US20120241136A1 - Cooling device - Google Patents
Cooling device Download PDFInfo
- Publication number
- US20120241136A1 US20120241136A1 US13/301,862 US201113301862A US2012241136A1 US 20120241136 A1 US20120241136 A1 US 20120241136A1 US 201113301862 A US201113301862 A US 201113301862A US 2012241136 A1 US2012241136 A1 US 2012241136A1
- Authority
- US
- United States
- Prior art keywords
- fins
- pieces
- cooling device
- base
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
- 1. Technical Field
- The present disclosure relates to a cooling device.
- 2. Description of Related Art
- A cooling device is usually used for cooling an electronic component, such as a CPU. Referring to
FIG. 1 , a conventional cooling device generally comprises acooler 80 and afan 90. Thecooler 80 may comprises abase 81 and a plurality offins 83 located on a top surface of thebase 81. The plurality offins 83 may be substantially perpendicular to thebase 81. Anair channel 85 may be defined by each twoadjacent fins 83. A bottom surface of thebase 81 may abut against anelectronic component 71 secured to acircuit board 70. Thebase 81 may transfer heat generated by the electronic component to the plurality offins 83. Thefan 90 may be secured to a side of the cooler 80. Thefan 90 guides air to flow via theair channel 85 and cools the plurality offins 83. However, the cooling surface area of thefins 30 may be small, resulting a low cooling efficiency. Therefore, an improved cooling device may be desire. - Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of a cooling device of a prior art. -
FIG. 2 is an exploded, isometric view of one embodiment of a cooling device of the present disclosure. -
FIG. 3 is an enlarged view of the portion III ofFIG. 2 . -
FIG. 4 is an isometric assembled view of the cooling device ofFIG. 2 . - The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to
FIGS. 2-4 , a cooling device in accordance with an embodiment comprises acooler 10 and afan 30. - The
cooler 10 may be used to cool anelectronic component 60. Theelectronic component 60 is secured to acircuit board 50. Thecooler 10 comprises abase 11, a plurality offirst fins 13, and a plurality ofsecond fins 15. The plurality offirst fins 13 extend from a top surface of thebase 11, and are substantially perpendicular to the top surface or a bottom surface of thebase 11. The top surface is substantially parallel to the bottom surface. Each of the plurality ofsecond fins 15 comprises a plurality ofbody portions 150, and a plurality of connectingpieces 155. Each of the plurality ofbody portions 150 comprises afirst piece 151 and twosecond pieces 153. Thefirst pieces 151 are substantially parallel to each other. The twosecond pieces 153 are substantially parallel to each other and perpendicular to thefirst pieces 151. Each of the plurality of connectingpieces 155 is connected to adjacent two of the two adjacentsecond pieces 153. In one embodiment, each of the plurality of connectingpieces 155 is substantially parallel to thefirst pieces 151, and a distance between the twosecond pieces 153 of one of the plurality ofbody portions 150 is substantially equal to a distance between adjacent two of the twosecond pieces 153 of adjacent two of the plurality ofbody portions 150. Anair channel 156 is defined by each adjacent two of the twosecond pieces 153. - In assembly, each of the plurality of
second fins 15 is secured to each adjacent two of the plurality offirst fins 13. One of the twosecond piece 153 abuts against the top surface of thebase 11. The twosecond pieces 153 are substantially parallel to thebase 11. An extending direction of theair channel 156 is substantially perpendicular to the plurality offirst fins 13. In one embodiment, each of thefirst piece 151 and each of the plurality of connectingpieces 155 abut against each of the plurality offirst fins 13. Thefan 30 is secured to the cooler 10 on one side of theair channel 156. Thecooler 10 is secured to thecircuit board 50, and a bottom surface of thebase 11 abuts against theelectronic component 60. - In use, heat generated from the
electronic component 60 is transferred to the plurality offirst fins 13 and the plurality ofsecond fins 15 through thebase 11. Thefan 30 guides air flow to flow via theair channel 156 to cool the cooler 10. - In the above described cooling device, the plurality second fins 15 increase cooling surface area of the cooling device, so the heat can be dissipated quickly. Thus, the cooling efficiency is improved.
