US20110273840A1 - Server and cooler moduel arrangement - Google Patents
Server and cooler moduel arrangement Download PDFInfo
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- US20110273840A1 US20110273840A1 US12/773,265 US77326510A US2011273840A1 US 20110273840 A1 US20110273840 A1 US 20110273840A1 US 77326510 A US77326510 A US 77326510A US 2011273840 A1 US2011273840 A1 US 2011273840A1
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- server
- cooler module
- operating system
- accommodation chamber
- electronic device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
Definitions
- the present invention relates to server cooling technology and more particularly, to a server and cooler module arrangement, which has fans arranged at different elevations to aim at different heat sources for quick dissipation of waste heat during operation of the server.
- cooling fans In order to prevent accumulation of waste heat in a computer, for example, server computer, multiple cooling fans are usually used. Cooling fans use air as a medium to dissipate heat without damaging electronic component parts. Subject to a reasonable design, cooling fans can effectively carry waste heat away from a server computer, avoiding accumulation of waste heat.
- a bracket B is mounted inside a server A to support a plurality of cooling fans B 1 that are operable to send cooling air toward a circuit board A 1 , a power supply device A 2 and electronic devices A 3 (mobile HDD, CD-ROM, and etc.).
- the cooling fans B 1 are fixedly mounted on the bracket B at fixed locations to send air in predetermined directions.
- the positions of the cooling fans B 1 cannot be separately adjusted to aim at the respective heat sources at the circuit board A 1 , power supply device A 2 and electronic devices A 3 .
- the cooling fans B 1 cannot accurately send air toward the respective heat sources at the circuit board A 1 , power supply device A 2 and electronic devices A 3 to effectively carry waste heat away from the internal space of the server A to the outside open air.
- the server A may have new electronic parts and electronic devices A 3 installed therein.
- the cooling fans B 1 cannot be adjusted to send cooling air toward the new heat sources, causing accumulation of waste heat in the server A.
- the circuit board A 1 and the power supply device A 2 may be respectively equipped with a respective mini fan for cooling.
- the working directions of the cooling fans B 1 may be unable to effectively carry exhaust air of the mini fans of the circuit board A 1 and the power supply device A 2 away from the internal space of the server A, causing accumulation of waste heat in the server A.
- the present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a server and cooler module arrangement, which allows adjustment of the positions of cooling fans subject to the locations of the heat sources so that waste heat can be quickly carried away from the server during operation of the server.
- a server and cooler module arrangement comprises a server, and a cooler module mounted in the server for carrying waste heat out of the server efficiently.
- the server comprises an accommodation chamber, a partition way defined in the accommodation chamber, an operating system and an electronic device arranged in a stack in the accommodation chamber at one side relative to the partition way, an access device unit arranged in the accommodation chamber at an opposite side relative to the partition way, and a plurality of thermal zones located on an outer side of the operating system in communication with the space outside the server.
- the cooler module comprises a rack mounted in the partition way and having a plurality of open frames, and a plurality of fans respectively adjustably mounted in the open frames and respectively aimed at the operating system, the electronic device and the access device unit for drawing air or sending air toward the operating system, the electronic device and the access device unit to dissipate waste heat.
- the fans are adjustably mounted in the open frames of the rack at different elevations and respectively aimed at the operating system, the electronic device and the access device unit for drawing air or sending air toward different heat sources at the operating system, the electronic device and the access device unit for quick dissipation of waste heat.
- FIG. 1 is an elevational view of a server and cooler module arrangement according to the present invention.
- FIG. 2 illustrates the internal structure of the server and cooler module arrangement in accordance with the present invention after opening of the top cover panel.
- FIG. 3 is a perspective view of the server and cooler arrangement according to the present invention.
- FIG. 4 is an exploded view of the server and cooler module arrangement according to the present invention.
- FIG. 5 is a schematic sectional side view of the server and cooler module arrangement according to the present invention.
- FIG. 6 is an elevational assembly view of a part of the server and cooler module arrangement according to the present invention.
- FIG. 7 illustrates the arrangement of fans in a server according to the prior art.
- a server and cooler module arrangement in accordance with the present invention is shown comprising a server 1 and a cooler module 2 .
- the server 1 comprises an accommodation chamber 10 , an operating system 11 and an electronic device 12 arranged in a stack in the accommodation chamber 10 at one side, an access device unit 13 arranged in the accommodation chamber 10 at an opposite side, and a partition way 14 defined between the stack of the operating system 11 and electronic device 12 and the access device unit 13 .
