US20150027517A1 - Method and structure for tiling industrial thin-film solar devices - Google Patents
Method and structure for tiling industrial thin-film solar devices Download PDFInfo
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- US20150027517A1 US20150027517A1 US14/514,185 US201414514185A US2015027517A1 US 20150027517 A1 US20150027517 A1 US 20150027517A1 US 201414514185 A US201414514185 A US 201414514185A US 2015027517 A1 US2015027517 A1 US 2015027517A1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/0201—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising specially adapted module bus-bar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
A method for integrating photovoltaic module includes providing a cover plate having a first surface and a second surface opposed to the first surface and supplying two or more solar devices respectively formed on substrates. Each of the two or more photovoltaic devices includes a plurality of photovoltaic cells electrically coupled to each other and each cell is characterized by a thin-film photovoltaic layer sandwiched between a first electrode material and a second electrode material. The first electrode material overlies the substrate and the second electrode material overlies the thin-film photovoltaic layer. The method further includes disposing the two or more solar devices side by side to laminate with the cover plate by means of a first organic material filled between the second electrode material and the second surface. Each of the two or more solar devices has a peripheral edge region being sealed by a second organic material. The method further includes electrically coupling the two or more solar devices to each other.
Description
- This application is a divisional of U.S. patent application Ser. No. 13/006,743, filed Jan. 14, 2011, entitled “Method and Structure for Tiling Industrial Thin-Film Solar Devices” by inventor Robert D. Wieting, which claims priority to U.S. Provisional Patent Application No. 61/297,661, filed Jan. 22, 2010, entitled “Method and Structure for Tiling Industrial Thin-Film Solar Devices” by inventor Robert D. Wieting, commonly assigned and incorporated by reference herein for all purposes.
- The present invention relates generally to photovoltaic techniques. More particularly, the present invention provides a method and structure for tiling solar devices to a transparent cover plate. Merely by example, embodiments of the present invention are applied to laminate two or more industrial-sized solar panels based on thin-film photovoltaic materials including copper indium diselenide species (CIS), copper indium gallium diselenide species (CIGS), and/or others.
- From the beginning of time, mankind has been challenged to find way of harnessing energy. Energy comes in the forms such as petrochemical, hydroelectric, nuclear, wind, biomass, solar, and more primitive forms such as wood and coal. Over the past century, modern civilization has relied upon petrochemical energy as an important energy source. Petrochemical energy includes gas and oil. Gas includes lighter forms such as butane and propane, commonly used to heat homes and serve as fuel for cooking Gas also includes gasoline, diesel, and jet fuel, commonly used for transportation purposes. Heavier forms of petrochemicals can also be used to heat homes in some places. Unfortunately, the supply of petrochemical fuel is limited and essentially fixed based upon the amount available on the planet Earth. Additionally, as more people use petroleum products in growing amounts, it is rapidly becoming a scarce resource, which will eventually become depleted over time.
- More recently, environmentally clean and renewable sources of energy have been desired. An example of a clean source of energy is hydroelectric power. Hydroelectric power is derived from electric generators driven by the flow of water produced by dams such as the Hoover Dam in Nevada. The electric power generated is used to power a large portion of the city of Los Angeles in California. Clean and renewable sources of energy also include wind, waves, biomass, and the like. That is, windmills convert wind energy into more useful forms of energy such as electricity. Still other types of clean energy include solar energy. Specific details of solar energy can be found throughout the present background and more particularly below.
- Solar energy technology generally converts electromagnetic radiation from the sun to other useful forms of energy. These other forms of energy include thermal energy and electrical power. For electrical power applications, solar cells are often used. Although solar energy is environmentally clean and has been successful to a point, many limitations remain to be resolved before it becomes widely used throughout the world. As an example, one type of solar cell uses crystalline materials, which are derived from semiconductor material ingots. These crystalline materials can be used to fabricate optoelectronic devices that include photovoltaic and photodiode devices that convert electromagnetic radiation into electrical power. However, crystalline materials are often costly and difficult to make on a large scale. Other types of solar cells use “thin film” technology to form a thin film of photosensitive material to be used to convert electromagnetic radiation into electrical power. Similar limitations exist with the use of thin film technology in making solar cells. That is, efficiencies are often poor. Additionally, film reliability is often poor and cannot be used for extensive periods of time in conventional environmental applications. Often, thin films are difficult to mechanically integrate with each other. These and other limitations of these conventional technologies can be found throughout the present specification and more particularly below.
