|Publication number||US3913219 A|
|Publication date||21 Oct 1975|
|Filing date||24 May 1974|
|Priority date||24 May 1974|
|Also published as||CA1030271A, CA1030271A1, DE2523002A1, DE2523002C2|
|Publication number||US 3913219 A, US 3913219A, US-A-3913219, US3913219 A, US3913219A|
|Inventors||George Jay Lichtblau|
|Original Assignee||Lichtblau G J|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (11), Referenced by (168), Classifications (58), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
United States Patent [191 'Lichtblau [4 1 Oct. 21, 1975 1 PLANAR CIRCUIT FABRICATION PROCESS  Inventor: George Jay Lichtblau, 425 E. 63rd St., New York, NY. 10021  Filed: May 24, 1974  Appl. No.: 473,187
 US. Cl. 29/592; 29/25.42; 29/625;
7 174/685; 317/101 F; 317/256  Int. Cl. 1105K 3/06; HOlG 7/00  Field of Search 29/625, 2542, 592, 602;
174/685; 204/15, 23, 32 R, 129.6, 129.6 S; 156/3, 6, 8, 13; 317/101 B, 101 F, 101 A, 242, 256; 117/931 R, 93.1 CD
3,448,516 6/1969 Buck 29/625 3,484,731 12/1969 Rich 29/625 X 3,485,688 12/1969 lrvine 174/685 X 3,655,496 4/1972 Ettre 174/685 UX 3,678,437 7/19'72 Vaden 174/685 X 3,678,577 7/1972 Weglin et a1 174/685 X 3,808,680 5/1974 Lafrate et al 29/625 Primary ExaminerC. W. Lanham Assistant ExaminerJoseph A. Walkowski Attorney, Agent, or FirmWeingarten, Maxham & Schurgin  ABSTRACT A process for the high volume fabrication of planar electrical circuits having precision electrical characteristics and especially adapted for use in electronic security systems employing resonant circuits. A multiplicity of circuits are formed by high speed printing techniques on opposite surfaces of an insulative web and the individual circuits separated for use.
30 Claims, 12 Drawing Figures FIG.
, US. Patent Oct. 21, 1975 She et2of3 3,913,219
Oct. 21, 1975 U.S. Patent v Sheet3of3 3,913,219
ETCHANT A SOURCE H iVIOO PUMP WATER 08 RINSE DRYER v crzr-cr-rznzv-crj \IIZ \,||4 M98 7 gi j PUMP \w'oe FIG 8 F IG. 9 I24 ULTRA c -WEL q us FIG.
PLANAR CIRCUIT FABRICATION PROCESS FIELD OF THE INVENTION This invention relates to the fabrication of flexible planar printed circuits and more particularly to the fabrication of planar resonant circuits having precision electrical characteristics.
BACKGROUND OF THE INVENTION Techniques are known for fabricating printed circuits and flexible printed circuits but such techniques have not been wholly satisfactory for the volume production of low cost circuits required for many purposes. For example, in electronic security systems such as shown in copending applications Ser. Nos. 214,361 and 262,465 of the same inventor as herein, a resonant circuit affixed as a tag to an item being protected is electronically interrogated at a controlled area to determine tag presence and upon such detection is electronically altered to destroy the resonant properties of the tag circuit at its detection frequency. The tag circuits are often expendable and are only used once, such as on items sold in retail store, and are useable in great quantities. Thus, the unit cost should be extremely low to not markedly affect the economies of maintaining an electronic security system. With conventional printed circuit techniques, the circuit pattern is applied to a substrate by silk screening or by photoprocessing techniques. The silk screening technique is slow and often requires considerable skilled labor especially in producing high accuracy circuits. Photoprocessing tech niques are complex and require the use of expensive chemicals. In both techniques special surface treatment of the substrateand deposited conductive layers must often be employed, thereby increasing the overall complexity of the fabrication process. In most conventional printed circuit processes, cleaning and washing steps are'employed after each stage of the process, which adds tooverall cost and complexity.
SUMMARY OF THE INVENTION According to the invention, a circuit fabrication process is provided for the high volume production of resonant tag and other high accuracy circuits at extremely low cost and in a highly automated manner. The invention makes use of high speed printing techniques utilized in a unique processing sequence which does not require special surface treatments during the process. At an initial stage of the novel process, an electrically insulative substrate is provided having directly bonded on each opposite surface thereof a conductive foil. The thickness of the insulative substrate is maintained to an accurate tolerance commensurate with the intended resonant properties of a completed tag circuit, which is formed by planar patterns on both conductive surfaces. The'dielectric properties of the substrate are also selected to yield intended electrical properties in a completed circuit.
DESCRIPTION OF THE DRAWINGS The invention will be more fully understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a pictorial view of one side of a resonant tag circuit fabricated according to the invention;
FIG. 2 is a pictorial view of the opposite side of the resonant tag.circuit of FIG. 1;
FIG. 3 is a schematic diagram of the equivalent electrical circuit of the resonant tag circuit of FIGS. 1 and 2;
FIG. 4 is a diagrammatic representation showing the fabrication of the circuit substrate web;
FIG. 5 is a diagrammatic representation showing the provision of a conductive surface on both sides of the substrate;
FIG. 6 is a diagrammatic representation of a printing station at which the circuit patterns are provided on the conductive surfaces;
FIG. 7 is a pictorial representation of a plurality of planar circuits formed on a surface of the substrate web;
FIG. 8 is a diagrammatic representation of an etching station at which the circuit patterns are etched on the conductive surfaces;
FIG. 9 is a diagrammatic representation of ultrasonic welding apparatus useful in the invention;
FIG. 10 is a pictorial representation of a preferred welding tip configuration useful in the invention;
FIG. 1 1 is a diagrammatic representation showing the formation of individual tag circuits between paper layers; and
FIG. 12 is a diagrammatic representation showing a plurality of planar circuits adhered to a release layer.
DETAILED DESCRIPTION OF THE INVENTION The novel process is especially useful in providing resonant tag circuits such as described in the aforesaid copending applications relating to electronic security systems for preventing the unauthorized removal of items from a controlled area. The resonant tag circuit itself is shown in FIGS. 1 and 2, which respectively depict the opposite planar surfaces of the tag. Referring to FIG. 1, there is shown a rectangular spiral conductive path 10 extending between an outer conductive area 12 and an inner conductive area 14. A conductive path 16 also extends from conductive area 12 around the periphery of path 10 to a conductive area 18.
On the opposite surface of the tag, shown in FIG. 2, conductive areas 20 and 22 are provided in registration with respective conductive areas 12 and 14 and are interconnected by a conductive path 24. A conductive area 26 is provided in registration with conductive area 18 and is coupled to area 20 by a relatively narrow conductive path 28. The conductive areas 12 and 14 are cooperative with corresponding conductive areas 20 and 22 to provide first and second capacitors for the tag circuit. First and second inductors are provided by conductive paths l0 and 16, respectively. The conductive path 28 serves as a fusible link which during operation of the electronic security system can be electrically destroyed to alter the resonant properties of the tag circuit, as described in the aforesaid copending application. A conductive interconnection 21 couples areas 18 and 26 to complete the circuit.
