US20110079370A1 - Non-Uniform Height And Density Fin Design For Heat Sink - Google Patents

Non-Uniform Height And Density Fin Design For Heat Sink Download PDF

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Publication number
US20110079370A1
US20110079370A1 US12/836,755 US83675510A US2011079370A1 US 20110079370 A1 US20110079370 A1 US 20110079370A1 US 83675510 A US83675510 A US 83675510A US 2011079370 A1 US2011079370 A1 US 2011079370A1
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Prior art keywords
fins
fin
heat sink
height
maximum height
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US12/836,755
Inventor
Jing Wen
Joseph Sean Brady
Warren W. Clark
Danny McCain
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Textron Innovations Inc
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Textron Inc
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Priority to US12/836,755 priority Critical patent/US20110079370A1/en
Priority to CA 2710331 priority patent/CA2710331A1/en
Assigned to TEXTRON INC. reassignment TEXTRON INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MCCAIN, DANNY, CLARK, WARREN W., BRADY, JOSEPH SEAN, WEN, JING
Publication of US20110079370A1 publication Critical patent/US20110079370A1/en
Assigned to TEXTRON INNOVATIONS INC. reassignment TEXTRON INNOVATIONS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TEXTRON INC., TEXTRON RHODE ISLAND INC.
Abandoned legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to finned heat exchangers and heat sinks.
  • Heat sinks having multiple cooling fins can be used where heat exchange is required to remove heat generated by electrical components.
  • electrical components requiring heat removal in applications such as utility vehicles include power converters, voltage regulators, and/or devices which handle current flow or voltage change for components such as electric motors and the like.
  • a size (length and/or height) and density (spacing between fins) are commonly uniformly set which is generally a function of manufacturing efficiency and having ample space for arranging the cooling fins. Uniform size and density fins are practical when heat distribution is uniform, but can result in localized overheating when, for example, approximately 70% or more of the generated heat flow is concentrated in local areas of the heat sink, and particularly when only non-forced convective cooling flow is available.
  • a heat sink includes a heat sink plate and at least one heat generating electrical component mounted to a first side of the heat sink plate.
  • a plurality of fins is connected and oriented perpendicular to a second side of the heat sink plate.
  • the plurality of fins includes a maximum height fin positioned proximate to a position of the electrical component, and a minimum height fin spatially separated from the maximum height fin and the electrical component.
  • a first group of fins is positioned between the maximum height fin and the minimum height fin. Each fin of the first group of fins progressively decreases in height from a height of the maximum height fin to a height of the minimum height fin.
  • a first spacing between the maximum height fin and a proximate one of the fins of the first group of fins is less than a second spacing between any two consecutive ones of the first group of fins.
  • a heat sink includes a heat sink plate and an electrical component support directly connected to a first side of the heat sink plate having at least one heat generating electrical component mounted to the electrical component support.
  • a plurality of fins is connected and oriented perpendicular to a second side of the heat sink plate.
  • the plurality of fins includes at least one maximum height fin positioned proximate to the electrical component.
  • First and second minimum height fins are each oppositely positioned with respect to the at least one maximum height fin and spatially separated from the electrical component.
  • a first group of fins is positioned between the at least one maximum height fin and the first minimum height fin.
  • Each fin of the first group of fins progressively decreases in height from a height of the at least one maximum height fin to a height of the first minimum height fin.
  • a second group of fins is positioned between the at least one maximum height fin and the second minimum height fin. Each fin of the second group of fins progressively decreases in height from the height of the at least one maximum height fin to a height of the second minimum height fin.
  • a heat sink assembly includes a cover box releasably connected to the heat sink plate.
  • the cover box is adapted to enclose the at least one heat generating electrical component and the first side of the heat sink plate.
  • a method for arranging a plurality of cooling fins of a heat sink includes mounting the at least one heat generating electrical component to a first side of the heat sink plate; extending the plurality of fins perpendicular to a second side of the heat sink plate; positioning the maximum height fin proximate to the electrical component; spatially separating the minimum height fin from the maximum height fin and the electrical component; interposing the first group of fins between the maximum height fin and the minimum height fin; and progressively decreasing a height of each fin of the first group of fins from a height of the maximum height fin to a height of the minimum height fin.
