US20140339077A1 - Plating device - Google Patents
Plating device Download PDFInfo
- Publication number
- US20140339077A1 US20140339077A1 US14/371,638 US201214371638A US2014339077A1 US 20140339077 A1 US20140339077 A1 US 20140339077A1 US 201214371638 A US201214371638 A US 201214371638A US 2014339077 A1 US2014339077 A1 US 2014339077A1
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- US
- United States
- Prior art keywords
- plating
- shaped member
- shaft
- fluid spray
- plated portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007747 plating Methods 0.000 title claims abstract description 239
- 239000012530 fluid Substances 0.000 claims abstract description 124
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 239000007921 spray Substances 0.000 claims description 59
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 abstract description 38
- 229910052751 metal Inorganic materials 0.000 abstract description 38
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 22
- 239000008188 pellet Substances 0.000 description 16
- 150000002500 ions Chemical class 0.000 description 14
- 239000000203 mixture Substances 0.000 description 10
- 230000001105 regulatory effect Effects 0.000 description 10
- 229910001092 metal group alloy Inorganic materials 0.000 description 9
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910003271 Ni-Fe Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/001—Magnets
Definitions
- the present invention relates to a plating device, for example a plating device for forming magnetostrictive films in a magnetostrictive torque sensor by a magnetic alloy plating process.
- An electrically-powered power steering device generates assistive torque to reduce the steering torque needed to be produced in the steering system through operation of the steering wheel by the driver. By generating assistive torque, the electrically-powered power steering device can reduce the burden on the driver.
- An electrically-powered power steering device has a steering torque sensor for detecting steering torque; the torque sensor for detecting torque, such as steering torque, acting on a shaft-shaped member (also called a pivot, pinion shaft, or input shaft), can be constituted, for example, by a magnetostrictive torque sensor which utilizes magnetostrictive effect by a plurality of magnetostrictive films having mutually different magnetic anisotropy.
- Patent Literature 1 discloses a plating device employed for forming two magnetostrictive films by plating of a plated portion of a shaft-shaped member, doing so prior to imparting having mutually different magnetic anisotropy to the films. Due to the flow of current from the positive electrode (a metal cage or metal pellets) of the plating device to an exposed portion or non-masked portion (negative electrode, plated portion) of the shaft-shaped member, metal ions (e.g. Ni ions or Fe ions) present in the plating fluid are deposited on the negative electrode side, forming a magnetic alloy plating such as a magnetostrictive film or the like.
- metal ions e.g. Ni ions or Fe ions
- the lines of current (lines of electrical force) lead towards the plated portion (negative electrode) from the entirety of the positive electrode, the lines of current are dependent upon the pattern, such as the length, of the positive electrode, and cannot flow uniformly into the plated portion.
- the plating device disclosed in the aforementioned Patent Literature 1 it is indicated to form the shielding jig at the center to a smaller diameter than the diameter of the shielding jigs above and below, to thereby establish a uniform current density distribution over the entire surface of the plated portion.
- the inventors have found that, in actual practice, the current density distribution over the surface of the plated portion in an axial direction of a shaft-shaped member will differ depending on the location of the plated portion, in a manner dependent upon the pattern of the positive electrode, and that variability of thickness of the magnetic alloy plating may not always be kept within the allowable range, depending on the type of specifications.
- Patent Literature 1 Japanese Patent Application Laid-Open
- An object of the present invention is to provide a plating device whereby it is possible to more form a magnetic alloy plating to more uniform thickness.
- a plating device having a plating tank retaining a plating fluid, the device being used to carry out magnetic alloy plating of a shaft-shaped member immersed in the plating fluid, the shaft-shaped member serving as a negative electrode, wherein the plating device has a plurality of shielding jigs fitted about an outer peripheral surface of the shaft-shaped member and defining a plated portion on the shaft-shaped member, and a positive electrode disposed surrounding the shaft-shaped member, and having an output portion facing the plated portion.
- the center position of the plated portion and the center position of the output portion in the axial direction of the shaft-shaped member are aligned to within a predetermined tolerance relating to the center position.
- the lines of current flowing into the plated portion are symmetrical with respect to the center position of the plated portion. Consequently, despite variability of thickness of the magnetic alloy plating, by virtue of being symmetrical with respect to the center position of the plated portion, the magnetic alloy plating can be formed to more uniform thickness.
- the variability of thickness of magnetic alloy plating observed when the lines of current flowing into the plated portion are not symmetrical with respect to the center position of the plated portion may fail to be kept within the allowable range at, for example, at one end location of the plated portion.
- a magnetic alloy plating can be formed to more uniform thickness by aligning the center position of the plated portion of the shaft-shaped member and the center position of the output portion of the positive electrode to within an tolerance relating to center position, in order to keep the variability of thickness of magnetic alloy plating to within the allowable range throughout the entire plated portion.
- the length of the plated portion and the length of the output portion of the positive electrode are aligned to within a predetermined tolerance relating to the length, in an axial direction of the shaft-shaped member.
- the magnetic alloy plating can be formed to more uniform thickness.
- the plating device further has a shield disposed between the positive electrode and the shaft-shaped member.
- the shield allows positive electrode output portions to be formed in portions of the positive electrode, instead of using the entire positive electrode as the output portion.
- the pattern of the shield defines the pattern of the output portion of the positive electrode, the pattern of the shield being determined such that variability of thickness of the magnetic alloy plating is kept to within an allowable range.
- the pattern (the center position and length) of the output portion of the positive electrode is adjusted through adjustment of the pattern of the shield, whereby the metallic alloy plating can be formed to more uniform thickness.
- the pattern, such as the length, of the plated portion may differ.
- the metallic alloy plating can be formed to more uniform thickness while achieving compatibility with shaft-shaped members and plated portions of various different types.
- the shield is preferably of assembly type detachable from the positive electrode.
- the metallic alloy plating can be formed to more uniform thickness, while achieving compatibility with shaft-shaped members and plated portions of various different types.
- the plating device is further provided with a plating fluid spray nozzle having plating a fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank.
- the patterns, such as the center positions, of the plated portions may differ.
- the metallic alloy plating can be formed to more uniform thickness while achieving compatibility with shaft-shaped members and plated portions of various different types.
- the center position of the plated portion and the center position of the plating fluid spray orifice are aligned to within a tolerance relating to center position, in the axial direction of the shaft-shaped member.
- the length of the plated portion and the length of the plating fluid spray orifice are aligned to within a tolerance relating to the length, in an axial direction of the shaft-shaped member.
- the density of the metal ions flowing to the plated portion will be uniform over the entirety of the plated portions. Consequently, the metallic alloy plating can be formed to more uniform thickness. Even in cases in which the shaft-shaped member is rotated to stir the plating fluid inside the plating tank, the metallic alloy plating can be formed to more uniform composition.
- FIG. 1 is a schematic view illustrating a detailed example arrangement of a plating device according to the present invention
- FIG. 2 (A) illustrates a general example arrangement of the plating device of FIG. 1
- FIG. 2 (B) illustrates a detailed example arrangement of the interior of the plating tank shown in FIG. 1 ;
- FIG. 3 (A) illustrates another general example arrangement of the plating device of FIG. 1 ;
- FIG. 3 (B) illustrates another detailed example arrangement of the interior of the plating tank shown in FIG. 1 ;
- FIG. 4 is a top view showing the plating tank of FIG. 1 ;
- FIG. 5 (A) is a view showing an example external appearance of a plating fluid spray nozzle shown in FIG. 2 (B);
- FIG. 5 (B) is a view showing a general example arrangement of an output portion of the plating fluid spray nozzle shown in FIG. 5 (A);
- FIG. 6 (A) is a view showing an example external appearance of the plating fluid spray nozzle shown in FIG. 3 (B);
- FIG. 6 (B) illustrates a modification example of a positive electrode of the plating device shown in FIG. 1 ;
- FIG. 7 is an exploded perspective view illustrating a metal cage and a shield of FIG. 3 (B);
- FIG. 8 (A) illustrates a modification example of the shield of FIG. 7 ;
- FIG. 8 (B) illustrates a modification example of the positive electrode of FIG. 3 (B);
- FIG. 9 (A) to 9 (H) respectively show descriptive diagrams in which the center position of a plated portion and the center position of an output portion are substantially aligned.
- FIG. 10 (A) to 10 (H) respectively illustrate other descriptive diagrams in which the center position of a plated portion and the center position of an output portion are substantially aligned.
- FIG. 1 shows a detailed schematic example of a plating device according to the present invention
- FIG. 2 (A) shows primarily a simplified example (or enlarged view) of the scheme of the plating device (or output portions of the positive electrode) according to the present invention
- the plating device 1 is provided with a shield 10 m situated between the positive electrode 10 and a shaft-shaped member 5 ;
- a characterizing feature of the example in FIG. 2 (A) is that the output portion 10 s of the positive electrode 10 is defined by the shield 10 m .
- a characterizing feature of the plating device 1 of FIG. 1 is that the plating device of Patent Literature 1 is improved upon.
- the plating device 1 need not be provided with the shield 10 m , as long as the magnetic alloy plating can be formed to uniform thickness by the output portion 10 s.
- the plating device 1 has a plating tank 3 retaining a plating fluid 2 , and is designed to carry out magnetic alloy plating on the shaft-shaped member 5 which is immersed as a negative electrode in the plating fluid 3 .
- the plating device 1 is provided with a plurality of shield jigs 13 , 14 , 15 installed about an outside peripheral face of the shaft-shaped member 5 , for defining plated portions 5 s of the shaft-shaped member 5 ; and with the positive electrode 10 situated surrounding the shaft-shaped member 5 , and having the output portion 10 s which faces the plated portion 5 s.
