US20150036123A1 - Apparatus for Sensor with Improved Power Consumption and Associated Methods - Google Patents

Apparatus for Sensor with Improved Power Consumption and Associated Methods Download PDF

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US20150036123A1
US20150036123A1 US14/520,813 US201414520813A US2015036123A1 US 20150036123 A1 US20150036123 A1 US 20150036123A1 US 201414520813 A US201414520813 A US 201414520813A US 2015036123 A1 US2015036123 A1 US 2015036123A1
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current
sensor
pulse
coil
mcu
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US14/520,813
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Abidin Guclu Onaran
Charles D. Thompson
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Silicon Audio Seismic LLC
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Silicon Audio Seismic LLC
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Publication of US20150036123A1 publication Critical patent/US20150036123A1/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/16Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
    • G01V1/18Receiving elements, e.g. seismometer, geophone or torque detectors, for localised single point measurements
    • G01V1/181Geophones
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/16Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/20Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/004Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means using fibre optic sensors
    • G01H9/006Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means using fibre optic sensors the vibrations causing a variation in the relative position of the end of a fibre and another element
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/093Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by photoelectric pick-up
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/13Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position
    • G01P15/132Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position with electromagnetic counterbalancing means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2611Measuring inductance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/16Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
    • G01V1/18Receiving elements, e.g. seismometer, geophone or torque detectors, for localised single point measurements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/16Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
    • G01V1/18Receiving elements, e.g. seismometer, geophone or torque detectors, for localised single point measurements
    • G01V1/181Geophones
    • G01V1/182Geophones with moving coil
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V13/00Manufacturing, calibrating, cleaning, or repairing instruments or devices covered by groups G01V1/00 – G01V11/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Acoustics & Sound (AREA)
  • Geology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Electromagnetism (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Micromachines (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

A sensor includes a coil suspended in a magnetic field, and a light source to produce a light output in response to a current, wherein a duty cycle and/or pulse-repetition frequency of the current is configurable. The sensor further includes an optical detector to use the light output of the light source to detect displacement of the coil in response to a stimulus.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This patent application is related to the following patent applications:
  • U.S. patent application Ser. No. ______, filed on ______, titled “Apparatus for Sensor with Programmable Gain and Dynamic Range and Associated Methods,” Attorney Docket No. SIAU002;
  • U.S. patent application Ser. No. ______, filed on ______, titled “Apparatus for Sensor with Configurable Coil Constant and Associated Methods,” Attorney Docket No. SIAU003;
  • U.S. patent application Ser. No. ______, filed on ______, titled “Apparatus for Sensor with Communication Port for Configuring Sensor Characteristics and Associated Methods,” Attorney Docket No. SIAU004;
  • U.S. patent application Ser. No. ______, filed on ______, titled “Apparatus for Sensor with Configurable Coil and Associated Methods,” Attorney Docket No. SIAU006;
  • U.S. patent application Ser. No. ______, filed on ______, titled “Apparatus for Sensor with Configurable Damping and Associated Methods,” Attorney Docket No. SIAU007; and
  • International Application No. PCT/US2013/032584, filed on Mar. 15, 2013, titled “Closed Loop Control Techniques for Displacement Sensors with Optical Readout.” The foregoing applications are incorporated by reference in their entireties for all purposes.
  • Furthermore, the present patent application is a continuation-in-part of International Application No. PCT/US2013/032584, filed on Mar. 15, 2013, titled “Closed Loop Control Techniques for Displacement Sensors with Optical Readout,” which claims priority to: (1) Provisional U.S. Patent Application No. 61/712,652, filed on Oct. 11, 2012; and (2) Provisional U.S. Patent Application No. 61/721,903, filed on Nov. 2, 2012. The foregoing applications are incorporated by reference in their entireties for all purposes.
  • TECHNICAL FIELD
  • The disclosure relates generally to sensors, such as acceleration, speed, and displacement sensors and, more particularly, to apparatus for such sensors with improved power consumption, and associated methods.
  • BACKGROUND
  • With advances in electronics, a variety of sensors have been developed to sense physical quantities. The sensors may use a variety of technologies, such as electrical, mechanical, optical, and micro-electromechanical systems (MEMS), or combinations of such technologies. More particularly, some sensors can sense displacement, velocity, or acceleration. Sensors that can sense displacement, velocity, or acceleration find use in a variety of fields, such as ground or earth exploration, for instance, reflection seismology.
  • As an example, devices known as geophones use a magnet and a coil that move relative to each other in response to ground movement. Waves sent into the earth generate reflected energy waves. In response to reflected energy waves, geophones generate electrical signals that may be used to locate underground objects, such as natural resources.
  • FIG. 1 illustrates a conceptual diagram 10 of a geophone, which includes a magnet 16 coupled to an anchor point 12 (e.g., housing) and spring 14, and coil 18 with mass m. In response to a stimulus, such as the energy waves described above, coil 18 moves in relation to magnet 16. As a result, an electrical output signal is generated by coil 18.
  • The coil-spring assembly form a physical system that responds non-uniformly as the frequency of the stimulus is varied. Assuming that spring 14 has a spring constant k, the coil-spring assembly, with mass m (i.e., a negligible spring mass), has a natural frequency of oscillation of
  • f N = k m .
  • FIG. 2 illustrates a frequency response curve 20 of the geophone of FIG. 1 to physical stimuli. Frequency response curve 20 has a peak 23 at the frequency fN. Thus, geophone 10 has better response (higher output signal level) at frequencies near or equal to fN.
  • Note that the description in this section and the corresponding figures are included as background information material. The materials in this section should not be considered as an admission that such materials constitute prior art to the present patent application.
  • SUMMARY
  • According to an exemplary embodiment, a sensor includes a coil suspended in a magnetic field, and a light source to produce a light output in response to a current, wherein a duty cycle and/or pulse-repetition frequency of the current is configurable. The sensor further includes an optical detector to use the light output of the light source to detect displacement of the coil in response to a stimulus.
  • According to another exemplary embodiment, a system includes a sensor. The sensor includes a coil suspended in a magnetic field, a light source to produce a light output in response to a current, wherein a duty cycle and/or pulse-repetition frequency of the current is configurable by a microcontroller unit (MCU), and an optical detector to use the light output of the light source to detect displacement of the coil in response to a stimulus. The sensor further includes a feedback circuit coupled to the optical detector and to the coil to form a negative feedback loop.
  • According to another exemplary embodiment, a method of operating a sensor is disclosed. The sensor includes a coil suspended in a magnetic field, a light source to produce a light output in response to a current, and an optical detector to use the light output of the light source to detect displacement of the coil in response to a stimulus. The method includes configuring a duty cycle and/or pulse-repetition frequency of the current.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The appended drawings illustrate only exemplary embodiments and therefore should not be considered as limiting the scope of the application or the claims. Persons of ordinary skill in the art appreciate that the disclosed concepts lend themselves to other equally effective embodiments. In the drawings, the same numeral designators used in more than one drawing denote the same, similar, or equivalent functionality, components, or blocks.
  • FIG. 1 illustrates a conceptual diagram of a geophone.
  • FIG. 2 depicts the frequency response of a geophone in response to physical stimuli.
  • FIG. 3 shows a sensor according to an exemplary embodiment.
  • FIG. 4 depicts forces operating in a sensor according to an exemplary embodiment.
  • FIG. 5 illustrates a virtual spring caused by use of negative feedback in an exemplary embodiment.
  • FIG. 6 depicts a cross-section of a sensor according to an exemplary embodiment.
  • FIG. 7 illustrates a cross-section of a sensor according to an exemplary embodiment.
  • FIG. 8 shows a schematic diagram of a sensor according to an exemplary embodiment.
  • FIG. 9 illustrates a schematic diagram of a sensor according to an exemplary embodiment.
  • FIG. 10 depicts an output signal of a trans-impedance amplifier (TIA) in an exemplary embodiment.
  • FIG. 11 shows a flow diagram for a method of operating a sensor according to an exemplary embodiment.
  • FIG. 12 illustrates a block diagram of a sensor communicating with another device or component according to an exemplary embodiment.
  • FIG. 13 depicts a circuit arrangement 650 sensor with configurable light source duty cycle and/or pulse-repetition frequency according to an exemplary embodiment.
  • FIG. 14 shows a plot of light-source power dissipation as a function of current in exemplary embodiments.
  • FIG. 15 illustrates a plot of light-source current as a function of time according to an exemplary embodiment.
  • FIG. 16 depicts a plot of light-source current as a function of time according to another exemplary embodiment.
  • FIG. 17 shows a circuit arrangement that may be used for configuring light-source duty cycle and/or pulse-repetition frequency according to an exemplary embodiment.