  • FIG. 1 is a left front perspective view of an electrical component having a non-uniform height and density fin design for a heat sink unit of the present disclosure
  • FIG. 2 is a left front perspective view of the non-uniform height and density fin design heat sink unit of FIG. 1 shown with the cover box removed;
  • FIG. 3 is a front elevational view of the non-uniform height and density fin design heat sink unit of FIG. 2 ;
  • FIG. 4 is the front elevational view of the non-uniform height and density fin design heat sink unit of FIG. 3 ;
  • FIG. 5 is a partial front elevational view taken at area 5 of FIG. 2 ;
  • FIG. 6 is a top perspective view of another heat sink assembly of the present disclosure.
  • FIG. 7 is a cross sectional side elevational view taken at section 7 of FIG. 1 ;
  • FIG. 8 is a front elevational view of another embodiment of a heat sink unit.
  • FIG. 9 is a partial front elevational view modified from the view of area 5 of FIG. 2 to show a plurality of waves in lieu of ribs.
  • Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
  • first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
  • Spatially relative terms such as “inner,” “outer,” “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
  • an electrical component 10 can include a cover box 12 which is adapted to a partially enclose a heat sink unit 14 .
  • Heat sink unit 14 includes a heat sink plate 16 having first and second end walls 18 , 20 and a plurality of fins 22 .
  • a handle 24 or similar manual engagement device can be provided with cover box 12 to assist in movement to support connection and removal of cover box 12 to heat sink unit 14 .
  • heat sink unit 14 has each of the plurality of fins 22 connected to a fin contact side 26 .
  • the fins 22 can be formed by machining from a solid block of material having a high coefficient of heat transfer such as metal, including aluminum.
  • the fins 22 and first and second end walls 18 , 20 can also be homogenously formed with heat sink plate 16 using a casting process.
  • At least one and according to several embodiments a plurality of receiving slots 28 ′ 28 ′′, 28 ′′′, 28 ′′′′ can be created on a first side or component attachment side 30 of heat sink plate 16 .
  • each of the receiving slots 28 can be, square-shaped, T-shaped, or dovetail-shaped.
  • An electrical component support 32 is engaged in one of the receiving slots 28 and according to several embodiments is slidably received in receiving slot 28 ′′. Additional electrical component supports (shown in reference to FIG. 8 ) can be engaged in others of the receiving slots 28 .
  • the heat sink plate 16 and the first and second end walls 18 , 20 together with the cover box 12 collectively define an outer perimeter surface enclosing the electrical component support 32 .
  • a plurality of heat generating components such as first, second, third, and fourth heat sources 34 , 36 , 38 , 40 can be fixed to a support face 42 of electrical component support 32 .
  • Heat generated by any of the first, second, third, or fourth heat sources 34 - 40 is substantially removed via a conductive transfer path from electrical component support 32 to heat sink plate 16 in each of a first heat transfer path “A” and a second heat transfer path “B”. From first and second heat transfer paths “A” and “B” heat energy is conductively transferred through the plurality of fins 22 and the first and second end walls 18 , 20 for convective transfer to air surrounding the fins 22 or forced over the fins 22 .
  • a structural reinforcement/connection 44 is created after electrical component support 32 is slidably received within receiving slot 28 ′′.
  • Structural reinforcement/connection 44 can be formed in a plurality of ways including but not limited to the use of a thermally conductive adhesive or by soldering or welding electrical component support 32 to heat sink plate 16 .
  • additional heat sources such as heat source 40 ′ can be directly attached to component attachment side 30 of heat sink plate 16 by fastening and/or adhesive bonding to component attachment side 30 .
  • the plurality of fins 22 are varied with respect to their height measured from fin contact side 26 , as well as their spacing from one another.
  • multiple fins having a maximum fin height “C” are positioned on fin contact side 26 proximate to but oppositely facing with respect to the position of electrical component support 32 on component attachment side 30 .