- the plurality of shield jigs 13 , 14 , 15 are constituted by the shield jigs 13 , 15 at the upper and lower ends, and the intermediate shield jig 14 situated between the shield jigs 13 , 15 at either end.
- the plated portion 5 s is constituted by sections of the shaft-shaped member 5 which are situated inwardly from the shield jigs 13 , 15 at either end, and which are not covered by the shield jig 14 .
- the plated portion 5 s is constituted by two sections of the shaft-shaped member 5 which are positioned between adjacent shield jigs among the plurality of shield jigs 13 , 14 , 15 (i.e., between the between adjacent shield jigs 13 , 14 and between the adjacent shield jigs 14 , 15 ). While the plated portion 5 s is constituted, for example, by two sections of the shaft-shaped member 5 , the length (profile length) of the plated portion 5 s , ignoring the space between the two sections (the section covered by the shield jig 14 ) is equal to the distance 5 l from one end of the plated portion 5 s to the other end. In an axial direction J of the shaft-shaped member 5 , the position of the one end (bottom portion) of the shaft-shaped member 5 is 0 (the origin), and the center position of the plated portion 5 s is 5 c.
- the shield 10 m is constituted by a plurality of members, and like the plated portion 5 s , the output portion 10 s of the positive electrode 10 is constituted by sections which are defined by a plurality of members, which sections are not covered or shielded by the plurality of members.
- the length (profile length) of the output portion 10 s is the distance 10 l from one end of the output portion 10 s to the other end, and the center position of the output portion 10 s in the axial direction J of the shaft-shaped member 5 is 10 c .
- the length 5 l of the plated portion 5 s of the shaft-shaped member 5 and the length 10 l of the output portion 10 s of the positive electrode 10 in the axial direction J of the shaft-shaped member 5 are preferably substantially aligned, as discussed below.
- the length 5 l of the plated portion 5 s may be slightly greater than the length 10 l of the output portion 10 s , or the two may be perfectly aligned, or the length 5 l of the plated portion 5 s may be slightly shorter than the length 10 l of the output portion 10 s.
- the center position 5 c of the plated portion 5 s of the shaft-shaped member 5 and the center position 26 c of the output portion of plating fluid spray nozzles 9 are preferably substantially aligned in the axial direction J of the shaft-shaped member 5 .
- the length 61 of the plated portion 5 s of the shaft-shaped member 5 and the length 261 of the output portion of the plating fluid spray nozzles 9 are preferably substantially aligned in the axial direction J of the shaft-shaped member 5 .
- the plating device 1 is further provided with a plating fluid regulating tank 4 for regulating the temperature and the like of the plating fluid 2 , and with a rotary retainer device 6 rotatably retaining the shaft-shaped member 5 which has the plated portion 5 s .
- the shaft-shaped member 5 is, for example, a steering shaft comprising chrome molybdenum steel, retained in a vertical orientation at the center of the plating tank 3 by a retainer member 12 of the rotary retainer device 6 .
- a fluid chamber 7 is situated to the outside of the bottom of the plating tank 3 , and a recovery section 8 is situated to the outside in the upper portion of the plating tank; in the interior of the plating tank 3 are situated not only the positive electrode 10 and the plated portion 5 s (negative electrode), but also the plating fluid spray nozzles 9 , which are made of insulating resin, for example. As discussed below, the plating fluid spray nozzles 9 are of assembly type detachable from the plating tank 3 or the fluid chamber 7 , for example.
- the plating fluid 2 is an alloy plating fluid containing at least two species of metal ions (e.g., Ni ions and Fe ions) in prescribed proportions, and is maintained at predetermined temperature by the plating fluid regulating tank 4 .
- the shield jigs 13 , 14 , 15 which are made, for example, of insulating resin, are installed about the outside peripheral surface of the shaft-shaped member 5 .
- the shield jigs 13 , 14 , 15 are of disk shape, preferably 10 mm or larger in size for example, and are separable in diametrical directions, so as to enable attachment to and detachment from the shaft-shaped member 5 .
- the diameter of the intermediate shield jig 14 situated between the shield jigs 13 , 15 at either end is preferably formed to be smaller than the diameter of the shield jigs 13 , 15 at either end; the intermediate shield jig 14 may be omitted as well.
- the rotary retainer device 6 is provided with a rotary shaft 18 made of metal, furnished at a vertical orientation; a lifting/lowering mechanism 19 situated in an intermediate portion of the rotary shaft 18 ; a bearing 20 situated in a joined portion of the rotary shaft 18 and the lifting/lowering mechanism 19 ; the retainer member 12 situated at one end of the rotary shaft 18 ; a motor 21 situated at the other end of the rotary shaft 18 ; and a feeder brush 23 electrically connected to the negative pole of a power supply 22 situated in proximity to the motor 21 .
- the rotary retainer device 6 Through up and down motion of the rotary shaft 18 by the lifting/lowering mechanism 19 , the rotary retainer device 6 is able to immerse the shaft-shaped member 5 in the plating fluid 2 , or withdraw the shaft-shaped member 5 up and out from the plating fluid 2 .
- the rotary retainer device 6 is constituted such that the shaft-shaped member 5 is rotated through rotation of the rotary shaft 18 by the motor 21 .
- the plating fluid regulating tank 4 is provided with a stirrer 29 , a temperature regulator 30 , and a heater 31 ; the plating fluid 2 is retained inside the plating fluid regulating tank 4 .
- the temperature regulator 30 measures the temperature of the plating fluid 2 , and controls the heater 31 to maintain the plating fluid 2 at the prescribed temperature.
- the plating fluid 2 within the plating fluid regulating tank 4 is supplied to the fluid chamber 7 interior via a plating fluid supply line 32 through which the plating fluid regulating tank 4 interior and the fluid chamber 7 interior communicate.
- a pump 33 , a strainer 34 , and a flow meter 35 are situated midway along the plating fluid supply line 32 .
- a controller 36 for regulating the flow rate of the plating fluid 2 is also provided, the controller 36 being connected to the pump 33 via an inverter 37 .
- the flow rate of the plating fluid 2 passing through the plating fluid supply line 32 is measured by the flow meter 35 , and the controller 36 compares the measured value thereof to a preset value, and controls the inverter 37 .
- the flow rate of the plating fluid 2 supplied to the fluid chamber 7 interior i.e., the flow rate of the plating fluid 2 sprayed from the plating fluid spray orifices 26 ( FIG. 2B ) is regulated. Dust or other foreign matter in the plating fluid 2 in the plating fluid supply line 32 is filtered out by the strainer 34 .
- FIG. 2 (B) shows a detailed schematic example of the interior of the plating tank 3 shown in FIG. 1 .
- FIG. 3 (A) primarily shows another simplified example (enlarged view) of the scheme of the output portion 10 s of the positive electrode 10 of the plating device 1 shown in FIG. 1 ; and
- FIG. 3 (B) shows another detail schematic example showing the interior of the plating tank 3 of the plating device 1 shown in FIG. 1 .
- the shield jig 14 situated between the shield jigs 13 , 15 at either end is omitted.
- the space between the two magnetostrictive films prior to being imparted with mutually different magnetic anisotropy is omitted, instead forming a single magnetic alloy plating in a single plated portion 5 s , and to then impart mutually different magnetic anisotropy to the single magnetic alloy plating, forming a magnetostrictive film having two functions.
- the plated portion 5 s is positioned [further] towards the upper side of the plating fluid 2 , as compared with the example in FIG. 2 .
- the plating fluid spray nozzles 9 are of assembly type detachable from the plating tank 3 via the fluid chamber 7 .
- a flange 9 f is situated in the bottom part of the plating fluid spray nozzle 9 , and the plating fluid spray nozzle 9 or the flange 9 f is fastened to the fluid chamber 7 by a plurality of bolts 9 b .
- the flange 9 f and the bolts 9 b are merely one example of fasteners; the fasteners could be constituted by other members or other parts.
- the position at which the plated portion 5 s is situated on the shaft-shaped member 5 (the center position 5 c ) will differ; in the example of FIG. 3 (B), the plated portion 5 s is positioned [further] towards the upper side of the plating fluid 2 , as compared with the example in FIG. 2 (B).
- the plating fluid spray nozzles 9 of FIG. 2 (B) can be extended in length, positioning a plurality of the plating fluid spray orifices 26 at the top, to prepare the replacement plating fluid spray nozzles 9 of FIG. 3 (B) for example.
- the plating tank 3 is constituted, for example, by a cylindrical tank made of an insulating resin, or one made of metal to which an insulating coating film has been applied to the inside surface.
- the plating fluid 2 is supplied to the interior of the plating tank 3 from the interior of the fluid chamber 7 via the plating fluid spray nozzles 9 , and overflows into the recovery section 8 from the upper edge of the plating tank 3 , to be recovered in the plating fluid regulating tank 4 of FIG. 1 , via a plating fluid recovery line 11 situated at the bottom of the recovery section 8 .
- the plating fluid 2 When the power supply 22 is ON, the plating fluid 2 is sprayed from the plating fluid spray orifices 26 towards the plated portion 5 s of the rotating shaft-shaped member 5 . In so doing, the plating fluid 2 is supplied to the entire surface of the plated portion 5 s , and uniform flow can be obtained over the entire surface of the plated portion 5 s . Because the shaft-shaped member 5 rotates, the concentration of Ni ions and the concentration of Fe ions in the plating fluid 2 are maintained at constant levels over the entire surface of the plated portion 5 s.