- The present invention relates generally to photovoltaic techniques. More particularly, the present invention provides a method and structure for tiling two or more solar devices to a transparent cover plate. Merely by example, the present invention is applied to laminate two or more thin-film solar devices having sizes of about 165 cm or greater.
- According to an embodiment, the present invention provides a method for integrating photovoltaic module. The method includes providing a cover plate having a first surface and a second surface opposed to the first surface. The method further includes supplying two or more solar devices respectively formed on substrates. Each of the two or more photovoltaic devices includes a plurality of photovoltaic cells electrically coupled to each other. Each cell is characterized by a thin-film photovoltaic layer sandwiched between a first electrode material and a second electrode material. The first electrode material overlies the substrate and the second electrode material overlies the thin-film photovoltaic layer. Additionally, the method includes disposing the two or more solar devices side by side to laminate with the cover plate by means of a first organic material filled between the second electrode material and the second surface. Each of the two or more solar devices has a peripheral edge region being sealed by a second organic material. Furthermore, the method includes electrically coupling the two or more solar devices to each other.
- In an alternative embodiment, the present invention provides a structure for tiling thin-film solar devices. The structure includes a cover plate with at least a dimension of about 165 cm and greater in one direction including a front surface and a rear surface opposed to the front surface. Additionally, the structure includes two or more solar devices laminated side by side to the rear surface and electrically coupled to each other by a ribbon connector. Each of the two or more solar devices includes a plurality of thin-film photovoltaic cells overlying a substrate. Each of the thin-film photovoltaic cells has a stripe shaped pattern in parallel to each other.
- It is to be appreciated that the present invention provides numerous benefits over conventional techniques. Among other things, the method and structure provided in the present invention are compatible but scaled to very large industrial panels from conventional modules, which allow cost effective implementation of new generation integrated thin-film photovoltaic modules into large scale commercial applications. The integrated solar module laminates two or more thin-film photovoltaic devices to a common cover plate. This effective enhances the power capacity of the solar module by extending either circuit current delivered from the entire module or the voltage level for coupling with outside electric contacts. Physically, each of the two or more thin-film solar devices can have a dimension of 65 cm times 165 cm and be disposed side by side onto a hardened glass plate having a dimension of 165 cm or greater in one direction. The encapsulation of the integrated module is compatible with stand alone module, so that additional cost saving in packaging process and material can be achieved by implementation of current invention. Additionally, scale up the stand alone thin-film solar device and their integration provide high quality with reduced cost but enhanced overall efficiency over 11%. There are other benefits as well.
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FIG. 1 is a perspective view of a method and structure for tiling solar devices according to an embodiment of the present invention. -
FIG. 2 illustrates a side view (A) and a bottom view (B) of a cover plate laminated to two solar devices according to an embodiment of the present invention. -
FIG. 3 is a schematic cross-section view of a thin-film solar device according to an embodiment of the present invention. -
FIG. 4 is a schematic top view of a thin-film solar device with stripe shaped cell patterns according to the embodiment of the present invention. -
FIG. 5 illustrates a cross-section view (A) and a top view (B) of laminated solar devices including ribbon electric conductors according to an embodiment of the present invention. -
FIG. 6 illustrates a cross-section view (A) and a top view (B) of laminated solar devices including ribbon electric conductors according to another embodiment of the present invention. - The present invention relates generally to photovoltaic techniques. More particularly, the present invention provides a method and structure for tiling two or more solar devices on a transparent cover plate. Merely by example, the present invention is applied to laminate two or more thin-film solar devices having about 165 cm or greater in form factor to a glass cover plate.