  • FIG. 18 illustrates a circuit arrangement that may be used for configuring light-source duty cycle and/or pulse-repetition frequency according to another exemplary embodiment.
  • FIG. 19 depicts a circuit arrangement that may be used for configuring light-source duty-cycle according to another exemplary embodiment.
  • FIG. 20 shows a circuit arrangement that may be used for configuring light-source duty cycle and/or pulse-repetition frequency according to another exemplary embodiment.
  • DETAILED DESCRIPTION
  • The disclosed concepts relate generally to sensors, such as acceleration, speed, and displacement sensors. More specifically, the disclosed concepts provide systems, apparatus, and methods for sensors with improved power consumption, as described below in detail.
  • Sensors according to exemplary embodiments can sense acceleration, velocity, and/or displacement. As persons of ordinary skill in the art understand, acceleration, velocity, and displacement are governed by mathematical relationships. Thus, one may sense one of acceleration, velocity, and displacement, and derive the others from it.
  • For example, if acceleration, a, is sensed, velocity, v, and displacement, x, may be derived from a. More specifically:
  • a = v t v = a · t v = x t x = v · t
  • Sensors according to exemplary embodiments include a combination of electrical, optical, and mechanical components. FIG. 3 illustrates a conceptual diagram of a sensor 100 according to an exemplary embodiment.
  • Referring to FIG. 3, sensor 100 includes a spring 106 attached (e.g., at one end) to an acceleration reference frame or plane 103. Spring 106 has a spring constant ks. Spring 106 is also attached (e.g., at another end) to coil 109. Coil 109 and its corresponding assembly (not shown), e.g., a bobbin, have a mass m, also known as proof mass.
  • A magnet 112 is positioned near or proximately to coil 109. A magnetic field 112A is established between the north and south poles of magnet 112. Thus, coil 109 is completely or partially suspended within magnetic field 112A. By virtue of spring 106, coil 109 may move in relation to magnet 112 and, thus, in relation to magnetic field 112A.
  • More specifically, in response to a physical stimuli, such as a force that causes displacement x of coil 109, coil 109 moves in relation to magnet 112 and magnetic field 112A. As persons of ordinary skill in the art understand, movement of a conductor, such as coil 109, in a magnetic field, such as magnetic field 112A, induces a current in the coil. Thus, in response to the stimuli, coil 109 produces a current.
  • Optical position sensor 115 detects the movement of coil 109 in response to the stimuli. More specifically, as described below in detail, optical position sensor 115 generates an output signal, for example, a current, in response to the movement of coil 109.
  • Note that in some embodiments, rather than generating a current, optical position sensor 115 may generate a voltage signal. For example, optical position sensor 115 may include a mechanism, such as an amplifier or converter, to convert a current produced by the electro-optical components of optical position sensor 115 to an output voltage. In either case, optical position sensor 115 provides an output signal 115-1 to amplifier 118.
  • Without loss of generality, in exemplary embodiments, amplifier 118 constitutes a TIA. TIA 118 generates an output voltage in response to an input current. Thus, in the case where optical position sensor 115 provides an output current (rather than an output voltage) 115-1, TIA 118 converts the current to a voltage signal.
  • In some embodiments, depending on a number of factors, TIA 118 may include circuitry for driving coil 109, such as a coil driver (not shown). Such factors include design and performance specifications for a given implementation, for example, the amount of drive specified for coil 109, etc., as persons of ordinary skill in the art will understand.
  • TIA 118 (or other amplifier circuitry, as noted above) provides an output signal 118-1 to coil 109. The polarity of output signal 118-1 is selected such that output signal 118-1 counteracts the current induced in coil 109 in response to the physical stimuli. In other words, optical position sensor 115 and TIA 118 couple to coil 109 so as to form a negative-feedback loop.
  • The feedback or driving signal, i.e., signal 118-1, causes a force to act on coil 109. In exemplary embodiments, the force is proportional to the displacement x. Thus, a force exerted by spring 106 and a force exerted by coil 109 (by virtue of negative feedback and driving signal 118-1) cooperate with each other against the force created by acceleration of coil 109 (the proof mass). FIG. 4 illustrates the two forces.
  • More specifically, FIG. 4 shows a force vector 121 that corresponds to force Fs exerted by spring 106. FIG. 4 also depicts a force vector 124 that corresponds to force Fc exerted by virtue of the acceleration of coil 109. According to Hook's law, force Fs relates to displacement x, specifically Fs=−ks·x, where, as noted above, ks represents the spring constant of spring 106. In effect, spring 106 resists the displacement in proportion to ks.
  • Furthermore, according to Newton's second law (ignoring any relativistic effects), force Fc relates to the mass of coil 109 (including any physical components, such as a bobbin), and to the acceleration that coil 109 experiences as a result of the external stimuli (e.g., the source that causes displacement x to occur). Specifically, Fc=mc·a, where mc represents the mass of coil 109, and a denotes the acceleration that coil 109 experiences.
  • As noted above, negative feedback is employed in sensor 100 (see FIG. 5) so as to cause the mass mc to come to equilibrium. Mathematically stated, the feedback causes the mass mc to come to equilibrium when Fs equals Fc. Thus, sensor 100 may be viewed as operating according to a force-balance principle, i.e., Fs=Fc at equilibrium.
  • Stated another way, force-balance occurs when −ks·x=mc·a. One may readily determine the spring constant ks and the mass of coil 109, mc (e.g., by consulting data sheets or controlling manufacturing processes, etc.). Using the values of ks and mc in the above equation, one may determine the acceleration of coil 109 in response to the stimulus, i.e.:
  • a = - k s · x m c .
  • In other words, output signal 118-1 of TIA 118 is proportional to acceleration a. Given acceleration a, velocity v, and displacement x may be determined, by using the mathematical relations described above. (Note also that optical position sensor 115 may also determine displacement x). Thus, sensor 100 may be used to determine displacement (position), velocity, and/or acceleration, as desired.
  • Using negative feedback provides a number of benefits. First, it flattens or tends to flatten the response of sensor 100 to the stimuli. Second, feedback increases the frequency response of sensor 100, i.e., sensor 100 has more of a broadband response because of the use of feedback.
  • Third, negative feedback reduces the amount of displacement that results in a desired output signal level. In effect, negative feedback acts as a virtual spring coupled in parallel with spring 106, a concept that FIG. 5 illustrates. More specifically, the negative-feedback signal applied to coil 109 causes virtual spring 130 to counteract force Fc, which is exerted because of the acceleration of coil 109, as described above. Thus, spring 106 and virtual spring 130 work as additive forces to reach force equilibrium in opposition to the force created by acceleration of the coil mass (proof mass). Virtual spring 130 is controlled electronically, e.g., by TIA 118 in FIG. 3.
  • Referring again to FIG. 5, because of the use of negative feedback, virtual spring 130 has a larger spring constant, kv, than does spring 106. Use of virtual spring 130 results in sensor 100 creating a given output in response to a smaller stimulus. Put another way, virtual spring 130 acts as a stiff spring. Thus, compared to an open-loop arrangement, sensor 100 has a reduced total displacement for a desired level of output signal. Also, force applied to a sensor that uses an open-loop arrangement (e.g., a geophone), causes the mass suspended by the spring to wobble more, which limits the upper response limit of the sensor.
  • As noted, use of negative feedback flattens or tends to flatten the sensor frequency response, and also reduces the sensitivity of the force-balance system to the value of spring constant ks of spring 106, since the spring constant of virtual spring 130 dominates. A benefit of the foregoing is to allow the use of a stiffer spring suspension 106, which in turn facilitates sensor operation at any orientation with respect to Earth's gravity. Additionally, an increase in loop gain results in a stiffer virtual spring constant 130, which in turn allows a larger full scale stimulus range.
  • Note that a variety of embodiments of sensors according to the disclosure are contemplated. For example, in some embodiments, the position of coil 109 and magnet 112 may be reversed or switched (see FIG. 3). Thus, coil 109 may be stationary, while magnet 112 may be suspended by spring 106.
  • As another example, in some embodiments, more than one magnet 112 may be used, as desired. As yet another example, in some embodiments, more than one coil 109 may be used, e.g., two coils in parallel or series, as desired. Other arrangements are possible, depending on factors such as design and performance specifications, cost, available technology, etc., as persons of ordinary skill in the art will understand.
  • FIG. 6 depicts a cross-section of a sensor 200 according to an exemplary embodiment. Sensor 200 includes a housing, frame, or enclosure 205 to provide physical support for various components of sensor 200. In the embodiment shown, housing 205 has sides 205A, 205B, 205C, and 205D, for example, a top, a right side or wall, a bottom, and a left side or wall. Other housing, frames, or enclosures are possible and contemplated, as persons of ordinary skill in the art will understand.