- masking tape 16 is wrapped about the outside peripheral face of the shaft-shaped member 5 , in a section above the upper shield jig 13 and a section below the lower shaft jig 15 (see FIG. 5 (A) and FIG. 6 (A)).
- the plated portion 5 s of the shaft-shaped member 5 is constituted by the section not covered by the shield jigs 13 , 14 , 15 or the shield jigs 13 , 15 , and the masking tape 16 .
- the positive electrode 10 is constituted by a metal cage 27 of cylindrical shape open at the top end and closed at the bottom end, and a plurality of metal pellets 28 contained within the metal cage 27 .
- the metal cage 27 is arranged encircling the plating fluid spray nozzle 9 which is located to the inside of the inside peripheral surface thereof, and is supported by fasteners, not illustrated, in such a way as to not contact the inside peripheral surface and bottom surface of the plating tank 3 .
- the metal cage 27 is formed, for example, of mesh comprising Ti, which does not dissolve into the plating fluid 2 when current is passed through, and is electrically connected to the positive pole of the power supply 22 ( FIG. 1 ).
- the metal pellets 28 are pellets made, for example, of an Ni—Fe alloy which is dissolvable in the plating fluid 2 , a pellet mixture of metal pellets of Ni alone and metal pellets of Fe alone, or the like. While the metal pellets 28 are employed as the positive electrode 10 , spheres or any other shape would be acceptable, provided that the size is one that may be accommodated within the metal cage 27 , and [large enough] to not leak out through the mesh of the metal cage 27 .
- Ni ions and the Fe ions in the plating fluid 2 are consumed in the course of carrying out Ni—Fe alloy plating, Ni ions and Fe ions dissolve into the plating fluid 2 from the metal pellets 28 through electrolysis, and maintain the concentration of Ni ions and the concentration of Fe ions in the plating fluid 2 at constant levels, whereby the plating fluid 2 can be easily managed. Because the constitution in one in which the metal pellets 28 are contained within the metal cage 27 , the metal cage 27 can be easily supplied with the metal pellets 28 , even during the plating process.
- FIG. 4 shows a top view of the plating tank 3 shown in FIG. 1 .
- FIG. 5 (A) shows an example of the exterior of the plating fluid spray nozzle 9 shown in FIG. 2 (B); and
- FIG. 6 (A) shows an example of the exterior of the plating fluid spray nozzle 9 shown in FIG. 3 (B).
- FIG. 5 (B) primarily shows a simplified schematic example of the output portion of the plating fluid spray nozzle 9 shown in FIG. 5 (A); and
- FIG. 6 (B) shows a modification example of the positive electrode 10 of the plating device 1 shown in FIG. 1 .
- FIG. 5 (B) primarily shows a simplified schematic example of the output portion of the plating fluid spray nozzle 9 shown in FIG. 5 (A); and
- FIG. 6 (B) shows a modification example of the positive electrode 10 of the plating device 1 shown in FIG. 1 .
- FIG. 5 (B) primarily shows a simplified schematic example of the output portion of the plating fluid spray nozzle 9 shown in FIG
- the plating fluid spray nozzles 9 are, for example, four in number, arranged at equidistant intervals on a circle centered on the shaft-shaped member 5 .
- the number of plating fluid spray nozzles 9 may be four or more, or one.
- the entire positive electrode 10 faces the plated portion (negative electrode) 5 s .
- the entire positive electrode 10 of FIG. 6 (B) constitutes the output portion 10 s of the positive electrode 10 of FIG. 2 (A), the positive electrode 10 of FIG. 6 (B) being fastened such that the center position 5 c of the plated portion 5 s and the center position 10 c of the output portion 10 s are aligned.
- the plating device 1 or the plating tank 3 may be provided with the shield 10 m shown, for example, in FIG. 4 .
- the plurality of plating fluid spray orifices 26 are situated on the outside peripheral face of the plating fluid spray nozzle 9 so as to face the plated portion 5 s , and are arranged parallel to the axial direction of the shaft-shaped member 5 .
- the plurality of plating fluid spray orifices 26 are separated into a plurality of regions (for example, an upper region and a lower region) in corresponding fashion to individual plated portions 5 s , 5 s (for example, two plated sub-portions 5 s , 5 s of the entire plated portion 5 s ).
- the lengths 26 l 1 , 26 l 2 of the individual regions are preferably substantially aligned with the length 5 l 1 , 5 l 2 of each one corresponding plated sub-portions 5 s .
- the centers 26 c 1 , 26 c 2 of the individual regions are preferably substantially aligned with the centers 5 c 1 , 5 c 2 of each one corresponding plated sub-portion 5 s .
- the magnetic alloy plating can be formed to more uniform thickness, and the magnetic alloy plating can be formed to more uniform composition, even in cases in which the shaft-shaped member 5 is rotated to stir the plating fluid 2 inside the plating tank 3 .
- two sub-output portions in the entire output portion 10 s of the positive electrode 10 are separated into a plurality of regions (for example, an upper region and a lower region) in corresponding fashion to the individual plated sub-portions 5 s , the lengths 10 l 1 , 10 l 2 of the individual regions (the upper region and the lower region) preferably being substantially aligned with lengths 5 l , 5 l 2 of each one corresponding plated sub-portion 5 s .
- the centers 10 c 1 , 10 c 2 of the individual regions are preferably substantially aligned with the centers 5 c 1 , 5 c 2 of each one corresponding plated sub-portion 5 s .
- the magnetic alloy plating can be formed to more uniform thickness in each of the individual plated portion 5 s , 52 (for example, the two plated sub-portions 5 s , 5 s of the entire plated portion 5 s ).
- FIG. 7 shows an example of an exploded perspective view of the metal cage 27 and the shield 10 m of FIG. 3 (B).
- the shield 10 m which is cylindrical in shape and has three openings for example, can be fastened to the inside surface (inside peripheral surface) of the metal cage 27 , for example, by bolts 10 b , a frame 10 f 1 , and nuts (not illustrated).
- the pattern of the shield 10 m defines the pattern of the output portion 10 s of the positive electrode 10 , the shield 10 m preferably being of assembly type detachable from the positive electrode 10 or to the metal cage 27 , for example.
- the section corresponding to the metal pellets 28 or the positive electrode 10 at the opening of the shield 10 m defines the output portion 10 s of the positive electrode 10 , the shield 10 m preferably being of replaceable type.
- the metal cage 27 or the positive electrode 10 may be of replaceable type.
- the metal cage 27 can be fastened to the plating tank 3 of FIG. 1 by a frame 10 f 2 and fasteners such as members or parts (not illustrated) or the like.
- the shield 10 m and the fasteners are insulators, both being constituted, for example, of an insulating substance, or the surfaces of both being coated with an insulating coating, for example.
- the lower side of the cylindrical shield 10 m would be furnished, for example, with three openings while closing off the opening in the section corresponding to the shield jig 14 ; in other words, the cylindrical shield 10 m would be furnished, for example, with [a total of] six openings.
- FIG. 8 (A) shows a modification example of the shield 10 m of FIG. 7
- FIG. 8 (B) shows a modification example of the positive electrode 10 of FIG. 3 (B).
- the shield 10 m is constituted by two cylindrical members.
- the output portion 10 s of the metal pellets 28 or the positive electrode 10 is defined by the space between the shield 10 m , 10 m .
- the pattern of the shield 10 m , 10 m defines the pattern of the output portion 10 s of the metal pellets 28 or the positive electrode 10 .
- the shield 10 m , 10 m of FIG. 8 (A) may, for example, be fastened to six positive electrodes 10 , 10 , 10 , 10 , 10 , 10 constituted by six plate-shaped members, by bolts 10 b , nuts 10 n , or the like, as in the example shown in FIG. 8 (B), for example.
- the plating device 1 may employ non-dissolving plate-shaped positive electrodes 10 .
- the shield 10 m would be constituted, for example, by three cylindrical members (not illustrated) including a cylindrical member in a section corresponding to the shield jig 14 , with spaces between adjacent members situated at the bottom side.
- FIG. 9 (A) to FIG. 9 (H) respectively show descriptive diagrams in which the center position 5 c of the plated portion 5 s (or the center positions 5 c 1 , 5 c 2 of the plated sub-portions 5 s ) and the center position 10 c of the output portion 10 s (or the center positions 10 c 1 , 10 c 2 of the sub-output portions 10 s ) are substantially aligned.
- FIG. 9 (C) shows the variability in film thickness of, for example, Ni—Fe alloy plating, when the center position 5 c of the plated portion 5 s and the center position 10 c of the output portion 10 s are perfectly aligned, and represents film thickness, for example, at six different positions in the plated portion 5 s of FIG.
- FIG. 9 (A) and FIG. 9 (B) show the variability in film thickness when the center position 10 c of the output portion 10 s is higher than the center position 5 c of the plated portion 5 s ; the center position 10 c in FIG. 9 (A) is higher than the center position 10 c in FIG. 9 (B).
- FIG. 9 (H) show the variability in film thickness when the center position 10 c of the output portion 10 s is lower than the center position 5 c of the plated portion 5 s ; the center positions 10 c in FIG. 9 (D) to FIG. 9 (H) are progressively lower in the order FIG. 9 (D) to FIG. 9 (H), with the center position 10 c in FIG. 9 (H) being the lowest.