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FIG. 1 is a perspective view of a method and structure for tiling solar devices according to an embodiment of the present invention. This diagram is merely an example, which should not limit the scope of the claims herein. As shown, astructure 1000 for tiling solar devices on to a cover plate is schematically broken down to a group of basic elements. In an embodiment, thestructure 1000 includes acover plate 100, two or moresolar devices substrate sealant material 320, afill material 200, acommon conductor 400, and a plurality ofribbon conductor 402. The cover plate is typically flat with a front surface on light-receiving side and a rear surface for attaching one or more solar devices. Thecover plate 100 has a thickness in the range of 0.5-10 mm, preferably 1-5 mm, and can be of any material that has sufficient transparency above the photovoltaic layer. Suitably the cover plate is a cover glass, preferably hardened glass. In a specific embodiment, thecover plate 100 can be a polymeric material bearing an optical transparency characteristic. In another specific embodiment, thecover plate 100 has a large physical dimension capable of allowing two or more industrial sized solar devices together to be laminated thereon. For example, the dimension of thecover plate 100 may be at least 165 cm or greater in one direction. Of course, there can be other variations, alternatives, and modifications. For example, thecover plate 100 can have various kinds of shapes including a rectangular shape. - Referring to
FIG. 1 , the two or moresolar devices cover plate 100. Normally, the two or more solar devices are not covering all area of thecover plate 100. In an embodiment, the two or moresolar devices solar devices cover plate 100 in one direction and total width of all solar devices plus the addition gaps substantially fitted with thecover plate 100 in another direction. In a specific embodiment, the thin-filmsolar device - As shown in
FIG. 1 , each cell has a strip shape in parallel to all other cells. For example, the strip shape of each cell is about 6 millimeters in width and has a length up to the substrate except some boarder region at two ends. Within the boarder region of the thin-filmsolar device polymeric sealant material 320, such as a polymer tape, is applied to protect the solar device from ingress of moisture. Corresponding to the boarder region of eachsolar device 301 on thecover plate 100 anopaque frame region 105 is formed on the rear surface for block light and in particular UV irradiation to the polymer material of the photovoltaic cells. The rest portion, or the major area, of thecover plate 100 is substantially transparent for full spectrum of the sun light overlying the plurality of thin-film photovoltaic cells in stripe shape. Finally, each of the two or more solar devices is laminated its upper-electrode surface to the rear surface of the cover plate by means of thefill material 200. In a specific embodiment, the fill material is an organic polymer material bearing both characteristics of mechanical bonding and optical transparency. For example, thefill material 200 is a transparent polymer selected from ethylene vinyl acetate (EVA) and polyvinyl butyral (PVB), which fills the intermediate space and provides a seal at the circumference of each module for coupling with thesealant material - Additionally, the two or more
solar devices cover plate 100 to form an integrated thin-film photovoltaic module. The electric coupling between any two neighboring solar devices attached to the cover plate can be electrical in parallel or in series, allowing the integrated thin-film photovoltaic module to support higher electric current capacity or voltage power level. In an embodiment, these electric coupling is achieved by means of acommon conductor 400 disposed along an edge of the integrated thin-film photovoltaic module and a plurality ofribbon conductor 402 to connect from the two or moresolar devices common conductor 400. In particular, oneribbon conductor 402 may couple to the upper-electrode of a solar device while anotherribbon conductor 403 may couple to the lower-electrode of the same solar device. In another embodiment, one ribbon conductor may connect from the upper-electrode of a firstsolar device 301 to pass a hole through it including the substrate to couple with the lower-electrode of a secondsolar device 303 next todevice 301. Respectively, another ribbon conductor coupled to the upper-electrode of the firstsolar device 301 or the lower-electrode of thesecond device 303 may be linkable to an external electric contact for collecting the current from the entire integrated thin-film module. Additional detail description about the method and structure for tiling the two or more solar devices can be found throughout the specification and more particularly below. -
FIG. 2-A is side view of a cover plate laminated to two solar devices according to an embodiment of the present invention. This diagram is merely an example, which should not limit the scope of the claims herein. As shown, thecover plate 100 includes a transparent and flat plate having afront surface 101 and arear surface 103. Thefront surface 101 may be applied as a light-receiving side and therear surface 103 is utilized for attaching two (or more)solar devices 301. In an embodiment, the twosolar devices 301 are encapsulated to therear surface 103 by means of a transparentorganic material 200. The transparentorganic material 200 fills the intermediate space region between therear surface 103 of thecover plate 100 and a top surface of thesolar device 301. In a specific embodiment, a circumferential border region of thesolar device 301, including the applied encapsulating transparentorganic material 200, has been protected by apolymeric material 320, which is a sealant mainly for protecting the solar device against ingress of moisture through the boarder region. As shown, thecover plate 100 has its width in a desired dimension large enough to fit total widths of twosolar devices 301 plus some extra device-device spacing when the two solar devices are disposed side by side. In an implementation, the width of a singlesolar device 301 may be as large as 65 cm for some industrial sized thin-film photovoltaic module. Therefore, thecover plate 100 for the integrated solar module may be twice that size or even bigger. - Referring to
FIG. 2-B , a bottom view of the cover plate according to the embodiment of the present invention is shown. This is the bottom view of thecover plate 100 shown inFIG. 2-A . In accordance with the invention thecover plate 100 has its partial area made as opaque. This is achieved by acoating material 305 on the cover plate within the as-mentioned area. The coating can be painted, screen printed and heated, but can also e.g. be a polymeric tape. For example, a ceramic paste can be screen-printed and tempered. Instead of coating, also the body of thecover plate 100 can be modified in the area so as to be opaque, for example by adding a pigment or by inclusion of an opaque layer or substance. The coating is preferably non-conducting. In an embodiment, the as-mentioned opaque area is located properly on therear surface 103 and in a framed region located just above a border area of asolar device 301 when thecover plate 101 is laminated with thesolar device 301. Because the border area of the solar device does not have photovoltaic active material, the opaque area on the cover plate includes substantially all area that can receive light and under which area no photovoltaic layer is present. However, if no such opaque area is used, the photovoltaic layer edges of the solar device will be easily subjected to heating by sun light irradiation different from area having photovoltaic layer, which leads to thermal stress and eventually macroscopic cracking to the solar device. Additionally, the UV degradation of the polymeric material along the solar device edge will be a problem. Therefore, adding theopaque coating 305 characterized by color suitably dark, preferably black, and capable of substantially blocking UV radiation becomes a solution for preventing from the UV degradation and undesired thermal stress. The details of adding proper opaque area to the cover plate when packaging thin-film photovoltaic module can be found in a U.S. patent application Ser. No. 12/158,239 titled “PHOTOVOLTAIC DEVICE AND METHOD FOR ENCAPSULATING” filed by Hermann Calwer etc. on Dec. 20, 2006, incorporated by reference. In an specific embodiment, for acover plate 100 designed to fit two solar devices side by side, theopaque coating 305 is applied with two such framed regions side by side, as shown inFIG. 2-B . Additionally, the non-opaque region shown is projected just above the thin-film photovoltaic cells of the laminatedsolar devices 301. The length dimension L of thecover plate 100 is properly selected to fit the length of each of the two or moresolar devices 301, which are disposed side by side when encapsulated with thecover plate 100. In an implementation for integrating large scale industrial thin-film solar panel, the length L can be as large as 165 cm and greater. -
FIG. 3 is a schematic cross-section view of a thin-film solar device according to an embodiment of the present invention. This diagram is merely an example, which should not limit the scope of the claims herein. In an embodiment, the thin-filmsolar device 2000 is supported on a substrate 2010 which is typically glass of about 1 to 3 millimeters thickness. A back contact or lower electrode comprises a metal layer 2031 deposited upon substrate 2010. Layer 2031, in the preferred embodiment, typically comprises molybdenum which has been deposited by sputtering to a thickness of about 0.2 to 2 microns. On top of the lower electrode 2031 a p-typechalkopyrite semiconductor layer 2020 is arranged, having a thickness of about 0.2 to 2 microns. - In a specific embodiment, a particular class of thin-film solar devices has an absorber layer formed of a group I-III-VI semiconductor, also referred to as a chalkopyrite semiconductor. Such a semiconductor is generally of the copper indium diselenide (“CIS”) type, wherein this expression is to be understood such that indium can be partly or fully replaced by gallium and/or aluminium, and selenium can be partly or fully replaced by sulphur. The CIS type layer can further comprise a low concentration, trace, or a doping concentration of one or more further elements or compounds, in particular alkali such as sodium, potassium, rubidium, cesium, and/or francium, or alkali compounds. The concentration of such further constituents is typically 5 wt % or less, preferably 3 wt % or less. The