The resonant circuit provided by the tag of FIGS. 1 and 2 is shown in electrical schematic form in FIG. 3, and it will be appreciated that this circuit configuration provides two resonant frequencies. The conductive paths l0 and 16 serve as respective inductors L2 and L1 of the resonant circuit. The conductive areas 12 and 20 separated by the interposed substrate serve as eapacitor C1, while capacitor C2 is formed by the conductive areas 14 and 22. The series combination composed of inductors L1, L2 and capacitor C2 are tuned to a detection frequency. The loop composed of inductor L1 and capacitor C1 is tuned to a destruction frequency. Destruction of the resonant properties of the tag at the detection frequency is accomplished by application of energy at the destruction frequency to cause fusing of link 28.
In the electronic security system of the copending applications, a first resonant frequency is provided for detection of tag presence at a controlled zone, while a second resonant frequency is provided for destruction of the fusible link of the tag to thus destroy tag resonance at the first or detection frequency. As a result, the presence of a tag at a controlled zone having a detectable first resonant frequency is indicative of the unauthorized removal of an item bearing the tag. When an item bearing a tag is to be properly removed from the controlled area, the fusible link is first destroyed by application of energy at the second resonant frequency to destroy the resonant properties of the tag at the detection frequency, such that the tag can be removed from the controlled area without causing an alarm.
Resonant circuits of the type described above require very accurate dimensions and tolerances to achieve requisite resonant properties. The substrate material thickness must be within relatively close tolerances, as should the thickness of the conductive films provided on the substrate surfaces and the dimensions of the conductive patterns thereon. Moreover, the relatively close tolerances must be achievable on a high volume production basis at relatively low cost to be economically realistic for commercial use, especially where a tag circuit is to be expendable such as after a single use.
As an initial step of the novel process for fabricating a resonant tag circuit such as that shown above, both sides of a web of insulative material which forms the substrate of the tag circuit are coated or laminated with a conductive material to serve as the conductive surfaces from which circuit patterns are formed. The substrate is an electrically'insulative material having a low dissipation factor ata frequency of interest and a stable dielectric constant; typically, plastic materials such as polyethylene, polypropylene, Teflon and polyisobutylene are suitable for the purpose. Polyethylene is especially preferred by reason of its low cost and its easy bondability to aluminum foil which is preferably employed for the conductive surfaces by reason of its relatively low cost. The conductive surfaces can also be of other materials providing the intended electrical conductivity such as silver or copper. The polyethylene film has a typical thickness of 0.001 inches with a thickness tolerance of 35%. The film is treated by corona discharge by passing the film between two charged plates providing an ionizing atmosphere therebetween, such that there is a constant static discharge between the plates and through the film. This treatment is similar to that employed for providing a printable surface on plastic material, and conditions the surface of the plastic so that it can be more easily bonded to the aluminum foil.
Fabrication of the substrate is illustrated diagrammatically in FIG. 4, wherein an extruder 40 having an extrusion die 42 produces a continuous web 44 of high density polyethylene or other suitable material onto a cooled metal plate 46. The film is then passed through corona discharge treating apparatus 48 such as charged plates 50 and 52 energized by source 54, after which the web is wound on a storage reel 56,or directed to the next processing station.
The layers of conductive material provided on both surfaces of the substrate web are preferably aluminum by reason of its good conductivity and relatively low cost. As shown in FIG. 5, aluminum foil layer 58 and 60 supplied from respective reels 62 and 64 are laminated to respective sides of the polyethylene web 44 provided from reel 66, with the dull side of the foil in contact with the substrate web, by means of heated pressure rollers 68 and 70, the laminated web 72 then being wound on a storage reel 74. The dull side of the aluminum foil is in contact with the substrate web to provide better bondability to the substrate than the opposite shiny aluminum surface. The dull side of the foil I has a greater surface roughness then the shiny surface and, therefore, provides greater surface area for bonding to the substrate. Moreover, the shiny surface, being of finer surface texture than the dull surface, contains less residual oil from the foil rolling process and thus ink adheres more readily to the shiny surface. Printing can be accomplished on the dull foil surface so long as the surface is sufficiently free of residual oil to permit adherence of ink. In the preferred implementation of the invention, no chemical cleaning of the conductive foil is required. Printing on the dull surface would usually require chemical or similar cleaning treatment prior to application of ink.
One aluminum foil is thicker than the other to provide lower electrical resistance for the inductive coils to be formed as part of the resonant tag circuit. The thinner aluminum foil provides the material for the fusible link and also minimizes the amount of aluminum needed to fabricate the circuit to thusconser've cost. Typically, the thicker foil is 0.002 inch'thickwhile the thinner foil is 0.00035 inch thick, with the aluminum being of type 1145 dead soft. The laminated web is trimmed to a suitable width for subsequent processing, a usual width of two feet being employed, the web being of any convenient length for reeled storage.
The laminated web isnext printed on both surfaces of the aluminum foil with the particular patterns required for the resonant tags being produced. Aplurality of repetitive patterns is printed across the width of the laminated web to provide a plurality of resonant tags which are subsequently separated for'individual use. Printing is preferably accomplished in a web fed rotogravure press having accurate control of front to back registration. The ink is of a type providing good coverage with substantially no pin holes or other breaks which would affect circuit formation. The print rollers of the press are configured to promote maximum ink coverage and the ink is preferably a black carbon filled nitrocellulose based lacquer or a vinyl based ink. As an example, black nitrocellulose ink, Sun Chemical Co. No. 73793 has been employed, the ink being diluted in a solvent containing in approximate proportions one third toluol, one third ethyl acetate and one third ethyl alcohol. The ink is diluted until a viscosity is achieved for intended ink coverage, and printing of the circuit patterns on the aluminum surfaces is accomplished by a rotogravure press operating with a web speed of 200 feet per minute. a a
Referring to FIG. 6, the circuit pattern is printed on aluminum surface 76 by print roller 78working in cooperation with backing roller 80, while printing of the circuit pattern on the opposite surface 82 is accomplished by print roller 84 and cooperative backing roller 86. Drying apparatus 88 and 90 can be provided for drying the ink at each application station. Such apparatus can include heaters for heating the ink to cause greater fusion to the aluminum surface as is desirable for certain types of ink such as a vinyl based ink. The heat is sufficient to melt the vinyl which is in suspension in the ink composition to cause fusion of the vinyl particles to each other and to the aluminum to thereby more efficiently bond the ink to the aluminum surface.