- center position 10 c of the output portion 10 s or for the center position 10 c of the output portion 10 s to be slightly lower than the center position 5 c of the plated portion 5 s ( FIG. 9 (D), FIG. 9 (E), FIG. 9 (F)), provided that the center position 5 c of the plated portion 5 s (or the center positions 5 c 1 , 5 c 2 ) and the center position 10 c of the positive electrode 10 (or the center positions 10 c 1 , 10 c 2 ) are aligned within the prescribed tolerance relating to center position, such that the variability of thickness of the magnetic alloy film is maintained within the acceptable range throughout the entire plated portion 5 s.
- the length 5 l of the plated portion 5 s it is acceptable for the length 5 l of the plated portion 5 s to be longer that the length 10 l of the output portion 10 s ; for the two to be perfectly aligned; or for the length 5 l of the plated portion 5 s to be slightly shorter than the length 10 l of the output portion 10 s , provided that the length 5 l of the plated portion 5 s (or the lengths 5 l , 5 l 2 ) and length 10 l of the output portion 10 s of the positive electrode 10 (or the lengths 10 l 1 , 10 l 2 ) are aligned within the prescribed tolerance relating to length, such that the variability of thickness of the magnetic alloy film is maintained within the acceptable range throughout the entire plated portion 5 s.
- FIG. 10 (A) to FIG. 10 (H) each respectively show one more descriptive diagram in which the center position 5 c of the plated portion 5 s and the center position 10 c of the output portion 10 s are substantially aligned.
- FIG. 10 (C) shows variability in the iron composition or proportion of iron in, for example, Ni—Fe alloy plating, when the center position 5 c of the plated portion 5 s and the center position 10 c of the output portion 10 s are perfectly aligned.
- the range indicated by the pair of dotted lines in FIG. 10 (C) is an allowable range relating to iron composition, and is determined according to specifications.
- the center positions 10 c in FIG. 10 (A) to FIG. 10 (H) respectively correspond to the center positions in FIG. 9 (A) to FIG.
- the center position 5 c of the plated portion 5 s (or the center positions 5 c 1 , 5 c 2 ) and the center position 10 c of the positive electrode 10 (or the center positions 10 c 1 , 10 c 2 ) can be aligned within the prescribed tolerance relating to center position ( FIG. 10 (B) to FIG. 10 (F), FIG. 9 (B) to FIG. 9 (F)), so that variability of each component of the magnetic alloy plating is maintained within an allowable range throughout the entire plated portion 5 s .
- the iron composition not just the film thickness, whereby the length 5 l of the plated portion 5 s (or the lengths 5 l , 5 l 2 ) and length 10 l of the output portion 10 s of the positive electrode 10 (or the lengths 10 l 1 , 10 l 2 ) are aligned within the prescribed tolerance relating to length.
Abstract
Disclosed is a plating device that has a plating tank that retains a plating fluid and carries out magnetic metal plating on a shaft shaped member immersed in the plating fluid as a negative electrode. The plating device is provided with: a plurality of shielding jigs that are fitted to the outer peripheral surface of the shaft shaped member and regulate the part of the shaft shaped member being plated; and a positive electrode provided in the vicinity of the shaft shaped member and having an output part that faces the part being plated. A center position in the axial direction of the shaft shaped member for the part being plated and a center position of the output part are aligned within a prescribed allowable value for the center positions.
Description
- The present invention relates to a plating device, for example a plating device for forming magnetostrictive films in a magnetostrictive torque sensor by a magnetic alloy plating process.
- Vehicles are commonly equipped with, for example, electrically-powered power steering devices. An electrically-powered power steering device generates assistive torque to reduce the steering torque needed to be produced in the steering system through operation of the steering wheel by the driver. By generating assistive torque, the electrically-powered power steering device can reduce the burden on the driver. An electrically-powered power steering device has a steering torque sensor for detecting steering torque; the torque sensor for detecting torque, such as steering torque, acting on a shaft-shaped member (also called a pivot, pinion shaft, or input shaft), can be constituted, for example, by a magnetostrictive torque sensor which utilizes magnetostrictive effect by a plurality of magnetostrictive films having mutually different magnetic anisotropy.
- For example,
Patent Literature 1 discloses a plating device employed for forming two magnetostrictive films by plating of a plated portion of a shaft-shaped member, doing so prior to imparting having mutually different magnetic anisotropy to the films. Due to the flow of current from the positive electrode (a metal cage or metal pellets) of the plating device to an exposed portion or non-masked portion (negative electrode, plated portion) of the shaft-shaped member, metal ions (e.g. Ni ions or Fe ions) present in the plating fluid are deposited on the negative electrode side, forming a magnetic alloy plating such as a magnetostrictive film or the like. - However, because the lines of current (lines of electrical force) lead towards the plated portion (negative electrode) from the entirety of the positive electrode, the lines of current are dependent upon the pattern, such as the length, of the positive electrode, and cannot flow uniformly into the plated portion. Stated another way, depending on the type of specifications required of an electrically-powered power steering device, it may be necessary for the lines of current to flow more uniformly into the plated portion. Specifically, in the plating device disclosed in the
aforementioned Patent Literature 1, it is indicated to form the shielding jig at the center to a smaller diameter than the diameter of the shielding jigs above and below, to thereby establish a uniform current density distribution over the entire surface of the plated portion. However, the inventors have found that, in actual practice, the current density distribution over the surface of the plated portion in an axial direction of a shaft-shaped member will differ depending on the location of the plated portion, in a manner dependent upon the pattern of the positive electrode, and that variability of thickness of the magnetic alloy plating may not always be kept within the allowable range, depending on the type of specifications. - Patent Literature 1: Japanese Patent Application Laid-Open
-
- Publication No. 2008-101243
- An object of the present invention is to provide a plating device whereby it is possible to more form a magnetic alloy plating to more uniform thickness.
- According to a first aspect of the present invention, there is provided a plating device having a plating tank retaining a plating fluid, the device being used to carry out magnetic alloy plating of a shaft-shaped member immersed in the plating fluid, the shaft-shaped member serving as a negative electrode, wherein the plating device has a plurality of shielding jigs fitted about an outer peripheral surface of the shaft-shaped member and defining a plated portion on the shaft-shaped member, and a positive electrode disposed surrounding the shaft-shaped member, and having an output portion facing the plated portion. The center position of the plated portion and the center position of the output portion in the axial direction of the shaft-shaped member are aligned to within a predetermined tolerance relating to the center position.
- In cases in which the center position of the plated portion of a shaft-shaped member and the center position of the output portion of the positive electrode are aligned in the axial direction of the shaft-shaped member, the lines of current flowing into the plated portion are symmetrical with respect to the center position of the plated portion. Consequently, despite variability of thickness of the magnetic alloy plating, by virtue of being symmetrical with respect to the center position of the plated portion, the magnetic alloy plating can be formed to more uniform thickness.
- Stated another way, in cases in which the lines of current flowing into a plated portion are not symmetrical with respect to the center position of the plated portion, and moreover the thickness of the magnetic alloy plating is at its thickest or thinnest at a position furthest away from the center position of the plated portion (one end location of the plated portion), the difference between that thickness and the thickness of the magnetic alloy plating at the one end location of the plated portion will exceed the difference when the lines of current flowing into the plated portion are symmetrical with respect to the center position of the plated portion. Consequently, the variability of thickness of magnetic alloy plating observed when the lines of current flowing into the plated portion are not symmetrical with respect to the center position of the plated portion may fail to be kept within the allowable range at, for example, at one end location of the plated portion.
- Accordingly, a magnetic alloy plating can be formed to more uniform thickness by aligning the center position of the plated portion of the shaft-shaped member and the center position of the output portion of the positive electrode to within an tolerance relating to center position, in order to keep the variability of thickness of magnetic alloy plating to within the allowable range throughout the entire plated portion.
- In the first aspect, in preferred practice, the length of the plated portion and the length of the output portion of the positive electrode are aligned to within a predetermined tolerance relating to the length, in an axial direction of the shaft-shaped member.
- In cases in which the length of the plated portion of the shaft-shaped member and the length of the output portion of the positive electrode are aligned in the axial direction of the shaft-shaped member, the lines of current flowing into the plated portion will be perpendicular to the plated portion surface. Consequently, the current density distribution will be uniform over the entire surface of the plated portion, allowing the magnetic alloy plating to be formed to more uniform thickness.
- Consequently, by aligning the length of the plated portion of the shaft-shaped member and the length of the output portion of the positive electrode to within a predetermined tolerance relating to length such that variability of thickness of magnetic alloy plating is kept to within the allowable range throughout the entire plated portion, the magnetic alloy plating can be formed to more uniform thickness.
- In the first aspect, in preferred practice, the plating device further has a shield disposed between the positive electrode and the shaft-shaped member.
- The shield allows positive electrode output portions to be formed in portions of the positive electrode, instead of using the entire positive electrode as the output portion.
- In the first aspect, in preferred practice, the pattern of the shield defines the pattern of the output portion of the positive electrode, the pattern of the shield being determined such that variability of thickness of the magnetic alloy plating is kept to within an allowable range.
- Depending on the type of positive electrode, there may be instances in which the center position of the plated portion of the shaft-shaped member and the center position of the output portion of the positive electrode cannot be aligned. Or, depending on the type of positive electrode, there may be instances in which the lengths of the plated portion of the shaft-shaped member and the length of the output portion of the positive electrode cannot be aligned. Accordingly, the pattern (the center position and length) of the output portion of the positive electrode is adjusted through adjustment of the pattern of the shield, whereby the metallic alloy plating can be formed to more uniform thickness.
