US20120145363A1 - Fan duct and heat dissipation device using the same - Google Patents

Fan duct and heat dissipation device using the same Download PDF

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Publication number
US20120145363A1
US20120145363A1 US12/981,426 US98142610A US2012145363A1 US 20120145363 A1 US20120145363 A1 US 20120145363A1 US 98142610 A US98142610 A US 98142610A US 2012145363 A1 US2012145363 A1 US 2012145363A1
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US
United States
Prior art keywords
fan duct
plate
side plates
airflow guiding
top plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/981,426
Inventor
Wen-Tang Peng
Guang-Yi Zhang
Xiao-Zheng Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, Xiao-zheng, PENG, WEN-TANG, ZHANG, GUANG-YI
Publication of US20120145363A1 publication Critical patent/US20120145363A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure relates to a fan duct capable of engaging with different heat sinks, and a heat dissipation device using the fan duct.
  • a typical heat dissipation device includes a heat sink thermally contacting an electronic device, and a fan disposed near the heat sink.
  • a fan duct is covered over the heat sink to guide airflow from the fan to the heat sink.
  • different sizes of heat sinks are needed. Different sizes of fan ducts need to be provided to match the different sizes of heat sinks, resulting in increased manufacturing costs.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 3 is an isometric, assembled view of a heat dissipation device in accordance with another embodiment of the disclosure.
  • a heat dissipation device in accordance with an embodiment of the disclosure is provided for cooling an electronic device 32 mounted on a circuit board 30 .
  • the heat dissipation device comprises a heat sink 10 , and a fan duct 20 covering the heat sink 10 .
  • the heat sink 10 includes a heat conducting plate 12 thermally contacting the electronic device 32 , a fin assembly 16 disposed on the heat conducting plate 12 , and four heat pipes 18 thermally connecting the heat conducting plate 12 and the fin assembly 16 .
  • the fin assembly 16 includes a plurality of fins 162 stacked together. Each fin 162 is made of metal such as aluminum, copper or an alloy thereof. The fins 162 are spaced from each other, and each two adjacent fins 162 form an airflow channel (not labeled) therebetween.
  • the fan duct 20 can be made of a material such as plastic, and includes a fan duct body 21 and an airflow guiding plate 23 .
  • the fan duct body 21 includes a top plate 22 , and two side plates 24 extending perpendicular downwardly from two opposite lateral sides of the top plate 22 . A distance between the two side plates 24 is substantially equal to a width of the heat sink 10 .
  • the heat sink 10 is located between the two side plates 24 .
  • a rectangular through hole 220 is defined in an end of the top plate 22 .
  • the heat sink 10 is mounted in the fan duct 20 away from the through hole 220 of the top plate 22 .
  • the airflow guiding plate 23 is mounted in the fan duct 20 near the through hole 220 of the top plate 22 .
  • the fan duct body 21 has an air inlet 25 near the through hole 220 for air to flow into the fan duct 20 , and an air outlet 26 away from the through hole 220 for airflow to exhaust from the fan duct 20 .
  • a pair of opposing pivot holes 240 are respectively defined in joints of the top plate 22 and the side plates 24 , respectively.
  • the pivot holes 240 are located between the through hole 220 and the air inlet 25 .
  • Four spaced circular positioning holes 242 are defined in each side plate 24 of the fan duct 20 near the heat sink 10 .
  • the four positioning holes 242 are arranged in each side plate 24 along an arc-shaped path. Each positioning hole 242 of one side plate 24 is aligned with a corresponding one of the positioning holes 242 of the other side plate 24 along a horizontal direction, to thereby form four pairs of positioning holes 242 corresponding to four different heights of heat sinks.
  • the airflow guiding plate 23 includes a rectangular body 232 located between the side plates 24 , a pivot 234 extending horizontally outwardly from an edge of one end of the body 232 , and two buckles 236 extending perpendicularly downwardly from edges of the other end of the body 232 .
  • a circular protrusion 237 protrudes outward from each buckle 236 .
  • the body 232 of the airflow guiding plate 23 has an area a little larger than the through hole 220 of the top plate 22 .
  • the pivot 234 of the airflow guiding plate 23 is pivotedly connected in the pivot holes 240 , so that the airflow guiding plate 23 can rotate around the pivot 234 in the fan duct 20 .
  • the protrusions 237 of the buckles 236 are buckled in the topmost pair of positioning holes 242 of the side plates 24 to fix the airflow guiding plate 23 on the fan duct body 21 of the fan duct 20 .
  • the body 232 of the airflow guiding plate 23 abuts a top of the heat sink 10 to guide airflow toward the heat sink 10 .
  • the airflow guiding plate 23 is rotated downwardly around the pivot 234 , and the protrusions 237 of the buckles 236 are buckled in another pair of positioning holes 242 in the side plates 24 .
  • the body 232 of the airflow guiding plate 23 abuts a top of the heat sink 10 a to guide airflow toward the heat sink 10 a.
  • the airflow guiding plate 23 can be adjusted to fix at different positions of the fan duct 20 , whereby the fan duct 20 can match different heat sinks of various heights. Accordingly, the cost of manufacturing different heat dissipation devices can be reduced.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A fan duct includes a fan duct body and an airflow guiding plate connecting with the fan duct body. The fan duct has an air inlet for airflow flowing into the fan duct, and an air outlet for airflow exhausting out of the fan duct. One end of the airflow guiding plate connects the fan duct body near the air inlet, and the other end of the airflow guiding plate can be fixed at different positions of the fan duct body.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to a fan duct capable of engaging with different heat sinks, and a heat dissipation device using the fan duct.
  • 2. Description of Related Art
  • A typical heat dissipation device includes a heat sink thermally contacting an electronic device, and a fan disposed near the heat sink. In order to improve the efficiency of utilization of airflow generated from the fan, a fan duct is covered over the heat sink to guide airflow from the fan to the heat sink. However, in order to match different electronic devices, different sizes of heat sinks are needed. Different sizes of fan ducts need to be provided to match the different sizes of heat sinks, resulting in increased manufacturing costs.
  • What is needed, therefore, is a fan duct and a heat dissipation device using the fan duct which can overcome the limitations described.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.
  • FIG. 3 is an isometric, assembled view of a heat dissipation device in accordance with another embodiment of the disclosure.
    •  DETAILED DESCRIPTION
  • Referring to FIG. 1, a heat dissipation device in accordance with an embodiment of the disclosure is provided for cooling an electronic device 32 mounted on a circuit board 30. The heat dissipation device comprises a heat sink 10, and a fan duct 20 covering the heat sink 10.
  • Also referring to FIG. 2, the heat sink 10 includes a heat conducting plate 12 thermally contacting the electronic device 32, a fin assembly 16 disposed on the heat conducting plate 12, and four heat pipes 18 thermally connecting the heat conducting plate 12 and the fin assembly 16. The fin assembly 16 includes a plurality of fins 162 stacked together. Each fin 162 is made of metal such as aluminum, copper or an alloy thereof. The fins 162 are spaced from each other, and each two adjacent fins 162 form an airflow channel (not labeled) therebetween.
  • The fan duct 20 can be made of a material such as plastic, and includes a fan duct body 21 and an airflow guiding plate 23. The fan duct body 21 includes a top plate 22, and two side plates 24 extending perpendicular downwardly from two opposite lateral sides of the top plate 22. A distance between the two side plates 24 is substantially equal to a width of the heat sink 10. The heat sink 10 is located between the two side plates 24. A rectangular through hole 220 is defined in an end of the top plate 22. The heat sink 10 is mounted in the fan duct 20 away from the through hole 220 of the top plate 22. The airflow guiding plate 23 is mounted in the fan duct 20 near the through hole 220 of the top plate 22. The fan duct body 21 has an air inlet 25 near the through hole 220 for air to flow into the fan duct 20, and an air outlet 26 away from the through hole 220 for airflow to exhaust from the fan duct 20. A pair of opposing pivot holes 240 are respectively defined in joints of the top plate 22 and the side plates 24, respectively. The pivot holes 240 are located between the through hole 220 and the air inlet 25. Four spaced circular positioning holes 242 are defined in each side plate 24 of the fan duct 20 near the heat sink 10. The four positioning holes 242 are arranged in each side plate 24 along an arc-shaped path. Each positioning hole 242 of one side plate 24 is aligned with a corresponding one of the positioning holes 242 of the other side plate 24 along a horizontal direction, to thereby form four pairs of positioning holes 242 corresponding to four different heights of heat sinks.
  • The airflow guiding plate 23 includes a rectangular body 232 located between the side plates 24, a pivot 234 extending horizontally outwardly from an edge of one end of the body 232, and two buckles 236 extending perpendicularly downwardly from edges of the other end of the body 232. A circular protrusion 237 protrudes outward from each buckle 236. The body 232 of the airflow guiding plate 23 has an area a little larger than the through hole 220 of the top plate 22. The pivot 234 of the airflow guiding plate 23 is pivotedly connected in the pivot holes 240, so that the airflow guiding plate 23 can rotate around the pivot 234 in the fan duct 20. The protrusions 237 of the buckles 236 are buckled in the topmost pair of positioning holes 242 of the side plates 24 to fix the airflow guiding plate 23 on the fan duct body 21 of the fan duct 20. Thus the body 232 of the airflow guiding plate 23 abuts a top of the heat sink 10 to guide airflow toward the heat sink 10.
  • Referring to FIG. 3, when the heat sink 10 is replaced with a heat sink 10 a of a smaller height, the airflow guiding plate 23 is rotated downwardly around the pivot 234, and the protrusions 237 of the buckles 236 are buckled in another pair of positioning holes 242 in the side plates 24. Thus the body 232 of the airflow guiding plate 23 abuts a top of the heat sink 10 a to guide airflow toward the heat sink 10 a.
  • According to the disclosure, the airflow guiding plate 23 can be adjusted to fix at different positions of the fan duct 20, whereby the fan duct 20 can match different heat sinks of various heights. Accordingly, the cost of manufacturing different heat dissipation devices can be reduced.
  • It is believed that the embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (20)

1. A fan duct comprising:
a fan duct body defining an air inlet for airflow to enter the fan duct and an air outlet for airflow to exhaust from the fan duct; and
an airflow guiding plate, one end of the airflow guiding plate near the air inlet pivotedly connecting the fan duct body, an opposite end of the airflow guiding plate away from the air inlet capable of being detachably fixed at different positions of the fan duct body.
2. The fan duct of claim 1, wherein the fan duct body comprises a top plate and two side plates extending downwardly from two opposite lateral sides of the top plate, a pair of opposing pivot holes being respectively defined in the two side plates, the airflow guiding plate comprising a body located between the side plates, and a pivot extending outwardly from one end of the body, the pivot being pivotedly connected in the pivot holes of the side plates.
3. The fan duct of claim 2, wherein the pivot holes are respectively defined in joints of the top plate and the side plates.
4. The fan duct of claim 2, wherein a plurality of positioning holes are defined in each of the side plates, each positioning hole of one side plate being aligned with a corresponding one of the positioning holes of the other side plate along a horizontal direction, to thereby form a plurality of pairs of positioning holes corresponding to different heights, the airflow guiding plate further comprising two buckles extending from the other end of the body, the buckles being buckled in one of the pairs of positioning holes of the side plates.
5. The fan duct of claim 4, wherein a protrusion protrudes outward from each buckle of the airflow guiding plate, the protrusion being buckled in a corresponding positioning hole of the side plate.
6. The fan duct of claim 4, wherein the positioning holes are arranged in each side plate as an arc-shape.
7. The fan duct of claim 2, wherein the top plate defines a through hole in an end thereof, the airflow guiding plate being mounted in the fan duct body near the through hole of the top plate.
8. The fan duct of claim 7, wherein the body of the airflow guiding plate has an area larger than the through hole of the top plate.
9. The fan duct of claim 7, wherein the pivot holes are located between the through hole of the top plate and the air inlet.
10. The fan duct of claim 7, wherein the air inlet is located near the through hole of the top plate, and the air outlet is located away from the through hole of the top plate.
11. A heat dissipation device comprising:
a heat sink; and
a fan duct comprising:
a fan duct body defining an air inlet for airflow to enter the fan duct and an air outlet for airflow to exhaust from the fan duct; and
an airflow guiding plate, one end of the airflow guiding plate near the air inlet pivotedly connecting the fan duct body, an opposite end of the airflow guiding plate away from the air inlet capable of being detachably fixed at different positions of the fan duct body to selectively match not only the height of the heat sink but also one or more other heights of one or more other heat sinks.
12. The heat dissipation device of claim 11, wherein the fan duct body comprises a top plate and two side plates extending downwardly from two opposite lateral sides of the top plate, the heat sink being located between the two side plates, a pair of opposing pivot holes being respectively defined in the two side plates, the airflow guiding plate comprising a body located between the side plates, and a pivot extending outwardly from one end of the body, the pivot being pivotedly connected in the pivot holes of the side plates, the other end of the body of the airflow guiding plate abutting the heat sink.
13. The heat dissipation device of claim 12, wherein a distance between the two side plates is substantially equal to a width of the heat sink.
14. The heat dissipation device of claim 12, wherein the pivot holes are respectively defined in joints of the top plate and the side plates.
15. The heat dissipation device of claim 12, wherein a plurality of positioning holes are defined in each of the side plates, each positioning hole of one side plate being aligned with a corresponding one of the positioning holes of the other side plate along a horizontal direction, to thereby form a plurality of pairs of positioning holes corresponding to different heights, the airflow guiding plate further comprising two buckles extending from the other end of the body, the buckles being buckled in one of the pairs of positioning holes of the side plates.
16. The heat dissipation device of claim 15, wherein a protrusion protrudes outward from each buckle of the airflow guiding plate, the protrusion being buckled in a corresponding positioning hole of the side plate.
17. The heat dissipation device of claim 15, wherein the positioning holes are arranged in each side plate as an arc-shape.
18. The heat dissipation device of claim 12, wherein the top plate defines a through hole in an end thereof, the airflow guiding plate being mounted in the fan duct body near the through hole of the top plate.
19. The heat dissipation device of claim 18, wherein the body of the airflow guiding plate has an area larger than the through hole of the top plate.
20. The heat dissipation device of claim 18, wherein the pivot holes are located between the through hole of the top plate and the air inlet.
US12/981,426 2010-12-09 2010-12-29 Fan duct and heat dissipation device using the same Abandoned US20120145363A1 (en)