The respective circuit patterns are formed on the opposite surfaces of the laminated web in a repetitive manner, such as shown in FIG. 7, which depicts a plurality of circuit patterns 91 repetitively printed on the aluminum surface of the web. The corresponding circuit pattern on the opposite aluminum surface of the web is similarly printed in registered positions with the illustrated patterns to form a repetitive array of planar circuits which can subsequently be separated for individual use. Also printed with the circuit patterns 91 can be registration marks 92, the edges of which can be photoelectrically or otherwise sensed in known manner to maintain registration of the tag circuits with the processing apparatus. Similar registration marks are provided in alignment with marks 92 on the opposite web surface. For mechanical registration, holes 96 can be punched or otherwise formed at predetermined positions through the web with respect to the tag circuits printed thereon, such mechanical registration being generally less expensive than photoelectric registration systems. The position at which the registration holes are punched can be determined by photoelectric or other suitable means for sensing the position at which a hole is to be punched, or a position from which the hole location can be determined. For example, the holes can be punched at positions determined by target marks 94 printed at the desired locations along with printing of the circuit pattern.
Depending upon the layout of a particular processing facility, the web can next be directed to an etching station, or if the etching facility is located at a different site the web is rewound and conveyed to the etching facility. At an etching station, shown in FIG. 8, the printed web 98 is passed through continuous spray etching apparatus 100 having an etchant source 102, pumps 104 and 106, and nozzles 108 and 110 adjacent respective opposite surfaces of web 98, to chemically remove all unprinted aluminum foil on both sides of the web. The web is then passed through water rinse apparatus 112 which washes off remaining chemicals, after which the web is conveyed through an air dryer 114 to dry the thus processed web. The web can then be rewound onto a reelfor conveyance to the next processing facility or if a continuous facility is employed the web is directly transported to the next processing station. The registration marks 92 remain after etching and the underlying foil areas interconnect the adjacent circuit patterns and serve to enhance the structural strength thereof during further processing.
During the etching process, the printing ink is not removed, thereby providing considerable saving of processing time and cost. The etchant typically is a dilute ferric chloride solution applied in a spray with accurate control of temperature, concentration and pump pressure in conjunction with the web speed employed in a particular process. Since the two sides of aluminum are of different thicknesses, it is usually desired to employ different pump pressures for the etchant applied to respective surfaces of the web or to provide increased line widths on the thinner aluminum surface to compensate for the different etching speeds.
The roll of etched tags is usually next slit into narrower rolls, say two tags wide, to permit processing in an economical manner on commercially standard label processing equipment. It will be appreciated that such slitting of the web is not a necessity but is convenient to allow employment of available processing apparatus.
In order to provide an electrical connection between the two conductive patterns of the planar resonant circuit, the conductive patterns on respective web surfaces are interconnected through the ink pattern and the substrate typically by welding of the confronting conductive surfaces. Such weld can be made by conveying each tag circuit to an ultrasonic welder 116, as shown in FIG. 9, which includes a welding tip 118 which presses the circuit 120 at an intended position between the tip and a heated base 122 for a predetermined dwell time. The heated base is useful to soften the substratefilm of circuit 120 to permit the use of substantially lower ultransonic welding power and lower clamping force than if the web were unheated during the welding operation. The ultrasonic welder operates typically at a frequency of 40 KHz with an input power of 40 watts. The dwell time, welding time, temperature and clamping force are each variable to accommodate the particular materials being employed in the tag circuits being fabricated. Preferably, welding tip 118 has a flat end surface divided into four sectors 124 as shown in FIG. 10. By use of this sector tip configuration, the tip pressure is increased and four spot welds are provided for each application of the welding tip to the tag circuit. Individual tag circuits can be welded singly or two or more circuits can be simultaneously welded, as determined by the particular welding machinery employed in a particular process.
Welding techniques other than ultrasonic welding can also be employed to electrically interconnect the opposite conductive surfaces of the tag circuit. Cold welding techniques are also useful in performing this step of the novel process. Such cold welding can be acomplished by positioning a cold welding tool usually having a chisel-like tip configuration at the desired position with respect to a tag circuit supported by a suitable base and applying sufficient force to the cold welding tool to drive the tool through the laminated structure and cold-weld the confronting conductive surfaces. Cold welding is the preferred technique in many instances as it is usually faster than ultrasonic welding and requires relatively less expensive and complex welding apparatus to provide a reliable and repeatable weld. Other interconnection techniques can also be employed to provide the conductive through connection. When the invention is employed for the fabrication of circuits not requiring a conductive connection between opposite conductive patterns, this interconnection step can accordingly be eliminated.
The tag circuits are now in condition to be processed into individual tags. Referring to FIG. 11, the web 126 having the circuit patterns of FIGS. 1 and 7 on the upper surface thereof and the circuit patterns of FIG. 2 on the lower surface, is adhesively laminated to paper or other suitable sheet material by passing the web through pressure rollers 128 and 130 together with a paper or other sheet 132 having a pressure sensitive adhesive on the surface confronting web 126, and together with a release sheet 134 also having pressure sensitive adhesive on the surface confronting web 126. The laminated web is then fed to a rotary die cutter 136 which cuts out the waste material which is not part of the tag circuits; namely, the registration marks 92 which interconnect adjacent circuit patterns, as shown in FIG. 7. The die cutter is operative to cut through several layers of the web but not through the release sheet 134. The waste material adhered to sheet 132 is stripped away on sheet 132 and wound on a takeup reel 140, or otherwise disposed of. The separated tags 138 adhered to the release sheet 134 in the manner depicted in FIG. 12 are wound onto storage reel 142. The reel of tags can, if desired, be slit lengthwise to provide respective rolls of single tags.
For affixing to items being protected, individual tags are usually laminated between appropriate outer layers of paper, plastic or other material. Such outer surfaces can be provided by laminating the roll of tags and then cutting the individual tags from the laminated roll.
It will be appreciated that the novel process can be employed for the fabrication of printed circuits other than resonant tag circuits such as described above. The
particular substrate and conductive foil employed of course depend upon the requirements of the particular circuit, which govern the choice of materials having the requisite mechanical and electrical properties for the particular purpose. In the resonant tag fabrication described above, the aluminum foil is laminated to the substrate without the use of adhesives in order to maintain precise thickness tolerance and requisite dielectric properties of the substrate between the spaced conductive surfaces. For circuits that do not require a low dissipation factor or as precise a thickness tolerance, adhesives can be employed in affixing the conductive foil to the substrate. In addition, where thickness tolerance is not critical, the initial laminate can be made by extruding a layer of liquid plastic material between two spaced webs of aluminum or other conductive foil and then passing the extruded laminate through chilled rollers. While the rotogravure technique is preferred for printing the circuit patterns on the conductive foils, other printing techniques such as dry and wet offset techniques can also be employed.
It will also be appreciated that the novel process can be varied in particular aspects and can be practiced with different specific apparatus to accommodate the requirements of a particular operational process for the provision of different types of resonant or other planar circuits. It is not intended therefore to limit the invention by what has been shown and described except as indicated in the appended claims.
