US20120241136A1 - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
US20120241136A1
US20120241136A1 US13/301,862 US201113301862A US2012241136A1 US 20120241136 A1 US20120241136 A1 US 20120241136A1 US 201113301862 A US201113301862 A US 201113301862A US 2012241136 A1 US2012241136 A1 US 2012241136A1
Authority
US
United States
Prior art keywords
fins
pieces
cooling device
base
adjacent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/301,862
Inventor
Xiang-Kun Zeng
Zhi-Jiang Yao
Li-Fu Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Assigned to HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD. reassignment HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: XU, LI-FU, YAO, ZHI-JIANG, ZENG, Xiang-kun
Publication of US20120241136A1 publication Critical patent/US20120241136A1/en
Abandoned legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling device for cooling an electronic component is disclosed. The cooling device comprises a cooler comprising a base, a plurality of first fins and a plurality of second fins. The plurality of first fins extends substantially perpendicular from the base, and the plurality of second fins are secured to the base. Each of the plurality of second fins is between adjacent two of the plurality of first fins. Each of the plurality of second fins comprises a plurality of body portions and a plurality of connecting pieces. Each of the plurality of connecting pieces connects adjacent two of the plurality of body portions.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a cooling device.
  • 2. Description of Related Art
  • A cooling device is usually used for cooling an electronic component, such as a CPU. Referring to FIG. 1, a conventional cooling device generally comprises a cooler 80 and a fan 90. The cooler 80 may comprises a base 81 and a plurality of fins 83 located on a top surface of the base 81. The plurality of fins 83 may be substantially perpendicular to the base 81. An air channel 85 may be defined by each two adjacent fins 83. A bottom surface of the base 81 may abut against an electronic component 71 secured to a circuit board 70. The base 81 may transfer heat generated by the electronic component to the plurality of fins 83. The fan 90 may be secured to a side of the cooler 80. The fan 90 guides air to flow via the air channel 85 and cools the plurality of fins 83. However, the cooling surface area of the fins 30 may be small, resulting a low cooling efficiency. Therefore, an improved cooling device may be desire.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of a cooling device of a prior art.
  • FIG. 2 is an exploded, isometric view of one embodiment of a cooling device of the present disclosure.
  • FIG. 3 is an enlarged view of the portion III of FIG. 2.
  • FIG. 4 is an isometric assembled view of the cooling device of FIG. 2.
  • DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • Referring to FIGS. 2-4, a cooling device in accordance with an embodiment comprises a cooler 10 and a fan 30.
  • The cooler 10 may be used to cool an electronic component 60. The electronic component 60 is secured to a circuit board 50. The cooler 10 comprises a base 11, a plurality of first fins 13, and a plurality of second fins 15. The plurality of first fins 13 extend from a top surface of the base 11, and are substantially perpendicular to the top surface or a bottom surface of the base 11. The top surface is substantially parallel to the bottom surface. Each of the plurality of second fins 15 comprises a plurality of body portions 150, and a plurality of connecting pieces 155. Each of the plurality of body portions 150 comprises a first piece 151 and two second pieces 153. The first pieces 151 are substantially parallel to each other. The two second pieces 153 are substantially parallel to each other and perpendicular to the first pieces 151. Each of the plurality of connecting pieces 155 is connected to adjacent two of the two adjacent second pieces 153. In one embodiment, each of the plurality of connecting pieces 155 is substantially parallel to the first pieces 151, and a distance between the two second pieces 153 of one of the plurality of body portions 150 is substantially equal to a distance between adjacent two of the two second pieces 153 of adjacent two of the plurality of body portions 150. An air channel 156 is defined by each adjacent two of the two second pieces 153.
  • In assembly, each of the plurality of second fins 15 is secured to each adjacent two of the plurality of first fins 13. One of the two second piece 153 abuts against the top surface of the base 11. The two second pieces 153 are substantially parallel to the base 11. An extending direction of the air channel 156 is substantially perpendicular to the plurality of first fins 13. In one embodiment, each of the first piece 151 and each of the plurality of connecting pieces 155 abut against each of the plurality of first fins 13. The fan 30 is secured to the cooler 10 on one side of the air channel 156. The cooler 10 is secured to the circuit board 50, and a bottom surface of the base 11 abuts against the electronic component 60.
  • In use, heat generated from the electronic component 60 is transferred to the plurality of first fins 13 and the plurality of second fins 15 through the base 11. The fan 30 guides air flow to flow via the air channel 156 to cool the cooler 10.
  • In the above described cooling device, the plurality second fins 15 increase cooling surface area of the cooling device, so the heat can be dissipated quickly. Thus, the cooling efficiency is improved.
  • It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and the arrangement of parts within the principles of the disclosure, to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (16)

