US20120103572A1 - Heat dissipating apparatus with vortex generator - Google Patents
Heat dissipating apparatus with vortex generator Download PDFInfo
- Publication number
- US20120103572A1 US20120103572A1 US13/106,938 US201113106938A US2012103572A1 US 20120103572 A1 US20120103572 A1 US 20120103572A1 US 201113106938 A US201113106938 A US 201113106938A US 2012103572 A1 US2012103572 A1 US 2012103572A1
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- US
- United States
- Prior art keywords
- heat dissipating
- vortex generator
- heat
- oblique surfaces
- dissipating apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
- F28F1/325—Fins with openings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat dissipating apparatus, in particular to a heat dissipating apparatus capable of generating vortices by a vortex generator and providing a stack effect.
- vortex generator is considered as one of the passive thermal conductivity enhancement technologies, and it combines small protrusions such as embossments, stamps and punches with a main thermal exchange surface such as the surface of a heat dissipating fin by a manufacturing method, thereby preventing possible separations occurred at the boundary and reducing frictions.
- the vortex generator also has a smaller pressure drop.
- vortex generators applied to heat dissipating fins generally use vortex energy to facilitate an exchange of heat with air.
- the effect is still not good enough, because the produced vortices only flow in a direction based on the airflow direction of a fan. If no airflow is driven by the fan or a stagnancy is caused by too much accumulated heat, the heat exchange effect of the conventional vortex generators will be so small that the heat dissipating efficiency cannot be enhanced.
- the present Inventor proposes a novel and reasonable structure based on years of experience in the related industry and extensive researches.
- each heat dissipating fin is provided with the vortex generators, so that the heat dissipating apparatus can induce a stack effect by means of the vortex generators on and below each heat dissipating fin. In this way, the heat accumulated between the respective dissipating fins can be dissipated to achieve the heat dissipating effect automatically.
- the present invention provides a heat dissipating apparatus with a vortex generator, which comprises: a heat conducting base, at least one heat pipe, and a plurality of heat dissipating fins, wherein the heat pipe is coupled to the heat conducting base and sequentially penetrating the heat dissipating fins, each heat dissipating fin includes a vortex generator installed thereon and disposed adjacent to a side of the heat pipe, each vortex generator has two guiding oblique surfaces erected from a surface of the heat dissipating fin, the two guiding oblique surfaces are arranged with an included angle therebetween, a through hole is formed at a position opposite to a side of the heat dissipating fin.
- the present invention has advantages as follows. Since the vortex generators protrude from each heat dissipating fin, the total area for heat dissipation will be increased. Further, since external cold air flowing through the adjacent two heat dissipating fins is disturbed by the protruding vortex generators, it takes more time for the external cold air to pass through the adjacent two heat dissipating fins, so that the time for heat exchange is extended and thus the heat transfer is improved greatly.
- FIG. 1 is a perspective view of the present invention
- FIG. 2 is a perspective view of a heat dissipating fin in accordance with a preferred embodiment of the present invention
- FIG. 3 is a planar partial view of the heat dissipating fin of the present invention.
- FIG. 4 is a cross-sectional view taken along the line 4 - 4 in FIG. 3 ;
- FIG. 5 is a cross-sectional view taken along the line 5 - 5 in FIG. 3 ;
- FIG. 6 is a top view of a using status of the present invention.
- FIG. 7 is a cross-sectional view taken along the line 7 - 7 in FIG. 6 ;
- FIG. 8 is a cross-sectional view taken along the line 8 - 8 in FIG. 6 ;
- FIG. 9 is a perspective view of the heat dissipating fin in accordance with another preferred embodiment of the present invention.
- FIG. 10 is a cross-sectional view of the heat dissipating fin in accordance with another preferred embodiment of the present invention.
- the present invention provides a heat dissipating apparatus with a vortex generator, which comprises: a heat conducting base 1 , at least one heat pipe 2 , and a plurality of heat dissipating fins 3 .
- the heat conducting base 1 is made of a material with good thermal conductivity such as aluminum and copper and substantially in form of a plate adhered to a heat-generating electronic component (not shown in the figure) such as a CPU of a computer.