  • first, second, third, fourth, and fifth maximum height fins 46 , 48 , 50 , 52 , 54 are positioned in a side-by-side relationship with respect to a proximate one of each of the maximum height fins 46 , 48 , 50 , 52 , 54 .
  • each of the maximum height fins 46 , 48 , 50 , 52 , 54 are also commonly spaced at a maximum height fin spacing “D” which is minimized with respect to the spacing of any other ones of the fins 22 .
  • a second reduced height fin 58 positioned to the left of first maximum height fin 46 as viewed in FIG. 3 are spaced from their respective maximum height fin by a fin spacing “E” which is greater than maximum height fin spacing “D”.
  • Each of the fins 22 beginning at first reduced height fin 56 has a sequentially reduced height from each fin to a proximate fin outward to a first minimum height fin 60 positioned proximate to first end wall 18 .
  • each of the fins 22 starting at second reduced height fin 58 extending toward the left as viewed in FIG. 3 has a sequentially reduced fin height extending toward a second minimum height fin 64 positioned proximate to second end wall 20 .
  • the first and second minimum height fins 60 , 64 can each have a minimum fin height “F” which is substantially equal to either first end wall 18 or second end wall 20 , respectively.
  • a minimum height fin spacing “G” between the minimum height fins, for example between first minimum height fin 60 and a descending height fin 62 have a minimum height fin spacing “G” which is greater than either maximum height fin spacing “D” or fin spacing “E”.
  • a plate reinforcement portion 68 can be provided proximate to any one of the receiving slots 28 .
  • a height of an intermediate height fin 66 associated with one of the plate reinforcement portions 68 can be adjusted accordingly to maintain the sequentially decreasing height of fins 22 as they extend away from electrical component support 32 .
  • the height of each of the fins 22 can be measured with respect to a plane 70 centrally disposed through heat sink plate 16 .
  • the present fin geometry maximizes an overall efficiency and heat removal capability of heat sink plate 16 .
  • the overall weight and number of fins 22 is also reduced by increasing fin spacing for the fins extending away from electrical component support 32 toward either first or second end wall 18 , 20 .
  • a first spacing “X” between electronic component support 32 and first end wall 18 can be greater than, equal to, or less than a second spacing “Z” between electronic component support 32 and second end wall 20 depending on the quantity of fins in each of the first or second groups of fins “W” and “Y”.
  • maximum fin height “C” can be approximately 573 mm (2.25 in), and minimum fin height “F” can be 3.43 cm (1.35 in).
  • Maximum height fin spacing “D” can be approximately 7.2 mm (0.28 in), and minimum height fin spacing “G” can be approximately 12.0 mm (0.47 in). The above exemplary dimensions have been found to maintain a maximum temperature differential of approximately 26° C. between third maximum height fin 50 and each of first minimum height fin 60 and second minimum height fin 64 when the maximum temperature is approximately 108° C. due to the heat load from electrical component support 32 , operating in an ambient temperature of 50° C.
  • multiple engagement slots 72 can be located at opposite ends of the heat sink unit 14 as well as centrally located. According to several embodiments an engagement slot 72 is centrally positioned between a first and a second center fin 74 , 76 .
  • the engagement slot 72 opens outward via first and second tapered surfaces 78 , 80 which homogenously join with first and second center fins 74 , 76 .
  • First tapered surface 78 defines an angle alpha ( ⁇ ) with respect to an axis oriented parallel to first and second center fins 74 , 76
  • a second tapered surface 80 defines an angle beta ( ⁇ ) which is similarly created with respect to an axis oriented parallel to first and second center fins 74 , 76 .
  • a second engagement slot 82 is similarly created between first minimum height fin 60 and first end wall 18 and a second engagement slot 82 ′ is created between first minimum height fin 60 and second end wall 20 .
  • Each of the second engagement slots 82 , 82 ′ include a third and fourth tapered surface 84 , 86 similar to first and second tapered surfaces 78 , 80 .
  • An angle gamma ( ⁇ ) is defined by third tapered surface 84 and an axis oriented parallel to first end wall 18 .
  • an angle delta ( ⁇ ) is defined by fourth tapered surface 86 with respect to an axis oriented parallel to first end wall 18 . According to several embodiments, angles ⁇ , ⁇ , ⁇ , and ⁇ are each approximately 60 degrees.