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CN201010580857.7A CN102573383B (en) 2010-12-09 2010-12-09 Wind scooper and use the heat abstractor of this wind scooper
CN201010580857.7 2010-12-09

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130052934A1 (en) * 2011-08-25 2013-02-28 Hon Hai Precision Industry Co., Ltd. Air guiding device
US20130255914A1 (en) * 2012-03-28 2013-10-03 Hon Hai Precision Industry Co., Ltd. Heat sink assembly
US20140133086A1 (en) * 2012-11-12 2014-05-15 Inventec Corporation Electronic device
US20140146471A1 (en) * 2012-11-28 2014-05-29 Hon Hai Precision Industry Co., Ltd. Air duct and electronic device with the same
US20140318648A1 (en) * 2013-04-24 2014-10-30 Hon Hai Precision Industry Co., Ltd. Chassis with air guiding member
USD773624S1 (en) * 2014-06-18 2016-12-06 Mitsubishi Electric Corporation Outdoor unit for air conditioner
USD775316S1 (en) * 2014-06-18 2016-12-27 Mitsubishi Electric Corporation Outdoor unit for air conditioner
US20180042136A1 (en) * 2016-08-02 2018-02-08 Sony Interactive Entertainment Inc. Heat sink and electronic device
US9961796B1 (en) * 2016-11-02 2018-05-01 Inventec (Pudong) Technology Corporation Server
US10372176B2 (en) * 2018-01-03 2019-08-06 Dell Products, Lp Information handling system with a common air duct for multiple air flow guiding configurations
CN111447799A (en) * 2020-04-29 2020-07-24 水氪(北京)科技发展有限公司 Heat dissipation system for food purifier
USD907184S1 (en) * 2017-11-28 2021-01-05 Gree Electric Appliances, Inc. Of Zhuhai Air conditioning apparatus
US20210100130A1 (en) * 2019-09-30 2021-04-01 TechnoGuard Inc. Computer server cabinet portable louver system

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109960380B (en) * 2017-12-22 2022-10-04 富联精密电子(天津)有限公司 Wind scooper, case adopting wind scooper and electronic device
CN108563310A (en) * 2018-04-23 2018-09-21 郑州云海信息技术有限公司 A kind of wind scooper for supporting half long half high high power consumption add-on card heat dissipation
CN109357326B (en) * 2018-09-14 2020-09-11 青岛海信日立空调系统有限公司 Wind scooper and electric box
CN110506824A (en) * 2019-09-26 2019-11-29 江苏科技大学 A kind of cotton candy machine based on electromagnetic heating

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5963424A (en) * 1995-11-07 1999-10-05 Sun Microsystems, Inc. Pulsar desk top system that will produce 500 watts of heat
US6155920A (en) * 1998-12-18 2000-12-05 Lite-On Enclosure Inc. Air ducts structure of a radiating fan
US6736196B2 (en) * 2002-01-30 2004-05-18 Hon Hai Precision Ind. Co., Ltd. Fan duct assembly
US20050113016A1 (en) * 2003-11-20 2005-05-26 First International Computer, Inc. Airflow guide structure and manufacture thereof
US20050219813A1 (en) * 2004-04-05 2005-10-06 Dell Products L.P. Adjustable heat sink shroud
US20060034051A1 (en) * 2004-08-10 2006-02-16 Jian Wang Electronic device having a temperature control system including a ductwork assembly
US20070117502A1 (en) * 2005-11-22 2007-05-24 Gateway Inc. Adjustable cooling air duct for use with components of different sizes
US7262964B1 (en) * 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
US20080117569A1 (en) * 2006-11-20 2008-05-22 Jia-Shunn Lee Power-supplying device
US20080239661A1 (en) * 2007-03-28 2008-10-02 Adc Dsl Systems, Inc. Apparatus for cooling electronics
US20100105313A1 (en) * 2008-10-27 2010-04-29 Hon Hai Precision Industry Co., Ltd. Air conducting device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6005770A (en) * 1997-11-12 1999-12-21 Dell U.S.A., L.P. Computer and a system and method for cooling the interior of the computer
CN201115221Y (en) * 2007-08-21 2008-09-10 英业达股份有限公司 Wind guide cover
US7643292B1 (en) * 2008-12-23 2010-01-05 Chenbro Micom Co., Ltd. Adjustable air director