- the operating system 11 comprises a circuit board 111 carrying a circuit layout, a power supply device 112 and other requisite electronic components, an isolation frame 113 covering the circuit board 111 and the power supply device 112 and a plurality of thermal zones 114 located on the isolation frame 113 adjacent to the circuit board 111 in communication between the space inside the operating system 11 and the space outside the server 1 . Further, the electronic device 12 is stacked on the top side of the isolation frame 113 of the operating system 11 .
- the cooler module 2 comprises a rack 21 having a plurality of open frames 210 , and a plurality of fans 22 respectively adjustably mounted in the open frames 210 at different elevations.
- the mounting arrangement between each fan 22 and the associating open frame 210 allows adjustment of the fan 22 relative to the rack 21 to the desired elevation and position.
- the rack 21 of the cooler module 2 is mounted in the partition way 14 inside the accommodation chamber 10 between the stack of the operating system 11 and electronic device 12 and the access device unit 13 , and then the fans 22 are respectively mounted in the open frames 210 and respectively adjusted to the respective optimal positions corresponding to the circuit board 111 , the power supply device 112 , the electronic device 12 and the access device unit 13 to draw air or send air, avoiding accumulation of heat in the server 1 .
- the aforesaid electronic device 12 and access device unit 13 include at least one mobile hard disk drive (2.5-inch HDD or 3.5-inch HDD), at least one CD-ROM, at least one multimedia access device and other electronic tools for server application.
- the thermal zones 114 are heat dissipation holes in communication between the inside space of the server 1 and the atmosphere.
- the open frames 210 are rectangular frames spaced on the rack 21 .
- the fans 22 are respectively mounted in the open frames 210 and respectively adjusted to the desired elevations and positions and then respectively affixed to the rack 21 with fastening members, for example, screws. Further, the open frames 210 can be formed integral with one another, i.e., the rack 21 is a single-piece member.
- the open frames 210 can be separately made and then fastened together to form the rack 21 .
- baffles 211 are affixed to the rack 21 to block the gaps in the open frames 210 outside the fans 22 , avoiding air rampant, backflow or air disturbance, and lowering the noise level.
- the partition way 14 is defined in the server 1 between the stack of the operating system 11 and electronic device 12 and the access device unit 13 in the accommodation chamber 10 , and the rack 21 of the cooler module 2 is mounted in the partition way 14 inside the accommodation chamber 10 to hold the fans 22 in the open frames 210 thereof in the respective optimal positions corresponding to the circuit board 111 , the power supply device 112 , the electronic device 12 and the access device unit 13 .
- the fan 22 can draw air or send air to carry waste heat away from the heat source (CPU, IC chip, interface card or electronic component at the circuit board 111 or in the electronic device 12 ) of the server 1 through the thermal zones 114 .
- the fans 22 can also carry exhaust air from a system fan 115 of the operating system 11 and the internal fan (not shown) of the power supply device 12 out of the server 1 through the thermal zones 114 , avoiding accumulation of heat in the accommodation chamber 10 of the server 1 .
- the stack of the operating system 11 , the electronic device 12 and the access device unit 13 are arranged in the accommodation chamber 10 subject to their heat energy releasing characteristics so that high energy heat sources and low energy heat sources are arranged at different elevations.
- the fans 22 are vertically adjustably mounted in the open frames 210 of the rack 21 to draw air or send air toward the respective heat sources, thereby carrying waste heat away from the respective heat sources of the server 1 to the outside open air through the thermal zones 114 rapidly and efficiently.
- the effective utilization of the space of the accommodation chamber 10 for the arrangement of different heat sources of the server 1 avoids accumulation of waste heat in a particular place inside the accommodation chamber 10 , facilitating heat dissipation.
- the access device unit 13 which is mounted in the accommodation chamber 10 at one side of the partition way 14 opposite to the stack of the operating system 11 and electronic device 12 , comprises a casing 131 that defines therein a plurality of compartments 130 , and at least one mobile hard disk drive (2.5-inch HDD or 3.5-inch HDD) and at least one CD-ROM and/or at least one multimedia access device respectively mounted in the compartments 130 inside the casing 131 .
