US20130170174A1 - Multi-cavities light emitting device - Google Patents

Multi-cavities light emitting device Download PDF

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Publication number
US20130170174A1
US20130170174A1 US13/340,169 US201113340169A US2013170174A1 US 20130170174 A1 US20130170174 A1 US 20130170174A1 US 201113340169 A US201113340169 A US 201113340169A US 2013170174 A1 US2013170174 A1 US 2013170174A1
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Prior art keywords
light emitting
central slot
emitting unit
cavities
side slots
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Abandoned
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US13/340,169
Inventor
Hsi-yan Chou
Tzu-Chi Cheng
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Interlight Optotech Corp
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Intematix Technology Center Corp
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Priority to US13/340,169 priority Critical patent/US20130170174A1/en
Assigned to INTEMATIX TECHNOLOGY CENTER CORP. reassignment INTEMATIX TECHNOLOGY CENTER CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, TZU-CHI, CHOU, HSI-YAN
Publication of US20130170174A1 publication Critical patent/US20130170174A1/en
Assigned to INTERLIGHT OPTOTECH CORPORATION reassignment INTERLIGHT OPTOTECH CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: INTEMATIX TECHNOLOGY CENTER CORP.
Priority to US15/198,453 priority patent/US9755113B2/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light emitting device, in particular to a Multi-Cavities light emitting device capable of emitting a warm white light.
  • LED light emitting diodes
  • the LED module 1 a comprises a substrate 10 a , a plurality of LED chips (such as blue LED chips) 20 a , a fluorescent plastic (such as a yellow fluorescent plastic) 30 a and a plurality of lenses 40 a , wherein the substrate 10 a includes a plurality of slots 11 a arranged in a matrix, and the LED chips 20 a are installed into the slots 11 a respectively, and the fluorescent plastic 30 a is filled into the slots 11 a for covering the LED chips 20 a and emitting a desired light color, and finally the lenses 40 a are combined and formed onto the fluorescent plastic 30 a and the LED chips 20 a to seal each LED chip 20 a . With the lens 40 a , the light emitting efficiency of the LED chip 20 a can be improved to provide a white light source.
  • LED chips such as blue LED chips
  • a fluorescent plastic such as a yellow fluorescent plastic
  • the lenses 40 a are combined with the LED chips 20 a one by one, so that the overall assembling time and cost will be increased.
  • a large number of slots 11 a are densely disposed, so that a substrate with a larger area is required, and the strength of the substrate 10 a will be affected adversely, and the substrate 10 a may be cracked or broken easily to result in a low yield rate.
  • the present invention provides a Multi-Cavities light emitting device, comprising a base, a blue light emitting unit, at least two red light emitting units, a light conversion layer and a lens, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the blue light emitting unit is installed in the central slot, and the at least two red light emitting units are installed in the corresponding side slots respectively, and the light conversion layer is covered onto the blue light emitting unit, and the lens is protruded from the base and sealed onto the central slot and the at least two side slots.
  • the present invention provides a Multi-Cavities light emitting device, comprising a base, a red light emitting unit, at least two blue light emitting units, a light conversion layer, and a lens, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the red light emitting unit is installed in the central slot, and the at least two blue light emitting units are installed in the two corresponding side slots respectively, and the light conversion layer is covered onto the blue light emitting unit, and the lens is protruded from the base and sealed onto the central slot and the at least two side slots.
  • the present invention provides a Multi-Cavities light emitting device, comprising: a base, a first light emitting unit, and at least two second light emitting units, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot.
  • the central slot and the side slots are formed in an area greater than 50% of the area of the base, and the first light emitting unit is installed in the central slot, and the two second light emitting units are installed in the at least two side slots respectively.
  • Another objective of the present invention is to provide a Multi-Cavities light emitting device, wherein a ceramic material is used for making the base, and a gap between the central slot and each of the side slots is greater than 0.5 mm to maintain the strength of the base, so as avoid the substrate from being cracked or broken, and improve the yield rate of the product.