- Moreover, depending on the type of shaft-shaped member, the pattern, such as the length, of the plated portion may differ. In such cases as well, with a single positive electrode, by adjusting the pattern of the shield, the metallic alloy plating can be formed to more uniform thickness while achieving compatibility with shaft-shaped members and plated portions of various different types.
- In the first aspect, the shield is preferably of assembly type detachable from the positive electrode.
- By making the shield replaceable, the metallic alloy plating can be formed to more uniform thickness, while achieving compatibility with shaft-shaped members and plated portions of various different types.
- In the first aspect, in preferred practice, the plating device is further provided with a plating fluid spray nozzle having plating a fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank.
- Depending on the type of shaft-shaped member, the patterns, such as the center positions, of the plated portions may differ. In such cases, by replacing the plating fluid spray nozzle having plating a fluid spray orifice which faces the plated portion, the metallic alloy plating can be formed to more uniform thickness while achieving compatibility with shaft-shaped members and plated portions of various different types.
- In the first aspect, in preferred practice, the center position of the plated portion and the center position of the plating fluid spray orifice are aligned to within a tolerance relating to center position, in the axial direction of the shaft-shaped member.
- In cases in which the center position of the plated portion of the shaft-shaped member and the center position of the plating fluid spray orifice (the output portion of the plating fluid nozzle) are aligned in the axial direction of the shaft-shaped member, the lines of flow of the plating fluid flowing to the plated portions will be symmetrical with respect to the center positions of the plated portions. Consequently, despite variability of thickness of magnetic alloy plating, there is symmetry with respect to the center positions of the plated portions, and the metallic alloy plating can be formed to more uniform thickness. Even in cases in which the shaft-shaped member is rotated to stir the plating fluid inside the plating tank, the metallic alloy plating can be formed to more uniform composition.
- In the first aspect, in preferred practice, the length of the plated portion and the length of the plating fluid spray orifice are aligned to within a tolerance relating to the length, in an axial direction of the shaft-shaped member.
- In cases in which the length of the plated portion of the shaft-shaped member and the length of the plating fluid spray orifices (the output portion of the plating fluid nozzle) are aligned in the axial direction of the shaft-shaped member, the density of the metal ions flowing to the plated portion will be uniform over the entirety of the plated portions. Consequently, the metallic alloy plating can be formed to more uniform thickness. Even in cases in which the shaft-shaped member is rotated to stir the plating fluid inside the plating tank, the metallic alloy plating can be formed to more uniform composition.
- It will be readily apparent to a person skilled in the art that various modifications to the aspects according to the present invention shown herein by way of examples are possible without departing from the spirit of the invention.
-
FIG. 1 is a schematic view illustrating a detailed example arrangement of a plating device according to the present invention; -
FIG. 2 (A) illustrates a general example arrangement of the plating device ofFIG. 1 , andFIG. 2 (B) illustrates a detailed example arrangement of the interior of the plating tank shown inFIG. 1 ; -
FIG. 3 (A) illustrates another general example arrangement of the plating device ofFIG. 1 ; -
FIG. 3 (B) illustrates another detailed example arrangement of the interior of the plating tank shown inFIG. 1 ; -
FIG. 4 is a top view showing the plating tank ofFIG. 1 ; -
FIG. 5 (A) is a view showing an example external appearance of a plating fluid spray nozzle shown inFIG. 2 (B); -
FIG. 5 (B) is a view showing a general example arrangement of an output portion of the plating fluid spray nozzle shown inFIG. 5 (A); -
FIG. 6 (A) is a view showing an example external appearance of the plating fluid spray nozzle shown inFIG. 3 (B); -
FIG. 6 (B) illustrates a modification example of a positive electrode of the plating device shown inFIG. 1 ; -
FIG. 7 is an exploded perspective view illustrating a metal cage and a shield ofFIG. 3 (B); -
FIG. 8 (A) illustrates a modification example of the shield ofFIG. 7 ; -
FIG. 8 (B) illustrates a modification example of the positive electrode ofFIG. 3 (B); -
FIG. 9 (A) to 9 (H) respectively show descriptive diagrams in which the center position of a plated portion and the center position of an output portion are substantially aligned; and -
FIG. 10 (A) to 10 (H) respectively illustrate other descriptive diagrams in which the center position of a plated portion and the center position of an output portion are substantially aligned. - Certain preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Persons skilled in the art should keep in mind that the present invention is not unduly limited to the embodiments described below.
-
FIG. 1 shows a detailed schematic example of a plating device according to the present invention, andFIG. 2 (A) shows primarily a simplified example (or enlarged view) of the scheme of the plating device (or output portions of the positive electrode) according to the present invention. In the example ofFIG. 1 , theplating device 1 is provided with ashield 10 m situated between thepositive electrode 10 and a shaft-shapedmember 5; a characterizing feature of the example inFIG. 2 (A) is that theoutput portion 10 s of thepositive electrode 10 is defined by theshield 10 m. Stated another way, a characterizing feature of theplating device 1 ofFIG. 1 is that the plating device ofPatent Literature 1 is improved upon. As will be discussed below, depending on the type ofpositive electrode 10, theplating device 1 need not be provided with theshield 10 m, as long as the magnetic alloy plating can be formed to uniform thickness by theoutput portion 10 s. - In the example of
FIG. 1 , theplating device 1 has aplating tank 3 retaining aplating fluid 2, and is designed to carry out magnetic alloy plating on the shaft-shapedmember 5 which is immersed as a negative electrode in theplating fluid 3. In the example ofFIG. 2 (A), theplating device 1 is provided with a plurality of shield jigs 13, 14, 15 installed about an outside peripheral face of the shaft-shapedmember 5, for defining platedportions 5 s of the shaft-shapedmember 5; and with thepositive electrode 10 situated surrounding the shaft-shapedmember 5, and having theoutput portion 10 s which faces the platedportion 5 s. - Referring to
FIG. 2 (A), the plurality of shield jigs 13, 14, 15 are constituted by the shield jigs 13, 15 at the upper and lower ends, and theintermediate shield jig 14 situated between the shield jigs 13, 15 at either end. The platedportion 5 s is constituted by sections of the shaft-shapedmember 5 which are situated inwardly from the shield jigs 13, 15 at either end, and which are not covered by theshield jig 14. Stated another way, the platedportion 5 s is constituted by two sections of the shaft-shapedmember 5 which are positioned between adjacent shield jigs among the plurality of shield jigs 13, 14, 15 (i.e., between the between adjacent shield jigs 13, 14 and between the adjacent shield jigs 14, 15). While the platedportion 5 s is constituted, for example, by two sections of the shaft-shapedmember 5, the length (profile length) of the platedportion 5 s, ignoring the space between the two sections (the section covered by the shield jig 14) is equal to thedistance 5 l from one end of the platedportion 5 s to the other end. In an axial direction J of the shaft-shapedmember 5, the position of the one end (bottom portion) of the shaft-shapedmember 5 is 0 (the origin), and the center position of the platedportion 5 s is 5 c. - Referring to
FIG. 2 (A), theshield 10 m is constituted by a plurality of members, and like the platedportion 5 s, theoutput portion 10 s of thepositive electrode 10 is constituted by sections which are defined by a plurality of members, which sections are not covered or shielded by the plurality of members. The length (profile length) of theoutput portion 10 s is the distance 10 l from one end of theoutput portion 10 s to the other end, and the center position of theoutput portion 10 s in the axial direction J of the shaft-shapedmember 5 is 10 c. In cases in which the center position of the platedportion 5 s of the shaft-shapedmember 5 and thecenter position 10 c of theoutput portion 10 s of thepositive electrode 10 are aligned, the lines of current flowing into the platedportion 5 s will be symmetrical with respect to the center position of the platedportion 5 s. Consequently, variation in the thickness of the magnetic alloy plating will be symmetrical with respect to the center position of the platedportion 5 s as well, and the magnetic alloy plating can be formed to uniform thickness. However, it is not necessary for thecenter position 5 c and thecenter position 10 c of theoutput portion 10 s of thepositive electrode 10 to be perfectly aligned, and it is sufficient for the two to be substantially aligned, as discussed below. - In the example of
FIG. 2 (A), thelength 5 l of the platedportion 5 s of the shaft-shapedmember 5 and the length 10 l of theoutput portion 10 s of thepositive electrode 10 in the axial direction J of the shaft-shapedmember 5 are preferably substantially aligned, as discussed below. Thelength 5 l of the platedportion 5 s may be slightly greater than the length 10 l of theoutput portion 10 s, or the two may be perfectly aligned, or thelength 5 l of the platedportion 5 s may be slightly shorter than the length 10 l of theoutput portion 10 s. - In the example of
FIG. 2 (A), thecenter position 5 c of the platedportion 5 s of the shaft-shapedmember 5 and thecenter position 26 c of the output portion of plating fluid spray nozzles 9 (plating fluid spray orifices 26), discussed later, are preferably substantially aligned in the axial direction J of the shaft-shapedmember 5. Further, the length 61 of the platedportion 5 s of the shaft-shapedmember 5 and the length 261 of the output portion of the platingfluid spray nozzles 9 are preferably substantially aligned in the axial direction J of the shaft-shapedmember 5. - In the example of