CIS layer 2020 can be formed by sputter deposition of a sequence of layers comprising the metal constituents of the CIS layer, followed by a programmed thermal annealing processing with an environment containing Selenium vapor species and/or additionally sulfide species. A preferred process has been described in U.S. Patent Application No. 61/178,459 titled “Method and System for Selenization in Fabricating CIGS/CIS Solar Cells” filed on May 14, 2009, commonly assigned to Stion Corporation, incorporated for all purpose by reference. - On top of the CIS type layer commonly a buffer layer or
window 2025 is arranged. The buffer layer can include CdS. A Cd-free inorganic layer such as Zn(O,S) possibly also including hydroxide may be used, but the buffer layer can also be omitted. It is also possible to arrange a layer of intrinsic ZnO, i.e. a ZnO layer that having a bulk resistivity higher than 1 Ohm·cm, preferably higher than 100 Ohm·cm, such as between 1 and 10×103 Ohm·cm. Preferably the layer is between 10 nm and 150 nm thick. Thesolar device 2000 further comprises an upper-electrode 2032 overlying thebuffer layer 2025. In an example, the upper electrode layer is n-type ZnO layer appropriately doped to provide relatively low resistivity, for example, better than about 2.0×10−3 Ohm·cm, and preferably better than 1.0×10−3 Ohm·cm. The thickness of thelayer 2032 ranges from 0.5 to 2 microns. In an embodiment, the thin-filmsolar device 2000 described above is a same class of the two or moresolar devices 301 that are laminated to the cover plate for forming an integrated photovoltaic module. -
FIG. 4 is a schematic top view of a thin-film solar device with stripe shaped cells according to the embodiment of the present invention. This diagram is merely an example, which should not limit the scope of the claims herein. In a specific embodiment, manufacturing the CIS based thin-film solar device includes a cell patterning process for creating a plurality of stripe shaped cells divided by line patterns in one or more layers. For example, a first plurality of patterns in the lower electrode layer 2031 and a second plurality of patterns in theCIS absorber layer 2020 and partially in the lower-electrode layer 2031 are formed using either laser or mechanical scribe device. The first plurality of patterns and the second plurality of patterns (and any additional series of patterns on buffer layer or upper electrode layer) are utilized for forming electric links from cell to cell and to the electric contact for the thin-film solar device. As shown inFIG. 4 , a portion of the thin-filmsolar device 2000 includes a plurality ofphotovoltaic cells 2001 each having a width w (spacing between two neighboring line patterns) extending from one end of the substrate to another end (there may be no photovoltaic layers on 1-2 cm border regions of the substrate). In a specific embodiment, the width w of each of thesecells 2001 is about 6 mm. The length of thesecells 2001 can ranges from 20 cm to 165 cm or greater depending on the physical dimension of the substrate overlying which the solar device is formed. Of course, there can be many variations, alternatives, and modifications. -
FIGS. 5-A and 5-B illustrate a cross-section view and a top view of laminated solar devices electrically coupled by one or more ribbon conductors between the cover plate and the solar devices according to an embodiment of the present invention. As shown inFIG. 5-A , an integrated photovoltaic module includes at least asolar device 510 laminated to acover plate 500 by means of a transparentpolymeric material 520. In an embodiment, near one side of peripheral border region of the integrated module acommon conductor 560 is disposed and a pair ofribbon conductors 565 is used for making electric coupling between thesolar device 510 and thecommon conductor 560. Theribbon conductor 565 is buried within thepolymeric material 520. InFIG. 5B , a top view of two solar devices disposed side by side for laminating to the cover plate is shown. From this angle, eachribbon conductor 565 is seen to directly connect eachsolar device 510 to thecommon conductor 560. Aspecific ribbon conductor 565 couples to an upper-electrode or lower-electrode of thesolar device 510. The common conductor is arranged to collect the current from the entire integrated module and is connected or connectable to an electrical contact outside the module. -