  • the light emitting device of the present invention comprises at least three slots formed on the base, and the blue LED chip and the red LED chip are installed into each corresponding slot, and the blue LED chip is covered by a plastic layer containing a yellow or green phosphor, so as to emit a warm white light. Since the red LED chip is not covered with a fluorescent plastic layer, therefore the light extraction efficiency of the red LED chip will not be affected, and the overall light extraction efficiency of the light emitting device can be improved.
  • the lens is integrally sealed onto the central slot and at least two side slots, and thus it is not necessary to seal the slots one by one, and the manufacturing time and labor of the light emitting device can be reduced to lower the overall cost.
  • the invention can minimize the light emitting area effectively to facilitate a secondary optical design at a later stage, so as to provide a more practical use of the present invention.
  • FIG. 1 is a schematic planar view of a conventional LED module
  • FIG. 2 is a partial cross-sectional view of a conventional LED module
  • FIG. 3 is a schematic planar view of a Multi-Cavities light emitting device of the present invention.
  • FIG. 4 is a cross-sectional view of a Multi-Cavities light emitting device of the present invention.
  • FIG. 5 is a cross-sectional view of a Multi-Cavities light emitting device in accordance with another embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of another Multi-Cavities light emitting device in accordance with a further embodiment of the present invention.
  • the Multi-Cavities light emitting device 1 comprises a base 10 , a first light emitting unit 20 , at least two second light emitting units 30 , a light conversion layer 40 and a lens 50 .
  • the base 10 has a central slot 11 and at least two side slots 12 symmetrically formed on external sides of the central slot 11 .
  • the base 10 can be a ceramic base having a plurality of conductive holes 13 and an inner-layer circuit 14 , but the invention is not limited to such arrangement only.
  • the first light emitting unit 20 is a blue light emitting unit
  • each of the second light emitting units 30 is a red light emitting unit
  • the central slot 11 and the side slots 12 are substantially in a long elliptical shape, and a gap between the central slot 11 and each of the side slots 12 is greater than 0.5 mm.
  • the central slot 11 and the side slots 12 are formed in an area greater than 50% of the area of the base 10 .
  • the first light emitting unit 20 is installed in the central slot 11 , and the two second light emitting units 30 are installed into two corresponding side slots 12 respectively.
  • the first light emitting unit 20 (which is the blue light emitting unit) and the second light emitting units 30 (which are the red light emitting units) are electrically coupled through the conductive holes 13 and the inner-layer circuit 14 , and the substrate 10 includes a plurality of electric connecting pads 15 installed at the bottom of the substrate 10 .
  • the blue light emitting unit installed in the central slot 11 is a blue LED chip array
  • the red light emitting units installed on both external sides of the blue light emitting unit are red LED chip arrays.
  • the light conversion layer 40 is a plastic layer containing a yellow or green phosphor, and the light conversion layer 40 is covered onto the first light emitting unit 20 (which is the blue light emitting unit).
  • the first light emitting unit 20 which is the blue light emitting unit
  • YAG yttrium aluminum garnet
  • the lens 50 is protruded from the base for sealing the central slot 11 and the at least two side slots 12 , and the lens 50 is made of resin, silicone, or epoxy resin, and a diffusion agent is added into the material of the lens to form the shape of a lens naturally, so as to enhance the light extraction and mix the lights emitted from the first light emitting unit 20 (which is the blue light emitting unit) and the second light emitting units 30 (which are the red light emitting units).
  • FIG. 5 for a cross-sectional view of a Multi-Cavities light emitting device in accordance with another embodiment of the present invention, the difference between FIG. 5 and FIG. 4 resides on that the blue light emitting unit 20 is combined into the central slot 11 by the method of a flip chip.
  • the blue light emitting unit and the red light emitting unit can be interchangeable.
  • the first light emitting unit 20 can be a red light emitting unit
  • each of the second light emitting units 30 can be a blue light emitting unit.
  • the red light emitting unit is installed in the central slot 11 .
  • the side slots 12 include the blue light emitting units installed therein respectively, and the side slots 12 are filled with the light conversion layers 40 , and the light conversion layers 40 are disposed at positions corresponding to the blue light emitting units for covering the blue light emitting unit, and the lens 50 is provided for sealing the central slot 11 and side slots 12 , so as to complete assembling the light emitting device 1 .