- the heat pipe 2 is coupled to the heat conducting base 1 and sequentially penetrates through the heat dissipating fins 3 , such that the heat conducting base 1 can absorb the heat generated by the heat-generating electronic component and conduct the heat to each heat dissipating fin 3 quickly. More specifically, each heat dissipating fin 3 has a corresponding penetrating hole 30 formed thereon and a circular flange 31 protrudes from the periphery of each penetrating hole 30 .
- the heat pipe 2 passes through the penetrating hole 30 of each heat dissipating fin 3 and closely contacts each circular flange 31 . In this preferred embodiment of the invention, there is a plurality of heat pipes 2 .
- the present invention comprises at least one vortex generator 4 installed on each heat dissipating fin 3 and disposed proximate to a backwind side of the heat pipe 2 .
- a vortex generator 4 is installed at a side of the backwind side of each heat pipe 2 , such that after an external airflow (such as the airflow of a fan) flows to a windward side of the heat pipe 2 , the airflow will pass through the vortex generator 4 and produce a spiral vortex and drive the airflow to flow towards the backwind side of the heat pipe 2 , thereby dissipating the hot air at the backwind side of the heat pipe 2 .
- Each vortex generator 4 has two guiding oblique surfaces 40 , 41 erected from a surface of the heat dissipating fin 3 , and the two guiding oblique surfaces 40 , 41 have top edges 400 , 410 ascendingly protruding from the two guiding oblique surfaces 40 , 41 .
- a lower position is aligned towards an adjacent heat pipe 2 .
- the top edges 400 , 410 of the two guiding oblique surfaces 40 , 41 extend towards the lower position to form included angle lines L 1 .
- the included angle lines L 1 of the two guiding oblique surfaces 40 , 41 extend to be intersected to form an included angle.
- a through hole 32 is formed to penetrate through a side opposite to the heat dissipating fin 3 .
- an included angle ⁇ produced by the intersection of the included angle lines L 1 is preferably equal to 60°, but the present invention is not limited to such angle only.
- the ratio of the length 11 and the maximum height h 1 (or height) of the two guiding oblique surfaces 40 , 41 is preferably equal to 2:1.
- each heat dissipating fin 3 of the present invention has a plurality of auxiliary vortex generators 5 arranged transversally, and each auxiliary vortex generator 5 has two guiding oblique surfaces 50 protruding from a surface of the heat dissipating fin 3 .
- the two guiding oblique surfaces 50 protrude in a tapered form.
- a through hole 51 is formed to penetrate through a position opposite to the heat dissipating fin 3 , and the through hole 51 is oriented upwardly and obliquely. More specifically, in FIG.
- the two guiding oblique surfaces 50 of the auxiliary vortex generator 5 preferably have an included angle ⁇ 2 of 30°, but the present invention is not limited to such angle only.
- the ratio of the length 12 and the width w of the two guiding oblique surfaces 50 is preferably equal to 2:1.
- the heat dissipating apparatus with a vortex generator of the present invention can be achieved.
- a fan 6 is further provided on one side of each heat dissipating fin 3 of the heat dissipating apparatus, thereby assisting the heat dissipation from each heat dissipating fin 3 .
- each vortex generator 4 has a through hole 32 penetrating through the heat dissipating fin 3 , after the heat dissipating fins 3 are stacked up, each through hole 32 forms a passage that allows the hot airflow to flow and rise. As a result, the hot air that cannot be driven away by the wind produced by the fan 6 can rise and escape naturally. Thus, a stack effect is induced to achieve the heat dissipation.
- Each auxiliary vortex generator 5 as shown in FIGS. 6 and 8 can assist accelerating the dissipation of the remaining heat between the heat dissipating fins 3 , so that the accumulated hot airflow can rise vertically and escape from the through hole 51 to induce a better stack effect.
- the auxiliary vortex generators 5 are provided in pairs.
- the two guiding oblique surfaces 50 of each auxiliary vortex generator 5 protrude to be intersected to form a ridge L 2 .