  • Magnet 112 is arranged with magnet caps 215A and 215B. In the embodiment shown, magnet 112 is disposed between magnet caps 215A and 215B. A variety of types and shapes of magnets may be used, as desired. Examples include neodymium-iron-boron (NIB) or aluminum nickel cobalt (ALNICO) alloy magnets, but other materials, such as alloys with appropriate properties, may be used. Other arrangements of the magnet and magnet caps or support are possible and contemplated, as persons of ordinary skill in the art will understand.
  • Coil 109 is wound on a bobbin 220. In the embodiment shown, coil 109 and bobbin 220 together form the proof mass (neglecting the mass of spring 106). In the embodiment shown, coil 109 is wound in two sections on bobbin 220, although other arrangements are possible and contemplated, as persons of ordinary skill in the art will understand.
  • The proof mass is suspended by spring 106, which for illustration purposes is shown as four sections labeled 106A-106D. In exemplary embodiments, spring 106 may include one, two, or more springs, such as flat, leaf, or spider springs, as desired. Other types and/or arrangements of spring 106 are possible and contemplated, as persons of ordinary skill in the art will understand. A variety of materials and techniques may be used to fabricate spring 106. Some examples include etching or die cutting. Beryllium copper may be used as one example of spring material, but other materials with appropriate spring properties (e.g., having relatively low temperature coefficient) may be used, as desired.
  • In exemplary embodiments, such as the embodiment of FIG. 6, spring 106 may have a relatively low spring constant. More specifically, spring 106 may have sufficient stiffness to suspend and support the proof mass. As noted above, a virtual spring (not shown) having a relatively high spring constant (i.e., higher than the spring constant of spring 106) operates in conjunction with spring 106. Thus, spring 106 may provide just enough stiffness to physically support the proof mass.
  • In the embodiment shown in FIG. 6, spring 106 (shown as sections or portions 106A-106D) suspend the proof mass with respect to magnet 112 (and magnet caps 215A-215B, if used). In other words, a stimulus, such as force, applied to sensor 200 causes the proof mass to move or experience a displacement with respect to magnet 112 (and magnet caps 215A-215B). Other arrangements are possible and contemplated, as persons of ordinary skill in the art will understand. For example, spring 106 may attach to housing 205, rather than magnet caps 215A-215B.
  • Sensor 200 includes an optical interferometer to generate an electrical signal in response to displacement of coil 109 in relation to magnet 112 or housing 205. The electrical signal constitutes the output of the optical interferometer. The electrical signal may be provided to an amplifier, e.g., TIA 118 in FIG. 3.
  • Referring again to FIG. 6, in the embodiment shown, the optical interferometer includes a light source 225, such as a vertical cavity surface-emitting laser (VCSEL). The light output of light source 225 is reflected by a mirror 222, and is diffracted by diffraction grating 235. The resulting optical signals are detected by optical detectors 230A, 230B, and 230C.
  • A mechanical or physical stimulus applied to sensor 200 causes a change in the detected light, and thus causes optical detectors 230A-230C to provide an electrical output signal. The electrical output signal, e.g., a current signal, may be used in a feedback loop, as discussed above.
  • Note that, if desired, the electrical output signal may be used in an open-loop configuration, rather than in a closed-loop (negative feedback) configuration. As noted above, closed-loop configuration provides some advantages over open-loop configuration. In some situations, however, operating sensor 200 in an open-loop configuration may be desired, for instance, on a temporary basis.
  • FIG. 7 depicts a cross-section of a sensor 250 according to an exemplary embodiment. Sensor 250 includes a housing, frame, or enclosure 205 to provide physical support for various components of sensor 250. In the embodiment shown, housing 205 has sides 205A, 205B and 205C, for example, a right side or wall, a bottom, and a left side or wall. Other housing, frames, or enclosures are possible and contemplated, as persons of ordinary skill in the art will understand.
  • Magnet 112 is arranged with magnet caps 215A, 215B, and 215C. In the embodiment shown, magnet 112 is attached to magnet cap 215B, which is disposed against or in contact with magnet caps 215A and 215C. A variety of types and shapes of magnets may be used, as desired. As noted, examples include neodymium-iron-boron (NIB) or aluminum nickel cobalt (ALNICO) alloy magnets, but other materials, such as alloys, with appropriate properties can be used. In some embodiments, magnet 112 may extend to a cavity in bobbin 220 (described below). Other arrangements of the magnet and magnet caps or support are possible and contemplated, as persons of ordinary skill in the art will understand.
  • Coil 109 is wound on a bobbin 220. In the embodiment shown, coil 109 and bobbin 220 together form the proof mass (neglecting the mass of spring 106). In the embodiment shown, coil 109 is wound around bobbin 220, although other arrangements are possible and contemplated, as persons of ordinary skill in the art will understand.
  • The proof mass is suspended by spring 106, which for illustration purposes is shown as four sections labeled 106A-106D. In exemplary embodiments, spring 106 may include one, two, or more springs, such as flat, leaf, or spider springs, as desired. Other types and/or arrangements of spring 106 are possible and contemplated, as persons of ordinary skill in the art will understand. As noted above, a variety of materials and techniques may be used to fabricate spring 106. Some examples include etching or die cutting. Beryllium copper may be used as one example of spring material, but other materials with appropriate spring properties (e.g., having relatively low temperature coefficient) may be used, as desired.
  • In exemplary embodiments, such as the embodiment of FIG. 7, spring 106 may have a relatively low spring constant. More specifically, spring 106 may have sufficient stiffness to suspend and support the proof mass. As noted above, a virtual spring (not shown), having a relatively high spring constant (i.e., higher than the spring constant of spring 106) operates in conjunction with spring 106. Thus, spring 106 may provide just enough stiffness to physically support the proof mass.
  • In the embodiment shown in FIG. 7, spring 106 (shown as sections or portions 106A-106D) suspend the proof mass with respect to magnet 112 (and magnet caps 215A-215C, if used). In other words, a stimulus, such as force, applied to sensor 250 causes the proof mass to move or experience a displacement with respect to magnet 112 (and magnet caps 215A-215C). Other arrangements are possible and contemplated, as persons of ordinary skill in the art will understand. For example, spring 106 may attach to magnet caps 215A and 215C, rather than housing 205.
  • Sensor 250 includes an optical interferometer to generate an electrical signal in response to displacement of coil 109 in relation to magnet 112 or housing 205. The electrical signal constitutes the output of the optical interferometer. The electrical signal may be provided to an amplifier, e.g., TIA 118 in FIG. 3.
  • Referring again to FIG. 7, in the embodiment shown, the optical interferometer includes a light source 225, such as a VCSEL. The light output of light source 225 is reflected by a mirror 222, and is diffracted by diffraction grating 235. The resulting optical signals are detected by optical detectors 230A, 230B, and 230C.
  • A stimulus applied to sensor 250 causes a change in the detected light, and thus causes optical detectors 230A-230C to provide an electrical output signal. The electrical output signal, e.g., a current signal, may be used in a feedback loop, as discussed above.
  • Note that, if desired, the electrical output signal may be used in an open-loop configuration, rather than in a closed-loop (negative feedback) configuration. As noted above, closed-loop configuration provides some advantages over open-loop configuration. In some situations, however, operating sensor 250 in an open-loop configuration may be desired, for instance, on a temporary basis.
  • FIG. 8 shows a schematic diagram or circuit arrangement 300A for a sensor according to an exemplary embodiment, for instance sensors 200 and 250 in FIGS. 6 and 7, respectively. Referring to FIG. 8, as described above, optical detectors 230A-230C (photodiodes in the embodiment shown) provide an output signal to TIA 118. A bias source, labeled VBIAS, for example, ground or zero potential, provides an appropriate bias signal to detectors 230A-230C. In the embodiment of FIG. 8, the output signal of optical detectors 230A-230C is provided to TIA 118 as a differential signal.
  • Note that FIG. 8 omits light source 225 for the sake of clarity of presentation. Light source 225, e.g., a VCSEL, may be powered by an appropriate circuit (not shown). Examples include a voltage regulator, a reference source, etc., as desired. Also, in some embodiments, MCU 310 may control or program the light level that light source 225 emits, depending on various factors, such as power consumption, desired sensor parameters and performance, etc.
  • In the embodiment shown in FIG. 8, TIA 118 includes two individual TIA circuits or amplifiers, 118A and 118B, to accommodate the differential input signal. TIA 118 includes resistors 305A-305B to adjust (or calibrate or set or program or configure) the gain of TIAs 118A-118B, respectively.
  • Thus, by adjusting resistor 305A, the gain of amplifier 118A may be adjusted. Similarly, by adjusting resistor 305B, the gain of amplifier 118B may be adjusted. A controller, such as a microcontroller unit (MCU) 310 in the exemplary embodiment shown, adjusts the values of resistors 305A-305B.