  • this preferred embodiment is substantially the same as the first preferred embodiment, and the light emitting device 1 ′ of this preferred embodiment comprises a base 10 ′, a first light emitting unit 20 ′ (which is a blue light emitting unit), at least four second light emitting units 30 ′ (which are red light emitting units), a light conversion layer 40 ′ and a lens 50 ′.
  • the base 10 ′ has a central slot 11 ′ and four side slots 12 ′, and the side slots 12 ′ are formed around external sides of the central slot 11 ′, wherein each side slot 12 ′ includes a second light emitting unit 30 ′ installed therein, and each second light emitting unit 30 ′ (which is the red light emitting unit) includes a plurality of red LED chips connected in series with each other, and the red light emitting unit can be substituted by a red LED array.
  • the quantity and position of the second light emitting units 30 ′ and the first light emitting units 20 ′ are not limited, so that the desired brightness and color temperature can be adjusted flexibly.

Abstract

A Multi-Cavities light emitting device includes a base, a blue light emitting unit, at least two red light emitting units, a light conversion layer and a lens, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the blue light emitting unit is installed in the central slot, and the two red light emitting units are installed in the two side slots respectively, and the light conversion layer is covered onto the blue light emitting unit, and the lens is protruded from the base and sealed onto the central slot and at least two side slots, so as to achieve the effects of improving the light extraction efficiency of an LED chip and the yield rate of the product and reducing the overall assembling time and cost.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a light emitting device, in particular to a Multi-Cavities light emitting device capable of emitting a warm white light.
    • BACKGROUND OF THE INVENTION
  • With the features of low power consumption, good power-saving effect, long service life, small volume and quick response, light emitting diodes (LED) have gradually replaced traditional tungsten bulbs, fluorescent lamps or mercury lamps, and the LEDs are applied extensively in various types of lamps.
  • With reference to FIGS. 1 and 2 for a schematic planar view and a partial cross-sectional view of a conventional LED module respectively, the LED module 1 a comprises a substrate 10 a, a plurality of LED chips (such as blue LED chips) 20 a, a fluorescent plastic (such as a yellow fluorescent plastic) 30 a and a plurality of lenses 40 a, wherein the substrate 10 a includes a plurality of slots 11 a arranged in a matrix, and the LED chips 20 a are installed into the slots 11 a respectively, and the fluorescent plastic 30 a is filled into the slots 11 a for covering the LED chips 20 a and emitting a desired light color, and finally the lenses 40 a are combined and formed onto the fluorescent plastic 30 a and the LED chips 20 a to seal each LED chip 20 a. With the lens 40 a, the light emitting efficiency of the LED chip 20 a can be improved to provide a white light source.
  • In the foregoing structure, the lenses 40 a are combined with the LED chips 20 a one by one, so that the overall assembling time and cost will be increased. In addition, a large number of slots 11 a are densely disposed, so that a substrate with a larger area is required, and the strength of the substrate 10 a will be affected adversely, and the substrate 10 a may be cracked or broken easily to result in a low yield rate.
  • In view of the drawbacks of the conventional LED module, the inventor of the present invention based on years of experience in the related industry to conduct extensive researches and experiments, and finally developed a feasible design to overcome the aforementioned drawbacks of the prior art.
    • SUMMARY OF THE INVENTION
  • Therefore, it is a primary objective of the present invention to provide a Multi-Cavities light emitting device to achieve the effects of improving the light extraction efficiency of an LED chip and the yield rate of the product and reducing the overall assembling time and cost.
  • To achieve the aforementioned objective, the present invention provides a Multi-Cavities light emitting device, comprising a base, a blue light emitting unit, at least two red light emitting units, a light conversion layer and a lens, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the blue light emitting unit is installed in the central slot, and the at least two red light emitting units are installed in the corresponding side slots respectively, and the light conversion layer is covered onto the blue light emitting unit, and the lens is protruded from the base and sealed onto the central slot and the at least two side slots.