- the included angle ⁇ 2 formed by the ridges L 2 of a pair of adjacent auxiliary vortex generators 5 is preferably equal to 60°, but the present invention is not limited to such angle only.
- a ventilation hole 33 is formed at a position next to each vortex generator 4 .
- a tapered circular enclosed portion 34 is formed to protrude upwardly from the periphery of the ventilation hole 33 .
- the circular enclosed portion 34 is disposed between the two guiding oblique surfaces 40 , 41 . After the heat dissipating fins 3 are stacked up, each circular enclosed portion 34 allows hot air to pass from the bottom through the ventilation hole 33 and rise effectively to achieve a more significant stack effect.
- the present invention improves over the prior art and complies with the patent application requirements, and thus is duly filed for patent application.
Abstract
A heat dissipating apparatus with a vortex generator includes a heat conducting base, a heat pipe, and a plurality of heat dissipating fins. Each heat dissipating fin has a vortex generator installed thereon and disposed adjacent to a side of the heat pipe. The vortex generator has two guiding oblique surfaces protruding from a surface of the heat dissipating fin. The two guiding oblique surfaces are disposed with an included angle there between. A through hole is formed at a position opposite to a side of the heat dissipating fin, such that the vortex generator of each heat dissipating fin induces a stack effect at corresponding upper and lower parts of the heat dissipating fin to improve the heat dissipating efficiency.
Description
- The present invention relates to a heat dissipating apparatus, in particular to a heat dissipating apparatus capable of generating vortices by a vortex generator and providing a stack effect.
- In recent years, vortex generator is considered as one of the passive thermal conductivity enhancement technologies, and it combines small protrusions such as embossments, stamps and punches with a main thermal exchange surface such as the surface of a heat dissipating fin by a manufacturing method, thereby preventing possible separations occurred at the boundary and reducing frictions. In addition to the advantage of having a better thermal conductivity enhancement of the heat dissipating fin, the vortex generator also has a smaller pressure drop.
- In the past, vortex generators applied to heat dissipating fins generally use vortex energy to facilitate an exchange of heat with air. However, the effect is still not good enough, because the produced vortices only flow in a direction based on the airflow direction of a fan. If no airflow is driven by the fan or a stagnancy is caused by too much accumulated heat, the heat exchange effect of the conventional vortex generators will be so small that the heat dissipating efficiency cannot be enhanced.
- In view of the aforementioned shortcomings of the prior art, the present Inventor proposes a novel and reasonable structure based on years of experience in the related industry and extensive researches.
- Therefore, it is a primary objective of the present invention to provide a heat dissipating apparatus with a vortex generator. Each heat dissipating fin is provided with the vortex generators, so that the heat dissipating apparatus can induce a stack effect by means of the vortex generators on and below each heat dissipating fin. In this way, the heat accumulated between the respective dissipating fins can be dissipated to achieve the heat dissipating effect automatically.
- To achieve the foregoing objective, the present invention provides a heat dissipating apparatus with a vortex generator, which comprises: a heat conducting base, at least one heat pipe, and a plurality of heat dissipating fins, wherein the heat pipe is coupled to the heat conducting base and sequentially penetrating the heat dissipating fins, each heat dissipating fin includes a vortex generator installed thereon and disposed adjacent to a side of the heat pipe, each vortex generator has two guiding oblique surfaces erected from a surface of the heat dissipating fin, the two guiding oblique surfaces are arranged with an included angle therebetween, a through hole is formed at a position opposite to a side of the heat dissipating fin.
- In comparison with prior art, the present invention has advantages as follows. Since the vortex generators protrude from each heat dissipating fin, the total area for heat dissipation will be increased. Further, since external cold air flowing through the adjacent two heat dissipating fins is disturbed by the protruding vortex generators, it takes more time for the external cold air to pass through the adjacent two heat dissipating fins, so that the time for heat exchange is extended and thus the heat transfer is improved greatly.