What is claimed is:
l. A method for fabricating a plurality of individual planar resonant tags each having at least one selfcontained operative tuned circuit with integrally formed circuit elements including at least one inductor and at least onecapacitor, said method comprising the steps of:
providing an insulative substrate web of material of predetermined thickness and dielectric characteristics and with a conductive surface on each opposite side thereof;
printing with an etchant-resistive material a first repetitive circuit pattern including the formation of at least one inductor and a conductive area serving as a portion :of said at least one capacitor on one conductive surface of said substrate web; printing with an etchant-resistive material a second repetitive circuit pattern on the other conductive surface of said substrate web in predetermined relation to said first repetitive circuit pattern and including the formation of a conductive area in alignment with the conductive area on said one conductive surface and serving as a portion of said at least one capacitor; said first and second printed circuit patterns providing said planar tags with said conductive areas and the interposed dielectric material provided by said substrate web defining said at least one capacitor;
etching said first and second circuit patterns to remove unprinted portions of said conductive surfaces on both sides of said substrate web thereby to provide repetitive first and second cooperative conductive circuit patterns conforming to said printed circuit patterns; and
separating cooperative circuit patterns to provide individual planar resonant tags.
2. The method according to claim I wherein said conductive surface providing step includes the steps of:
providing an electrically insulative web of material of predetermined thickness and having a low dissipation factor at a frequency of interest and a stable dielectric constant;
treating the opposite surfaces of said web by corona discharge to enhance the bonding characteristics of said surfaces; and I laminating first and second conductive foils respectively to said treated surfaces.
3. The method according to claim 1 wherein said separating step includes:
laminating said web containing said cooperative circuit patterns to at least a first sheet;
die cutting each of said cooperative circuit patterns representing an individual planar resonant tag from waste material; and
separating said waste material from said first sheet containing individual planar resonant tags.
4. The method according to claim 1 wherein said separating step includes: 1
laminating said web containing said cooperative circuit patterns to at least a first sheet;
die cutting each of said cooperative circuit patterns representing an individual planar resonant tag; and
removing from said first sheet said individual planar resonant tags. I
- 5. The method according to claim 1 wherein said conductive surface providing step includes the steps of:
providing an electrical insulative web of material of predetermined thickness and having a low dissipation factor at a frequency of interest and a stable dielectric constant;
treating the opposite surfaces of said web to enhance the bonding characteristic of said surfaces; and laminating first and second conductive foils respectively to said treated surfaces.
6. The method according to claim 1 wherein said printing steps include the printing of registration marks together with said circuit patterns on the respective conductive surfaces of said substrate web, said registration marks being in, physical interconnection between patterns.
7. The method according to claim 1 wherein said printing steps are accomplished before provision of said conductive surfaces on said substrate web.
8. The method according to claim 1 wherein said printing steps are accomplished after provision of said conductive surfaces of said substrate web.
9. The method according to claim 1 wherein said etching step is accomplished without removal of said etchant-resistive material defining said circuit patterns.
10. The method according to claim 1 wherein said printing steps include printing with an etchant-resistive material said repetitive circuit patterns on said conductive surfaces without prior cleaning of said conductive surfaces.
11. The method according to claim 1 wherein said printing steps include printing with a nonphotoresponsive etchant-resistive material.
12. The method according to claim 1 wherein at least one of said printing steps includes printing with said etchant-resistive material a plurality of fusible links each in circuit with an associated one of said repetitive circuit patterns.
13. The method according to claim 1 wherein said printing steps include high speed web fed press printmg.
14. The method according to claim 1 further including the step of electrically connecting said first and second cooperative conductive circuit patterns of each of said planar circuits through said substrate at at least one selected position thereof.
15. The method according to claim 2 wherein said electrical connection is formed by welding said first and second cooperative conductive circuit patterns through said substrate at said at least one selected position thereof.
16. The method according to claim wherein said welding step includes:
disposing each of said circuit patterns at a heated base to soften said substrate; and
applying an ultrasonic welding tip to said circuit pattern at said selected position to form said electrical connection.
17. The method according to claim 15 wherein said welding step includes the provision of a cold weld between said first and second conductive circuit patterns at said at least one selected position to form said electrical connection.
18. The method according to claim 15 wherein said welding step includes the provision of an ultrasonic weld between said first and second conductive circuit patterns at said at least one selected position to form said electrical connection.
19. The method according to claim 18 wherein said ultrasonic weld is provided by a multiple sector welding tip operative to provide multiple spot welds between said first and second conductive circuit patterns.
20. The method according to claim 1 wherein said printingsteps include the printing of registration marks together with said circuit pattens on the conductive surfaces of said substrate web.
21. The method according to claim 20 including the further step of punching one or more holes through said substrate web at selected positions with respect to said first and second circuit patterns to serve as registration elements.
22. The method according to claim 1 wherein said printing steps include the rotogravure printing of said circuit patterns.
23. The method according to claim 11 wherein said printing steps further include printing with a black nitrocellulose ink to form said circuit patterns.
24. The method according to claim 1 wherein said separating step includes:
laminating said web containing said cooperative pairs of circuit pattern between first and second sheets; die cutting each circuit pattern pair; and
separating said second sheet containing individual die cut planar circuits from said first sheet to provide individual planar resonant tags.
25. The method according to claim 24 further incl uding the step of slitting said second sheet along the length thereof to provide respective rolls of single planar circuits.
26. The method according to claim 1 wherein said substrate web is polyethylene and wherein said conductive surfaces are aluminum foil.
27. The method according to claim 26 wherein said aluminum foil is bonded to said polyethylene web with the dull side of said aluminum foil in contact with said web.
28. The method according to claim 27 wherein one of said aluminum foils is of a thickness greater than the other to provide predetermined lower electrical resistance for planar inductors formed thereof as part of said planar circuit.
29. The method according to claim 28 wherein said etching step includes etching the ones of saidcircuit patterns having aluminum foil of greater thickness at a higher rate than said other circuit pattern to provide the same etching time for said foils of different thicknesses.