  • To achieve the aforementioned objective, the present invention provides a Multi-Cavities light emitting device, comprising a base, a red light emitting unit, at least two blue light emitting units, a light conversion layer, and a lens, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the red light emitting unit is installed in the central slot, and the at least two blue light emitting units are installed in the two corresponding side slots respectively, and the light conversion layer is covered onto the blue light emitting unit, and the lens is protruded from the base and sealed onto the central slot and the at least two side slots.
  • To achieve the aforementioned objective, the present invention provides a Multi-Cavities light emitting device, comprising: a base, a first light emitting unit, and at least two second light emitting units, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot. The central slot and the side slots are formed in an area greater than 50% of the area of the base, and the first light emitting unit is installed in the central slot, and the two second light emitting units are installed in the at least two side slots respectively.
  • Another objective of the present invention is to provide a Multi-Cavities light emitting device, wherein a ceramic material is used for making the base, and a gap between the central slot and each of the side slots is greater than 0.5 mm to maintain the strength of the base, so as avoid the substrate from being cracked or broken, and improve the yield rate of the product.
  • Compared with the prior art, the light emitting device of the present invention comprises at least three slots formed on the base, and the blue LED chip and the red LED chip are installed into each corresponding slot, and the blue LED chip is covered by a plastic layer containing a yellow or green phosphor, so as to emit a warm white light. Since the red LED chip is not covered with a fluorescent plastic layer, therefore the light extraction efficiency of the red LED chip will not be affected, and the overall light extraction efficiency of the light emitting device can be improved. In addition, the lens is integrally sealed onto the central slot and at least two side slots, and thus it is not necessary to seal the slots one by one, and the manufacturing time and labor of the light emitting device can be reduced to lower the overall cost. The invention can minimize the light emitting area effectively to facilitate a secondary optical design at a later stage, so as to provide a more practical use of the present invention.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic planar view of a conventional LED module;
  • FIG. 2 is a partial cross-sectional view of a conventional LED module;
  • FIG. 3 is a schematic planar view of a Multi-Cavities light emitting device of the present invention;
  • FIG. 4 is a cross-sectional view of a Multi-Cavities light emitting device of the present invention;
  • FIG. 5 is a cross-sectional view of a Multi-Cavities light emitting device in accordance with another embodiment of the present invention; and
  • FIG. 6 is a cross-sectional view of another Multi-Cavities light emitting device in accordance with a further embodiment of the present invention.
    •  DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The technical characteristics and contents of the present invention will become apparent with the following detailed description and related drawings. The drawings are provided for the purpose of illustrating the present invention only, but not intended for limiting the scope of the invention.
  • With reference to FIGS. 3 and 4 for a schematic planar view and a cross-sectional view of a Multi-Cavities light emitting device of the present invention respectively, the Multi-Cavities light emitting device 1 comprises a base 10, a first light emitting unit 20, at least two second light emitting units 30, a light conversion layer 40 and a lens 50.
  • The base 10 has a central slot 11 and at least two side slots 12 symmetrically formed on external sides of the central slot 11. The base 10 can be a ceramic base having a plurality of conductive holes 13 and an inner-layer circuit 14, but the invention is not limited to such arrangement only.
  • In this preferred embodiment, the first light emitting unit 20 is a blue light emitting unit, and each of the second light emitting units 30 is a red light emitting unit, and the central slot 11 and the side slots 12 are substantially in a long elliptical shape, and a gap between the central slot 11 and each of the side slots 12 is greater than 0.5 mm. In addition, the central slot 11 and the side slots 12 are formed in an area greater than 50% of the area of the base 10.
  • The first light emitting unit 20 is installed in the central slot 11, and the two second light emitting units 30 are installed into two corresponding side slots 12 respectively. The first light emitting unit 20 (which is the blue light emitting unit) and the second light emitting units 30 (which are the red light emitting units) are electrically coupled through the conductive holes 13 and the inner-layer circuit 14, and the substrate 10 includes a plurality of electric connecting pads 15 installed at the bottom of the substrate 10. In this preferred embodiment, the blue light emitting unit installed in the central slot 11 is a blue LED chip array, and the red light emitting units installed on both external sides of the blue light emitting unit are red LED chip arrays.