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FIG. 1 is a perspective view of the present invention; -
FIG. 2 is a perspective view of a heat dissipating fin in accordance with a preferred embodiment of the present invention; -
FIG. 3 is a planar partial view of the heat dissipating fin of the present invention; -
FIG. 4 is a cross-sectional view taken along the line 4-4 inFIG. 3 ; -
FIG. 5 is a cross-sectional view taken along the line 5-5 inFIG. 3 ; -
FIG. 6 is a top view of a using status of the present invention; -
FIG. 7 is a cross-sectional view taken along the line 7-7 inFIG. 6 ; -
FIG. 8 is a cross-sectional view taken along the line 8-8 inFIG. 6 ; -
FIG. 9 is a perspective view of the heat dissipating fin in accordance with another preferred embodiment of the present invention; and -
FIG. 10 is a cross-sectional view of the heat dissipating fin in accordance with another preferred embodiment of the present invention. - The technical characteristics and contents of the present invention will become apparent with the following detailed description and related drawings. The drawings are provided for the purpose of illustrating the present invention only, but not intended for limiting the scope of the invention.
- With reference to
FIG. 1 for a perspective view of the present invention, the present invention provides a heat dissipating apparatus with a vortex generator, which comprises: a heat conductingbase 1, at least oneheat pipe 2, and a plurality ofheat dissipating fins 3. - The heat conducting
base 1 is made of a material with good thermal conductivity such as aluminum and copper and substantially in form of a plate adhered to a heat-generating electronic component (not shown in the figure) such as a CPU of a computer. Theheat pipe 2 is coupled to the heat conductingbase 1 and sequentially penetrates through theheat dissipating fins 3, such that the heat conductingbase 1 can absorb the heat generated by the heat-generating electronic component and conduct the heat to each heat dissipating fin 3 quickly. More specifically, eachheat dissipating fin 3 has a corresponding penetratinghole 30 formed thereon and acircular flange 31 protrudes from the periphery of each penetratinghole 30. Theheat pipe 2 passes through the penetratinghole 30 of eachheat dissipating fin 3 and closely contacts eachcircular flange 31. In this preferred embodiment of the invention, there is a plurality ofheat pipes 2. - With reference to
FIGS. 2 and 3 , the present invention comprises at least onevortex generator 4 installed on eachheat dissipating fin 3 and disposed proximate to a backwind side of theheat pipe 2. In other words, avortex generator 4 is installed at a side of the backwind side of eachheat pipe 2, such that after an external airflow (such as the airflow of a fan) flows to a windward side of theheat pipe 2, the airflow will pass through thevortex generator 4 and produce a spiral vortex and drive the airflow to flow towards the backwind side of theheat pipe 2, thereby dissipating the hot air at the backwind side of theheat pipe 2. Eachvortex generator 4 has two guidingoblique surfaces heat dissipating fin 3, and the two guidingoblique surfaces top edges oblique surfaces adjacent heat pipe 2. Thetop edges oblique surfaces oblique surfaces hole 32 is formed to penetrate through a side opposite to theheat dissipating fin 3. - With reference to
FIG. 3 for a more detailed description, an included angle θ produced by the intersection of the included angle lines L1 is preferably equal to 60°, but the present invention is not limited to such angle only. InFIG. 4 , the ratio of thelength 11 and the maximum height h1 (or height) of the two guidingoblique surfaces - In
FIGS. 3 and 5 , eachheat dissipating fin 3 of the present invention has a plurality ofauxiliary vortex generators 5 arranged transversally, and eachauxiliary vortex generator 5 has two guidingoblique surfaces 50 protruding from a surface of theheat dissipating fin 3. The two guidingoblique surfaces 50 protrude in a tapered form. A throughhole 51 is formed to penetrate through a position opposite to theheat dissipating fin 3, and the throughhole 51 is oriented upwardly and obliquely. More specifically, inFIG. 3 , the two guidingoblique surfaces 50 of theauxiliary vortex generator 5 preferably have an included angle θ2 of 30°, but the present invention is not limited to such angle only. The ratio of thelength 12 and the width w of the two guidingoblique surfaces 50 is preferably equal to 2:1. - With the aforementioned assembly, the heat dissipating apparatus with a vortex generator of the present invention can be achieved.
- In
FIG. 6 , afan 6 is further provided on one side of eachheat dissipating fin 3 of the heat dissipating apparatus, thereby assisting the heat dissipation from eachheat dissipating fin 3. After the airflow produced by thefan 6 passes through the windward side of theheat pipe 2, a portion of the airflow will flow along the external guidingoblique surfaces vortex generators 4, and another portion of the airflow will enter the twovortex generators 4 to accelerate the dissipation of the heat accumulated at the backwind side of theheat pipe 2. InFIG. 7 , since eachvortex generator 4 has a throughhole 32 penetrating through theheat dissipating fin 3, after theheat dissipating fins 3 are stacked up, each throughhole 32 forms a passage that allows the hot airflow to flow and rise. As a result, the hot air that cannot be driven away by the wind produced by thefan 6 can rise and escape naturally. Thus, a stack effect is induced to achieve the heat dissipation. - Each
auxiliary vortex generator 5 as shown inFIGS. 6 and 8 can assist accelerating the dissipation of the remaining heat between theheat dissipating fins 3, so that the accumulated hot airflow can rise vertically and escape from the throughhole 51 to induce a better stack effect. - With reference to
FIG. 9 for a perspective view of a heat dissipating fin in accordance with another preferred embodiment of the present invention, theauxiliary vortex generators 5 are provided in pairs. The two guidingoblique surfaces 50 of eachauxiliary vortex generator 5 protrude to be intersected to form a ridge L2. The included angle θ2 formed by the ridges L2 of a pair of adjacentauxiliary vortex generators 5 is preferably equal to 60°, but the present invention is not limited to such angle only. InFIG. 10 , aventilation hole 33 is formed at a position next to eachvortex generator 4. A tapered circular enclosedportion 34 is formed to protrude upwardly from the periphery of theventilation hole 33. In this preferred embodiment of the present invention, the circular enclosedportion 34 is disposed between the two guidingoblique surfaces heat dissipating fins 3 are stacked up, each circular enclosedportion 34 allows hot air to pass from the bottom through theventilation hole 33 and rise effectively to achieve a more significant stack effect. - To sum up the above, the present invention improves over the prior art and complies with the patent application requirements, and thus is duly filed for patent application.
- While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.
Claims (17)
1. A heat dissipating apparatus with a vortex generator, comprising:
a heat conducting base (1);
a heat pipe (2), coupled to the heat conducting base (1); and
a plurality of heat dissipating fins (3), sequentially penetrated by the heat pipe (2);
wherein each heat dissipating fin (3) has a vortex generator (4) installed thereon and disposed proximate to a side of the heat pipe (2), the vortex generator (4) has two guiding oblique surfaces (40), (41) arranged with an included angle therebetween, and a through hole (32) is formed at a position opposite to a side of the heat dissipating fin (3).
2. The heat dissipating apparatus with a vortex generator of claim 1 , wherein the heat conducting base (1) is substantially a plate.
3. The heat dissipating apparatus with a vortex generator of claim 1 , wherein each of the heat dissipating fins (3) has a corresponding penetrating hole (30) for allowing the heat pipe (2) to pass through.
4. The heat dissipating apparatus with a vortex generator of claim 3 , wherein each penetrating hole (30) has a circular flange (31) protruding from the periphery of the penetrating hole (30) for keeping a close contact with the heat pipe (2).
5. The heat dissipating apparatus with a vortex generator of claim 1 , wherein there is a plurality of heat pipes (2), and each heat pipe (2) has a vortex generator (4) installed on its one side.
6. The heat dissipating apparatus with a vortex generator of claim 1 , wherein the two guiding oblique surfaces (40), (41) of each vortex generator (4) have top edges (400), (410) ascendingly protruding from the two guiding oblique surfaces (40), (41) respectively, the top edges (400), (410) of the two guiding oblique surfaces (40), (41) extend downwardly to form included angle lines (L1) respectively that are intersected with each other.