1. A cooling device comprising:
a cooler comprising a base, a plurality of first fins and a plurality of second fins;
wherein the plurality of first fins extends substantially perpendicular from the base, and the plurality of second fins are secured to the base; and each of the plurality of second fins is between adjacent two of the plurality of first fins; each of the plurality of second fins comprises a plurality of body portions and a plurality of connecting pieces, each of the plurality of connecting pieces connects adjacent two of the plurality of body portions.
2. The cooling device of claim 1, wherein each of the plurality of body portions comprises two second pieces, and a first piece connected to each of the two second pieces, and each of the plurality of connecting pieces connects adjacent two of the two second pieces of adjacent two of the plurality of body portions.
3. The cooling device of claim 2, wherein the first piece is substantially perpendicular to each of the two second pieces, and parallel to each of the plurality of plurality of connecting pieces.
4. The cooling device of claim 2, wherein one of the two second pieces abuts against the base, and is substantially parallel to the base.
5. The cooling device of claim 2, wherein the two second pieces define an air channel for air flow flowing through, and the air channel has an extending direction substantially perpendicular to each of the plurality of first fins.
6. The cooling device of claim 2, wherein a distance between the two second pieces of each of the plurality of body portions is substantially equal to a distance between the adjacent two of the two second pieces of adjacent two of the plurality of body portions.
7. The cooling device of claim 2, wherein each of the first piece and each of the plurality of connecting pieces abut against adjacent two of the plurality of first fins.
8. The cooling device of claim 1, wherein the plurality of first fins are integrated with the base.
9. A cooling device comprising:
a fan; and
a cooler comprising a base, a plurality of first fins and a plurality of second fins;
wherein the plurality of first fins extends substantially perpendicular from the base; the plurality of second fins are secured to the base; each of the plurality of second fins is between adjacent two of the plurality of first fins; each of the plurality of second fins comprises a plurality of body portions and a plurality of connecting pieces, each of the plurality of connecting pieces connects adjacent two of the plurality of body portions; each of the plurality of body portions comprises two second pieces, and a first piece connected to each of the two second pieces, the two second pieces defines an air channel; the fan is secured to a side of the air channel, and the fan guides air flow to flow through the air channel.
10. The cooling device of claim 9, wherein each of the plurality of connecting pieces connects adjacent two of the two second pieces of adjacent two of the plurality of body portions.
11. The cooling device of claim 9, wherein the first piece is substantially perpendicular to each of the two second pieces, and substantially parallel to each of the plurality of connecting pieces.
12. The cooling device of claim 9, wherein one of the two second pieces abuts against the base, and is substantially parallel to the base.
13. The cooling device of claim 9, wherein the air channel has an extending direction substantially perpendicular to each of the plurality of first fins.
14. The cooling device of claim 9, wherein a distance between the two second pieces of each of the plurality of body portions is substantially equal to a distance between the adjacent two of the two second pieces of adjacent two of the plurality of body portions.
15. The cooling device of claim 9, wherein each of the first piece and each of the plurality of connecting pieces abut against adjacent two of the plurality of first fins.
16. The cooling device of claim 9, wherein the plurality of first fins are integrated with the base.
US13/301,862 2011-03-21 2011-11-22 Cooling device Abandoned US20120241136A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110067217.0 2011-03-21
CN2011100672170A CN102692979A (en) 2011-03-21 2011-03-21 Cooling device