  • Typically, given the differential nature of the input signal of TIA 118, MCU 310 adjusts resistors 305A-305B to the same resistance value so as to increase or improve the common-mode rejection ration (CMRR) of TIA 118. Put another way, the two branches of TIA 118, i.e., the branches containing amplifiers 118A and 118B, respectively, are typically matched by adjusting resistors 305A-305B to the same resistance value. In some situations, however, resistors 305A-305B might be adjusted to different values, for example to compensate for component mismatch, manufacturing variations, etc.
  • Note that adjusting the gains of amplifiers 118A-118B does not set the full-scale range of the sensor. Rather, the gains of amplifiers 118A-118B determine the overload point of the sensor, i.e., the peak overload point of the sensor in response to a stimulus. Furthermore, the coil constant of coil 109 determines the magnitude of the output signal of the sensor in response to a given amount of acceleration in response to a stimulus, such as force. The coil constant is defined in units of Newtons per Ampere. Increasing the coil constant increases the full-scale range of the sensor for a given available or applied coil current. For fixed values of resistors 320A and 320B, the effect of increasing coil constant is a decrease in the sensor's scale factor in terms of Volts per unit of stimulus (e.g., acceleration (g)), as force-balance equilibrium will be reached at a lower coil current (and hence output voltage) for a given stimulus value.
  • The output of amplifier 118A feeds one end or terminal of coil 109 via resistors 315A and 320A. Conversely, the output of amplifier 118B feeds the other end of coil 109 via resistors 315B and 320B. Thus, amplifiers 118A-118B provide a drive signal for coil 109 via resistors 315A-315B and 320A-320B.
  • MCU 310 may adjust (or calibrate or set or program or configure) the values of resistors 320A-320B. Similar to resistors 305A-305B, typically, given the differential nature of the output signal of the sensor, MCU 310 adjusts resistors 320A-320B to the same resistance value. In some situations, however, resistors 320A-320B might be adjusted to different values, for example to compensate for component mismatch, manufacturing variations, etc.
  • Note that the values of resistors 320A-320B affect the gain or scale factor of the sensor. In other words, the values of resistors 320A-320B determine the full range or scale that the sensor can sense, e.g., the full range of acceleration in response to the stimulus.
  • Nodes 325A and 325B provide the differential output signal of the sensor. In the embodiment shown, node 325A provides the positive output signal, whereas node 325B provides the negative output signal. Together, the positive and negative output signals provide a differential output signal that is proportional to acceleration, a, experienced by the proof mass in response to the stimulus (e.g., force), as discussed above.
  • In some embodiments, MCU 310 may include circuitry to receive and process the output signal provided at nodes 325A-325B. For example, MCU 310 may include analog-to-digital converter (ADC) circuitry to convert the output signal at nodes 325A-325B to a digital quantity. MCU 310 may communicate the resulting digital quantity to another circuit or component, for example, via link 370, as desired. Furthermore, MCU 310 may receive power (to supply the various components in the sensor) or other information, for example, parameters related to adjusting various resistor values, as described above, via link 370.
  • FIG. 9 shows a schematic diagram or circuit arrangement 300B for a sensor according to an exemplary embodiment, for instance sensors 200 and 250 in FIGS. 6 and 7, respectively. Referring to FIG. 9, as described above, optical detectors 230A-230C (photodiodes in the embodiment shown) provide an output signal to TIA 118. In the example shown, VBIAS is ground potential although, as noted above, other appropriate values may be used. In the embodiment of FIG. 9, the output signal of optical detectors 230A-230C is provided to TIA 118 as a single-ended signal.
  • Note that FIG. 9 omits light source 225 for the sake of clarity of presentation. Light source 225, e.g., a VCSEL, may be powered by an appropriate circuit (not shown). Examples include a voltage regulator, a reference source, etc., as desired. Also, in some embodiments, MCU 310 may control or program the light level that light source 225 emits, depending on various factors, such as power consumption, desired sensor parameters and performance, etc.
  • The gain of TIA 118 may be adjusted by adjusting (or calibrating or setting or programming or configuring) resistor 305. In the embodiment shown, MCU 310 adjusts the values of resistor 305. In other embodiments, other arrangements may be used, as desired, for example, use of a host or controller coupled to the sensor, described below.
  • The output of TIA 118 drives an input of amplifier 345 via resistor 335. A feedback resistor 340 couples the output of amplifier 345 to resistor 335 (input of amplifier 345). If desired, the gain of amplifier 345 may be adjusted by adjusting resistor 340 (more specifically, the ratio of resistors 340 and 335). In the embodiment shown, MCU 310 may adjust the value of resistor 345.
  • The output of amplifier 345 drives an input of amplifier 355 via resistor 350. A feedback resistor 360 couples the output of amplifier 355 to resistor 350 (input of amplifier 355). If desired, the gain of amplifier 355 may be adjusted by adjusting resistor 360 (more specifically, the ratio of resistors 360 and 350). In the embodiment shown, MCU 310 may adjust the value of resistor 360.
  • Note that adjusting the gain of TIA 118 (and optionally the gains of amplifiers 345 and 355) does not set the full-scale range of the sensor. Rather, the gain of TIA 118 (and optionally the gains of amplifiers 345 and 355) determines the overload point of the sensor, i.e., the peak overload point of the sensor in response to a stimulus. Furthermore, the coil constant of coil 109 determines the magnitude of the output signal of the sensor in response to a given amount of acceleration in response to a stimulus, such as force. More specifically, the coil constant of coil 109 in conjunction with the values of 320A and 320B determine the output scale factor in Volts per unit of stimulus, e.g., g of acceleration.
  • The output of amplifier 345 feeds one end or terminal of coil 109 via resistors 315A and 320A. Conversely, the output of amplifier 355 feeds the other end of coil 109 via resistors 315B and 320B. Thus, amplifiers 345 and 355 provide a drive signal for coil 109 via resistors 315A-315B and 320A-320B.
  • MCU 310 may adjust (or calibrate or set or program or configure) the values of resistors 320A-320B. Note that the values of resistors 320A-320B affect the gain or scale factor of the sensor. In other words, the values of resistors 320A-320B determine the full range or scale that the sensor can sense, e.g., the full range of acceleration in response to the stimulus.
  • Nodes 325A and 325B provide the differential output signal of the sensor. In the embodiment shown, node 325A provides the positive output signal, whereas node 325B provides the negative output signal. Together, the positive and negative output signals provide a differential output signal that is proportional to acceleration, a, experienced by the proof mass in response to the stimulus (e.g., force), as discussed above.
  • In some embodiments, MCU 310 may include circuitry to receive and process the output signal provided at nodes 325A-325B. For example, MCU 310 may include analog-to-digital converter (ADC) circuitry to convert the output signal at nodes 325A-325B to a digital quantity. MCU 310 may communicate the resulting digital quantity to another circuit or component, for example, via link 370, as desired. Furthermore, MCU 310 may receive power (to supply the various components in the sensor) or other information, for example, parameters related to adjusting various resistor values, as described above, via link 370.
  • Note that although the exemplary embodiments of FIGS. 8-9 show MCU 310 as the controller, other possibilities exist and are contemplated. For example, a processor (e.g., a central processing unit (CPU) or other type of processor), a logic circuit, a finite-state machine, etc., may be used to control the values of the various resistors. The choice of the controller used depends on factors such as design and performance specifications, the degree of flexibility and programmability desired, the available technology, cost, etc., as persons of ordinary skill in the art will understand.
  • FIG. 10 illustrates the output signal 400 of a TIA 118 in an exemplary embodiment, for example, one of the embodiments of FIGS. 3 and 6-9. Output signal 400 shows how the output signal 400 (measured in Volts) of TIA 118 varies as a function of displacement, x (measured in meters). The output signal 400 shows a variation around a reference point 405 in response to displacement.
  • Thus, in the example shown, in response to a displacement x1, having, for example, an absolute value of 100 nm around reference point 405 (say, ±100 nm), the output signal 400 varies from −V to +V, for example, by ±2 volts. The output signal 400 is a function of the gain of TIA 118. As noted above, the gain of TIA 118 determines the peak response or overload point of TIA 118.
  • Note that the output signal 400 of TIA 118 may be periodic (e.g., a cyclical interference fringe condition) in response to displacement, as persons of ordinary skill in the art will understand. FIG. 10 shows merely a portion of output signal 400 for the sake of discussion.
  • FIG. 11 shows a flow diagram 500 for a method of operating a sensor according to an exemplary embodiment. More specifically, the figure illustrates the actions that a controller, such as MCU 310, described above, may take, starting with the sensor's power-up.