7. The heat dissipating apparatus with a vortex generator of claim 6 , wherein the included angle formed by intersecting the two included angle lines (L1) is equal to 60°.
8. The heat dissipating apparatus with a vortex generator of claim 1 , wherein the two guiding oblique surfaces (40), (41) of each vortex generator (4) have an aspect ratio of 2:1.
9. The heat dissipating apparatus with a vortex generator of claim 1 , wherein each heat dissipating fin (3) includes a plurality of auxiliary vortex generators (5) arranged transversally on the heat dissipating fin (3).
10. The heat dissipating apparatus with a vortex generator of claim 9 , wherein each auxiliary vortex generator (5) has two guiding oblique surfaces (50) protruding from a surface of the heat dissipating fin (3), the two guiding oblique surfaces (50) protrude in a tapered form, a through hole (51) is formed at a corresponding position penetrating through the heat dissipating fin (3).
11. The heat dissipating apparatus with a vortex generator of claim 10 , wherein the two guiding oblique surfaces (50) of each auxiliary vortex generator (5) have an included angle of 30°.
12. The heat dissipating apparatus with a vortex generator of claim 10 , wherein the two guiding oblique surfaces (50) of each auxiliary vortex generator (5) have an aspect ratio of 2:1.
13. The heat dissipating apparatus with a vortex generator of claim 10 , wherein the through hole (51) of each auxiliary vortex generator (5) is oriented upwardly and obliquely.
14. The heat dissipating apparatus with a vortex generator of claim 9 , wherein the auxiliary vortex generators (5) are provided in pairs.
15. The heat dissipating apparatus with a vortex generator of claim 9 , wherein the two guiding oblique surfaces (50) of the auxiliary vortex generator (5) protrude to be intersected to form a ridge (L2), the ridges (L2) of adjacent paired auxiliary vortex generators (5) form an included angle of 60°.
16. The heat dissipating apparatus with a vortex generator of claim 1 , wherein each heat dissipating fin (3) further includes a ventilation hole (33) formed at a position proximate to each vortex generators (4), and a tapered circular enclosed portion (34) protrudes upwardly from the periphery of the ventilation hole (33).
17. The heat dissipating apparatus with a vortex generator of claim 16 , wherein the circular enclosed portion (34) is disposed between the two guiding oblique surfaces (40), (41).
Priority Applications (1)
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US29/556,581 USD802543S1 (en) | 2010-11-03 | 2016-03-01 | Cooling fin |
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TW099221252 | 2010-11-03 | ||
TW099221252U TWM403012U (en) | 2010-11-03 | 2010-11-03 | Heat dissipating device having swirl generator |
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US29/556,581 Continuation USD802543S1 (en) | 2010-11-03 | 2016-03-01 | Cooling fin |
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US13/106,938 Abandoned US20120103572A1 (en) | 2010-11-03 | 2011-05-13 | Heat dissipating apparatus with vortex generator |
US29/556,581 Active USD802543S1 (en) | 2010-11-03 | 2016-03-01 | Cooling fin |
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US29/556,581 Active USD802543S1 (en) | 2010-11-03 | 2016-03-01 | Cooling fin |
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JP (1) | JP3167993U (en) |
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USD802543S1 (en) * | 2010-11-03 | 2017-11-14 | Enermax Technology Corporation | Cooling fin |
CN110476246A (en) * | 2017-03-24 | 2019-11-19 | 松下知识产权经营株式会社 | Radiator and power generator |
US10739832B2 (en) * | 2018-10-12 | 2020-08-11 | International Business Machines Corporation | Airflow projection for heat transfer device |