Publications (1)

Publication Number Publication Date
US20120241136A1 true US20120241136A1 (en) 2012-09-27

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US13/301,862 Abandoned US20120241136A1 (en) 2011-03-21 2011-11-22 Cooling device

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US (1) US20120241136A1 (en)
CN (1) CN102692979A (en)
TW (1) TW201239594A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150245536A1 (en) * 2014-02-21 2015-08-27 Lenovo (Beijing) Co., Ltd. Heat Dissipating Device And Electronic Apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103476229A (en) * 2013-09-16 2013-12-25 南京九致信息科技有限公司 Heat radiating device
CN208445912U (en) * 2018-07-02 2019-01-29 深圳市大疆创新科技有限公司 Radiating subassembly and remote controler

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270604A (en) * 1978-11-17 1981-06-02 Sumitomo Precision Products Co. Ltd. Heat sink
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US5706169A (en) * 1996-05-15 1998-01-06 Yeh; Robin Cooling apparatus for a computer central processing unit
US20020029876A1 (en) * 2000-07-10 2002-03-14 Thermal Form & Function Llc Corrugated matrix heat sink for cooling electronic components
US6575229B1 (en) * 2002-08-28 2003-06-10 Tandis, Inc. Heat sink having folded fin heat exchanger core
US20040011511A1 (en) * 2002-07-18 2004-01-22 Debashis Ghosh Thermosiphon for electronics cooling with nonuniform airflow
US7548428B2 (en) * 2007-07-27 2009-06-16 Hewlett-Packard Development Company, L.P. Computer device heat dissipation system
US7619888B2 (en) * 2006-12-01 2009-11-17 Delta Electronics, Inc. Flat heat column and heat dissipating apparatus thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270604A (en) * 1978-11-17 1981-06-02 Sumitomo Precision Products Co. Ltd. Heat sink
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US5706169A (en) * 1996-05-15 1998-01-06 Yeh; Robin Cooling apparatus for a computer central processing unit
US20020029876A1 (en) * 2000-07-10 2002-03-14 Thermal Form & Function Llc Corrugated matrix heat sink for cooling electronic components
US20040011511A1 (en) * 2002-07-18 2004-01-22 Debashis Ghosh Thermosiphon for electronics cooling with nonuniform airflow
US6575229B1 (en) * 2002-08-28 2003-06-10 Tandis, Inc. Heat sink having folded fin heat exchanger core
US7619888B2 (en) * 2006-12-01 2009-11-17 Delta Electronics, Inc. Flat heat column and heat dissipating apparatus thereof
US7548428B2 (en) * 2007-07-27 2009-06-16 Hewlett-Packard Development Company, L.P. Computer device heat dissipation system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150245536A1 (en) * 2014-02-21 2015-08-27 Lenovo (Beijing) Co., Ltd. Heat Dissipating Device And Electronic Apparatus
US9532485B2 (en) * 2014-02-21 2016-12-27 Lenovo (Beijing) Co., Ltd. Heat dissipating device and electronic apparatus
DE102014113888B4 (en) 2014-02-21 2023-02-16 Lenovo (Beijing) Co., Ltd. Heat dissipation device and electronic device
DE102014113888B8 (en) 2014-02-21 2023-04-06 Lenovo (Beijing) Co., Ltd. Heat dissipation device and electronic device

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Publication number Publication date
TW201239594A (en) 2012-10-01
CN102692979A (en) 2012-09-26

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZENG, XIANG-KUN;YAO, ZHI-JIANG;XU, LI-FU;REEL/FRAME:027266/0173

Effective date: 20111118

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZENG, XIANG-KUN;YAO, ZHI-JIANG;XU, LI-FU;REEL/FRAME:027266/0173

Effective date: 20111118

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION