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Referenced by

Citing PatentFiling dateIssue dateOriginal AssigneeTitle
US422070610 May 19782 Sep 1980RCA CorporationEtchant solution containing HF-HnO.sub.3 -H.sub.2 SO.sub.4 -H.sub.2 O.sub.2
US42227794 Jun 197916 Sep 1980Dart Industries Inc.Non-chromate conversion coatings
US42253504 Jun 197930 Sep 1980Dart Industries Inc.Non-chromate conversion coatings
US42253514 Jun 197930 Sep 1980Dart Industries Inc.Non-chromate conversion coatings
US423311125 Jun 197911 Nov 1980Dart Industries Inc.Dissolution of metals utilizing an aqueous H.sub.2 SO.sub.4 -H.sub.2 O.sub.2 -3-sulfopropyldithiocarbamate etchant
US423311225 Jun 197911 Nov 1980Dart Industries Inc.Dissolution of metals utilizing an aqueous H.sub.2 SO.sub.4 -H.sub.2 O.sub.2 -polysulfide etchant
US423311325 Jun 197911 Nov 1980Dart Industries Inc.Dissolution of metals utilizing an aqueous H.sub.2 O.sub.2 -H.sub.2 SO.sub.4 -thioamide etchant
US423695725 Jun 19792 Dec 1980Dart Industries Inc.Dissolution of metals utilizing an aqueous H.sub.2 SO.sub.Y --H.sub.2 O.sub. -mercapto containing heterocyclic nitrogen etchant
US43516752 Mar 198128 Sep 1982ROHCO, Inc.Conversion coatings for zinc and cadmium surfaces
US437019724 Jun 198125 Jan 1983International Business Machines CorporationProcess for etching chrome
US44015097 Sep 198230 Aug 1983FMC CorporationComposition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide
US463628220 Jun 198513 Jan 1987Great Lakes Chemical CorporationMethod for etching copper and composition useful therein
US48592814 Jun 198722 Aug 1989Pennwalt CorporationEtching of copper and copper bearing alloys
US486137430 Oct 198729 Aug 1989Non-abrasive polish or cleaning composition and process for its preparation
US534050516 Aug 199123 Aug 1994Recytec SAMethod for dissolving radioactively contaminated surfaces from metal articles
US578348924 Sep 199621 Jul 1998Cabot CorporationMulti-oxidizer slurry for chemical mechanical polishing
US580085911 Dec 19951 Sep 1998Copper coating of printed circuit boards
US601550618 Apr 199718 Jan 2000Cabot CorporationComposition and method for polishing rigid disks
US603359618 Feb 19977 Mar 2000Cabot CorporationMulti-oxidizer slurry for chemical mechanical polishing
US603989111 Jul 199721 Mar 2000Cabot CorporationMulti-oxidizer precursor for chemical mechanical polishing
US606878711 Jul 199730 May 2000Cabot CorporationComposition and slurry useful for metal CMP
US608341928 Jul 19974 Jul 2000Cabot CorporationPolishing composition including an inhibitor of tungsten etching
US611725025 Feb 199912 Sep 2000Morton International Inc.Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US611778323 Mar 199812 Sep 2000EKC Technology, Inc.Chemical mechanical polishing composition and process
US612685311 Jul 19973 Oct 2000Cabot Microelectronics CorporationChemical mechanical polishing slurry useful for copper substrates
US613671129 May 199824 Oct 2000Cabot CorporationPolishing composition including an inhibitor of tungsten etching
US617702626 May 199823 Jan 2001Cabot Microelectronics CorporationCMP slurry containing a solid catalyst
US628430919 Dec 19974 Sep 2001Atotech Deutschland GmbHMethod of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US630956029 Sep 199730 Oct 2001Cabot Microelectronics CorporationChemical mechanical polishing slurry useful for copper substrates
US631303911 Jan 20006 Nov 2001EKC Technology, Inc.Chemical mechanical polishing composition and process
US631636614 Feb 200013 Nov 2001Cabot Microelectronics CorporationMethod of polishing using multi-oxidizer slurry
US638306522 Jan 20017 May 2002Cabot Microelectronics CorporationCatalytic reactive pad for metal CMP
US643594722 Jan 200120 Aug 2002Cabot Microelectronics CorporationCMP polishing pad including a solid catalyst
US644414017 Mar 19993 Sep 2002Morton International Inc.Micro-etch solution for producing metal surface topography
US653390524 Jan 200118 Mar 2003TiNi Alloy Company
Smart Therapeutics, Inc.
Method for sputtering tini shape-memory alloys
US656935015 Mar 200227 May 2003Cabot Microelectronics CorporationChemical mechanical polishing slurry useful for copper substrates
US657959117 Jul 200117 Jun 2003Atotech Deutschland GmbHMethod of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US65932394 Aug 199915 Jul 2003Cabot Microelectronics Corp.Chemical mechanical polishing method useful for copper substrates
US660244013 Aug 20015 Aug 2003Atotech Deutschland GmbHMethod of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US66351867 Jan 199921 Oct 2003EKC Technology, Inc.Chemical mechanical polishing composition and process
US684108411 Feb 200211 Jan 2005Nikko Materials USA, Inc.Etching solution for forming an embedded resistor
US73148232 Aug 20051 Jan 2008DuPont Airproducts NanoMaterials LLCChemical mechanical polishing composition and process
US821161717 Aug 20093 Jul 2012Palo Alto Research Center IncorporatedSolid inks for printed masks