FIGS. 6-A and 6-B are a cross-section view and a top view of laminated solar devices including ribbon electric conductors according to another embodiment of the present invention. This diagram is merely an example, which should not limit the scope of the claims herein. As shown, in another embodiment of the invention an integrated photovoltaic module includes a thin-filmsolar device 610 and at least another thin-filmsolar device 611 disposed next to thesolar device 610 both laminated to a rear surface of acover plate 600 by means of a transparentpolymeric material 620. Thesolar device polymeric material 620 in this encapsulated structure. In a specific embodiment, thesolar device 610 including its supporting substrate includes one or more through-holes 660 prepared before the lamination. Aribbon conductor 665, which coupled to the upper electrode layer of thesolar device 611, can pass through the through-hole 660 to the back side of the substrate of thesolar device 610 to be connectable with an electric contact mounted there or outside the entire integrated module. Theribbon conductor 665 completes the inter-device electric coupling between the two thin-filmsolar device other ribbon conductors 663 respectively attached to either upper or lower electrode layer of either thesolar device 610 orsolar device 611 to complete the electric coupling either in series or in parallel. - It is to be appreciated that the present invention provides numerous benefits over conventional techniques. Among other things, the method and structure provided in the present invention are compatible but scaled to very large industrial panels from conventional modules, which allow cost effective implementation of new generation integrated thin-film photovoltaic modules into large scale commercial applications. The integrated solar module laminates two or more thin-film photovoltaic devices to a common cover plate. This effective enhances the power capacity of the solar module by extending either circuit current delivered from the entire module or the voltage level for coupling with outside electric contacts. Physically, each of the two or more thin-film solar devices can have a dimension of 65 cm times 165 cm and be disposed side by side onto a hardened glass plate having a dimension of 165 cm or greater in one direction. The encapsulation of the integrated module is compatible with stand alone module, so that additional cost saving in packaging process and material can be achieved by implementation of current invention. Additionally, scale up the stand alone thin-film solar device and their integration provide high quality with reduced cost but enhanced overall efficiency over 11%.
- It is understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggest to persons skilled in the art and are to be included within the spirit and purview of this application and scope of the appended claims.
Claims (11)
1. A structure for tiling thin-film solar devices comprising:
a cover plate with at least a dimension of about 165 cm and greater in one direction including a front surface and a rear surface opposed to the front surface; and
at least two solar devices laminated side by side to the rear surface and electrically coupled to each other by a ribbon connector, each of the solar devices comprising a plurality of thin-film photovoltaic cells overlying a substrate, each of the thin-film photovoltaic cells having a stripe shaped pattern in parallel to each other.
2. The structure of claim 1 wherein the cover plate comprises a hardened glass having a transparent region over main areas of the solar devices and an opaque region over the peripheral edge regions of the solar devices.
3. The structure of claim 1 wherein the cover plate comprises a transparent polymer.
4. The structure of claim 1 the solar devices are attached to the rear surface via a transparent polymer selected from ethylene vinyl acetate and polyvinyl butyral.
5. The structure of claim 1 wherein each of the solar devices comprises a peripheral edge region sealed by a polymeric sealant material selected from butyl rubber, urethane and polyurethane materials, polyisobutylene materials, epoxide materials, polysulfamide materials, and cyanoacrylates.
6. The structure of claim 1 wherein each of the solar devices comprises a dimension of about 65 cm by 165 cm including the plurality of thin-film photovoltaic cells each having a size of about 6 mm by about 160 cm.
7. The structure of claim 1 wherein the plurality of thin-film photovoltaic cells having a stripe shaped pattern comprise a chalcopyrite compound semiconductor materials selected from copper indium diselenide, copper indium disulfide, copper indium gallium diselenide, and copper indium disulfide.
8. The structure of claim 1 wherein the ribbon conductor connects the solar devices electrically in series.
9. The structure of claim 1 wherein the ribbon conductor connects the solar devices electrically in parallel.
10. The structure of claim 1 wherein the ribbon conductor is disposed between the rear surface and the solar devices to connect an electric contact disposed near an edge of the cover plate.
11. The structure of claim 1 wherein the ribbon conductor respectively passes through the solar devices to connect an electric contact disposed rear side of the substrates.
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