  • The light conversion layer 40 is a plastic layer containing a yellow or green phosphor, and the light conversion layer 40 is covered onto the first light emitting unit 20 (which is the blue light emitting unit). For example, yttrium aluminum garnet (YAG) is one of the yellow phosphors. After lights of the first light emitting unit 20 (which is the blue light emitting unit) and the second light emitting units 30 (which are the red light emitting units) covered with the light conversion layer 40 are collected, a warm white light is produced, wherein the warm white light has a color temperature range from 2700K to 4000K.
  • The lens 50 is protruded from the base for sealing the central slot 11 and the at least two side slots 12, and the lens 50 is made of resin, silicone, or epoxy resin, and a diffusion agent is added into the material of the lens to form the shape of a lens naturally, so as to enhance the light extraction and mix the lights emitted from the first light emitting unit 20 (which is the blue light emitting unit) and the second light emitting units 30 (which are the red light emitting units).
  • With reference to FIG. 5 for a cross-sectional view of a Multi-Cavities light emitting device in accordance with another embodiment of the present invention, the difference between FIG. 5 and FIG. 4 resides on that the blue light emitting unit 20 is combined into the central slot 11 by the method of a flip chip.
  • It is noteworthy to point out that the blue light emitting unit and the red light emitting unit can be interchangeable. In other words, the first light emitting unit 20 can be a red light emitting unit, and each of the second light emitting units 30 can be a blue light emitting unit. The red light emitting unit is installed in the central slot 11. On the other hand, the side slots 12 include the blue light emitting units installed therein respectively, and the side slots 12 are filled with the light conversion layers 40, and the light conversion layers 40 are disposed at positions corresponding to the blue light emitting units for covering the blue light emitting unit, and the lens 50 is provided for sealing the central slot 11 and side slots 12, so as to complete assembling the light emitting device 1.
  • With reference to FIG. 6 for a Multi-Cavities light emitting device in accordance with another preferred embodiment of the present invention, this preferred embodiment is substantially the same as the first preferred embodiment, and the light emitting device 1′ of this preferred embodiment comprises a base 10′, a first light emitting unit 20′ (which is a blue light emitting unit), at least four second light emitting units 30′ (which are red light emitting units), a light conversion layer 40′ and a lens 50′. In this preferred embodiment, the base 10′ has a central slot 11′ and four side slots 12′, and the side slots 12′ are formed around external sides of the central slot 11′, wherein each side slot 12′ includes a second light emitting unit 30′ installed therein, and each second light emitting unit 30′ (which is the red light emitting unit) includes a plurality of red LED chips connected in series with each other, and the red light emitting unit can be substituted by a red LED array.
  • It is noteworthy to point out that in the use of the light emitting device 1, 1′ of the present invention, the quantity and position of the second light emitting units 30′ and the first light emitting units 20′ are not limited, so that the desired brightness and color temperature can be adjusted flexibly.
  • While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims (21)

What is claimed is:
1. A Multi-Cavities light emitting device, comprising:
a base, having a central slot and at least two side slots symmetrically formed on external sides of the central slot;
a blue light emitting unit, installed in the central slot;
at least two red light emitting units, installed in the at least two side slots respectively;
a light conversion layer, covered onto the blue light emitting unit; and
a lens, protruded from the base and sealed onto the central slot and the at least two side slots.
2. The Multi-Cavities light emitting device of claim 1, wherein the base is a ceramic base, and the base includes a plurality of conductive holes and an inner-layer circuit, and the blue light emitting unit and the red light emitting units are electrically coupled through the conductive holes and the inner-layer circuit.
3. The Multi-Cavities light emitting device of claim 1, wherein the base includes four side slots formed around external sides of the central slot, and the central slot and the side slots are substantially in a long elliptical shape, and a gap between the central slot and each of the side slots is greater than 0.5 mm.
4. The Multi-Cavities light emitting device of claim 1, wherein the central slot and the side slots are formed in an area greater than 50% of the area of the base.