  • After power-up, at 505 MCU 310 is reset. The reset of MCU 310 may be accomplished in a variety of ways. For example, a resistor-capacitor combination may hold the reset input of MCU 310 for a sufficiently long time to reset MCU 310. As another example, a power-on reset circuit external to MCU 310 may cause MCU 310 to reset. As another example, MCU 310 may be reset according to commands or control signals from a host.
  • After reset, MCU 310 begins executing firmware or user program instructions. The firmware or user program instructions may be included in a storage circuit within MCU 310 (e.g., internal flash memory) or in a storage circuit external to MCU 310 (e.g., an external flash memory). In any event, MCU 310 takes various actions in response to the firmware or user program instructions.
  • At 510, MCU 310 adjusts one or more resistors (e.g., resistors 305A-305B in FIG. 8 or resistor 305 in FIG. 9) to calibrate the gain of TIA 118 (see, for example, FIGS. 8 and 9). As described above in detail, the gain of TIA 118 affects certain attributes of the sensor.
  • At 515, MCU 310 adjusts resistors (e.g., resistors 320A-320B in FIGS. 8 and 9) in the signal path that drives coil 109 (see, for example, FIGS. 8 and 9). As described above in detail, the values of resistors 320A-320B affects certain attributes of the sensor, such as gain or scale of the sensor. Optionally, MCU 310 may make other adjustments or calibrations, for example, it may adjust the values of resistors 340 and 360 (see FIG. 9).
  • Referring again to FIG. 11, at 520 MCU 310 may optionally enter a sleep state. In the sleep state certain parts or blocks of MCU 310 may be disabled or powered down or placed in a low-power state (compared to when MCU 310 is powered up). Examples include placing the processor, input/output (I/O) circuits, signal processing circuits (e.g., ADC), and/or other circuits (e.g., arithmetic processing circuits) of MCU 310 in a sleep state.
  • Placing some of the circuitry of MCU 310 in a sleep state lowers the power consumption of MCU 310, in particular, and of the sensor, overall. Depending on the amount of power consumed in the sleep state and factors such as power-source capacity (e.g., the capacity of a battery used to power the sensor), MCU 310 may remain in the sleep state for relatively long periods of time, e.g., days, weeks, months, or even longer. Thus, the power savings because of the use of the sleep state provide a particular benefit in portable or remote applications where a battery may be used to power the sensor.
  • Note that some circuitry in MCU 310 may be kept powered up, even during the sleep mode or state. For example, a real-time clock (RTC) circuit (or other timer circuitry) may be kept powered and operational so as to track the passage of time. As another example, interrupt circuitry of MCU 310 may be kept powered and operation so that MCU 310 may respond to interrupts.
  • As part of entering the sleep state, the state of MCU 310 may be saved, for example, contents of registers, content of the program counter, etc. Saving the state of MCU 310 allows restoring MCU 310 later (e.g., when MCU 310 wakes up or resumes from the sleep state) to the same state as when it entered the sleep state.
  • MCU 310 may leave the sleep mode or state (wake up) and enter the normal mode of operation (e.g., processing signals generated in the sensor in response to a stimulus), or resume from the sleep state. For instance, in some embodiments, MCU 310 (or a CPU or other processor or controller) remains in the sleep state until one or more conditions are met, for example, the output signal (Out+-Out−) exceeding a preset threshold or value, or a timer generating a signal after a preset amount of time has elapsed, etc. In some embodiments, once the condition(s) is/are met, an interrupt may be generated to cause MCU 310 to leave the sleep state.
  • As part of the process of leaving the sleep state and entering the normal mode of operation, the state of MCU 310 may be restored (if the state was saved, as described above). Once MCU 310 leaves the sleep state, it can process signals generated in response to the stimuli, as described above.
  • In some embodiments, the sensor may be self-contained. In other words, the sensor, e.g., MCU 310, may include instructions for code that determine how the sensor responds to stimuli, how it processes the signals generated as a result of the application of the stimulus (e.g., log the signal values, and time/date information, as desired), etc. The sensor may also include a source of energy, such as a battery, to supply power to the various circuits of the sensor. Such embodiments may be suitable for operation in conditions where access to the sensor is limited or relatively difficult.
  • In other embodiments, the sensor may communicate with another device, component, system, or circuit, such as a host. FIG. 12 illustrates such an arrangement according to an exemplary embodiment.
  • Specifically, a sensor, such as the sensors depicted in FIGS. 3 and 6-9, includes a controller, such as MCU 310. Circuit arrangement 600 in FIG. 12 also includes a host (or device or component or system or circuit) 605. The sensor, specifically, the controller (MCU 310) communicates with host 605 via link 370.
  • In exemplary embodiments, link 370 may include a number of conductors, and facilitate performing a number of functions. In some embodiments, link 370 may constitute a multi-conductor cable or other or similar means of coupling. In some embodiments, link 370 may constitute a bus.
  • In some embodiments, link 370 may constitute a wireless link (e.g., the sensor and host 605 include receiver, transmitter, or transceiver circuitry that allow wireless communication via link 370 by using radio-frequency (RF) signals). Use of a wireless link provides the advantage of communication without using cumbersome electrical connections, and may allow arbitrary or desired locations for the sensor and host 605.
  • In some embodiments, link 370 may constitute an optical link. Use of an optical link allows for relatively low noise in link 370. In such a situation, the sensor and host 605 may include optical sources and/or receivers or detectors, depending on whether unidirectional or bidirectional communication is desired.
  • In some embodiments, link 370 provides a mechanism for supplying power to various parts of the sensor. The sensor may include one or more local regulators, as desired, to regulate or convert the power received from host 605 (or other source), for example, by changing the voltage level or increasing the load regulation, as desired.
  • In some embodiments, link 370 provides a mechanism for the sensor and host 605 to communicate a variety of signals. Examples include data signals, control signals, status signals, and handshaking signals (e.g., as used in information exchange protocols). As an example, link 370 provides a flexible mechanism by which the sensor may receive information (e.g., calibration information) from host 605.
  • As another example, the sensor may provide information, such as data corresponding to or derived from a stimulus applied to the sensors. Examples of such data include information regarding displacement, velocity, and/or acceleration. Using this mechanism, host 605 may record a log of the data using desired intervals.
  • In exemplary embodiments, link 370 provides a flexible communication channel by supporting a variety of types of signals, as desired. For example, in some embodiments, link 370 may be used to communicate analog signals. In other embodiments, link 370 may be used to communicate digital signals. In yet other embodiments, link 370 may be used to communicate mixed-signal information (both analog and digital signals).
  • In some embodiments, host 605 may constitute or comprise an MCU (or other processor or controller) (not shown). In such scenarios, MCU 310 in the sensor may be omitted or may be moved to host 605, as desired. As an alternative, in some embodiments, the MCU in host 605 may communicate with MCU 310 in the sensor.
  • One aspect of the disclosure relates to sensors with improved power consumption. Power consumption of sensors according to various embodiments may be improved in a number of ways. For example, as described above, in some embodiments, by changing the state of MCU 310 and/or other circuitry in the sensor from the normal mode of operation to the sleep state, power consumption of the sensor may be improved or reduced.
  • In addition, or as an alternative, in some embodiments, light source 225 may be powered or driven by a time-varying signal, rather than a DC or constant signal. More specifically, the duty cycle and/or pulse-repetition frequency of light source 225 may be configured in order to vary the power consumption of light source 225.
  • FIG. 13 depicts a circuit arrangement 650 sensor with configurable light source duty cycle and/or pulse-repetition frequency according to an exemplary embodiment.
  • As described above, the sensor in FIG. 13 includes coil 109 suspended in the magnetic field of one or more magnets 112. Optical position sensor 115 detects the movement of coil 109 in response to stimuli, such as acceleration. As described above, optical position sensor 115 generates an output signal 115-1, for example, a current or voltage, in response to the movement of coil 109.
  • Signal processing circuit 655 is coupled to coil 109 and optical position sensor 115 to form a negative feedback circuit, as described above. Thus, signal processing circuit 655 receives output signal 115-1 of optical position sensor 115, processes that signal, and then applies an output signal to coil 109, as described above.
  • Signal processing circuit 655 may include a variety of components, blocks, or circuits. FIGS. 8-9 show examples according to two exemplary embodiments. Thus, signal processing circuit 655 may include one or more TIAs (not shown), resistors (not shown), amplifiers (not shown), filtering or feedback circuits/networks, etc. Generally, a variety of signal processing circuits 655 are contemplated, and are not limited to the examples shown in FIGS. 8-9, as persons of ordinary skill in the art will understand.
  • An output of signal processing circuit 655 couples to and drives coil 109. By virtue of the negative feedback in the circuit, coil 109 produces a force such that the sensor operates according to a force-balance principle, as described above.
