US20120152509A1

US20120152509A1 - Heat sink

Info

Publication number: US20120152509A1
Application number: US12/977,087
Authority: US
Inventors: Meng-Hsien Lin
Original assignee: Hon Hai Precision Industry Co Ltd
Current assignee: Hon Hai Precision Industry Co Ltd
Priority date: 2010-12-15
Filing date: 2010-12-23
Publication date: 2012-06-21
Also published as: TW201224386A

Abstract

A heat sink includes a substrate, a first heat dissipation body, and a second heat dissipation. The first heat dissipation body includes a first base plate attached to the substrate, and a number of first cooling fins extending from the first base plate. The second heat dissipation body includes a second base plate attached to tops of first cooling fins and a number of second cooling fins extending from the second base plate.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to a heat sink.
2. Description of Related Art
With the continuing development of electronic technology, central processing units (CPUs) generate more heat during operation than previously. The heat needs to be dissipated as quickly as possible. A common method for dissipating the heat is to use an aluminum extrusion heat sink and a fan. However, this type of heat sink has one layer only, and because of limitation in the technology, a largest height of cooling fins of this type of heat sink is about 90 millimeters, which is inconvenient to dissipate heat generated by the CPUs.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an isometric view of an exemplary embodiment of a heat sink.

FIG. 2 a front plan view of the heat sink of FIG. 1.

DETAILED DESCRIPTION

The present disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to FIGS. 1 and 2, an exemplary embodiment of a heat sink used to dissipate heat generated by a central processing unit is integrally made by aluminum extrusion. The heat includes a substrate 10, a first heat dissipation body 20, and a second heat dissipation body 30.
The first heat dissipation body 20 includes a substantially V-shaped first base plate 21 extending up from the substrate 10 and a plurality of first cooling fins 22 extending up from the first base plate 21. A plurality of second cooling fins 24 extends horizontally between opposite sides of the first base plate 21 of the first heat dissipation body 20 and the substrate 10.
The second heat dissipation body 30 includes a substantially V-shaped second base plate 32 attached to the tops of the first cooling fins 22 and a plurality of third cooling fins 34 extending up from the second base plate 32.
In this embodiment, the height of the first cooling fins 22 of the first heat dissipation body 20 adding to the height of the third cooling fins 34 of the second heat dissipation body 30 is higher than 90 millimeters, which is convenient to dissipate heat generated by the CPU.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the present disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat sink comprising:

a substrate;

a first heat dissipation body comprising a first base plate extending up from the substrate and a plurality of first cooling fins extending up from the first base plate; and

a second heat dissipation body comprising a second base plate attached to tops of the first cooling fins of the first heat dissipation body and a plurality of second cooling fins extending up from the second base plate.

2. The heat sink of claim 1, wherein the first base plate of the first heat dissipation body is substantially V-shaped.

3. The heat sink of claim 2, wherein a plurality of third cooling fins extends horizontally from opposite sides of the first base plate of the first heat dissipation.

4. The heat sink of claim 1, wherein the second base plate of the second heat dissipation body is substantially V-shaped.

5. The heat sink of claim 1, wherein the heat sink is integrally made by aluminum extrusion.