- the modularized design of the access device unit 13 the casing 131 in facilitates its installation in the accommodation chamber 10 . Thus, the installation of the access device unit 13 requires less installation time and labor.
- the server and cooler module arrangement comprises a server 1 , which defines therein an accommodation chamber 10 and a partition way 14 in the accommodation chamber 10 and accommodates a stack of an operating system 11 and an electronic device 12 in the accommodation chamber 10 at one side relative to the partition way 14 and an access device unit 13 in the accommodation chamber 10 at an opposite side relative to the partition way 14 , and a cooler module 2 , which comprises a rack 21 mounted in the partition way 14 in the accommodation chamber 10 of the server 1 and a plurality of fans 22 respectively adjustably mounted in respective open frames 210 at two opposite sides at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system 11 , the electronic device 12 and the access device unit 13 for quick dissipation of waste heat.
- a server 1 which defines therein an accommodation chamber 10 and a partition way 14 in the accommodation chamber 10 and accommodates a stack of an operating system 11 and an electronic device 12 in the accommodation chamber 10 at one side relative to the partition way 14 and an access device unit 13 in the accommodation chamber 10 at an opposite side relative to the
- the positions of the fans 22 are adjustable so that the fans 22 can draw air or send air to carry waste heat away from the operating system 11 , the electronic device 12 and the access device unit 13 efficiently, avoiding accumulation of waste heat in the server 1 and assuring smooth functioning of the operating system 11 , the electronic device 12 and the access device unit 13 .
- server and cooler module arrangement of the present invention has the following advantages and features:
- the operating system 11 and the electronic device 12 are arranged in a stack in the accommodation chamber 10 , and the positions of the fans 22 are adjustable subject to the elevations of the heat sources in the operating system 11 and the electronic device 12 so that the fans 22 can draw air or send air to carry waste heat away from the operating system 11 and the electronic device 12 efficiently.
- the fans 22 of the cooler module 2 are operated to carry exhaust air from the system fan 115 of the operating system 11 and the internal fan of the power supply device 12 out of the server 1 through the thermal zones 114 , avoiding accumulation of waste heat in the accommodation chamber 10 of the server 1 .
- the operating system and the electronic device are arranged in a stack in the accommodation chamber of the server at one side
- the access device unit is arranged in the accommodation chamber at an opposite side
- the rack of the cooler module is set in the accommodation chamber between the stack of operation system and electronic device and the access device unit with the fans respectively adjustably mounted in respective open frames at different elevations for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.
Abstract
Description
- 1. Field of the Invention
- The present invention relates to server cooling technology and more particularly, to a server and cooler module arrangement, which has fans arranged at different elevations to aim at different heat sources for quick dissipation of waste heat during operation of the server.
- 2. Description of the Related Art
- Following fast development of semiconductor technology, the packaging density of electronic devices is comparatively higher, and the size of electronic devices is comparatively smaller. High-speed electronic devices consume much electric energy, and release much heat energy during operation. If waste heat is not quickly carried away, the problems of electron ionization and thermal stress may occur, lowering system stability and reliability and shortening the lifespan of the electronic components. Therefore, heat dissipation is an important issue to be settled.
- Nowadays, computer has been intensively used as tool means in many different fields for different purposes. The life cycle of computer becomes short to meet marketing requirement. In consequence, the replacement rate and culling rate of computer electronic components, such as CPU (central processing unit) and GPU (graphic processing unit), are high. During operation of a computer, the CPU(s), IC chips, power supply device, CD-ROM and other electronic components of the operating system will release waste heat. If waste heat from the CPU(s), IC chips, power supply device, CD-ROM and other electronic components of the operating system is not quickly dissipated, it will be accumulated in the computer, affecting normal functioning of the CPU(s), IC chips, power supply device, CD-ROM and electronic components of the operating system. In order to prevent accumulation of waste heat in a computer, for example, server computer, multiple cooling fans are usually used. Cooling fans use air as a medium to dissipate heat without damaging electronic component parts. Subject to a reasonable design, cooling fans can effectively carry waste heat away from a server computer, avoiding accumulation of waste heat.