  • As noted above, optical position sensor 115 includes an optical interferometer. The optical interferometer includes light source 225, and optical detectors 230A, 230B, and 230C. A mechanical or physical stimulus applied to sensor 200 causes a change in the detected light, and thus causes optical detectors 230A-230C to provide an electrical output signal. The electrical output signal, e.g., a current signal, may be used in a feedback loop, as discussed above.
  • A variety of light sources may be used in exemplary embodiments. For example, as noted above, in some embodiments, a VCSEL may be used as light source 225. In some embodiments, a light-emitting diode (LED) may be used as light source 225.
  • Controller 660 provides power to light source 225. As described below in detail, controller 660 may configure the current or voltage (or both, if desired) provided to light source 225. Mores specifically, controller 660 may configure the amplitude as well as timing of pulses of current or voltage (which result in a current flowing through light source 225) provided to light source 225. Consequently, controller 660 may configure the duty cycle and/or pulse-repetition frequency of the light-source current.
  • As noted above, the duty cycle and/or pulse-repetition frequency of the current supplied to light source 225 may be configured in order to vary the power consumption of light source 225. Varying the duty cycle and/or pulse-repetition frequency of light source 225 changes the current supplied to light source 225. The variation in the current causes corresponding changes in the power that light source 225 consumes or dissipates.
  • FIG. 14 shows a plot 615 of power dissipation in light-source 225 as a function of current (e.g., average current) in exemplary embodiments. Below a threshold current, IT, light source 225 consumes a certain amount of power, PT, for example, because of leakage or other phenomena.
  • Beyond the threshold current, IT, increasing the current through light source 225 results in a corresponding increase in the power consumption of light source 225. The increase in the power consumption traverses a relatively linear trajectory (assuming a relatively constant voltage across light source 225).
  • Thus, by configuring the average current through light source 225, the power consumption of light source 225 and, thus, of optical position sensor 115, may be reduced. As a result, other things being equal, the overall power consumption of the sensor may be improved or reduced.
  • FIG. 15 (not drawn to scale) illustrates a plot 675 of light-source current, is, as a function of time according to an exemplary embodiment. Specifically, FIG. 15 shows the current through light source 225, repeating with a period T. In other words, the current through light source 225 has a pulse-repetition frequency of
  • f = 1 T .
  • As noted above, the pulse-repetition frequency or frequency f may be configured in order to vary the power consumption of light source 225. In exemplary embodiments, the pulse-repetition frequency may be configured by configuring the period T.
  • In addition, or as alternative, the duty cycle of the light-source current may be configured. In the example shown, the light-source current has a duty cycle defined as
  • D = t ON T ,
  • where tON represents the portion of the period, T, during which light source 225 is powered on.
  • If a pulse train with a constant peak value is used to drive or power light source 225, the average value of the light-source current is the product of the duty cycle and the peak current value. In the example shown, plot 675 has a duty cycle of 50% or about 50%. Note that because the duty cycle of the light-source current is less than 100%, the average current is less than the peak current value. In the example illustrated in FIG. 15, the light-source current has an average value, labeled as 680, about half of the peak current value.
  • All else being equal, increasing the duty cycle of the light-source current increases the average current (labeled as 680) and, thus, the power consumed by light source 225. Conversely, decreasing the duty cycle of the light-source current increases the average current and, therefore, the power consumed by light source 225. FIG. 16 (not drawn to scale) depicts such a situation.
  • Specifically, in FIG. 16, the duty cycle is reduced (compared to the scenario illustrated in FIG. 15). Referring to FIG. 16, plot 675 has a duty cycle of 20% or about 20%. As noted above, because the duty cycle of the light-source current is less than 100%, the average current is less than the peak current value. In the example illustrated in FIG. 16, the light-source current has an average value, labeled as 680, about 20% of the peak current value.
  • In exemplary embodiments, the duty cycle (or pulse-repetition frequency, or both) of the light-source current may be varied in a continuous manner, or in steps, as desired. For example, the on-time, tON, may be varied in a continuous manner, or it may be varied in steps, for instance, increases or decreases of, say, x %, as desired.
  • As noted above, in exemplary embodiments, controller 660 may configure the duty cycle and/or pulse-repetition frequency of the light-source current. FIG. 17 shows a circuit arrangement 670 that may be used for configuring light-source duty cycle and/or pulse-repetition frequency according to an exemplary embodiment.
  • More specifically, controller 660 includes a voltage source 675, coupled to a resistor 680, in turn coupled to light source 225. Resistor 680 is selected so as to limit the current flowing through light source 225 to a desired value (e.g., based on the forward-voltage drop of a VCSEL or LED).
  • Voltage source 675 is a variable voltage source. Voltage source 675 provides as an output a voltage pulse train. The characteristics of the pulse train, such as its peak value, on-time, and period are configurable (by using circuitry in controller 660, which is not shown for the sake of facilitating presentation). Thus, by configuring or controlling voltage source 675, the duty cycle and/or pulse-repetition frequency of the light-source current may be configured.
  • FIG. 18 illustrates a circuit arrangement 700 that may be used for configuring light-source duty cycle and/or pulse-repetition frequency according to another exemplary embodiment. Circuit arrangement 700 is similar to the circuit arrangement shown in FIG. 17, but uses a fixed, rather than variable, voltage source 675.
  • In addition, circuit arrangement 700 includes a switch 705. In the example shown, switch 705 constitutes a metal oxide semiconductor field effect transistor (MOSFET), although other types of switch may be used, for example, bipolar junction transistors (BJTs), etc., as desired, and as persons of ordinary skill in the art will understand.
  • When turned on by the application of an appropriate bias signal to gate 710 of switch 705, switch 705 may be turned on and off. Using the n-channel MOSFET shown in the example, a positive gate signal turns on MOSFET 705, and vice-versa.
  • By controlling the gate signal of switch 705, controller 660 can turn switch 705 on and off so as to supply a pulse train to light source 225. The characteristics of the pulse train, such as its peak value, on-time, and period are configurable (by using circuitry in controller 660, which is not shown for the sake of facilitating presentation). Thus, by controlling switch 705, the duty cycle and/or pulse-repetition frequency of the light-source current may be configured.
  • Rather than using voltage sources, as FIGS. 17-18 illustrate, controller 660 may current sources to configure the duty cycle and/or pulse-repetition frequency of the light-source current. More specifically, FIG. 19 depicts a circuit arrangement 720 that may be used for configuring light-source duty cycle and/or pulse-repetition frequency according to another exemplary embodiment.
  • More specifically, controller 660 includes a current source 725, coupled to supply current to light source 225. The magnitude of the current, e.g., a peak value, may be selected to provide an appropriate or desired current to light source 225 (e.g., based on the forward-voltage drop of a VCSEL or LED).
  • Current source 725 is a variable current source. Current source 725 provides as an output a current pulse train. The characteristics of the pulse train, such as its peak value, on-time, and period are configurable (by using circuitry in controller 660, which is not shown for the sake of facilitating presentation). Thus, by configuring or controlling current source 725, the duty cycle and/or pulse-repetition frequency of the light-source current may be configured.
  • FIG. 20 shows a circuit arrangement 750 that may be used for configuring light-source duty cycle and/or pulse-repetition frequency according to another exemplary embodiment. Circuit arrangement 750 is similar to the circuit arrangement shown in FIG. 19, but uses a fixed, rather than variable, current source 755.
  • In addition, circuit arrangement 750 includes a switch 705. In the example shown, switch 705 constitutes a MOSFET, although other types of switch may be used, for example, BJTs, etc., as desired, and as persons of ordinary skill in the art will understand.
  • When turned on by the application of an appropriate bias signal to gate 710 of switch 705, switch 705 may be turned on and off. Using the n-channel MOSFET shown in the example, a positive gate signal turns on MOSFET 705, and vice-versa.
  • By controlling the gate signal of switch 705, controller 660 can turn switch 705 on and off so as to supply a pulse train to light source 225. The characteristics of the pulse train, such as its peak value, on-time, and period are configurable (by using circuitry in controller 660, which is not shown for the sake of facilitating presentation). Thus, by controlling switch 705, the duty cycle and/or pulse-repetition frequency of the light-source current may be configured.
  • Current source 755 is typically implemented with transistors, e.g., MOSFETs or BJTs, supplied from a supply voltage, VDD or VCC. Thus, even though turning off switch 705 results in an open circuit (or nearly open circuit) presented to current source 755, the compliance voltage of current source 755 should not pose a problem, given that the compliance voltage would not rise to more than VDD or VCC.
  • In exemplary embodiments, controller 660 may configure the light-source current to have desired duty cycles and/or pulse-repetition frequencies, as discussed above. With respect to pulse-repetition frequencies, a tradeoff may exist (depending on circuit components, the technology available or used, etc.). A larger pulse-repetition frequency allows more granularity over the control of light-source current characteristics.