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USD819578S1 (en) * | 2016-07-14 | 2018-06-05 | Enermax Technology Corporation | Heat dissipating fin |
USD827588S1 (en) * | 2016-12-27 | 2018-09-04 | Sony Corporation | Chip connector |
USD906268S1 (en) * | 2018-09-11 | 2020-12-29 | Rheem Manufacturing Company | Heat exchanger fin |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1853315A (en) * | 1925-09-25 | 1932-04-12 | Modine Mfg Co | Radiator |
US4817709A (en) * | 1987-12-02 | 1989-04-04 | Carrier Corporation | Ramp wing enhanced plate fin |
US4830102A (en) * | 1980-03-11 | 1989-05-16 | Kulkereskedelmi Transelektro Magyar Villamossagi Vallalat | Turbulent heat exchanger |
US5567395A (en) * | 1994-04-21 | 1996-10-22 | Nippon Soken, Inc. | Catalyst carrier for a catalytic converter for purifying an exhaust gas in an internal combustion engine |
US5730214A (en) * | 1997-01-16 | 1998-03-24 | General Motors Corporation | Heat exchanger cooling fin with varying louver angle |
US20030024687A1 (en) * | 2001-07-31 | 2003-02-06 | Cheng Chung Pin | Radiation fin set for heat sink |
US20040194936A1 (en) * | 2001-08-10 | 2004-10-07 | Kahoru Torii | Heat transfer device |
US20070051502A1 (en) * | 2004-05-19 | 2007-03-08 | Showa Denko K.K. | Heat exchanger fin, heat exchanger, condensers, and evaporators |
US20080121385A1 (en) * | 2006-11-28 | 2008-05-29 | Hyundai Mobis Co., Ltd. | Heat dissipation fin for heat exchangers |
US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20090014159A1 (en) * | 2005-12-28 | 2009-01-15 | Kouichi Nishino | Heat transfer device |
US20090199585A1 (en) * | 2006-03-23 | 2009-08-13 | Matsushita Electric Industrial Co., Ltd. | Fin-tube heat exchanger, fin for heat exchanger, and heat pump apparatus |
US20100025013A1 (en) * | 2008-07-31 | 2010-02-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
CN201488626U (en) * | 2009-07-09 | 2010-05-26 | 跃腾科技股份有限公司 | Heat tube type radiating fin capable of generating vortex |
US7961462B2 (en) * | 2009-05-28 | 2011-06-14 | Alcatel Lucent | Use of vortex generators to improve efficacy of heat sinks used to cool electrical and electro-optical components |
US8505618B2 (en) * | 2006-04-21 | 2013-08-13 | Panasonic Corporation | Heat transfer fin and fin-tube heat exchanger |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6578627B1 (en) * | 2001-12-28 | 2003-06-17 | Industrial Technology Research Institute | Pattern with ribbed vortex generator |
US20060231241A1 (en) * | 2005-04-18 | 2006-10-19 | Papapanu Steven J | Evaporator with aerodynamic first dimples to suppress whistling noise |
CN100389493C (en) * | 2005-05-29 | 2008-05-21 | 富准精密工业(深圳)有限公司 | Heat sink |
USD597497S1 (en) * | 2007-10-26 | 2009-08-04 | Delta Electronics Inc. | Heat dissipating module |
US8359745B2 (en) * | 2009-07-29 | 2013-01-29 | Cpumate Inc. | Method for manufacturing a heat sink |
CN102116586B (en) * | 2009-12-30 | 2013-11-06 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
TWM403012U (en) * | 2010-11-03 | 2011-05-01 | Enermax Tech Corporation | Heat dissipating device having swirl generator |
USD662897S1 (en) * | 2011-01-04 | 2012-07-03 | Technicolor S.A. | Heat sink |
CN102970851B (en) * | 2012-11-16 | 2015-07-22 | 东莞汉旭五金塑胶科技有限公司 | Heat pipe radiator |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
USD699690S1 (en) * | 2013-03-29 | 2014-02-18 | Silverstone Technology Co., Ltd. | Cooling fin |
USD722574S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | Power heat sink with hybrid vapor chamber—heat pipe module |
TWI508653B (en) * | 2014-06-10 | 2015-11-11 | Wistron Corp | Detachable guiding mechanism and related electronic device |