FIG. 1 , theplating device 1 is further provided with a platingfluid regulating tank 4 for regulating the temperature and the like of theplating fluid 2, and with arotary retainer device 6 rotatably retaining the shaft-shapedmember 5 which has the platedportion 5 s. The shaft-shapedmember 5 is, for example, a steering shaft comprising chrome molybdenum steel, retained in a vertical orientation at the center of theplating tank 3 by aretainer member 12 of therotary retainer device 6. Afluid chamber 7 is situated to the outside of the bottom of theplating tank 3, and arecovery section 8 is situated to the outside in the upper portion of the plating tank; in the interior of theplating tank 3 are situated not only thepositive electrode 10 and the platedportion 5 s (negative electrode), but also the platingfluid spray nozzles 9, which are made of insulating resin, for example. As discussed below, the platingfluid spray nozzles 9 are of assembly type detachable from theplating tank 3 or thefluid chamber 7, for example. - The
plating fluid 2 is an alloy plating fluid containing at least two species of metal ions (e.g., Ni ions and Fe ions) in prescribed proportions, and is maintained at predetermined temperature by the platingfluid regulating tank 4. The shield jigs 13, 14, 15, which are made, for example, of insulating resin, are installed about the outside peripheral surface of the shaft-shapedmember 5. The shield jigs 13, 14, 15 are of disk shape, preferably 10 mm or larger in size for example, and are separable in diametrical directions, so as to enable attachment to and detachment from the shaft-shapedmember 5. The diameter of theintermediate shield jig 14 situated between the shield jigs 13, 15 at either end is preferably formed to be smaller than the diameter of the shield jigs 13, 15 at either end; theintermediate shield jig 14 may be omitted as well. - The
rotary retainer device 6 is provided with arotary shaft 18 made of metal, furnished at a vertical orientation; a lifting/loweringmechanism 19 situated in an intermediate portion of therotary shaft 18; abearing 20 situated in a joined portion of therotary shaft 18 and the lifting/loweringmechanism 19; theretainer member 12 situated at one end of therotary shaft 18; amotor 21 situated at the other end of therotary shaft 18; and afeeder brush 23 electrically connected to the negative pole of apower supply 22 situated in proximity to themotor 21. Through up and down motion of therotary shaft 18 by the lifting/loweringmechanism 19, therotary retainer device 6 is able to immerse the shaft-shapedmember 5 in theplating fluid 2, or withdraw the shaft-shapedmember 5 up and out from theplating fluid 2. Therotary retainer device 6 is constituted such that the shaft-shapedmember 5 is rotated through rotation of therotary shaft 18 by themotor 21. - The plating
fluid regulating tank 4 is provided with astirrer 29, atemperature regulator 30, and aheater 31; theplating fluid 2 is retained inside the platingfluid regulating tank 4. Through stirring of theplating fluid 2 by thestirrer 29, for example, the Ni ion and Fe ions in theplating fluid 2 can be uniformly dispersed, as well as producing uniform temperature throughout theplating fluid 2. Thetemperature regulator 30 measures the temperature of theplating fluid 2, and controls theheater 31 to maintain theplating fluid 2 at the prescribed temperature. - The
plating fluid 2 within the platingfluid regulating tank 4 is supplied to thefluid chamber 7 interior via a platingfluid supply line 32 through which the platingfluid regulating tank 4 interior and thefluid chamber 7 interior communicate. Apump 33, astrainer 34, and aflow meter 35 are situated midway along the platingfluid supply line 32. Acontroller 36 for regulating the flow rate of theplating fluid 2 is also provided, thecontroller 36 being connected to thepump 33 via aninverter 37. The flow rate of theplating fluid 2 passing through the platingfluid supply line 32 is measured by theflow meter 35, and thecontroller 36 compares the measured value thereof to a preset value, and controls theinverter 37. Through regulation of the pump flow rate of thepump 33 by theinverter 37, the flow rate of theplating fluid 2 supplied to thefluid chamber 7 interior, i.e., the flow rate of theplating fluid 2 sprayed from the plating fluid spray orifices 26 (FIG. 2B ) is regulated. Dust or other foreign matter in theplating fluid 2 in the platingfluid supply line 32 is filtered out by thestrainer 34. -
FIG. 2 (B) shows a detailed schematic example of the interior of theplating tank 3 shown inFIG. 1 .FIG. 3 (A) primarily shows another simplified example (enlarged view) of the scheme of theoutput portion 10 s of thepositive electrode 10 of theplating device 1 shown inFIG. 1 ; andFIG. 3 (B) shows another detail schematic example showing the interior of theplating tank 3 of theplating device 1 shown inFIG. 1 . In the example ofFIG. 3 , theshield jig 14 situated between the shield jigs 13, 15 at either end is omitted. Stated another way, it is acceptable for the space between the two magnetostrictive films prior to being imparted with mutually different magnetic anisotropy to be omitted, instead forming a single magnetic alloy plating in a single platedportion 5 s, and to then impart mutually different magnetic anisotropy to the single magnetic alloy plating, forming a magnetostrictive film having two functions. Furthermore, in the example ofFIG. 3 , the platedportion 5 s is positioned [further] towards the upper side of theplating fluid 2, as compared with the example inFIG. 2 . - In the example of
FIG. 2 (B) and the example ofFIG. 3 (B), the platingfluid spray nozzles 9 are of assembly type detachable from theplating tank 3 via thefluid chamber 7. Aflange 9 f is situated in the bottom part of the platingfluid spray nozzle 9, and the platingfluid spray nozzle 9 or theflange 9 f is fastened to thefluid chamber 7 by a plurality ofbolts 9 b. Theflange 9 f and thebolts 9 b are merely one example of fasteners; the fasteners could be constituted by other members or other parts. - Depending on the type of shaft-shaped
member 5, the position at which the platedportion 5 s is situated on the shaft-shaped member 5 (thecenter position 5 c) will differ; in the example ofFIG. 3 (B), the platedportion 5 s is positioned [further] towards the upper side of theplating fluid 2, as compared with the example inFIG. 2 (B). In this case as well, by replacing the platingfluid spray nozzles 9 having the platingfluid spray orifices 26 which face the platedportion 5 s, the metallic alloy plating can be formed to more uniform thickness, while achieving compatibility with shaft-shapedmembers 5 and platedportions 5 s of various different types. Stated another way, the platingfluid spray nozzles 9 ofFIG. 2 (B) can be extended in length, positioning a plurality of the platingfluid spray orifices 26 at the top, to prepare the replacement platingfluid spray nozzles 9 ofFIG. 3 (B) for example. - As discussed below, by replacing the
shield 10 m, compatibility with shaft-shapedmembers 5 and platedportions 5 s of various different types can be achieved in the same manner as with replacement of the platingfluid spray nozzles 9. - In the example of
FIG. 2 (B) and the example ofFIG. 3 (B), theplating tank 3 is constituted, for example, by a cylindrical tank made of an insulating resin, or one made of metal to which an insulating coating film has been applied to the inside surface. Theplating fluid 2 is supplied to the interior of theplating tank 3 from the interior of thefluid chamber 7 via the platingfluid spray nozzles 9, and overflows into therecovery section 8 from the upper edge of theplating tank 3, to be recovered in the platingfluid regulating tank 4 ofFIG. 1 , via a platingfluid recovery line 11 situated at the bottom of therecovery section 8. - When the
power supply 22 is ON, theplating fluid 2 is sprayed from the platingfluid spray orifices 26 towards the platedportion 5 s of the rotating shaft-shapedmember 5. In so doing, theplating fluid 2 is supplied to the entire surface of the platedportion 5 s, and uniform flow can be obtained over the entire surface of the platedportion 5 s. Because the shaft-shapedmember 5 rotates, the concentration of Ni ions and the concentration of Fe ions in theplating fluid 2 are maintained at constant levels over the entire surface of the platedportion 5 s. - In the example of
FIG. 2 (B) and the example ofFIG. 3 (B), maskingtape 16 is wrapped about the outside peripheral face of the shaft-shapedmember 5, in a section above theupper shield jig 13 and a section below the lower shaft jig 15 (seeFIG. 5 (A) andFIG. 6 (A)). The platedportion 5 s of the shaft-shapedmember 5 is constituted by the section not covered by the shield jigs 13, 14, 15 or the shield jigs 13, 15, and themasking tape 16. - In the example of
FIG. 2 (B) and the example ofFIG. 3 (B), thepositive electrode 10 is constituted by ametal cage 27 of cylindrical shape open at the top end and closed at the bottom end, and a plurality ofmetal pellets 28 contained within themetal cage 27. Themetal cage 27 is arranged encircling the platingfluid spray nozzle 9 which is located to the inside of the inside peripheral surface thereof, and is supported by fasteners, not illustrated, in such a way as to not contact the inside peripheral surface and bottom surface of theplating tank 3. Themetal cage 27 is formed, for example, of mesh comprising Ti, which does not dissolve into theplating fluid 2 when current is passed through, and is electrically connected to the positive pole of the power supply 22 (FIG. 1 ). Themetal pellets 28, on the other hand, are pellets made, for example, of an Ni—Fe alloy which is dissolvable in theplating fluid 2, a pellet mixture of metal pellets of Ni alone and metal pellets of Fe alone, or the like. While themetal pellets 28 are employed as thepositive electrode 10, spheres or any other shape would be acceptable, provided that the size is one that may be accommodated within themetal cage 27, and [large enough] to not leak out through the mesh of themetal cage 27. - Even when the Ni ions and the Fe ions in the
plating fluid 2 are consumed in the course of carrying out Ni—Fe alloy plating, Ni ions and Fe ions dissolve into the plating fluid 2 from themetal pellets 28 through electrolysis, and maintain the concentration of Ni ions and the concentration of Fe ions in theplating fluid 2 at constant levels, whereby theplating fluid 2 can be easily managed. Because the constitution in one in which themetal pellets 28 are contained within themetal cage 27, themetal cage 27 can be easily supplied with themetal pellets 28, even during the plating process. -
FIG. 4 shows a top view of theplating tank 3 shown inFIG. 1 .FIG. 5 (A) shows an example of the exterior of the platingfluid spray nozzle 9 shown inFIG. 2 (B); andFIG. 6 (A) shows an example of the exterior of the platingfluid spray nozzle 9 shown inFIG. 3 (B).FIG. 5 (B) primarily shows a simplified schematic example of the output portion of the platingfluid spray nozzle 9 shown inFIG. 5 (A); andFIG. 6 (B) shows a modification example of thepositive electrode 10 of theplating device 1 shown inFIG. 1 . In the example ofFIG. 4 , the platingfluid spray nozzles 9 are, for example, four in number, arranged at equidistant intervals on a circle centered on the shaft-shapedmember 5. The number of platingfluid spray nozzles 9 may be four or more, or one. - In the example of