  • a reinforced wall portion 88 which has a reinforcement thickness “T” is provided proximate to receiving slot 28 ′ and similarly provided approximate to receiving slot 28 ′′′′. Reinforcement thickness “T” as previously noted is provided to reinforce heat sink plate 16 proximate to individual ones of the receiving slots 28 .
  • each of the plurality of fins 22 can further include a plurality of raised elements or ribs 90 on both or opposed sides of each fin 22 .
  • Elements or ribs 90 can be oriented in a transverse direction “H” with respect to a height of each individual fin 22 .
  • a wave height “J” can be approximately 50% to 60% of a fin thickness “K” of each of the fins 22 .
  • the plurality of ribs 90 can be created during the casting or manufacturing step which creates fins 22 .
  • the plurality of ribs 90 increases a total heat convection surface area “L” of each of the fins 22 without requiring a further increase in the fin height.
  • ribs 90 can reduce the temperature at any location of the plurality of fins 22 by approximately 3° C. to 5° C. which can increase the heat transfer efficiency of fins 22 by approximately 3% to 7% compared to identically sized fins lacking ribs 90 .
  • a heat exchanger or heat sink 92 can be formed such as by casting a metal such as aluminum to create a heat sink plate 94 having a plurality of raised fins 96 oriented substantially parallel to each other. Each of the plurality of fins 96 at tapering fin ends 100 taper toward a contact point with a plate surface 98 . An opposite raised fin end 102 can be provided for each of the plurality of fins 96 . Individual groups of fins such as center fins 104 , 106 , 108 can be taller or shorter than proximate fins 110 , 112 . Center fins 104 , 106 , 108 can also have a spacing “R” which can be less than, equal to, or greater than a spacing “S” between the remaining fins of the plurality of fins 96 .
  • Ribs 90 can also be angularly oriented with respect to transverse direction “H”. Ribs 90 can be oriented at an angle epsilon ( ⁇ ) ranging from approximately 120 degrees to approximately 150 degrees with respect to a plane 114 defined by heat sink plate 16 .
  • heat sink unit 14 includes a heat sink plate 16 and at least one heat generating electrical component support 32 mounted to the first or component attachment side 30 of the heat sink plate 16 .
  • a plurality of fins 22 is connected and oriented perpendicular to the second or fin contact side 26 of the heat sink plate 16 .
  • the plurality of fins 22 include a maximum height fin 46 positioned on the second side 26 proximate to a position on the first side 30 of the electrical component support 32 .
  • a minimum height fin 60 is connected to the heat sink plate 16 .
  • a first group of fins “W” is positioned between the maximum height fin 54 and the minimum height fin 60 .
  • Each fin of the first group of fins “W” progressively decreases in height from a height “C” of the maximum height fin 54 to a height “F” of the minimum height fin 60 .
  • a first spacing “E” between the maximum height fin 54 and a proximate one or reduced height fin 56 of the fins of the first group of fins “W” is less than or equal to a second spacing “N” between any two consecutive ones of the first group of fins “W”.
  • first and second end walls 18 , 20 are connected to and are oriented perpendicular to the heat sink plate 16 .
  • the plurality of fins 22 is positioned between the first and second end walls 18 , 20 .
  • a second group of fins “Y” includes at least one second maximum height fin 46 , 48 , 50 , 52 positioned proximate the maximum height fin 54 , and a second minimum height fin 64 positioned proximate the second end wall 20 . Consecutive fins of the second group “Y” progressively decrease in height from the height “C” of the second maximum height fin 46 , 48 , 50 , or 52 to the height “F” of the second minimum height fin 64 .
  • a heat sink unit 116 can have two or more electrical component supports 32 ′, 32 ′′ which are slidably disposed in two or more individual ones of the receiving slots 28 ′′, 28 ′′′′ on a component attachment side 30 ′ of a heat sink plate 118 .
  • at least one of the maximum height fins 54 ′, 54 ′′ is positioned on the fin contact side 26 ′ of heat sink plate 118 proximate to the placement of each of the electrical component supports 32 ′, 32 ′′.