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5963424A (en) * 1995-11-07 1999-10-05 Sun Microsystems, Inc. Pulsar desk top system that will produce 500 watts of heat
US6155920A (en) * 1998-12-18 2000-12-05 Lite-On Enclosure Inc. Air ducts structure of a radiating fan
US6736196B2 (en) * 2002-01-30 2004-05-18 Hon Hai Precision Ind. Co., Ltd. Fan duct assembly
US20050113016A1 (en) * 2003-11-20 2005-05-26 First International Computer, Inc. Airflow guide structure and manufacture thereof
US20050219813A1 (en) * 2004-04-05 2005-10-06 Dell Products L.P. Adjustable heat sink shroud
US20060034051A1 (en) * 2004-08-10 2006-02-16 Jian Wang Electronic device having a temperature control system including a ductwork assembly
US7262964B1 (en) * 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
US20070117502A1 (en) * 2005-11-22 2007-05-24 Gateway Inc. Adjustable cooling air duct for use with components of different sizes
US20080117569A1 (en) * 2006-11-20 2008-05-22 Jia-Shunn Lee Power-supplying device
US20080239661A1 (en) * 2007-03-28 2008-10-02 Adc Dsl Systems, Inc. Apparatus for cooling electronics
US20100105313A1 (en) * 2008-10-27 2010-04-29 Hon Hai Precision Industry Co., Ltd. Air conducting device

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130052934A1 (en) * 2011-08-25 2013-02-28 Hon Hai Precision Industry Co., Ltd. Air guiding device
US20130255914A1 (en) * 2012-03-28 2013-10-03 Hon Hai Precision Industry Co., Ltd. Heat sink assembly
US20140133086A1 (en) * 2012-11-12 2014-05-15 Inventec Corporation Electronic device
US9036344B2 (en) * 2012-11-12 2015-05-19 Inventec (Pudong) Technology Corporation Electronic device
CN103857256B (en) * 2012-11-28 2016-08-10 国家电网公司 Wind scooper and there is the electronic installation of this wind scooper
US20140146471A1 (en) * 2012-11-28 2014-05-29 Hon Hai Precision Industry Co., Ltd. Air duct and electronic device with the same
CN103857256A (en) * 2012-11-28 2014-06-11 鸿富锦精密工业（深圳）有限公司 Wind scooper and electronic apparatus having the same
US9723749B2 (en) * 2013-04-24 2017-08-01 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Chassis with air guiding member
US20140318648A1 (en) * 2013-04-24 2014-10-30 Hon Hai Precision Industry Co., Ltd. Chassis with air guiding member
USD773624S1 (en) * 2014-06-18 2016-12-06 Mitsubishi Electric Corporation Outdoor unit for air conditioner
USD775316S1 (en) * 2014-06-18 2016-12-27 Mitsubishi Electric Corporation Outdoor unit for air conditioner
US20180042136A1 (en) * 2016-08-02 2018-02-08 Sony Interactive Entertainment Inc. Heat sink and electronic device
US11147185B2 (en) * 2016-08-02 2021-10-12 Sony Interactive Entertainment Inc. Heat sink and electronic device
EP3288073B1 (en) * 2016-08-02 2022-02-16 Sony Interactive Entertainment Inc. Heat sink and electronic device
US9961796B1 (en) * 2016-11-02 2018-05-01 Inventec (Pudong) Technology Corporation Server
USD907184S1 (en) * 2017-11-28 2021-01-05 Gree Electric Appliances, Inc. Of Zhuhai Air conditioning apparatus
US10372176B2 (en) * 2018-01-03 2019-08-06 Dell Products, Lp Information handling system with a common air duct for multiple air flow guiding configurations
US20210100130A1 (en) * 2019-09-30 2021-04-01 TechnoGuard Inc. Computer server cabinet portable louver system
US11510344B2 (en) * 2019-09-30 2022-11-22 TechnoGuard Inc. Computer server cabinet portable louver system
CN111447799A (en) * 2020-04-29 2020-07-24 水氪(北京)科技发展有限公司 Heat dissipation system for food purifier

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