- It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and the arrangement of parts within the principles of the disclosure, to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110067217.0 | 2011-03-21 | ||
CN2011100672170A CN102692979A (en) | 2011-03-21 | 2011-03-21 | Cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120241136A1 true US20120241136A1 (en) | 2012-09-27 |
Family
ID=46858511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/301,862 Abandoned US20120241136A1 (en) | 2011-03-21 | 2011-11-22 | Cooling device |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120241136A1 (en) |
CN (1) | CN102692979A (en) |
TW (1) | TW201239594A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150245536A1 (en) * | 2014-02-21 | 2015-08-27 | Lenovo (Beijing) Co., Ltd. | Heat Dissipating Device And Electronic Apparatus |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103476229A (en) * | 2013-09-16 | 2013-12-25 | 南京九致信息科技有限公司 | Heat radiating device |
CN208445912U (en) * | 2018-07-02 | 2019-01-29 | 深圳市大疆创新科技有限公司 | Radiating subassembly and remote controler |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4270604A (en) * | 1978-11-17 | 1981-06-02 | Sumitomo Precision Products Co. Ltd. | Heat sink |
US4884631A (en) * | 1988-03-17 | 1989-12-05 | California Institute Of Technology | Forced air heat sink apparatus |
US5706169A (en) * | 1996-05-15 | 1998-01-06 | Yeh; Robin | Cooling apparatus for a computer central processing unit |
US20020029876A1 (en) * | 2000-07-10 | 2002-03-14 | Thermal Form & Function Llc | Corrugated matrix heat sink for cooling electronic components |
US6575229B1 (en) * | 2002-08-28 | 2003-06-10 | Tandis, Inc. | Heat sink having folded fin heat exchanger core |
US20040011511A1 (en) * | 2002-07-18 | 2004-01-22 | Debashis Ghosh | Thermosiphon for electronics cooling with nonuniform airflow |
US7548428B2 (en) * | 2007-07-27 | 2009-06-16 | Hewlett-Packard Development Company, L.P. | Computer device heat dissipation system |
US7619888B2 (en) * | 2006-12-01 | 2009-11-17 | Delta Electronics, Inc. | Flat heat column and heat dissipating apparatus thereof |
-
2011
- 2011-03-21 CN CN2011100672170A patent/CN102692979A/en active Pending
- 2011-03-23 TW TW100109797A patent/TW201239594A/en unknown
- 2011-11-22 US US13/301,862 patent/US20120241136A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4270604A (en) * | 1978-11-17 | 1981-06-02 | Sumitomo Precision Products Co. Ltd. | Heat sink |
US4884631A (en) * | 1988-03-17 | 1989-12-05 | California Institute Of Technology | Forced air heat sink apparatus |
US5706169A (en) * | 1996-05-15 | 1998-01-06 | Yeh; Robin | Cooling apparatus for a computer central processing unit |
US20020029876A1 (en) * | 2000-07-10 | 2002-03-14 | Thermal Form & Function Llc | Corrugated matrix heat sink for cooling electronic components |
US20040011511A1 (en) * | 2002-07-18 | 2004-01-22 | Debashis Ghosh | Thermosiphon for electronics cooling with nonuniform airflow |
US6575229B1 (en) * | 2002-08-28 | 2003-06-10 | Tandis, Inc. | Heat sink having folded fin heat exchanger core |
US7619888B2 (en) * | 2006-12-01 | 2009-11-17 | Delta Electronics, Inc. | Flat heat column and heat dissipating apparatus thereof |
US7548428B2 (en) * | 2007-07-27 | 2009-06-16 | Hewlett-Packard Development Company, L.P. | Computer device heat dissipation system |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150245536A1 (en) * | 2014-02-21 | 2015-08-27 | Lenovo (Beijing) Co., Ltd. | Heat Dissipating Device And Electronic Apparatus |
US9532485B2 (en) * | 2014-02-21 | 2016-12-27 | Lenovo (Beijing) Co., Ltd. | Heat dissipating device and electronic apparatus |
DE102014113888B4 (en) | 2014-02-21 | 2023-02-16 | Lenovo (Beijing) Co., Ltd. | Heat dissipation device and electronic device |
DE102014113888B8 (en) | 2014-02-21 | 2023-04-06 | Lenovo (Beijing) Co., Ltd. | Heat dissipation device and electronic device |
Also Published As
Publication number | Publication date |
---|---|
TW201239594A (en) | 2012-10-01 |
CN102692979A (en) | 2012-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZENG, XIANG-KUN;YAO, ZHI-JIANG;XU, LI-FU;REEL/FRAME:027266/0173 Effective date: 20111118 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZENG, XIANG-KUN;YAO, ZHI-JIANG;XU, LI-FU;REEL/FRAME:027266/0173 Effective date: 20111118 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |