US20130016334A1 - Method for determining planting ball number of camera module - Google Patents
Method for determining planting ball number of camera module Download PDFInfo
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- US20130016334A1 US20130016334A1 US13/279,496 US201113279496A US2013016334A1 US 20130016334 A1 US20130016334 A1 US 20130016334A1 US 201113279496 A US201113279496 A US 201113279496A US 2013016334 A1 US2013016334 A1 US 2013016334A1
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- United States
- Prior art keywords
- contact pad
- distance
- image pickup
- pickup device
- substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C5/00—Measuring height; Measuring distances transverse to line of sight; Levelling between separated points; Surveyors' levels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Definitions
- the present invention relates to a method for determining the planting ball number, and more particularly to a method for determining the planting ball number of a camera module.
- the contact pad 111 is disposed around the opening 112 and aligned with the connection region 122 .
- the opening 112 is formed by using a hole-breaking component (not shown) to punch the substrate 11 .
- the hole-breaking component is withdrawn from the substrate 11 , the edge of the opening 112 is readily subject to deformation in response to the stress. Under this circumstance, an upturned edge 113 is created at an edge of the opening 112 .
- the upturned edge 113 may result in some drawbacks. For example, since the upturned edge 113 is protruded upwardly, the gap distance between the substrate 11 and the chip 12 is increased. Moreover, since the contacting point between the upturned edge 113 and the chip 12 acts like a fulcrum, a torque is readily generated to cause damage of the conductive bump 13 . Under this circumstance, the adhesion instability between the substrate 11 and the chip 12 is largely increased.
- FIG. 2 schematically illustrates another conventional camera module.
- a plurality of conductive bumps 13 are placed on the same connection region 122 .
- the possibility of allowing the contacting point between the upturned edge 113 and the chip 12 to be formed as a fulcrum will be minimized.
- the heights of the contact pads 111 corresponding to different connection regions 122 are not always identical, some drawbacks occur. For example, if the same number of conductive bumps 13 are placed on all of the connection regions 122 , unnecessary packaging cost is increased. In addition, the uneven heights of the contact pads 111 may result in skew of the chip 12 .
- the present invention relates to a method for determining the planting ball number of a camera module, thereby enhancing the quality of packaging the camera module.
- a method for determining a planting ball number of a camera module includes a chip and a substrate.
- the substrate has an opening with four rims.
- the chip is fixed on a plurality of contact pads of the substrate through a plurality of planting balls.
- Each of the planting balls has a ball height.
- the method is configured for determining a number of planting balls on each contact pad and includes the following steps.
- an image pickup device is allowed to focus on at least four specified contact pads of the substrate to acquire four specified contact pad distances from the at least four specified contact pads to the image pickup device, and the four specified contact pad distances are averaged to acquire an average contact pad distance.
- the image pickup device is allowed to focus on the four rims of the opening of the substrate to acquire four opening distances from the four rims to the image pickup device, and a smallest opening distance among the four opening distances is acquired.
- the image pickup device is allowed to focus on each contact pads of the substrate to acquire an actual contact pad distance from each contact pad to the image pickup device, thereby obtaining a plurality of actual contact pad distances.
- the step (D) is performed to successively judge whether the actual contact pad distance is greater than the average contact pad distance.
- a first difference value between the actual contact pad distance and the smallest opening distance is calculated, and the first difference value is divided by the ball height to acquire the planting ball number for the contact pad corresponding to the actual contact pad distance.
- a second difference value between the average contact pad distance and the smallest opening distance is calculated, and the second difference value is divided by the ball height to acquire the planting ball number for the contact pad corresponding to the actual contact pad distance.
- the at least four specified contact pads are located at four corner of the substrate, respectively.
- the image pickup device includes a contrast autofocus unit.
- FIG. 2 schematically illustrates another conventional camera module
- FIG. 3 schematically illustrates a camera module according to an embodiment of the present invention
- FIG. 5 schematically illustrates the image pickup device of the machine as shown in FIG. 4 ;
- FIG. 6 is a flowchart illustrating a method for determining the planting ball number of a camera module according to an embodiment of the present invention
- FIG. 7 schematically illustrates the distance from a contact pad P x to the image pickup device.
- FIG. 8 schematically illustrates the distance from a contact pad P y to the image pickup device.
- FIG. 3 schematically illustrates a camera module according to an embodiment of the present invention.
- the camera module 20 comprises a substrate 21 and a chip 22 .
- the opening 211 has four rims 211 a , 211 b , 211 c and 211 d .
- Each of the contact pads P n is used for supporting at least one conductive bump.
- the conductive bump is a planting ball 23 , which is made of conductive metallic material. Through the planting ball 23 , the substrate 21 and the chip 22 are electrically connected with each other and combined together.
- the planting ball 23 has a ball high h.
- a method for determining the planting ball number of the camera module will be illustrated in more details as follows.
- FIG. 4 schematically illustrates a machine for determining the planting ball number.
- the machine 30 comprises a platform 31 and an image pickup device 32 .
- the platform 31 is used for supporting the substrate 21 .
- the image pickup device 32 is vertically movable relative to the platform 31 in a reciprocating manner for capturing a plurality of images of the substrate 21 .
- the image pickup device 32 comprises a contrast autofocus (contrast AF) unit 321 , a memory 322 and a processor 323 .
- the contrast autofocus unit 321 is used for judging the sharpness of the images, thereby achieving an auto-focusing efficacy.
- the distance between the substrate and the image pickup device 32 is estimated according to the sharpest image.
- the various distance data are stored in the memory 322 .
- the contrast method employed by the contrast autofocus unit 321 is a well-known auto-focusing technique, and is not redundantly described herein.
- the contrast method is presented herein for purpose of illustration and description only. In other words, any other auto-focusing technique (e.g. an infrared ranging method, an ultrasonic ranging method or a phase-based method) may be operated with the image pickup device 32 to achieve the auto-focusing efficacy.
- FIG. 6 is a flowchart illustrating a method for determining the planting ball number of a camera module according to an embodiment of the present invention. Please refer to FIGS. 3 and 6 .
- the substrate 21 is placed on the machine 30 .
- the step S 1 at least four specified contact pads are focused by the image pickup device 32 .
- the four specified contact pads P 1 , P 2 , P 3 and P 4 are focused by the image pickup device 32 .
- a first specified contact pad distance d 1 between the specified contact pads P 1 and the image pickup device 32 , a second specified contact pad distance d 2 between the specified contact pads P 2 and the image pickup device 32 , a third specified contact pad distance d 3 between the specified contact pads P 3 and the image pickup device 32 and a fourth specified contact pad distance d 4 between the specified contact pads P 4 and the image pickup device 32 are acquired.
- these four specified contact pad distance d 1 , d 2 , d 3 and d 4 are averaged to acquire an average contact pad distance d p .
- the average contact pad distance d p denotes the average distance from the image pickup device 32 to the contact pads P n of the substrate 21 .
- the average contact pad contact pad distance d p is stored in the memory 322 .
- the four specified contact pads P 1 , P 2 , P 3 and P 4 are respectively located at four predetermined coordinate positions, especially beside the four corners of the substrate 21 .
- the number of the specified contact pads is presented herein for purpose of illustration and description only. That is, the number of the specified contact pads may be varied according to the practical requirements.
- the midpoints M a , M b , M c and M d of the four rims 211 a , 211 b , 211 c and 211 d of the opening 211 of the substrate 21 are successively focused by the image pickup device 32 . Consequently, a first opening distance d a between the midpoint M a and the image pickup device 32 , a second opening distance d b between the midpoint M b and the image pickup device 32 , a third opening distance d c between the midpoint M c and the image pickup device 32 and a fourth opening distance d d between the midpoint M d and the image pickup device 32 are acquired.
- the smallest opening distance among the four opening distances d a , d b , d c and d d is acquired.
- the smallest opening distance denotes the distance from the most upturned rim of the opening 211 of the substrate 21 to the image pickup device 32 .
- the smallest opening distance is d m .
- the smallest opening distance d m is stored in the memory 322 .
- the midpoints M a , M b , M c and M d are respectively located at four midpoint coordinate positions of the four rims 211 a , 211 b , 211 c and 211 d.
- FIG. 7 schematically illustrates the distance from a contact pad P x to the image pickup device. If the actual contact pad distance d x of a contact pad P x of the plural contact pads P n is greater than the average contact pad distance d p , it means that the distance from the contact pad P x to the image pickup device 32 is farther (see FIG. 7 ). That is, the contact pad P x is at a level lower than most contact pads of the substrate 21 .
- the step S 5 is performed to calculate a first difference value A between the actual contact pad distance d x and the smallest opening distance d m and divide the first difference value A by the ball height h to acquire the planting ball number for the contact pad P x corresponding to the actual contact pad distance d x . Since the planting ball number is sufficient to prevent the most upturned rim of the opening 211 of the substrate 21 from being contacted with the chip 22 , the possibility of forming the most upturned rim as a fulcrum is minimized. As a consequence, the adhesion stability between the substrate 21 and the chip 22 is largely enhanced.
- FIG. 8 schematically illustrates the distance from a contact pad P y to the image pickup device. If the actual contact pad distance d y of another contact pad P y of the plural contact pads P n is smaller than or equal to the average contact pad distance d p , it means that the distance from the contact pad P y to the image pickup device 32 is not greater than the average contact pad distance d p (see FIG. 8 ).
- step S 6 is performed to calculate a second difference value B between the average contact pad distance d p and the smallest opening distance d m and divide the second difference value B by the ball height h to acquire the planting ball number for the contact pad P y corresponding to the actual contact pad distance d y .
- the method of the present invention is used for determining the planting ball number of a camera module. Firstly, an image pickup device is used to detect an average contact pad distance of the distances from four specified contact pads to the image pickup device. Then, a smallest opening distance among four opening distances from the four rims to the image pickup device is acquired. Then, an actual contact pad distance from each contact pad to the image pickup device is acquired. On the basis of the average contact pad distance, the method further comprises a step of successively judging whether the actual contact pad distance is greater than the average contact pad distance. Then, the planting ball number for the contact pad corresponding to the actual contact pad distance is calculated. In such way, since the overall planting ball number is reduced, the packaging cost of the camera module is decreased. Moreover, since the heights of the contact pads of the substrate are more uniform, the possibility of resulting in skew of the chip during the chip and the substrate are laminated together will be minimized.
Abstract
Description
- The present invention relates to a method for determining the planting ball number, and more particularly to a method for determining the planting ball number of a camera module.
-
FIG. 1 schematically illustrates a conventional camera module. As shown inFIG. 1 , thecamera module 10 is assembled by a flip-chip packaging technology. Thecamera module 10 comprises asubstrate 11 and achip 12. Thesubstrate 11 has acontact pad 111 and anopening 112. Thechip 12 has asensing region 121 and aconnection region 122. Aconductive bump 13 is disposed on theconnection region 122. Through theconductive bump 13, thecontact pad 111 and theconnection region 122 are electrically connected with each other, and thesubstrate 11 and thechip 12 are combined together. - Please refer to
FIG. 1 again. Thecontact pad 111 is disposed around theopening 112 and aligned with theconnection region 122. Theopening 112 is formed by using a hole-breaking component (not shown) to punch thesubstrate 11. However, after the hole-breaking component is withdrawn from thesubstrate 11, the edge of theopening 112 is readily subject to deformation in response to the stress. Under this circumstance, anupturned edge 113 is created at an edge of the opening 112. - During the
substrate 11 and thechip 12 are laminated together by the flip-chip packaging technology, theupturned edge 113 may result in some drawbacks. For example, since theupturned edge 113 is protruded upwardly, the gap distance between thesubstrate 11 and thechip 12 is increased. Moreover, since the contacting point between theupturned edge 113 and thechip 12 acts like a fulcrum, a torque is readily generated to cause damage of theconductive bump 13. Under this circumstance, the adhesion instability between thesubstrate 11 and thechip 12 is largely increased. -
FIG. 2 schematically illustrates another conventional camera module. For eliminating the adverse effect of the height of theupturned edge 113, a plurality ofconductive bumps 13 are placed on thesame connection region 122. In such way, the possibility of allowing the contacting point between theupturned edge 113 and thechip 12 to be formed as a fulcrum will be minimized. However, since the heights of thecontact pads 111 corresponding todifferent connection regions 122 are not always identical, some drawbacks occur. For example, if the same number ofconductive bumps 13 are placed on all of theconnection regions 122, unnecessary packaging cost is increased. In addition, the uneven heights of thecontact pads 111 may result in skew of thechip 12. - The present invention relates to a method for determining the planting ball number of a camera module, thereby enhancing the quality of packaging the camera module.
- In accordance with an aspect of the present invention, there is provided a method for determining a planting ball number of a camera module. The camera module includes a chip and a substrate. The substrate has an opening with four rims. The chip is fixed on a plurality of contact pads of the substrate through a plurality of planting balls. Each of the planting balls has a ball height. The method is configured for determining a number of planting balls on each contact pad and includes the following steps. In the step (A), an image pickup device is allowed to focus on at least four specified contact pads of the substrate to acquire four specified contact pad distances from the at least four specified contact pads to the image pickup device, and the four specified contact pad distances are averaged to acquire an average contact pad distance. In the step (B), the image pickup device is allowed to focus on the four rims of the opening of the substrate to acquire four opening distances from the four rims to the image pickup device, and a smallest opening distance among the four opening distances is acquired. In the step (C), the image pickup device is allowed to focus on each contact pads of the substrate to acquire an actual contact pad distance from each contact pad to the image pickup device, thereby obtaining a plurality of actual contact pad distances. Then, the step (D) is performed to successively judge whether the actual contact pad distance is greater than the average contact pad distance. If the actual contact pad distance is greater than the average contact pad distance, a first difference value between the actual contact pad distance and the smallest opening distance is calculated, and the first difference value is divided by the ball height to acquire the planting ball number for the contact pad corresponding to the actual contact pad distance. Whereas, if the actual contact pad distance is not greater than the average contact pad distance, a second difference value between the average contact pad distance and the smallest opening distance is calculated, and the second difference value is divided by the ball height to acquire the planting ball number for the contact pad corresponding to the actual contact pad distance.
- In an embodiment, the at least four specified contact pads are located at four corner of the substrate, respectively.
- In an embodiment, the at least four specified contact pads are located at four predetermined coordinate positions, respectively.
- In an embodiment, in the step (B), the image pickup device focuses on respective midpoint coordinate positions of the four rims, wherein each of the midpoint coordinate position is located at a midpoint of the corresponding rim.
- In an embodiment, the image pickup device includes a contrast autofocus unit.
- The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
-
FIG. 1 schematically illustrates a conventional camera module; -
FIG. 2 schematically illustrates another conventional camera module; -
FIG. 3 schematically illustrates a camera module according to an embodiment of the present invention; -
FIG. 4 schematically illustrates a machine for determining the planting ball number; -
FIG. 5 schematically illustrates the image pickup device of the machine as shown inFIG. 4 ; -
FIG. 6 is a flowchart illustrating a method for determining the planting ball number of a camera module according to an embodiment of the present invention; -
FIG. 7 schematically illustrates the distance from a contact pad Px to the image pickup device; and -
FIG. 8 schematically illustrates the distance from a contact pad Py to the image pickup device. -
FIG. 3 schematically illustrates a camera module according to an embodiment of the present invention. As shown inFIG. 3 , thecamera module 20 comprises asubstrate 21 and achip 22. Thesubstrate 21 has anopening 211 and a plurality of contact pads Pn, wherein n=1˜n, and n is a positive integer. The opening 211 has fourrims planting ball 23, which is made of conductive metallic material. Through theplanting ball 23, thesubstrate 21 and thechip 22 are electrically connected with each other and combined together. Theplanting ball 23 has a ball high h. - A method for determining the planting ball number of the camera module will be illustrated in more details as follows.
- Please refer to
FIG. 4 , which schematically illustrates a machine for determining the planting ball number. As shown inFIG. 4 , themachine 30 comprises aplatform 31 and animage pickup device 32. Theplatform 31 is used for supporting thesubstrate 21. Theimage pickup device 32 is vertically movable relative to theplatform 31 in a reciprocating manner for capturing a plurality of images of thesubstrate 21. - Please refer to
FIG. 5 , which schematically illustrates the image pickup device of the machine as shown inFIG. 4 . In this embodiment, theimage pickup device 32 comprises a contrast autofocus (contrast AF)unit 321, amemory 322 and aprocessor 323. Thecontrast autofocus unit 321 is used for judging the sharpness of the images, thereby achieving an auto-focusing efficacy. Moreover, the distance between the substrate and theimage pickup device 32 is estimated according to the sharpest image. The various distance data are stored in thememory 322. The contrast method employed by thecontrast autofocus unit 321 is a well-known auto-focusing technique, and is not redundantly described herein. The contrast method is presented herein for purpose of illustration and description only. In other words, any other auto-focusing technique (e.g. an infrared ranging method, an ultrasonic ranging method or a phase-based method) may be operated with theimage pickup device 32 to achieve the auto-focusing efficacy. -
FIG. 6 is a flowchart illustrating a method for determining the planting ball number of a camera module according to an embodiment of the present invention. Please refer toFIGS. 3 and 6 . Firstly, thesubstrate 21 is placed on themachine 30. In the step S1, at least four specified contact pads are focused by theimage pickup device 32. In this embodiment, the four specified contact pads P1, P2, P3 and P4 are focused by theimage pickup device 32. Consequently, a first specified contact pad distance d1 between the specified contact pads P1 and theimage pickup device 32, a second specified contact pad distance d2 between the specified contact pads P2 and theimage pickup device 32, a third specified contact pad distance d3 between the specified contact pads P3 and theimage pickup device 32 and a fourth specified contact pad distance d4 between the specified contact pads P4 and theimage pickup device 32 are acquired. Then, these four specified contact pad distance d1, d2, d3 and d4 are averaged to acquire an average contact pad distance dp. The average contact pad distance dp denotes the average distance from theimage pickup device 32 to the contact pads Pn of thesubstrate 21. After calculation, the average contact pad contact pad distance dp is stored in thememory 322. - In this embodiment, the four specified contact pads P1, P2, P3 and P4 are respectively located at four predetermined coordinate positions, especially beside the four corners of the
substrate 21. The number of the specified contact pads is presented herein for purpose of illustration and description only. That is, the number of the specified contact pads may be varied according to the practical requirements. - Then, in the step S2, the midpoints Ma, Mb, Mc and Md of the four
rims opening 211 of thesubstrate 21 are successively focused by theimage pickup device 32. Consequently, a first opening distance da between the midpoint Ma and theimage pickup device 32, a second opening distance db between the midpoint Mb and theimage pickup device 32, a third opening distance dc between the midpoint Mc and theimage pickup device 32 and a fourth opening distance dd between the midpoint Md and theimage pickup device 32 are acquired. Then, the smallest opening distance among the four opening distances da, db, dc and dd is acquired. The smallest opening distance denotes the distance from the most upturned rim of theopening 211 of thesubstrate 21 to theimage pickup device 32. As shown inFIG. 3 , the smallest opening distance is dm. After calculation, the smallest opening distance dm is stored in thememory 322. - In this embodiment, the midpoints Ma, Mb, Mc and Md are respectively located at four midpoint coordinate positions of the four
rims - Then, as shown in the step S3, all contact pads Pn of the
substrate 21 are successively focused by theimage pickup device 32. Consequently, an actual contact pad distance dn from each contact pad Pn to theimage pickup device 32 is acquired, wherein n=1˜n, and n is a positive integer. Then, the actual contact pad distances dn of all contact pads Pn are stored in thememory 322. - Then, in the step S4, the
processor 323 of theimage pickup device 32 successively judges whether each actual contact pad distance dn is greater than the average contact pad distance dp.FIG. 7 schematically illustrates the distance from a contact pad Px to the image pickup device. If the actual contact pad distance dx of a contact pad Px of the plural contact pads Pn is greater than the average contact pad distance dp, it means that the distance from the contact pad Px to theimage pickup device 32 is farther (seeFIG. 7 ). That is, the contact pad Px is at a level lower than most contact pads of thesubstrate 21. Then, the step S5 is performed to calculate a first difference value A between the actual contact pad distance dx and the smallest opening distance dm and divide the first difference value A by the ball height h to acquire the planting ball number for the contact pad Px corresponding to the actual contact pad distance dx. Since the planting ball number is sufficient to prevent the most upturned rim of theopening 211 of thesubstrate 21 from being contacted with thechip 22, the possibility of forming the most upturned rim as a fulcrum is minimized. As a consequence, the adhesion stability between thesubstrate 21 and thechip 22 is largely enhanced. - Please refer to the step S4 of
FIG. 6 again. Theprocessor 323 of theimage pickup device 32 successively judges whether each actual contact pad distance dn is greater than the average contact pad distance dp.FIG. 8 schematically illustrates the distance from a contact pad Py to the image pickup device. If the actual contact pad distance dy of another contact pad Py of the plural contact pads Pn is smaller than or equal to the average contact pad distance dp, it means that the distance from the contact pad Py to theimage pickup device 32 is not greater than the average contact pad distance dp (seeFIG. 8 ). Then, the step S6 is performed to calculate a second difference value B between the average contact pad distance dp and the smallest opening distance dm and divide the second difference value B by the ball height h to acquire the planting ball number for the contact pad Py corresponding to the actual contact pad distance dy. - From the above description, the method of the present invention is used for determining the planting ball number of a camera module. Firstly, an image pickup device is used to detect an average contact pad distance of the distances from four specified contact pads to the image pickup device. Then, a smallest opening distance among four opening distances from the four rims to the image pickup device is acquired. Then, an actual contact pad distance from each contact pad to the image pickup device is acquired. On the basis of the average contact pad distance, the method further comprises a step of successively judging whether the actual contact pad distance is greater than the average contact pad distance. Then, the planting ball number for the contact pad corresponding to the actual contact pad distance is calculated. In such way, since the overall planting ball number is reduced, the packaging cost of the camera module is decreased. Moreover, since the heights of the contact pads of the substrate are more uniform, the possibility of resulting in skew of the chip during the chip and the substrate are laminated together will be minimized.
- While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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TW100125114A TWI500317B (en) | 2011-07-15 | 2011-07-15 | Method for determining amount of planting ball of camera module |
TW100125114A | 2011-07-15 | ||
TW100125114 | 2011-07-15 |
Publications (2)
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US20130016334A1 true US20130016334A1 (en) | 2013-01-17 |
US8368872B1 US8368872B1 (en) | 2013-02-05 |
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US13/279,496 Expired - Fee Related US8368872B1 (en) | 2011-07-15 | 2011-10-24 | Method for determining planting ball number of camera module |
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EP0638801B1 (en) * | 1993-08-12 | 1998-12-23 | International Business Machines Corporation | Method of inspecting the array of balls of an integrated circuit module |
JP3235008B2 (en) * | 1994-07-16 | 2001-12-04 | 株式会社新川 | Method and apparatus for detecting ball in wire bonding section |
TWI298952B (en) * | 2005-11-11 | 2008-07-11 | Advanced Semiconductor Eng | Packaging structure of image-sensing chip |
TWI368435B (en) * | 2006-12-01 | 2012-07-11 | Altus Technology Inc | Image sensor package and image sensor module using the package |
TW200843048A (en) * | 2007-04-20 | 2008-11-01 | Hon Hai Prec Ind Co Ltd | Image sensor package structure |
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2011
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US8368872B1 (en) | 2013-02-05 |
TWI500317B (en) | 2015-09-11 |
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