  • Furthermore, in exemplary embodiments, pulse-repetition frequencies are selected or designed so that they are larger than the bandwidth of interest or operation of the sensors. More specifically, sensors according to various embodiments have a bandwidth (e.g., the bandwidth of the feedback network, the bandwidth of the optical interferometer, the bandwidth of the mechanical subsystem that includes the coil and spring(s), etc.) within which they respond to stimuli, such as acceleration.
  • In order for the pulsing of light source 225 not to interfere with the sensing of stimuli, the pulse-repetition frequency is selected or varies so that it is larger than then the bandwidth of the sensor. As a result, the fundamental and harmonics of the light-source current pulse-train fall outside the bandwidth of the sensor.
  • Conversely, a larger pulse-repetition frequency typically increases losses in the circuit and, thus, raises the overall power consumption of controller 660 and of the sensor. More specifically, given the finite on-state resistance of various switches used to control the light-source current (e.g., switch 705, or other components used in the voltage and current sources in FIGS. 17-20), an amount of power is dissipated during switching from one state to another (e.g., from on to off). Moreover, other losses, such as because of component and circuit parasitic capacitances, may exist. Larger pulse-repetition frequencies typically increase those losses and, thus, the overall power consumption of controller 660, and therefore of the sensor.
  • In the embodiments shown, controller 660 configures the duty cycle and/or pulse-repetition frequency of the light-source current. Other arrangements are contemplated, and may be used. For example, in some embodiments, MCU 310 (with internal or external voltage and/or current sources or other components), rather than controller 660, may provide the configuration function. As another example, in some embodiments, MCU 310 may include controller 660. In the latter case, the voltage and/or current sources or other components that supply power to light source 225 may be external or internal to MCU 310.
  • As another example, MCU 310 may communicate with controller 660 to cause controller 660 to configure the duty cycle and/or pulse-repetition frequency of the light-source current. As another example, a host, such as host 605 in FIG. 12, may communicate (e.g., via a communication port) with MCU 310 and/or controller 660 to cause configuration the duty cycle and/or pulse-repetition frequency of the light-source current.
  • Although sensors according to exemplary embodiments have been described and illustrated in the accompanying drawings, a variety of other embodiments and arrangements are contemplated. The following description provides some examples.
  • In some embodiments, MCU 310 may be omitted. Instead, a remote host, device, component, system, circuit, etc., may couple to circuitry in the sensor to perform various operations, e.g., adjust the values of the various resistors. The sensor may include circuitry to facilitate communication with the remote host. Analog, digital, or mixed-signal control communication signals may be used to adjust the resistor values, as desired.
  • In some embodiments, the electrical components (e.g., MCU 310, TIA 118, etc.) and rest of the sensor components (e.g., coil, optical position sensor) reside in the same housing. In other embodiments, the electrical components and rest of the sensor components reside in different components (e.g., to allow easier access to some components, while protecting other components) of the same housing.
  • In yet other embodiments, the electrical components and rest of the sensor components, for example, the coil and/or optical position sensor, reside in different or separate housings. The choice of configuration depends on a variety of factors, as persons of ordinary skill in the art will understand. Examples of such factors include design and performance specifications, the intended physical environment of the sensor, the level of access desired to various components, cost, complexity, etc.
  • Sensors according to exemplary embodiments may be used in a variety of applications. For example, sensors according to some embodiments may be used for geological exploration. As another example, sensors according to some embodiments may be used for detecting seismic movement, i.e., in seismology. As another example, sensors according to some embodiments may be used for detecting and/or deriving various quantities related to navigation, i.e., in inertial navigations. Other applications include using the sensor as a reference sensor for motion stimulus testing of other components or sensors under test.
  • Referring to the figures, persons of ordinary skill in the art will note that the various blocks shown might depict mainly the conceptual functions and signal flow. The actual circuit implementation might or might not contain separately identifiable hardware for the various functional blocks and might or might not use the particular circuitry shown. For example, one may combine the functionality of various blocks into one circuit block, as desired. Furthermore, one may realize the functionality of a single block in several circuit blocks, as desired. The choice of circuit implementation depends on various factors, such as particular design and performance specifications for a given implementation. Other modifications and alternative embodiments in addition to those described here will be apparent to persons of ordinary skill in the art. Accordingly, this description teaches those skilled in the art the manner of carrying out the disclosed concepts, and is to be construed as illustrative only. Where applicable, the figures might or might not be drawn to scale, as persons of ordinary skill in the art will understand.
  • The forms and embodiments shown and described should be taken as illustrative embodiments. Persons skilled in the art may make various changes in the shape, size and arrangement of parts without departing from the scope of the disclosed concepts in this document. For example, persons skilled in the art may substitute equivalent elements for the elements illustrated and described here. Moreover, persons skilled in the art may use certain features of the disclosed concepts independently of the use of other features, without departing from the scope of the disclosed concepts.

Claims (20)

1. A sensor, comprising:
a coil suspended in a magnetic field;
a light source to produce a light output in response to a current, wherein a duty cycle and/or pulse-repetition frequency of the current is configurable; and
an optical detector to use the light output of the light source to detect displacement of the coil in response to a stimulus.
2. The sensor according to claim 1, wherein a controller configures the duty cycle and/or pulse-repetition frequency of the current.
3. The sensor according to claim 2, wherein the controller comprises a microcontroller unit (MCU).
4. The sensor according to claim 2, wherein the controller resides in a microcontroller unit (MCU).
5. The sensor according to claim 1, wherein the light source comprises a vertical cavity surface-emitting laser (VCSEL).
6. The sensor according to claim 1, wherein the light source comprises a light-emitting diode (LED).
7. The sensor according to claim 1, wherein the sensor responds to the stimulus within a frequency band, and wherein pulse-repetition frequency of the current is configured such that the current has a frequency larger than the frequency band.
8. The sensor according to claim 1, further comprising a feedback circuit coupled to the optical detector and to the coil.
9. The sensor according to claim 1, further comprising a variable voltage source to configure the duty cycle and/or pulse-repetition frequency of the current.
10. The sensor according to claim 1, further comprising a voltage source and a controllable switch to configure the duty cycle and/or pulse-repetition frequency of the current.
11. The sensor according to claim 1, further comprising a variable current source to configure the duty cycle and/or pulse-repetition frequency of the current.
12. The sensor according to claim 1, further comprising a current source and a controllable switch to configure the duty cycle and/or pulse-repetition frequency of the current.
13. A system, comprising:
a sensor, comprising:
a coil suspended in a magnetic field;
a light source to produce a light output in response to a current, wherein a duty cycle and/or pulse-repetition frequency of the current is configurable by a microcontroller unit (MCU);
an optical detector to use the light output of the light source to detect displacement of the coil in response to a stimulus; and
a feedback circuit coupled to the optical detector and to the coil to form a negative feedback loop.
14. The system according to claim 13, further comprising a host coupled to provide at least one command to the MCU, wherein in response to the at least one command, the MCU configures the duty cycle and/or pulse-repetition frequency of the current.
15. The system according to claim 13, wherein the light source comprises a vertical cavity surface-emitting laser (VCSEL) or a light-emitting diode (LED).
16. The system according to claim 13, wherein the sensor responds to the stimulus within a frequency band, and wherein pulse-repetition frequency of the current is configured such that the current has a frequency larger than the frequency band.
17. A method of operating a sensor that includes a coil suspended in a magnetic field, a light source to produce a light output in response to a current, and an optical detector to use the light output of the light source to detect displacement of the coil in response to a stimulus, the method comprising configuring a duty cycle and/or pulse-repetition frequency of the current.
18. The method according to claim 17, wherein configuring the duty cycle and/or pulse-repetition frequency of the current further comprises using a microcontroller unit (MCU).
19. The method according to claim 17, wherein the light source comprises a vertical cavity surface-emitting laser (VCSEL) or a light-emitting diode (LED).
20. The method according to claim 17, wherein configuring the duty cycle and/or pulse-repetition frequency of the current further comprises configuring the current such that the current has a pulse-repetition frequency higher than a bandwidth within which the sensor responds to the stimulus.
