card-shaped data carriers|
|EP2924725A1 *||25 Mar 2014||30 Sep 2015||ABB Technology Ltd||Electric module for subsea applications|
|WO1999047332A1 *||16 Mar 1999||23 Sep 1999||Cardxx, Inc.||Method for making smart cards using isotropic thermoset adhesive materials|
|WO2002031881A1 *||11 Oct 2001||18 Apr 2002||Tyco Electronics Amp Gmbh||Electronic unit and process for the production thereof|
|WO2003036719A2 *||21 Oct 2002||1 May 2003||Commissariat A L'energie Atomique||Micro- or nano-electronic component comprising a power source and means for protecting the power source|
|WO2003036719A3 *||21 Oct 2002||4 Mar 2004||Commissariat Energie Atomique||Micro- or nano-electronic component comprising a power source and means for protecting the power source|
|WO2009000636A1 *||9 Jun 2008||31 Dec 2008||Nagraid S.A.||Method for manufacturing boards including at least one electronic module, assembly used in said method and intermediate product|
|WO2015144721A1 *||24 Mar 2015||1 Oct 2015||Abb Technology Ltd||Electric module for subsea applications|
|WO2016003482A1 *||27 Oct 2014||7 Jan 2016||Mc10, Inc.||Conformal electronic devices|
|U.S. Classification||361/760, 257/E23.14, 257/E25.012, 257/E21.705, 257/679, 174/525, 174/260, 361/749, 29/841, 257/E23.177, 257/787, 235/491, 343/702|
|International Classification||H01L23/24, H01L23/538, H01L25/065, H05K3/28, H01L21/98, H05K1/18, H01L23/58|
|Cooperative Classification||H01L2924/01082, H01L2924/01006, H01L2223/6677, H01L23/58, H01L25/50, H05K3/284, H01L23/24, H01L24/97, H01L2924/01027, H01L2924/19043, H01L2924/01005, H01L23/5387, H01L2924/14, Y10T29/4913, H01L2224/97, H01L2924/01033, H01L2924/01047, Y10T29/49146, H01L25/0655, H05K1/189|
|European Classification||H01L24/97, H01L25/50, H01L25/065N, H01L23/24, H01L23/538J, H01L23/58|
|1 Nov 2002||FPAY||Fee payment|
Year of fee payment: 4
|3 Nov 2006||FPAY||Fee payment|
Year of fee payment: 8
|13 Sep 2007||AS||Assignment|
Owner name: KEYSTONE TECHNOLOGY SOLUTIONS, LLC, IDAHO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:019825/0542
Effective date: 20070628
Owner name: KEYSTONE TECHNOLOGY SOLUTIONS, LLC,IDAHO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:019825/0542
Effective date: 20070628
|4 Jan 2010||AS||Assignment|
Owner name: ROUND ROCK RESEARCH, LLC,NEW YORK
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:023786/0416
Effective date: 20091223
Owner name: ROUND ROCK RESEARCH, LLC, NEW YORK
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:023786/0416
Effective date: 20091223
|26 Jan 2010||AS||Assignment|
Owner name: MICRON TECHNOLOGY, INC., IDAHO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KEYSTONE TECHNOLOGY SOLUTIONS, LLC;REEL/FRAME:023839/0881
Effective date: 20091222
Owner name: MICRON TECHNOLOGY, INC.,IDAHO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KEYSTONE TECHNOLOGY SOLUTIONS, LLC;REEL/FRAME:023839/0881
Effective date: 20091222
|28 Oct 2010||FPAY||Fee payment|
Year of fee payment: 12