30. The method according to claim 27 wherein said printing steps include printing with an etchant-resistive material said repetitive circuit patterns on the shiny surfaces of said aluminum foil without prior cleaning of said shiny surfaces.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US2849298 *||3 May 1955||26 Aug 1958||St Regis Paper Co||Printed circuitry laminates and production thereof|
|US2974284 *||22 Oct 1957||7 Mar 1961||Rotors for electrical indicating instruments|
|US3240647 *||22 Aug 1961||15 Mar 1966||Morgan Adhesives Co||Laminated printed circuit and method of making|
|US3340606 *||13 Nov 1962||12 Sep 1967||Rogers Corp||Printed circuit structure and method of making the same|
|US3448516 *||14 Feb 1966||10 Jun 1969||Norman R Buck||Method of preparing printed wiring|
|US3484731 *||5 Oct 1967||16 Dec 1969||Rich Edward L||Printed circuit inductor|
|US3485688 *||23 Mar 1966||23 Dec 1969||Ibm||Method for printing circuit designs|
|US3655496 *||25 Sep 1969||11 Apr 1972||Vitta Corp||Tape transfer of sinterable conductive, semiconductive or insulating patterns to electronic component substrates|
|US3678437 *||30 Dec 1970||18 Jul 1972||Itt||Flat cable wafer|
|US3678577 *||25 Sep 1969||25 Jul 1972||Jerobee Ind Inc||Method of contemporaneously shearing and bonding conductive foil to a substrate|
|US3808680 *||30 Jun 1972||7 May 1974||Ibm||Continuous processing for substrate manufacture|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US4369557 *||6 Aug 1980||25 Jan 1983||Jan Vandebult||Process for fabricating resonant tag circuit constructions|
|US4479432 *||6 Aug 1982||30 Oct 1984||Toppan Printing Co., Ltd.||Thick film printing method|
|US4482874 *||4 Jun 1982||13 Nov 1984||Minnesota Mining And Manufacturing Company||Method of constructing an LC network|
|US4498076 *||10 May 1982||5 Feb 1985||Lichtblau G J||Resonant tag and deactivator for use in an electronic security system|
|US4541559 *||16 Nov 1983||17 Sep 1985||Minnesota Mining And Manufacturing Company||Method of making electrical connections between opposing metal foils having a flexible, insulating layer sandwiched therebetween|
|US4567473 *||20 Nov 1984||28 Jan 1986||Lichtblau G J||Resonant tag and deactivator for use in an electronic security system|
|US4578654 *||16 Nov 1983||25 Mar 1986||Minnesota Mining And Manufacturing Company||Distributed capacitance lc resonant circuit|
|US4598276 *||6 Nov 1984||1 Jul 1986||Minnesota Mining And Manufacturing Company||Distributed capacitance LC resonant circuit|
|US4658264 *||9 Nov 1984||14 Apr 1987||Minnesota Mining And Manufacturing Company||Folded RF marker for electronic article surveillance systems|
|US4717438 *||29 Sep 1986||5 Jan 1988||Monarch Marking Systems, Inc.||Method of making tags|
|US4778552 *||22 Apr 1987||18 Oct 1988||Monarch Marking Systems, Inc.||Alarm tag and method of making and deactivating it|
|US4779077 *||13 Apr 1987||18 Oct 1988||Lichtblau G J||Continuously armed high reliability pulse train processor|
|US4818312 *||28 Oct 1987||4 Apr 1989||Monarch Marking Systems, Inc.||Method of making electronic tags|
|US4846922 *||24 Nov 1987||11 Jul 1989||Monarch Marking Systems, Inc.||Method of making deactivatable tags|
|US4905358 *||18 Jan 1989||6 Mar 1990||Motorola, Inc.||Thin film active trimmable capacitor/inductor|
|US4914829 *||16 Dec 1988||10 Apr 1990||Ag Communication Systems Corporation||Image alignment indicators|
|US4970495 *||9 Nov 1988||13 Nov 1990||Tokai Metals Co., Ltd.||Resonant frequency characteristic tag and method of manufacturing the same|
|US5055816 *||11 Jun 1990||8 Oct 1991||Motorola, Inc.||Method for fabricating an electronic device|
|US5059950 *||4 Sep 1990||22 Oct 1991||Monarch Marking Systems, Inc.||Deactivatable electronic article surveillance tags, tag webs and method of making tag webs|
|US5071509 *||19 Mar 1991||10 Dec 1991||Murata Mfg. Co., Ltd||Chip coil manufacturing method|
|US5081445 *||22 Mar 1991||14 Jan 1992||Checkpoint Systems, Inc.||Method for tagging articles used in conjunction with an electronic article surveillance system, and tags or labels useful in connection therewith|
|US5103210 *||27 Jun 1990||7 Apr 1992||Checkpoint Systems, Inc.||Activatable/deactivatable security tag for use with an electronic security system|
|US5108822 *||27 Dec 1990||28 Apr 1992||Tokai Electronics Co., Ltd.||Resonant tag and method of manufacturing the same|
|US5142270 *||22 May 1991||25 Aug 1992||Checkpoint Systems Inc.||Stabilized resonant tag circuit and deactivator|
|US5172461 *||12 Aug 1991||22 Dec 1992||Fritz Pichl||Method of producing electrical resonant circuits, specifically resonance labels|
|US5201988 *||21 Nov 1991||13 Apr 1993||Tokai Metals Co., Ltd.||Method of manufacturing a resonant tag|
|US5218189 *||9 Sep 1991||8 Jun 1993||Checkpoint Systems, Inc.||Binary encoded multiple frequency rf indentification tag|
|US5241299 *||30 Apr 1992||31 Aug 1993||Checkpoint Systems, Inc.||Stabilized resonant tag circuit|
|US5276431 *||29 Apr 1992||4 Jan 1994||Checkpoint Systems, Inc.||Security tag for use with article having inherent capacitance|
|US5281769 *||4 Nov 1991||25 Jan 1994||Nippon Telegraph And Telephone Corporation||Dewall plating technique|
|US5381137 *||26 Oct 1992||10 Jan 1995||Motorola, Inc.||RF tagging system and RF tags and method|
|US5447779 *||27 Jan 1993||5 Sep 1995||Tokai Electronics Co., Ltd.||Resonant tag and method of manufacturing the same|
|US5461353 *||30 Aug 1994||24 Oct 1995||Motorola, Inc.||Printed circuit board inductor|
|US5508684 *||2 Mar 1995||16 Apr 1996||Becker; Richard S.||Article tag|
|US5574431 *||29 Aug 1995||12 Nov 1996||Checkpoint Systems, Inc.||Deactivateable security tag|
|US5589251 *||22 Aug 1995||31 Dec 1996||Tokai Electronics Co., Ltd.||Resonant tag and method of manufacturing the same|
|US5598136 *||16 Nov 1994||28 Jan 1997||Murata Manufacturing Co., Ltd.||Chip coil and manufacturing method thereof|
|US5622652 *||7 Jun 1995||22 Apr 1997||Img Group Limited||Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid|