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US14/520,758 Abandoned US20150042359A1 (en) 2012-10-11 2014-10-22 Apparatus for Sensor with Configurable Coil Constant and Associated Methods
US14/520,866 Abandoned US20150035544A1 (en) 2012-10-11 2014-10-22 Apparatus for Sensor with Configurable Damping and Associated Methods
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US14/520,758 Abandoned US20150042359A1 (en) 2012-10-11 2014-10-22 Apparatus for Sensor with Configurable Coil Constant and Associated Methods
US14/520,866 Abandoned US20150035544A1 (en) 2012-10-11 2014-10-22 Apparatus for Sensor with Configurable Damping and Associated Methods
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109870592A (en) * 2019-03-20 2019-06-11 北京航空航天大学 A kind of optical accelerometer based on electromagnetism power drive

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2015112966A (en) * 2012-10-11 2016-12-10 СИЛИКОН АУДИО САЙЗМИК, ЭлЭлСи CLOSED CIRCUIT CONTROL METHODS FOR OPTICAL READING MOVEMENT SENSORS
CA2932455C (en) * 2013-12-31 2018-05-01 Halliburton Energy Services, Inc. Geophone with tunable resonance frequency
NO20140263A1 (en) * 2014-02-28 2015-08-31 Pgs Geophysical As Optical motion sensor
US11234080B2 (en) * 2014-11-18 2022-01-25 Ps Audio Design Oy Apparatus with surface to be displaced
GB201506046D0 (en) 2015-04-09 2015-05-27 Sinvent As Speech recognition
USD812024S1 (en) 2015-04-14 2018-03-06 Hanchett Entry Systems, Inc. Power transfer module housing
CA3014249C (en) * 2016-02-15 2023-05-09 Hyperion Sensors Inc. Optical sensing methods and systems for power applications, and the construction thereof
GB201609427D0 (en) * 2016-05-27 2016-07-13 Sintef Tto As Accelerometers
US11221354B2 (en) * 2016-07-01 2022-01-11 Intel Corporation Switched closed loop read-out methods and systems for resonant sensing platforms
CN106949955B (en) * 2017-04-18 2023-03-21 中国工程物理研究院电子工程研究所 Micro electro mechanical system platform based on optical detection
PL240132B1 (en) 2017-04-28 2022-02-21 Inphotech Spolka Z Ograniczona Odpowiedzialnoscia Method for measuring vibrations, preferably seismic vibrations and the device for measuring vibrations, preferably seismic vibrations
GB201708100D0 (en) 2017-05-19 2017-07-05 Sintef Input device
CA3107955A1 (en) 2017-08-01 2019-02-07 Hyperion Sensors Inc. Optical sensing methods and systems for transformers, and the construction thereof
CN107490775B (en) * 2017-09-30 2020-01-21 北京航空航天大学 Triaxial coil constant and non-orthogonal angle integrated measurement method
US10830787B2 (en) * 2018-02-20 2020-11-10 General Electric Company Optical accelerometers for use in navigation grade environments
CN109061225B (en) * 2018-06-29 2020-05-05 京东方科技集团股份有限公司 Acceleration measuring device and acceleration measuring method thereof
US11496034B2 (en) 2019-06-14 2022-11-08 Apple Inc. Haptic actuator having a double-wound driving coil for temperature-independent velocity sensing
US11527946B2 (en) * 2019-06-14 2022-12-13 Apple Inc. Haptic actuator having a double-wound driving coil for temperature- and driving current-independent velocity sensing
FR3108897B1 (en) * 2020-04-03 2022-04-08 Commissariat Energie Atomique Sensor control method
CN111692984A (en) * 2020-06-19 2020-09-22 南京工业大学 Bridge dynamic deflection measuring device and measuring method based on magnetic suspension technology
US20230221146A1 (en) * 2020-07-06 2023-07-13 Jatco Ltd Rotation sensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5445971A (en) * 1992-03-20 1995-08-29 Abbott Laboratories Magnetically assisted binding assays using magnetically labeled binding members
US20050157289A1 (en) * 2003-02-18 2005-07-21 Nhk Spring Co., Ltd. Actuator and object detecting apparatus that uses actuator
US20100103427A1 (en) * 2007-06-04 2010-04-29 Nhk Spring Co., Ltd. Object detector

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3047663A (en) * 1957-12-06 1962-07-31 Electronic Secretary Ind Inc Automatic scanning control
US3582875A (en) * 1968-11-12 1971-06-01 Stanley Herbert Van Wambeck Geophone device
US3858169A (en) * 1973-03-26 1974-12-31 Gulf Research Development Co Geophone impulse tester
GB1508228A (en) * 1974-11-12 1978-04-19 Sony Corp Transistor circuits
US4159464A (en) * 1976-07-06 1979-06-26 Western Geophysical Co. Of America Geophone with damping coil
US4285054A (en) * 1979-07-27 1981-08-18 Mark Products, Inc. Geophone
SE422369B (en) * 1979-08-03 1982-03-01 Arvid Lundbeck DEVICE FOR COMPENSATION OF TRANSFER FUNCTION
US4298969A (en) * 1979-09-26 1981-11-03 Exxon Production Research Company Method and apparatus for testing the impedances of geophone channels
US4754438A (en) * 1985-05-15 1988-06-28 Union Oil Company Of California Geophone testing apparatus
US5103174A (en) * 1990-02-26 1992-04-07 The United States Of America As Represented By The Secretary Of The Navy Magnetic field sensor and device for determining the magnetostriction of a material based on a tunneling tip detector and methods of using same
US5119345A (en) * 1991-05-03 1992-06-02 Shaw Industries Ltd. Geophone
US5134594A (en) * 1991-07-03 1992-07-28 Shaw Industries, Ltd. Geophone spring
US5962782A (en) * 1997-06-11 1999-10-05 The Broken Hill Proprietary Company Limited Gravity gradiometer accelerometers
US6545514B2 (en) * 1999-04-26 2003-04-08 Stmicroelectronics N.V. Drive circuit for inductive loads
US6433543B1 (en) * 2002-01-04 2002-08-13 Mohsen Shahinpoor Smart fiber optic magnetometer
US7116430B2 (en) * 2002-03-29 2006-10-03 Georgia Technology Research Corporation Highly-sensitive displacement-measuring optical device
US7239577B2 (en) * 2002-08-30 2007-07-03 Pgs Americas, Inc. Apparatus and methods for multicomponent marine geophysical data gathering
US20050031140A1 (en) * 2003-08-07 2005-02-10 Tymphany Corporation Position detection of an actuator using a capacitance measurement
DE10344558A1 (en) * 2003-09-25 2005-05-12 Send Signal Elektronik Gmbh Method and device for detecting seismic movements
WO2008042556A2 (en) * 2006-09-28 2008-04-10 Cggveritas Services Holding (U.S.) Inc. Autonomous ocean bottom seismic node recording device
JP2009258022A (en) * 2008-04-18 2009-11-05 Sony Corp Displacement detecting device
EP2933125B1 (en) * 2009-05-04 2019-03-20 Fox Factory, Inc. Suspension system for a vehicle
US8125852B2 (en) * 2009-05-25 2012-02-28 Schlumberger Technology Corporation Methods and systems for seismic signal detection
US8990022B2 (en) * 2009-12-23 2015-03-24 Pgs Geophysical As Direct velocity seismic sensing
RU2546997C2 (en) * 2010-01-22 2015-04-10 Ион Геофизикал Корпорейшн Seismic recording system with rejection of ghost wave and movement
US7975392B1 (en) * 2010-03-10 2011-07-12 National Oilwell Varco, L.P. Downhole tool
US9250118B2 (en) * 2011-03-31 2016-02-02 The Regents Of The University Of California Leaf-spring optical seismometer using fringe signals for seismic measurements
CN105661695A (en) * 2011-09-01 2016-06-15 佐尔医药公司 Wearable monitoring and treatment device
US9939551B2 (en) * 2012-09-24 2018-04-10 Schlumberger Technology Corporation Systems, devices and methods for borehole gravimetry
RU2015112966A (en) * 2012-10-11 2016-12-10 СИЛИКОН АУДИО САЙЗМИК, ЭлЭлСи CLOSED CIRCUIT CONTROL METHODS FOR OPTICAL READING MOVEMENT SENSORS
CA2840916C (en) * 2013-04-02 2016-11-01 Sas E&P Ltd. Dual-coil geophone accelerometer
US9513145B2 (en) * 2013-10-29 2016-12-06 Baker Hughes Incorporated Apparatus to reduce pressure and thermal sensitivity of high precision optical displacement sensors
US20160116499A1 (en) * 2014-10-22 2016-04-28 Silicon Audio Seismic, LLC Apparatus for Sensor with Communication Port for Configuring Sensor Characteristics and Associated Methods

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5445971A (en) * 1992-03-20 1995-08-29 Abbott Laboratories Magnetically assisted binding assays using magnetically labeled binding members
US20050157289A1 (en) * 2003-02-18 2005-07-21 Nhk Spring Co., Ltd. Actuator and object detecting apparatus that uses actuator
US20100103427A1 (en) * 2007-06-04 2010-04-29 Nhk Spring Co., Ltd. Object detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109870592A (en) * 2019-03-20 2019-06-11 北京航空航天大学 A kind of optical accelerometer based on electromagnetism power drive

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