FIG. 6 (B), the entirepositive electrode 10 faces the plated portion (negative electrode) 5 s. Stated another way, the entirepositive electrode 10 ofFIG. 6 (B) constitutes theoutput portion 10 s of thepositive electrode 10 ofFIG. 2 (A), thepositive electrode 10 ofFIG. 6 (B) being fastened such that thecenter position 5 c of the platedportion 5 s and thecenter position 10 c of theoutput portion 10 s are aligned. In the example ofFIG. 6 (B), theplating device 1 or theplating tank 3 may be provided with theshield 10 m shown, for example, inFIG. 4 . - In the example of
FIG. 5 (A) and the example ofFIG. 5 (B), the plurality of platingfluid spray orifices 26 are situated on the outside peripheral face of the platingfluid spray nozzle 9 so as to face the platedportion 5 s, and are arranged parallel to the axial direction of the shaft-shapedmember 5. In the example ofFIG. 5 (A), the plurality of platingfluid spray orifices 26 are separated into a plurality of regions (for example, an upper region and a lower region) in corresponding fashion to individual platedportions sub-portions portion 5 s). The lengths 26l 1, 26l 2 of the individual regions (the upper region and the lower region) are preferably substantially aligned with thelength 5l l 2 of each one corresponding platedsub-portions 5 s. Further, thecenters 26c c 2 of the individual regions (the upper region and the lower region) are preferably substantially aligned with thecenters 5c c 2 of each one corresponding platedsub-portion 5 s. In so doing, the magnetic alloy plating can be formed to more uniform thickness, and the magnetic alloy plating can be formed to more uniform composition, even in cases in which the shaft-shapedmember 5 is rotated to stir theplating fluid 2 inside theplating tank 3. - In the example of
FIG. 5 (B), for example, two sub-output portions in theentire output portion 10 s of thepositive electrode 10 are separated into a plurality of regions (for example, an upper region and a lower region) in corresponding fashion to the individual platedsub-portions 5 s, the lengths 10l 1, 10l 2 of the individual regions (the upper region and the lower region) preferably being substantially aligned withlengths l 2 of each one corresponding platedsub-portion 5 s. Further, thecenters 10c c 2 of the individual regions (the upper region and the lower region) are preferably substantially aligned with thecenters 5c c 2 of each one corresponding platedsub-portion 5 s. In so doing, the magnetic alloy plating can be formed to more uniform thickness in each of the individual platedportion 5 s, 52 (for example, the two platedsub-portions portion 5 s). -
FIG. 7 shows an example of an exploded perspective view of themetal cage 27 and theshield 10 m ofFIG. 3 (B). In the example ofFIG. 7 , theshield 10 m, which is cylindrical in shape and has three openings for example, can be fastened to the inside surface (inside peripheral surface) of themetal cage 27, for example, bybolts 10 b, a frame 10f 1, and nuts (not illustrated). The pattern of theshield 10 m defines the pattern of theoutput portion 10 s of thepositive electrode 10, theshield 10 m preferably being of assembly type detachable from thepositive electrode 10 or to themetal cage 27, for example. Stated another way, the section corresponding to themetal pellets 28 or thepositive electrode 10 at the opening of theshield 10 m defines theoutput portion 10 s of thepositive electrode 10, theshield 10 m preferably being of replaceable type. Alternatively, themetal cage 27 or thepositive electrode 10 may be of replaceable type. - The
metal cage 27 can be fastened to theplating tank 3 ofFIG. 1 by a frame 10f 2 and fasteners such as members or parts (not illustrated) or the like. Theshield 10 m and the fasteners (thebolts 10 b, the frame 10f 1, the frame 10f 2, and the like) are insulators, both being constituted, for example, of an insulating substance, or the surfaces of both being coated with an insulating coating, for example. - In cases in which the
metal cage 27 and theshield 10 m ofFIG. 7 are applied toFIG. 2 (B), the lower side of thecylindrical shield 10 m would be furnished, for example, with three openings while closing off the opening in the section corresponding to theshield jig 14; in other words, thecylindrical shield 10 m would be furnished, for example, with [a total of] six openings. -
FIG. 8 (A) shows a modification example of theshield 10 m ofFIG. 7 , andFIG. 8 (B) shows a modification example of thepositive electrode 10 ofFIG. 3 (B). In the example ofFIG. 8 (A), theshield 10 m is constituted by two cylindrical members. When theshield FIG. 8 (A) is fastened to themetal cage 27, theoutput portion 10 s of themetal pellets 28 or thepositive electrode 10 is defined by the space between theshield shield output portion 10 s of themetal pellets 28 or thepositive electrode 10. - Rather than fastening the
shield FIG. 8 (A) to themetal cage 27, it may, for example, be fastened to sixpositive electrodes bolts 10 b, nuts 10 n, or the like, as in the example shown inFIG. 8 (B), for example. Stated another way, rather than having thepositive electrode 10 be constituted by themetal cage 27 or themetal pellets 28, theplating device 1 may employ non-dissolving plate-shapedpositive electrodes 10. - In the case of application of the
shield FIG. 8 (A) toFIG. 2 (B), theshield 10 m would be constituted, for example, by three cylindrical members (not illustrated) including a cylindrical member in a section corresponding to theshield jig 14, with spaces between adjacent members situated at the bottom side. -
FIG. 9 (A) toFIG. 9 (H) respectively show descriptive diagrams in which thecenter position 5 c of the platedportion 5 s (or the center positions 5c c 2 of the plated sub-portions 5 s) and thecenter position 10 c of theoutput portion 10 s (or the center positions 10c c 2 of thesub-output portions 10 s) are substantially aligned.FIG. 9 (C) shows the variability in film thickness of, for example, Ni—Fe alloy plating, when thecenter position 5 c of the platedportion 5 s and thecenter position 10 c of theoutput portion 10 s are perfectly aligned, and represents film thickness, for example, at six different positions in the platedportion 5 s ofFIG. 3 (B), in the axial direction J of the shaft-shapedmember 5. The ranges indicated by pairs of dotted lines inFIG. 9 (C) are allowable range relating to film thickness, and are determined according to specifications.FIG. 9 (A) andFIG. 9 (B) show the variability in film thickness when thecenter position 10 c of theoutput portion 10 s is higher than thecenter position 5 c of the platedportion 5 s; thecenter position 10 c inFIG. 9 (A) is higher than thecenter position 10 c inFIG. 9 (B).FIG. 9 (D) toFIG. 9 (H) show the variability in film thickness when thecenter position 10 c of theoutput portion 10 s is lower than thecenter position 5 c of the platedportion 5 s; the center positions 10 c inFIG. 9 (D) toFIG. 9 (H) are progressively lower in the orderFIG. 9 (D) toFIG. 9 (H), with thecenter position 10 c inFIG. 9 (H) being the lowest. - In each of
FIG. 9 (A) toFIG. 9 (F), film thickness at all six positions is maintained with in the allowable range, whereas in each ofFIG. 9 (G) toFIG. 9 (H), film thickness at all six positions is not maintained within the allowable range. Consequently, [it is not necessary for] thecenter position 5 c of the platedportion 5 s and thecenter position 10 c of theoutput portion 10 s to be perfectly aligned (FIG. 9 (C)), it being acceptable for thecenter position 10 c of theoutput portion 10 s to be slightly higher than thecenter position 5 c of the platedportion 5 s (FIG. 9 (A),FIG. 9 (B)), or for thecenter position 10 c of theoutput portion 10 s to be slightly lower than thecenter position 5 c of the platedportion 5 s (FIG. 9 (D),FIG. 9 (E),FIG. 9 (F)), provided that thecenter position 5 c of the platedportion 5 s (or the center positions 5c center position 10 c of the positive electrode 10 (or the center positions 10c portion 5 s. - Likewise, it is acceptable for the
length 5 l of the platedportion 5 s to be longer that the length 10 l of theoutput portion 10 s; for the two to be perfectly aligned; or for thelength 5 l of the platedportion 5 s to be slightly shorter than the length 10 l of theoutput portion 10 s, provided that thelength 5 l of the platedportion 5 s (or thelengths output portion 10 s of the positive electrode 10 (or the lengths 10l 1, 10 l 2) are aligned within the prescribed tolerance relating to length, such that the variability of thickness of the magnetic alloy film is maintained within the acceptable range throughout the entire platedportion 5 s. -
FIG. 10 (A) toFIG. 10 (H) each respectively show one more descriptive diagram in which thecenter position 5 c of the platedportion 5 s and thecenter position 10 c of theoutput portion 10 s are substantially aligned.FIG. 10 (C) shows variability in the iron composition or proportion of iron in, for example, Ni—Fe alloy plating, when thecenter position 5 c of the platedportion 5 s and thecenter position 10 c of theoutput portion 10 s are perfectly aligned. The range indicated by the pair of dotted lines inFIG. 10 (C) is an allowable range relating to iron composition, and is determined according to specifications. The center positions 10 c inFIG. 10 (A) toFIG. 10 (H) respectively correspond to the center positions inFIG. 9 (A) toFIG. 9 (H), with thecenter position 10 c ofFIG. 10 (A) being the highest, and thecenter position 10 c ofFIG. 10 (H) being the lowest. In each ofFIG. 10 (B) toFIG. 10 (F), the iron composition at all six positions is maintained within the allowable range, whereas in each ofFIG. 10 (G) toFIG. 10 (H), the iron composition at all six positions is not maintained within the allowable range. - It is preferable to take into consideration the iron composition, not just the film thickness, whereby the
center position 5 c of the platedportion 5 s (or the center positions 5c center position 10 c of the positive electrode 10 (or the center positions 10c FIG. 10 (B) toFIG. 10 (F),FIG. 9 (B) toFIG. 9 (F)), so that variability of each component of the magnetic alloy plating is maintained within an allowable range throughout the entire platedportion 5 s. Likewise, it is preferable to take into consideration the iron composition, not just the film thickness, whereby thelength 5 l of the platedportion 5 s (or thelengths output portion 10 s of the positive electrode 10 (or the lengths 10l 1, 10 l 2) are aligned within the prescribed tolerance relating to length. - The present invention is not limited to the exemplary embodiments set forth hereinabove, and a person skilled in the art may easily make modifications to o the exemplary embodiments set forth hereinabove, within the technical scope encompassed by the claims.