|US5656081 *||7 Jun 1995||12 Aug 1997||Img Group Limited||Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid|
|US5682814 *||22 Aug 1995||4 Nov 1997||Tokai Electronics Co., Ltd.||Apparatus for manufacturing resonant tag|
|US5695860 *||1 Sep 1995||9 Dec 1997||Tokai Electronics Co., Ltd.||Resonant tag and method of manufacturing the same|
|US5751256 *||31 Jan 1995||12 May 1998||Flexcon Company Inc.||Resonant tag labels and method of making same|
|US5754110 *||7 Mar 1996||19 May 1998||Checkpoint Systems, Inc.||Security tag and manufacturing method|
|US5758575 *||7 Jun 1995||2 Jun 1998||Bemis Company Inc.||Apparatus for printing an electrical circuit component with print cells in liquid communication|
|US5763058 *||7 Oct 1995||9 Jun 1998||Paramount Packaging Corporation||Electrical circuit component formed of a conductive liquid printed directly onto a substrate|
|US5786764 *||4 Mar 1997||28 Jul 1998||Engellenner; Thomas J.||Voice activated electronic locating systems|
|US5790008 *||14 Jan 1997||4 Aug 1998||Littlefuse, Inc.||Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces|
|US5798693 *||7 Jun 1995||25 Aug 1998||Engellenner; Thomas J.||Electronic locating systems|
|US5902437 *||29 Feb 1996||11 May 1999||Flexcon Company Inc.||Method of making resonant tag labels|
|US5920290 *||14 May 1997||6 Jul 1999||Flexcon Company Inc.||Resonant tag labels and method of making the same|
|US5943764 *||7 Jun 1995||31 Aug 1999||Littelfuse, Inc.||Method of manufacturing a surface-mounted fuse device|
|US5963927 *||30 Jan 1997||5 Oct 1999||Neopost Limited||Mailing system|
|US5974661 *||20 Jan 1998||2 Nov 1999||Littelfuse, Inc.||Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components|
|US6010771 *||13 Feb 1998||4 Jan 2000||Bemis Company Inc.||Electrical circuit component formed of a conductive liquid printed directly onto a substrate|
|US6021050 *||2 Dec 1998||1 Feb 2000||Bourns, Inc.||Printed circuit boards with integrated passive components and method for making same|
|US6023028 *||7 Jun 1995||8 Feb 2000||Littelfuse, Inc.||Surface-mountable device having a voltage variable polgmeric material for protection against electrostatic damage to electronic components|
|US6057756 *||14 Aug 1998||2 May 2000||Engellenner; Thomas J.||Electronic locating systems|
|US6072394 *||29 Feb 1996||6 Jun 2000||Nitto Denko Corporation||Resonance circuit tag, method for production thereof and method for changing resonance characteristic thereof|
|US6087940 *||11 Jun 1999||11 Jul 2000||Novavision, Inc.||Article surveillance device and method for forming|
|US6177871 *||28 Jul 1999||23 Jan 2001||Westvaco Corporation||RF-EAS tag with resonance frequency tuning|
|US6388569 *||2 May 2000||14 May 2002||Thomas J. Engellenner||Electronic locating methods|
|US6492009||20 Sep 2001||10 Dec 2002||Graphic Packaging Corporation||Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process|
|US6586078 *||5 Jul 2001||1 Jul 2003||Soundcraft, Inc.||High pressure lamination of electronic cards|
|US6641860||3 Jan 2001||4 Nov 2003||T-Ink, L.L.C.||Method of manufacturing printed circuit boards|
|US6645389||9 Aug 2002||11 Nov 2003||Graphic Packaging Corporation||Method of demetallizing a web in an etchant bath and web suitable therefor|
|US6824857||1 Apr 2002||30 Nov 2004||Nashua Corporation||Circuit elements having an embedded conductive trace and methods of manufacture|
|US6878004||4 Mar 2002||12 Apr 2005||Littelfuse, Inc.||Multi-element fuse array|
|US6891469 *||14 May 2002||10 May 2005||Thomas J. Engellenner||Electronic locating systems|
|US6894614||4 May 2001||17 May 2005||Checkpoint Systems, Inc.||Radio frequency detection and identification system|
|US6917002||13 Jan 2004||12 Jul 2005||Lester E. Burgess||Pressure actuated switching device and method and system for making same|
|US6925701 *||13 Mar 2003||9 Aug 2005||Checkpoint Systems, Inc.||Method of making a series of resonant frequency tags|
|US6946963||16 Oct 2002||20 Sep 2005||Spectra Research, Inc.||Secure storage disc and disc surveillance system|
|US7008500 *||5 Jul 2002||7 Mar 2006||Soundcraft, Inc.||High pressure lamination of electronic cards|
|US7017820||8 Feb 2001||28 Mar 2006||James Brunner||Machine and process for manufacturing a label with a security element|
|US7034652||10 Jul 2002||25 Apr 2006||Littlefuse, Inc.||Electrostatic discharge multifunction resistor|
|US7035072||10 Jul 2002||25 Apr 2006||Littlefuse, Inc.||Electrostatic discharge apparatus for network devices|
|US7076858||19 Oct 2004||18 Jul 2006||Checkpoint Systems, Inc.||Method for controlling resonant tag frequency|
|US7116227||24 Nov 2004||3 Oct 2006||Checkpoint Systems, Inc.||Tag having patterned circuit elements and a process for making same|
|US7119685||29 Nov 2004||10 Oct 2006||Checkpoint Systems, Inc.||Method for aligning capacitor plates in a security tag and a capacitor formed thereby|
|US7132922||23 Dec 2003||7 Nov 2006||Littelfuse, Inc.||Direct application voltage variable material, components thereof and devices employing same|
|US7138919||24 Nov 2004||21 Nov 2006||Checkpoint Systems, Inc.||Identification marking and method for applying the identification marking to an item|
|US7148424 *||5 Oct 2001||12 Dec 2006||Dynamic Technologies Corp.||Disposable electronic devices with deconstructable construction and method|
|US7168150||19 Oct 2004||30 Jan 2007||Checkpoint Systems, Inc.||Method of making a resonant frequency tag|
|US7183891||5 Oct 2004||27 Feb 2007||Littelfuse, Inc.||Direct application voltage variable material, devices employing same and methods of manufacturing such devices|
|US7187289||6 May 2005||6 Mar 2007||Checkpoint Systems, Inc.||Radio frequency detection and identification system|
|US7202770||8 Apr 2003||10 Apr 2007||Littelfuse, Inc.||Voltage variable material for direct application and devices employing same|
|US7233474||24 Nov 2004||19 Jun 2007||Littelfuse, Inc.||Vehicle electrical protection device and system employing same|
|US7256738 *||7 Aug 2003||14 Aug 2007||Kabushiki Kaisha Miyake||Resonant circuits|