5. The Multi-Cavities light emitting device of claim 1, wherein the blue light emitting unit is a blue LED chip array, and each of the red light emitting units is a red LED chip array, and lights emitted from the blue light emitting unit and the red light emitting units and collected have a color temperature range from 2700K to 4000K.
6. The Multi-Cavities light emitting device of claim 1, wherein the light conversion layer contains a yellow or green phosphor and the yellow phosphor is yttrium aluminum garnet (YAG).
7. A Multi-Cavities light emitting device, comprising:
a base, having a central slot and at least two side slots symmetrically formed on external sides of the central slot;
a red light emitting unit, installed in the central slot;
at least two blue light emitting units, installed in the at least two side slots respectively;
at least two light conversion layers, covered onto the corresponding blue light emitting units respectively; and
a lens, protruded from the base, and sealed onto the central slot and the at least two side slots.
8. The Multi-Cavities light emitting device of claim 7, wherein the base is a ceramic base, and the base includes a plurality of conductive holes and an inner-layer circuit, and the blue light emitting unit and the red light emitting units are electrically coupled through the conductive holes and the inner-layer circuit.
9. The Multi-Cavities light emitting device of claim 7, wherein the base includes four side slots formed around external sides of the central slot, and the central slot and the side slots are substantially in a long elliptical shape, and a gap between the central slot and each of the side slots is greater than 0.5 mm.
10. The Multi-Cavities light emitting device of claim 7, wherein the central slot and the side slots are formed in an area greater than 50% of the area of the base.
11. The Multi-Cavities light emitting device of claim 7, wherein the red light emitting unit is a red LED chip array, and each of the blue light emitting units is a blue LED chip array, and lights emitted from the red light emitting unit and the blue light emitting units and collected have a color temperature range from 2700K to 4000K.
12. The Multi-Cavities light emitting device of claim 7, wherein the light conversion layers contain a yellow or green phosphor and the yellow phosphor is yttrium aluminum garnet (YAG).
13. A Multi-Cavities light emitting device, comprising:
a base, having a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the central slot and the side slots being formed in an area greater than 50% of the area of the base;
a first light emitting unit, installed in the central slot; and
at least two second light emitting units, installed in the at least two side slots respectively.
14. The Multi-Cavities light emitting device of claim 13, further comprising a light conversion layer, and the first light emitting unit is a blue light emitting unit, and each of the second light emitting units is a red light emitting unit, and the light conversion layer is covered onto the first light emitting unit.
15. The Multi-Cavities light emitting device of claim 13, further comprising at least two light conversion layers, and the first light emitting unit is a red light emitting unit, and each of the second light emitting units is a blue light emitting unit, and the light conversion layers are covered onto the second light emitting units.
16. The Multi-Cavities light emitting device of claim 13, wherein the base is a ceramic base, and the base includes a plurality of conductive holes and an inner-layer circuit, and the blue light emitting unit and the red light emitting units are electrically coupled through the conductive holes and the inner-layer circuit.
17. The Multi-Cavities light emitting device of claim 13, wherein the base includes four side slots formed around external sides of the central slot, and the central slot and the side slots are substantially in a long elliptical shape, and a gap between the central slot and each of the side slots is greater than 0.5 mm.
18. The Multi-Cavities light emitting device of claim 14, wherein the blue light emitting unit is a blue LED chip array, and the red light emitting unit is a red LED chip array, and lights emitted from the first light emitting unit and the second light emitting units and collected have a color temperature range from 2700K to 4000K.
19. The Multi-Cavities light emitting device of claim 15, wherein the blue light emitting unit is a blue LED chip array, and the red light emitting unit is a red LED chip array, and lights emitted from the first light emitting unit and the second light emitting units and collected have a color temperature range from 2700K to 4000K.
20. The Multi-Cavities light emitting device of claim 14, wherein the light conversion layer contains a yellow or green phosphor and the yellow phosphor is yttrium aluminum garnet (YAG).
21. The Multi-Cavities light emitting device of claim 15, wherein the light conversion layer contains a yellow or green phosphor and the yellow phosphor is yttrium aluminum garnet (YAG).
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