  • Additional fins such as intermediate height fins 66 ′, 66 ′′, 66 ′′′, 66 ′′′′ of a first or second group of fins “W 1 ”, “Y 1 ”, or “W 2 ”, “Y 2 ” are positioned between proximate ones of the electrical component supports 32 ′, 32 ′′, and the height of the fins of the first or second groups of fins “W 1 ”, “Y 1 ”, or “W 2 ”, “Y 2 ” can define a wave shape such as an approximately sinusoidal shape, having a minimum height at positions centrally located between the electrical component supports 32 ′, 32 ′′.
  • Local indentations 120 , 122 can be provided at the outward ends of reinforcement areas such as plate reinforcement portion 68 ′. Local indentations 120 , 122 maximize a length of the local fin such as intermediate height fin 66 ′′′′ and minimize a plate reinforcement portion 68 ′ weight.
  • each of the plurality of raised elements created on the fins 22 can further be in the shape of a plurality of raised waves 124 created in each fin 22 .
  • Elements or waves 124 can also be oriented in the transverse direction “H” with respect to a height of each individual fin 22 or oriented at an angle with respect to transverse direction “H”.
  • a wave height “J” can be a percentage of the fin thickness of each of the fins 22 .
  • Waves 124 can have a sinusoidal shape having oppositely directed peaks 126 and valleys 128 .
  • the plurality of waves 124 can be created during a casting or manufacturing step which creates fins 22 .
  • the plurality of waves 124 increases the total heat convection surface area “L” of each of the fins 22 without requiring a further increase in the fin height.
  • the addition of waves 124 can also reduce the temperature at any location of the plurality of fins 22 by approximately 3° C. to 5° C. which can increase the heat transfer efficiency of fins 22 by approximately 3% to 7% compared to identically sized fins lacking waves 124 .
  • the heat sink 14 includes a heat sink plate 16 , at least one heat generating electrical component 40 ′, and a plurality of fins 22 including a maximum height fin 54 , a minimum height fin 60 , and a first group of fins “W”.
  • the method includes steps of: 1) mounting the at least one heat generating electrical component 40 ′ to a first side 30 of the heat sink plate 16 ; 2) extending the plurality of fins 22 perpendicular to the fin contact or second side 26 of the heat sink plate 16 ; 3) positioning the maximum height fin 54 proximate to the electrical component 40 ′; 4) spatially separating the minimum height fin 60 from the maximum height fin 54 and the electrical component 40 ′; 5) interposing the first group of fins between the maximum height fin and the minimum height fin; and 6) progressively decreasing a height of each fin of the first group of fins “W” from a height “C” of the maximum height fin 54 to a height “F” of the minimum height fin 60 .
  • minimum height fin 60 is connected to the heat sink plate 16 as previously provided.
  • the first group of fins “W” is positioned between the maximum height fin 54 and the minimum height fin 60 .
  • the second group of fins “Y” is positioned between the first maximum height fin 46 and the second minimum height fin 64 .
  • Each fin of the first group of fins “W” and the second group of fins “Y” progressively decreases in height from height “C” of the maximum height fins 46 through 54 to height “F” of the first and second minimum height fins 60 , 64 .
  • first spacing “E” between the maximum height fin 54 and the proximate one (first reduced height fin 56 ) of the fins of the first group of fins “W” is greater than or equal to second spacing “N” between any two consecutive ones of the first group of fins “W”. Similar spacing can also be provided between first maximum height fin 46 (or the left hand end-most one of the maximum height fins and second reduced height fin 58 of the second group of fins “Y”.
  • a heat sink of the present disclosure offers several advantages. By predetermining a total number of fins, a maximum height of each of fin, a quantity of ribs or waves and the orientation of those ribs or waves created on each of the fins, and varying both the height and spacing of the fins, the overall heat transfer efficiency of the heat sink is improved by maximizing the temperature of each of the fins during operation including those furthest from the heat source. Fins having a maximum height are positioned approximate to the source of heat and each fin positioned away from those maximum height fins steadily decreases in height outward to a minimum height fin. At the same time, the spacing between the maximum height fins is minimized and the spacing between each consecutive fin extending away from the maximum height fin or fins can be increased.