|US7321296||9 May 2005||22 Jan 2008||Thomas J. Engellenner||Electronic locating systems|
|US7368033||6 Apr 2006||6 May 2008||Checkpoint Systems, Inc.||Security tag and system for fabricating a tag including an integrated surface processing system|
|US7384496||24 Nov 2004||10 Jun 2008||Checkpoint Systems, Inc.||Security tag system for fabricating a tag including an integrated surface processing system|
|US7492164||3 May 2005||17 Feb 2009||Upm-Kymmene Corporation||Method for manufacturing a product sensor, and a product sensor|
|US7609141||26 Feb 2007||27 Oct 2009||Littelfuse, Inc.||Flexible circuit having overvoltage protection|
|US7704346||19 Sep 2006||27 Apr 2010||Checkpoint Systems, Inc.||Method of fabricating a security tag in an integrated surface processing system|
|US7843308||26 Feb 2007||30 Nov 2010||Littlefuse, Inc.||Direct application voltage variable material|
|US7856708||18 Sep 2006||28 Dec 2010||Checkpoint Systems, Inc.||Process for forming at least a portion of a package or an envelope bearing a printed indicia|
|US7902971||18 Jan 2008||8 Mar 2011||Xalotroff Fund V, Limtied Liability Company||Electronic locating systems|
|US7983024||24 Apr 2007||19 Jul 2011||Littelfuse, Inc.||Fuse card system for automotive circuit protection|
|US7990738||2 Apr 2008||2 Aug 2011||Littelfuse, Inc.||Master fuse module|
|US8099335||29 Nov 2004||17 Jan 2012||Checkpoint Systems, Inc.||Method and system for determining billing information in a tag fabrication process|
|US8350720||20 Aug 2008||8 Jan 2013||Dave Thomas||Method and apparatus for object recognition and warning system of a primary vehicle for nearby vehicles|
|US8486283 *||2 Nov 2010||16 Jul 2013||Sinoelectric Powertrain Corporation||Method of making fusible links|
|US8985467||10 Jan 2013||24 Mar 2015||Checkpoint Systems, Inc.||Permanently deactivatable security tag|
|US9023218||9 Jul 2013||5 May 2015||Sinoelectric Powertrain Corporation||Method of making fusible links|
|US20010040507 *||4 May 2001||15 Nov 2001||Checkpoint Systems, Inc.||Radio frequency detection and identification system|
|US20030011026 *||10 Jul 2002||16 Jan 2003||Colby James A.||Electrostatic discharge apparatus for network devices|
|US20030025587 *||10 Jul 2002||6 Feb 2003||Whitney Stephen J.||Electrostatic discharge multifunction resistor|
|US20030166352 *||4 Mar 2002||4 Sep 2003||Seibang Oh||Multi-element fuse array|
|US20030187021 *||16 Oct 2002||2 Oct 2003||Hypnion, Inc.||Treatment of CNS disorders using CNS target modulators|
|US20030228748 *||20 May 2003||11 Dec 2003||Nelson Richard A.||Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture|
|US20040025324 *||7 Aug 2003||12 Feb 2004||Kabushiki Kaisha Miyake||Process for producing resonant tag|
|US20040140186 *||13 Jan 2004||22 Jul 2004||Burgess Lester E.||Pressure actuated switching device and method and system for making same|
|US20040177492 *||13 Mar 2003||16 Sep 2004||Checkpoint Systems, Inc.||Resonant frequency tag and method for controlling tag frequency|
|US20040200801 *||19 Nov 2001||14 Oct 2004||Lai Laurence M.C.||Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process|
|US20050077076 *||19 Oct 2004||14 Apr 2005||Checkpoint Systems, Inc.||Resonant frequency tag and method for controlling tag frequency|
|US20050081374 *||19 Oct 2004||21 Apr 2005||Checkpoint Systems, Inc.||Resonant frequency tag and method for controlling tag frequency|
|US20050126707 *||1 Feb 2005||16 Jun 2005||Lai Laurence M.||Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process|
|US20050161437 *||21 Jan 2005||28 Jul 2005||Lai Laurence M.||Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process|
|US20050183264 *||29 Nov 2004||25 Aug 2005||Eric Eckstein||Method for aligning capacitor plates in a security tag and a capacitor formed thereby|
|US20050183817 *||24 Nov 2004||25 Aug 2005||Eric Eckstein||Security tag system for fabricating a tag including an integrated surface processing system|
|US20050184872 *||24 Nov 2004||25 Aug 2005||Clare Thomas J.||Identification marking and method for applying the identification marking to an item|
|US20050184873 *||24 Nov 2004||25 Aug 2005||Eric Eckstein||Tag having patterned circuit elements and a process for making same|
|US20050187837 *||29 Nov 2004||25 Aug 2005||Eric Eckstein||Method and system for determining billing information in a tag fabrication process|
|US20050190519 *||24 Nov 2004||1 Sep 2005||Brown William P.||Vehicle electrical protection device and system employing same|
|US20050200483 *||6 May 2005||15 Sep 2005||Checkpoint Systems, Inc.||Radio frequency detection and identification system|
|US20050206523 *||9 May 2005||22 Sep 2005||Engellenner Thomas J||Electronic locating systems|
|US20050221101 *||30 Mar 2005||6 Oct 2005||Kazunori Yamada||Method of manufacturing laminated material for security tag|
|US20050275533 *||3 May 2005||15 Dec 2005||Marko Hanhikorpi||Method for manufacturing a product sensor, and a product sensor|
|US20060175003 *||6 Apr 2006||10 Aug 2006||Eric Eckstein||Security tag and system for fabricating a tag including an integrated surface processing system|
|US20070012775 *||19 Sep 2006||18 Jan 2007||Checkpoint Systems, Inc.||Method of fabricating a security tag in an integrated surface processing system|
|US20070039694 *||21 Jul 2004||22 Feb 2007||Thomas Walther||Method for producing rfid labels|
|US20070163111 *||26 Mar 2007||19 Jul 2007||Sony Chemical & Information Device Corporation||Method for manufacturing a multilayer flexible wiring board|
|US20070169958 *||26 Mar 2007||26 Jul 2007||Sony Chemical & Information Device Corporation||Mask for exposure|
|US20070235832 *||22 Sep 2006||11 Oct 2007||Hon Hai Precision Industry Co., Ltd.||Ground layer of printed circuit board|
|US20070296609 *||20 Jun 2007||27 Dec 2007||Dave Thomas||Method and apparatus for object recognition and warning system of a primary vehicle for nearby vehicles|
|US20080191883 *||12 Feb 2007||14 Aug 2008||Checkpoint Systems, Inc.||Resonant tag|
|US20080248266 *||11 Jun 2008||9 Oct 2008||Checkpoint Manufacturing Japan Co., Ltd.||Method of manufacturing laminated material for security tag|
|US20080258902 *||18 Jan 2008||23 Oct 2008||Thomas J. Engellenner||Electronic locating systems|
|US20090033582 *||1 Jun 2006||5 Feb 2009||Blenkhorn Gary P||RFID tags and antennas and methods of their manufacture|
|US20090066538 *||20 Aug 2008||12 Mar 2009||Dave Thomas||Method and apparatus for object recognition and warning system of a primary vehicle for nearby vehicles|
|US20090072995 *||20 Aug 2008||19 Mar 2009||Dave Thomas||Method and apparatus for transmitting information between a primary vehicle and a secondary vehicle|
|US20090165296 *||10 Mar 2009||2 Jul 2009||Yoash Carmi||Patterns of conductive objects on a substrate and method of producing thereof|
|US20090251200 *||2 Apr 2008||8 Oct 2009||Littlefuse, Inc.||Master fuse module|
|US20100301005 *||29 May 2009||2 Dec 2010||Nilsson Peter L J||Method of Manufacturing an Electrical Circuit on a Substrate|
|US20100301006 *||29 May 2009||2 Dec 2010||Nilsson Peter L J||Method of Manufacturing an Electrical Component on a Substrate|
|US20120103930 *||2 Nov 2010||3 May 2012||Sinoelectric Powertrain Corporation||Method of making fusible links|
|CN101197462B||7 Dec 2006||25 May 2011||上海英内电子标签有限公司||Production method for RFID etching aluminum antenna|
|DE3490695C2 *||23 Apr 1984||15 Mar 2001||Lichtblau G J||Resonant tag and deactivator for electronic security system|
|DE3732825A1 *||29 Sep 1987||31 Mar 1988||Monarch Marking Systems Inc||Deaktivierbare anhaenger bzw. etiketten fuer die verwendung in einem elektronischen artikel-ueberwachungssystem sowie verfahren zu ihrer herstellung|
|DE3836480A1 *||26 Oct 1988||11 May 1989||Monarch Marking Systems Inc||Anhaenger bzw. etikett und verfahren zu seiner herstellung|
|EP0096516A1 *||26 May 1983||21 Dec 1983||Minnesota Mining And Manufacturing Company||Multi-turn inductor and LC network and method of construction thereof|
|EP0730254A1 *||1 Mar 1996||4 Sep 1996||Nitto Denko Corporation||Resonance circuit tag, method for production thereof and method for changing resonance characteristics thereof|
|EP1142458A1 *||4 Nov 1999||10 Oct 2001||Checkpoint Systems, Inc.||Resonant tag with a conductive composition closing an electrical circuit|
|EP1236650A1 *||23 Feb 2001||4 Sep 2002||Westvaco Corporation||EAS ready paperboard|
|EP1436142A1 *||18 Sep 2002||14 Jul 2004||Graphic Packaging International, Inc.||Metal-containing web processed with a continuous etch process|
|EP1585076A1 *||11 Mar 2005||12 Oct 2005||Tokai Aluminum Foil Co., Ltd.||A method of manufacturing laminated material for security tags|
|EP1933285A2||23 Jan 2004||18 Jun 2008||Checkpoint Systems, Inc.||Method of making a series of resonant frequency tags|
|WO1982000541A1 *||31 Jul 1981||18 Feb 1982||J Vandebult||Modified resonant tag circuit constructions and fabrication processes therefor|
|WO1985000915A1 *||6 Sep 1983||28 Feb 1985||Crystalvision Inc||Liquid crystal display|
|WO1985004975A1 *||23 Apr 1984||7 Nov 1985||Little Inc A||Resonant tag and deactivator for use in an electronic security system|
|WO1997047019A2 *||27 May 1997||11 Dec 1997||Littelfuse Inc||A surface-mount fuse and the manufacture thereof|
|WO1998037564A2 *||20 Feb 1998||27 Aug 1998||Littelfuse Inc||A surface-mount fuse and the manufacture thereof|
|WO2000079497A1 *||21 Jun 2000||28 Dec 2000||Bent Thorning Bensen||Radiofrequency resonant circuit sensing device, method of its production, and uses|
|WO2001086967A2 *||4 May 2001||15 Nov 2001||Checkpoint Systems Inc||Radio frequency detection and identification system|
|WO2003043747A2 *||19 Nov 2002||30 May 2003||Graphic Packaging Corp||Manufacture having double sided features in a metal-containing web formed by etching|
|WO2003091962A1 *||17 Apr 2003||6 Nov 2003||Marko Hanhikorpi||A method for maufacturing a product sensor, and a product sensor|
|WO2004042668A1 *||2 Oct 2003||21 May 2004||Rafsec Oy||A method for manufacturing a product sensor, and a product sensor|
|WO2007143527A2 *||1 Jun 2007||13 Dec 2007||Warren S D Co||Rfid tags and antennas and methods of their manufacture|
|U.S. Classification||29/592.1, 257/E27.114, 101/153, 29/25.42, 101/221, 174/261, 101/170, 361/765|
|International Classification||H01G4/40, H05K3/06, H01F41/04, H05K1/16, H01H69/02, H05K3/20, H05K3/38, H05K1/00, H01G4/018, G08B13/24, H01F17/00, H01L27/01, H03H5/02, H05K3/00|
|Cooperative Classification||H05K2201/0355, H05K2203/097, G08B13/2437, G08B13/2431, H01H69/022, H05K1/0293, B32B2519/02, H05K3/0097, H05K3/061, H01L27/01, H05K2203/0143, H05K1/0393, H05K2203/1545, G08B13/244, H05K2203/171, G08B13/2442, G08B13/242, H05K2203/0113, H05K1/162, H05K3/381, H05K2203/175, H01F41/041, H05K1/165, H03H5/02|
|European Classification||G08B13/24B1G2, G08B13/24B3M2, G08B13/24B3M1, G08B13/24B3M, G08B13/24B3C, H05K3/00S, H01H69/02B, H03H5/02, H05K3/38B, H05K1/16L, H01L27/01, H01F41/04A|
|16 Mar 2000||AS||Assignment|
Owner name: FIRST UNION NATIONAL BANK, AS ADMINISTRATIVE AGENT
Free format text: GUARANTEE AND COLLATERAL AGREEMENT;ASSIGNOR:CHECKPOINT SYSTEMS, INC.;REEL/FRAME:010668/0049
Effective date: 19991209
|13 Jun 1996||AS||Assignment|
Owner name: CHECKPOINT SYSTEMS, INC., NEW JERSEY
Free format text: SECURITY INTEREST;ASSIGNORS:ARTHUR D. LITTLE, INC.;LICHTBLAU, GEORGE J.;LICHTBLEU, ANNE R.;REEL/FRAME:008000/0690
Effective date: 19960606
|13 Jun 1996||AS06||Security interest|
Owner name: ARTHUR D. LITTLE, INC.
Owner name: CHECKPOINT SYSTEMS, INC. 101 WOLF DRIVE THOROFARE,
Owner name: LICHTBLAU, GEORGE J.
Owner name: LICHTBLEU, ANNE R.
Effective date: 19960606
|6 May 1996||AS02||Assignment of assignor's interest|
Owner name: CHECKPOINT SYSTEMS, INC. 101 WOLF DRIVE THOROFARE,
Effective date: 19960502
Owner name: LICHTBLAU, GEORGE J.
|6 May 1996||AS||Assignment|
Owner name: CHECKPOINT SYSTEMS, INC., NEW JERSEY
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LICHTBLAU, GEORGE J.;REEL/FRAME:007936/0635
Effective date: 19960502