-
-
- O: origin
- 1: plating device
- 2: plating fluid
- 3: plating tank
- 5: shaft-shaped member
- 5 c: center position of plated portion
- 5 l: length of plated portion
- 5 s: plated portion
- 6: rotary means
- 9: plating fluid spray nozzle
- 9 b, 9 f: plating fluid spray nozzle fasteners
- 10: positive electrode
- 10 b, 10 n, 10 f 1: shield fasteners
- 10 c: center position of output portion
- 10 l: length of output portion
- 10 f 2: metal cage fastener
- 10 m: shield
- 10 s: output portion
- 13, 15: shield jigs at either end
- 14: shield jig situated between shield jigs at either end
- 26: plating fluid spray orifices
- 26 c center position of plating fluid spray orifice
- 27 metal cage
- 28 metal pellets
Claims (14)
1. A plating device comprising a plating tank retaining a plating fluid, the device being used to carry out magnetic alloy plating of a shaft-shaped member immersed in the plating fluid, the shaft-shaped member serving as a negative electrode, wherein the plating device includes
a plurality of shielding jigs fitted about an outer peripheral surface of the shaft-shaped member and defining a plated portion on the shaft-shaped member; and
a positive electrode disposed surrounding the shaft-shaped member, and having an output portion facing the plated portion;
characterized in that the center position of the plated portion and the center position of the output portion in the axial direction of the shaft-shaped member are aligned to within a predetermined tolerance relating to the center position.
2. The plating device of claim 1 , wherein a length of the plated portion and a length of the output portion of the positive electrode are aligned to within a predetermined tolerance relating to the length, in an axial direction of the shaft-shaped member.
3. The plating device of claim 1 , further comprising a shield disposed between the positive electrode and the shaft-shaped member.
4. The plating device of claim 3 , wherein a pattern of the shield defines a pattern of the output portion of the positive electrode, the pattern of the shield being determined such that variability of thickness of the magnetic alloy plating is kept to within an allowable range.
5. The plating device of claim 3 , wherein the shield is of assembly type detachable from the positive electrode.
6. The plating device of claim 1 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank.
7. The plating device of claim 6 , wherein the center position of the plated portion and the center position of the plating fluid spray orifice are aligned to within an tolerance relating to the center position, in the axial direction of the shaft-shaped member.
8. The plating device of claim 7 , wherein the length of the plated portion and the length of the plating fluid spray orifice are aligned to within a prescribed tolerance relating to the length, in the axial direction of the shaft-shaped member.
9. The plating device of claim 2 , further comprising a shield disposed between the positive electrode and the shaft-shaped member.
10. The plating device of claim 4 , wherein the shield is of assembly type detachable from the positive electrode.
11. The plating device of claim 2 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank.
12. The plating device of claim 3 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank.
13. The plating device of claim 4 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank.
14. The plating device of claim 5 , further comprising a plating fluid spray nozzle having a plating fluid spray orifice facing the plated portion, the plating fluid spray nozzle being of assembly type detachable from the plating tank.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2012003152 | 2012-01-11 | ||
JP2012-003152 | 2012-01-11 | ||
PCT/JP2012/083272 WO2013105420A1 (en) | 2012-01-11 | 2012-12-21 | Plating device |
Publications (1)
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US20140339077A1 true US20140339077A1 (en) | 2014-11-20 |
Family
ID=48781378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US14/371,638 Abandoned US20140339077A1 (en) | 2012-01-11 | 2012-12-21 | Plating device |
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US (1) | US20140339077A1 (en) |
JP (1) | JP5755341B2 (en) |
WO (1) | WO2013105420A1 (en) |
Families Citing this family (1)
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CN110328624B (en) * | 2019-07-26 | 2020-07-31 | 郑州磨料磨具磨削研究所有限公司 | Deposition fixture for special-shaped electroplating grinding wheel and using method thereof |
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US4469566A (en) * | 1983-08-29 | 1984-09-04 | Dynamic Disk, Inc. | Method and apparatus for producing electroplated magnetic memory disk, and the like |
US4534832A (en) * | 1984-08-27 | 1985-08-13 | Emtek, Inc. | Arrangement and method for current density control in electroplating |
US4588653A (en) * | 1983-08-29 | 1986-05-13 | Dynamic Disk, Inc. | Magnetic memory disk |
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US6168691B1 (en) * | 1996-08-09 | 2001-01-02 | Atotech Deutschland Gmbh | Device for electrochemical treatment of elongate articles |
US6402923B1 (en) * | 2000-03-27 | 2002-06-11 | Novellus Systems Inc | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element |
US20040226384A1 (en) * | 2003-05-12 | 2004-11-18 | Honda Motor Co., Ltd. | Magnetostrictive coat forming method, magnetostrictive torque sensor manufacturing method, and electric power steering apparatus employing the sensor |
US20050056541A1 (en) * | 2003-09-17 | 2005-03-17 | Wataru Oikawa | Method and apparatus for partially plating work surfaces |
US20090229380A1 (en) * | 2006-10-19 | 2009-09-17 | Honda Motor Co., Ltd. | Plating apparatus |
US7771581B2 (en) * | 2002-12-31 | 2010-08-10 | Advanced Cardiovascular Systems, Inc. | Apparatus and process for electrolytic removal of material from a medical device |
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DE19837973C1 (en) * | 1998-08-21 | 2000-01-20 | Atotech Deutschland Gmbh | Apparatus for electrochemical treatment of parts of bar-shaped workpieces in immersion bath installations |
JP3854249B2 (en) * | 2003-06-16 | 2006-12-06 | 本田技研工業株式会社 | Method for forming magnetostrictive film in magnetostrictive torque sensor |
-
2012
- 2012-12-21 JP JP2013553235A patent/JP5755341B2/en not_active Expired - Fee Related
- 2012-12-21 US US14/371,638 patent/US20140339077A1/en not_active Abandoned
- 2012-12-21 WO PCT/JP2012/083272 patent/WO2013105420A1/en active Application Filing
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US4469566A (en) * | 1983-08-29 | 1984-09-04 | Dynamic Disk, Inc. | Method and apparatus for producing electroplated magnetic memory disk, and the like |
US4588653A (en) * | 1983-08-29 | 1986-05-13 | Dynamic Disk, Inc. | Magnetic memory disk |
US4534832A (en) * | 1984-08-27 | 1985-08-13 | Emtek, Inc. | Arrangement and method for current density control in electroplating |
US5256274A (en) * | 1990-08-01 | 1993-10-26 | Jaime Poris | Selective metal electrodeposition process |
US5281325A (en) * | 1992-07-02 | 1994-01-25 | Berg N Edward | Uniform electroplating of printed circuit boards |
US6168691B1 (en) * | 1996-08-09 | 2001-01-02 | Atotech Deutschland Gmbh | Device for electrochemical treatment of elongate articles |
US6402923B1 (en) * | 2000-03-27 | 2002-06-11 | Novellus Systems Inc | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element |
US7771581B2 (en) * | 2002-12-31 | 2010-08-10 | Advanced Cardiovascular Systems, Inc. | Apparatus and process for electrolytic removal of material from a medical device |
US20040226384A1 (en) * | 2003-05-12 | 2004-11-18 | Honda Motor Co., Ltd. | Magnetostrictive coat forming method, magnetostrictive torque sensor manufacturing method, and electric power steering apparatus employing the sensor |
US20050056541A1 (en) * | 2003-09-17 | 2005-03-17 | Wataru Oikawa | Method and apparatus for partially plating work surfaces |
US20090229380A1 (en) * | 2006-10-19 | 2009-09-17 | Honda Motor Co., Ltd. | Plating apparatus |
Also Published As
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JPWO2013105420A1 (en) | 2015-05-11 |
JP5755341B2 (en) | 2015-07-29 |
WO2013105420A1 (en) | 2013-07-18 |
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