- According to the prior art, as shown in
FIG. 7 , a bracket B is mounted inside a server A to support a plurality of cooling fans B1 that are operable to send cooling air toward a circuit board A1, a power supply device A2 and electronic devices A3 (mobile HDD, CD-ROM, and etc.). The cooling fans B1 are fixedly mounted on the bracket B at fixed locations to send air in predetermined directions. According to this design, the positions of the cooling fans B1 cannot be separately adjusted to aim at the respective heat sources at the circuit board A1, power supply device A2 and electronic devices A3. Thus, the cooling fans B1 cannot accurately send air toward the respective heat sources at the circuit board A1, power supply device A2 and electronic devices A3 to effectively carry waste heat away from the internal space of the server A to the outside open air. - Therefore, the aforesaid prior art design has drawbacks as follows:
- 1. To fit different operation and control requirements, the server A may have new electronic parts and electronic devices A3 installed therein. When new electronic parts and electronic devices A3 are installed in the server A, the cooling fans B1 cannot be adjusted to send cooling air toward the new heat sources, causing accumulation of waste heat in the server A.
- 2. The circuit board A1 and the power supply device A2 may be respectively equipped with a respective mini fan for cooling. The working directions of the cooling fans B1 may be unable to effectively carry exhaust air of the mini fans of the circuit board A1 and the power supply device A2 away from the internal space of the server A, causing accumulation of waste heat in the server A.
- Therefore, it is desirable to provide a server and cooler module arrangement, which dissipates waste heat rapidly during operation of the server, preventing accumulation of waste heat in the server.
- The present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a server and cooler module arrangement, which allows adjustment of the positions of cooling fans subject to the locations of the heat sources so that waste heat can be quickly carried away from the server during operation of the server.
- To achieve this and other objects of the present invention, a server and cooler module arrangement comprises a server, and a cooler module mounted in the server for carrying waste heat out of the server efficiently. The server comprises an accommodation chamber, a partition way defined in the accommodation chamber, an operating system and an electronic device arranged in a stack in the accommodation chamber at one side relative to the partition way, an access device unit arranged in the accommodation chamber at an opposite side relative to the partition way, and a plurality of thermal zones located on an outer side of the operating system in communication with the space outside the server. The cooler module comprises a rack mounted in the partition way and having a plurality of open frames, and a plurality of fans respectively adjustably mounted in the open frames and respectively aimed at the operating system, the electronic device and the access device unit for drawing air or sending air toward the operating system, the electronic device and the access device unit to dissipate waste heat.
- Further, the fans are adjustably mounted in the open frames of the rack at different elevations and respectively aimed at the operating system, the electronic device and the access device unit for drawing air or sending air toward different heat sources at the operating system, the electronic device and the access device unit for quick dissipation of waste heat.
-
FIG. 1 is an elevational view of a server and cooler module arrangement according to the present invention. -
FIG. 2 illustrates the internal structure of the server and cooler module arrangement in accordance with the present invention after opening of the top cover panel. -
FIG. 3 is a perspective view of the server and cooler arrangement according to the present invention. -
FIG. 4 is an exploded view of the server and cooler module arrangement according to the present invention. -
FIG. 5 is a schematic sectional side view of the server and cooler module arrangement according to the present invention. -
FIG. 6 is an elevational assembly view of a part of the server and cooler module arrangement according to the present invention. -
FIG. 7 illustrates the arrangement of fans in a server according to the prior art. - Referring to
FIGS. 1˜5 , a server and cooler module arrangement in accordance with the present invention is shown comprising aserver 1 and acooler module 2. - The
server 1 comprises anaccommodation chamber 10, anoperating system 11 and anelectronic device 12 arranged in a stack in theaccommodation chamber 10 at one side, anaccess device unit 13 arranged in theaccommodation chamber 10 at an opposite side, and apartition way 14 defined between the stack of theoperating system 11 andelectronic device 12 and theaccess device unit 13. Theoperating system 11 comprises acircuit board 111 carrying a circuit layout, apower supply device 112 and other requisite electronic components, anisolation frame 113 covering thecircuit board 111 and thepower supply device 112 and a plurality ofthermal zones 114 located on theisolation frame 113 adjacent to thecircuit board 111 in communication between the space inside theoperating system 11 and the space outside theserver 1. Further, theelectronic device 12 is stacked on the top side of theisolation frame 113 of theoperating system 11. - The
cooler module 2 comprises arack 21 having a plurality ofopen frames 210, and a plurality offans 22 respectively adjustably mounted in theopen frames 210 at different elevations. The mounting arrangement between eachfan 22 and the associatingopen frame 210 allows adjustment of thefan 22 relative to therack 21 to the desired elevation and position. - During installation, the
rack 21 of thecooler module 2 is mounted in thepartition way 14 inside theaccommodation chamber 10 between the stack of theoperating system 11 andelectronic device 12 and theaccess device unit 13, and then thefans 22 are respectively mounted in theopen frames 210 and respectively adjusted to the respective optimal positions corresponding to thecircuit board 111, thepower supply device 112, theelectronic device 12 and theaccess device unit 13 to draw air or send air, avoiding accumulation of heat in theserver 1. - The aforesaid
electronic device 12 andaccess device unit 13 include at least one mobile hard disk drive (2.5-inch HDD or 3.5-inch HDD), at least one CD-ROM, at least one multimedia access device and other electronic tools for server application. Thethermal zones 114 are heat dissipation holes in communication between the inside space of theserver 1 and the atmosphere. Theopen frames 210 are rectangular frames spaced on therack 21. Thefans 22 are respectively mounted in theopen frames 210 and respectively adjusted to the desired elevations and positions and then respectively affixed to therack 21 with fastening members, for example, screws. Further, theopen frames 210 can be formed integral with one another, i.e., therack 21 is a single-piece member. Alternatively, theopen frames 210 can be separately made and then fastened together to form therack 21. After installation of thefans 22 in theopen frames 210 of therack 21,baffles 211 are affixed to therack 21 to block the gaps in theopen frames 210 outside thefans 22, avoiding air rampant, backflow or air disturbance, and lowering the noise level. - Referring to
FIG. 6 andFIGS. 3-5 again, thepartition way 14 is defined in theserver 1 between the stack of theoperating system 11 andelectronic device 12 and theaccess device unit 13 in theaccommodation chamber 10, and therack 21 of thecooler module 2 is mounted in thepartition way 14 inside theaccommodation chamber 10 to hold thefans 22 in theopen frames 210 thereof in the respective optimal positions corresponding to thecircuit board 111, thepower supply device 112, theelectronic device 12 and theaccess device unit 13. Thus, thefan 22 can draw air or send air to carry waste heat away from the heat source (CPU, IC chip, interface card or electronic component at thecircuit board 111 or in the electronic device 12) of theserver 1 through thethermal zones 114. Thefans 22 can also carry exhaust air from asystem fan 115 of theoperating system 11 and the internal fan (not shown) of thepower supply device 12 out of theserver 1 through thethermal zones 114, avoiding accumulation of heat in theaccommodation chamber 10 of theserver 1. - Further, the stack of the
operating system 11, theelectronic device 12 and theaccess device unit 13 are arranged in theaccommodation chamber 10 subject to their heat energy releasing characteristics so that high energy heat sources and low energy heat sources are arranged at different elevations. Further, thefans 22 are vertically adjustably mounted in theopen frames 210 of therack 21 to draw air or send air toward the respective heat sources, thereby carrying waste heat away from the respective heat sources of theserver 1 to the outside open air through thethermal zones 114 rapidly and efficiently. Thus, the effective utilization of the space of theaccommodation chamber 10 for the arrangement of different heat sources of theserver 1 avoids accumulation of waste heat in a particular place inside theaccommodation chamber 10, facilitating heat dissipation. - Further, the