CN204904199U (en) * | 2015-09-10 | 2015-12-23 | 酷码科技股份有限公司 | Heat abstractor and fan and fan module thereof |
-
2010
- 2010-11-03 TW TW099221252U patent/TWM403012U/en not_active IP Right Cessation
-
2011
- 2011-01-28 DE DE202011002064U patent/DE202011002064U1/en not_active Expired - Lifetime
- 2011-03-09 JP JP2011001258U patent/JP3167993U/en not_active Expired - Lifetime
- 2011-05-13 US US13/106,938 patent/US20120103572A1/en not_active Abandoned
-
2016
- 2016-03-01 US US29/556,581 patent/USD802543S1/en active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1853315A (en) * | 1925-09-25 | 1932-04-12 | Modine Mfg Co | Radiator |
US4830102A (en) * | 1980-03-11 | 1989-05-16 | Kulkereskedelmi Transelektro Magyar Villamossagi Vallalat | Turbulent heat exchanger |
US4817709A (en) * | 1987-12-02 | 1989-04-04 | Carrier Corporation | Ramp wing enhanced plate fin |
US5567395A (en) * | 1994-04-21 | 1996-10-22 | Nippon Soken, Inc. | Catalyst carrier for a catalytic converter for purifying an exhaust gas in an internal combustion engine |
US5730214A (en) * | 1997-01-16 | 1998-03-24 | General Motors Corporation | Heat exchanger cooling fin with varying louver angle |
US20030024687A1 (en) * | 2001-07-31 | 2003-02-06 | Cheng Chung Pin | Radiation fin set for heat sink |
US20040194936A1 (en) * | 2001-08-10 | 2004-10-07 | Kahoru Torii | Heat transfer device |
US20070051502A1 (en) * | 2004-05-19 | 2007-03-08 | Showa Denko K.K. | Heat exchanger fin, heat exchanger, condensers, and evaporators |
US20090014159A1 (en) * | 2005-12-28 | 2009-01-15 | Kouichi Nishino | Heat transfer device |
US20090199585A1 (en) * | 2006-03-23 | 2009-08-13 | Matsushita Electric Industrial Co., Ltd. | Fin-tube heat exchanger, fin for heat exchanger, and heat pump apparatus |
US8505618B2 (en) * | 2006-04-21 | 2013-08-13 | Panasonic Corporation | Heat transfer fin and fin-tube heat exchanger |
US20080121385A1 (en) * | 2006-11-28 | 2008-05-29 | Hyundai Mobis Co., Ltd. | Heat dissipation fin for heat exchangers |
US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20100025013A1 (en) * | 2008-07-31 | 2010-02-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7961462B2 (en) * | 2009-05-28 | 2011-06-14 | Alcatel Lucent | Use of vortex generators to improve efficacy of heat sinks used to cool electrical and electro-optical components |
CN201488626U (en) * | 2009-07-09 | 2010-05-26 | 跃腾科技股份有限公司 | Heat tube type radiating fin capable of generating vortex |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD802543S1 (en) * | 2010-11-03 | 2017-11-14 | Enermax Technology Corporation | Cooling fin |
US20150090435A1 (en) * | 2013-09-29 | 2015-04-02 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
US11604035B2 (en) * | 2013-09-29 | 2023-03-14 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
US20160353606A1 (en) * | 2015-05-26 | 2016-12-01 | Lsis Co., Ltd. | Closed cabinet for electric device having heat pipe |
CN110476246A (en) * | 2017-03-24 | 2019-11-19 | 松下知识产权经营株式会社 | Radiator and power generator |
US10739832B2 (en) * | 2018-10-12 | 2020-08-11 | International Business Machines Corporation | Airflow projection for heat transfer device |
US20220136784A1 (en) * | 2020-10-30 | 2022-05-05 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
US11781818B2 (en) * | 2020-10-30 | 2023-10-10 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
TWI812136B (en) * | 2022-03-31 | 2023-08-11 | 宏碁股份有限公司 | Electronic device, heat dissipation assembly, and thermal fin thereof |
Also Published As
Publication number | Publication date |
---|---|
DE202011002064U1 (en) | 2011-03-31 |
TWM403012U (en) | 2011-05-01 |
USD802543S1 (en) | 2017-11-14 |
JP3167993U (en) | 2011-05-26 |
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