access device unit 13, which is mounted in theaccommodation chamber 10 at one side of thepartition way 14 opposite to the stack of theoperating system 11 andelectronic device 12, comprises acasing 131 that defines therein a plurality ofcompartments 130, and at least one mobile hard disk drive (2.5-inch HDD or 3.5-inch HDD) and at least one CD-ROM and/or at least one multimedia access device respectively mounted in thecompartments 130 inside thecasing 131. The modularized design of theaccess device unit 13 thecasing 131 in facilitates its installation in theaccommodation chamber 10. Thus, the installation of theaccess device unit 13 requires less installation time and labor. - It is to be understood that the disclosure of the aforesaid preferred embodiment is simply an example of the present invention but not a limitation. In general, the server and cooler module arrangement comprises a
server 1, which defines therein anaccommodation chamber 10 and apartition way 14 in theaccommodation chamber 10 and accommodates a stack of anoperating system 11 and anelectronic device 12 in theaccommodation chamber 10 at one side relative to thepartition way 14 and anaccess device unit 13 in theaccommodation chamber 10 at an opposite side relative to thepartition way 14, and acooler module 2, which comprises arack 21 mounted in thepartition way 14 in theaccommodation chamber 10 of theserver 1 and a plurality offans 22 respectively adjustably mounted in respectiveopen frames 210 at two opposite sides at different elevations and adapted for drawing air or sending air toward different heat sources in theoperating system 11, theelectronic device 12 and theaccess device unit 13 for quick dissipation of waste heat. The positions of thefans 22 are adjustable so that thefans 22 can draw air or send air to carry waste heat away from theoperating system 11, theelectronic device 12 and theaccess device unit 13 efficiently, avoiding accumulation of waste heat in theserver 1 and assuring smooth functioning of theoperating system 11, theelectronic device 12 and theaccess device unit 13. - As indicated above, the server and cooler module arrangement of the present invention has the following advantages and features:
- 1. The
operating system 11 and theelectronic device 12 are arranged in a stack in theaccommodation chamber 10, and the positions of thefans 22 are adjustable subject to the elevations of the heat sources in theoperating system 11 and theelectronic device 12 so that thefans 22 can draw air or send air to carry waste heat away from theoperating system 11 and theelectronic device 12 efficiently. - 2. During operation of the
system fan 115 of theoperating system 11 and the internal fan of thepower supply device 12 to dissipate waste heat, thefans 22 of thecooler module 2 are operated to carry exhaust air from thesystem fan 115 of theoperating system 11 and the internal fan of thepower supply device 12 out of theserver 1 through thethermal zones 114, avoiding accumulation of waste heat in theaccommodation chamber 10 of theserver 1. - In conclusion, the operating system and the electronic device are arranged in a stack in the accommodation chamber of the server at one side, the access device unit is arranged in the accommodation chamber at an opposite side, and the rack of the cooler module is set in the accommodation chamber between the stack of operation system and electronic device and the access device unit with the fans respectively adjustably mounted in respective open frames at different elevations for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.
- Although a particular embodiment of the invention has been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention.
Claims (7)
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CN103809711B (en) * | 2012-11-12 | 2017-07-14 | 英业达科技有限公司 | Electronic installation |
US9713289B2 (en) | 2013-01-28 | 2017-07-18 | Ch2M Hill Engineers, Inc. | Modular pod |
USD754664S1 (en) * | 2013-03-15 | 2016-04-26 | Ch2M Hill Engineers, Inc. | Modular pod |
US9653124B2 (en) * | 2014-09-04 | 2017-05-16 | Liqid Inc. | Dual-sided rackmount storage assembly |
CN104375597B (en) * | 2014-11-25 | 2017-09-19 | 英业达科技有限公司 | Server |
JP2016170712A (en) * | 2015-03-13 | 2016-09-23 | 株式会社東芝 | Server system and storage device |
JP6339035B2 (en) * | 2015-03-13 | 2018-06-06 | 東芝メモリ株式会社 | Electronics |
US20170262029A1 (en) * | 2016-03-14 | 2017-09-14 | Intel Corporation | Data storage system with parallel array of dense memory cards and high airflow |
US11385689B2 (en) | 2016-10-26 | 2022-07-12 | Intel Corporation | Integrated electronic card front EMI cage and latch for data storage system |
US10795842B2 (en) | 2017-05-08 | 2020-10-06 | Liqid Inc. | Fabric switched graphics modules within storage enclosures |
US10019042B1 (en) * | 2017-06-13 | 2018-07-10 | David Franklin | Server using single board computer |
US10849253B2 (en) * | 2017-09-28 | 2020-11-24 | Hewlett Packard Enterprise Development Lp | Interconnected modular server and cooling means |
US10430333B2 (en) | 2017-09-29 | 2019-10-01 | Intel Corporation | Storage system with interconnected solid state disks |
US10856436B2 (en) * | 2019-01-31 | 2020-12-01 | Seagate Technology Llc | Multilevel enclosure cooling |
US10585827B1 (en) | 2019-02-05 | 2020-03-10 | Liqid Inc. | PCIe fabric enabled peer-to-peer communications |
TWM583667U (en) * | 2019-05-24 | 2019-09-11 | 勤誠興業股份有限公司 | Server device |
US11416353B2 (en) * | 2019-09-13 | 2022-08-16 | Dell Products L.P. | DIMM voltage regulator soft start-up for power fault detection |
US11550370B2 (en) | 2020-10-30 | 2023-01-10 | Seagate Technology Llc | Modular data storage systems |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4918572A (en) * | 1988-12-27 | 1990-04-17 | Motorola Computer X, Inc. | Modular electronic package |
US5398161A (en) * | 1993-07-23 | 1995-03-14 | Excel, Inc. | Telecommunications switch chassis having housing with front and rear compartments divided by interior partition and removable cover over rear compartment |
US5816673A (en) * | 1996-10-11 | 1998-10-06 | Sauer; James P. | Computer chassis assembly |
US6088224A (en) * | 1997-12-03 | 2000-07-11 | Emc Corporation | Cabinet for storing a plurality of processing unit modules |
US6115250A (en) * | 1998-01-20 | 2000-09-05 | Dell Usa, Lp | Computer and an assembly and method for cooling a computer |
TW441812U (en) * | 1998-01-21 | 2001-06-16 | Hon Hai Prec Ind Co Ltd | Computer fan position apparatus |
US6392872B1 (en) * | 1999-03-15 | 2002-05-21 | Emc Corporation | Computer system |
DE29904928U1 (en) * | 1999-03-18 | 1999-06-17 | Fritschle Simone | Housing with a fan device and fan device |
JP2001338486A (en) * | 2000-05-25 | 2001-12-07 | Hitachi Ltd | Information memory device |
TW484721U (en) * | 2000-11-06 | 2002-04-21 | Giga Byte Tech Co Ltd | Improved airflow guiding structure of server |
US6817889B2 (en) * | 2001-03-27 | 2004-11-16 | Delta Electronics Inc. | Heat-dissipating module |
JP4312424B2 (en) * | 2002-06-14 | 2009-08-12 | 株式会社日立製作所 | Disk array device |
US6839233B2 (en) * | 2003-01-02 | 2005-01-04 | Dell Products L.P. | Removable fan bay |
US6795314B1 (en) * | 2003-03-25 | 2004-09-21 | Hewlett-Packard Development Company, L.P. | Removable fan module and electronic device incorporating same |
TWM244718U (en) * | 2003-08-22 | 2004-09-21 | Hon Hai Prec Ind Co Ltd | Heat dissipating device employing air duct |
TWM284030U (en) * | 2004-04-06 | 2005-12-21 | Tatung Co | Frame for fixing a heat-dissipating fan |
TWM258329U (en) * | 2004-04-28 | 2005-03-01 | Tatung Co | Screwless fan support fixing structure |
JP4105121B2 (en) * | 2004-05-14 | 2008-06-25 | 富士通株式会社 | Electronic device casing structure and disk array device |
TWM262957U (en) * | 2004-08-23 | 2005-04-21 | Tatung Co | Top-cover plate dismantling structure of the computer server |
CN2756880Y (en) * | 2004-12-11 | 2006-02-08 | 鸿富锦精密工业(深圳)有限公司 | Fan fixing device |
US7920384B2 (en) * | 2005-08-09 | 2011-04-05 | Hewlett-Packard Development Company, L.P. | Fan cage for computer systems |
JP2007133712A (en) * | 2005-11-11 | 2007-05-31 | Hitachi Ltd | Disk array apparatus |
US7481704B2 (en) * | 2005-12-12 | 2009-01-27 | Inventec Corporation | Fan rack fixture having two pairs of positioning and locking portions |
US7643281B2 (en) * | 2006-12-13 | 2010-01-05 | Hitachi, Ltd. | Storage controller |
CN201084085Y (en) * | 2007-07-06 | 2008-07-09 | 鸿富锦精密工业(深圳)有限公司 | Fan installation apparatus |
JP4930429B2 (en) * | 2008-03-28 | 2012-05-16 | 富士通株式会社 | Device for cooling the printed circuit board |
US7839624B2 (en) * | 2009-04-23 | 2010-11-23 | Super Micro Computer Inc. | Industrial computer chassis structure with power source disposed centrally |
CN101963833A (en) * | 2009-07-24 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | Computer case and fan support on same |
CN102043449B (en) * | 2009-10-16 | 2013-06-05 | 鸿富锦精密工业(深圳)有限公司 | Computer case and fan fixing bracket thereon |
US20110116226A1 (en) * | 2009-11-16 | 2011-05-19 | Yi-Lin Yang | Server chassis |
-
2010
- 2010-05-04 US US12/773,265 patent/US8045328B1/en active Active
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