  • ribs or waves on the fins of the present disclosure also maximizes an efficiency of the fins while minimizing the fin height required for achieving maximum efficiency.
  • a metal such as aluminum is disclosed for certain embodiments of the present disclosure the present disclosure is not limited to the use of metal for the heat sink material. Other materials capable of conductive to convective heat transfer can be used for the fin designs of the present disclosure.

Abstract

A heat sink includes a heat sink plate and a heat generating electrical component mounted to a first side of the heat sink plate. Fins are connected and oriented perpendicular to a second side of the heat sink plate. The fins include a maximum height fin positioned proximate to the electrical component, and a minimum height fin spatially separated from the maximum height fin and the electrical component. A first group of fins is positioned between the maximum and minimum height fins. Each fin of the first group progressively decreases in height from a height of the maximum height fin to a height of the minimum height fin. A first spacing between the maximum height fin and a proximate one of the fins of the first group is less than a second spacing between any two consecutive ones of the first group of fins.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • The present application claims priority from U.S. provisional patent application Ser. No. 61/226,306, filed Jul. 17, 2009, the entire contents of which is hereby incorporated by reference into the present application.
  • FIELD
  • The present disclosure relates to finned heat exchangers and heat sinks.
  • BACKGROUND
  • This section provides background information related to the present disclosure which is not necessarily prior art.
  • Heat sinks having multiple cooling fins can be used where heat exchange is required to remove heat generated by electrical components. Examples of electrical components requiring heat removal in applications such as utility vehicles include power converters, voltage regulators, and/or devices which handle current flow or voltage change for components such as electric motors and the like. A size (length and/or height) and density (spacing between fins) are commonly uniformly set which is generally a function of manufacturing efficiency and having ample space for arranging the cooling fins. Uniform size and density fins are practical when heat distribution is uniform, but can result in localized overheating when, for example, approximately 70% or more of the generated heat flow is concentrated in local areas of the heat sink, and particularly when only non-forced convective cooling flow is available.
  • SUMMARY
  • This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
  • According to several embodiments, a heat sink includes a heat sink plate and at least one heat generating electrical component mounted to a first side of the heat sink plate. A plurality of fins is connected and oriented perpendicular to a second side of the heat sink plate. The plurality of fins includes a maximum height fin positioned proximate to a position of the electrical component, and a minimum height fin spatially separated from the maximum height fin and the electrical component. A first group of fins is positioned between the maximum height fin and the minimum height fin. Each fin of the first group of fins progressively decreases in height from a height of the maximum height fin to a height of the minimum height fin. A first spacing between the maximum height fin and a proximate one of the fins of the first group of fins is less than a second spacing between any two consecutive ones of the first group of fins.
  • According to other embodiments, a heat sink includes a heat sink plate and an electrical component support directly connected to a first side of the heat sink plate having at least one heat generating electrical component mounted to the electrical component support. A plurality of fins is connected and oriented perpendicular to a second side of the heat sink plate. The plurality of fins includes at least one maximum height fin positioned proximate to the electrical component. First and second minimum height fins are each oppositely positioned with respect to the at least one maximum height fin and spatially separated from the electrical component. A first group of fins is positioned between the at least one maximum height fin and the first minimum height fin. Each fin of the first group of fins progressively decreases in height from a height of the at least one maximum height fin to a height of the first minimum height fin. A second group of fins is positioned between the at least one maximum height fin and the second minimum height fin. Each fin of the second group of fins progressively decreases in height from the height of the at least one maximum height fin to a height of the second minimum height fin.
  • According to still other embodiments, a heat sink assembly includes a cover box releasably connected to the heat sink plate. The cover box is adapted to enclose the at least one heat generating electrical component and the first side of the heat sink plate.
  • According to still further embodiments, a method for arranging a plurality of cooling fins of a heat sink includes mounting the at least one heat generating electrical component to a first side of the heat sink plate; extending the plurality of fins perpendicular to a second side of the heat sink plate; positioning the maximum height fin proximate to the electrical component; spatially separating the minimum height fin from the maximum height fin and the electrical component; interposing the first group of fins between the maximum height fin and the minimum height fin; and progressively decreasing a height of each fin of the first group of fins from a height of the maximum height fin to a height of the minimum height fin.
  • Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
  • DRAWINGS
  • The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
  • FIG. 1 is a left front perspective view of an electrical component having a non-uniform height and density fin design for a heat sink unit of the present disclosure;
  • FIG. 2 is a left front perspective view of the non-uniform height and density fin design heat sink unit of FIG. 1 shown with the cover box removed;
  • FIG. 3 is a front elevational view of the non-uniform height and density fin design heat sink unit of FIG. 2;
  • FIG. 4 is the front elevational view of the non-uniform height and density fin design heat sink unit of FIG. 3;
  • FIG. 5 is a partial front elevational view taken at area 5 of FIG. 2;
  • FIG. 6 is a top perspective view of another heat sink assembly of the present disclosure;
  • FIG. 7 is a cross sectional side elevational view taken at section 7 of FIG. 1;
  • FIG. 8 is a front elevational view of another embodiment of a heat sink unit; and
  • FIG. 9 is a partial front elevational view modified from the view of area 5 of FIG. 2 to show a plurality of waves in lieu of ribs.
  • Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.
  • DETAILED DESCRIPTION
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
  • The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a”, “an” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
  • When an element or layer is referred to as being “on”, “engaged to”, “connected to” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to”, “directly connected to” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
  • Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
  • Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
  • Referring to FIG. 1, an electrical component 10 can include a cover box 12 which is adapted to a partially enclose a heat sink unit 14. Heat sink unit 14 includes a heat sink plate 16 having first and second end walls 18, 20 and a plurality of fins 22. A handle 24 or similar manual engagement device can be provided with cover box 12 to assist in movement to support connection and removal of cover box 12 to heat sink unit 14.
  • Referring to FIG. 2, heat sink unit 14 has each of the plurality of fins 22 connected to a fin contact side 26. The fins 22 can be formed by machining from a solid block of material having a high coefficient of heat transfer such as metal, including aluminum. The fins 22 and first and second end walls 18, 20 can also be homogenously formed with heat sink plate 16 using a casting process. At least one and according to several embodiments a plurality of receiving slots 2828″, 28′″, 28″″ can be created on a first side or component attachment side 30 of heat sink plate 16. According to several embodiments, each of the receiving slots 28 can be, square-shaped, T-shaped, or dovetail-shaped. An electrical component support 32 is engaged in one of the receiving slots 28 and according to several embodiments is slidably received in receiving slot 28″. Additional electrical component supports (shown in reference to FIG. 8) can be engaged in others of the receiving slots 28. The heat sink plate 16 and the first and second end walls 18, 20 together with the cover box 12 collectively define an outer perimeter surface enclosing the electrical component support 32.
  • A plurality of heat generating components such as first, second, third, and fourth heat sources 34, 36, 38, 40 can be fixed to a support face 42 of electrical component support 32. Heat generated by any of the first, second, third, or fourth heat sources 34-40 is substantially removed via a conductive transfer path from electrical component support 32 to heat sink plate 16 in each of a first heat transfer path “A” and a second heat transfer path “B”. From first and second heat transfer paths “A” and “B” heat energy is conductively transferred through the plurality of fins 22 and the first and second end walls 18, 20 for convective transfer to air surrounding the fins 22 or forced over the fins 22. To enhance the conductive transfer of heat from electrical component support 32 to heat sink plate 16, a structural reinforcement/connection 44 is created after electrical component support 32 is slidably received within receiving slot 28″. Structural reinforcement/connection 44 can be formed in a plurality of ways including but not limited to the use of a thermally conductive adhesive or by soldering or welding electrical component support 32 to heat sink plate 16. According to additional embodiments, additional heat sources such as heat source 40′ can be directly attached to component attachment side 30 of heat sink plate 16 by fastening and/or adhesive bonding to component attachment side 30.
  • Referring to FIG. 3, to maximize the conductive heat transfer from electrical component support 32 to heat sink plate 16, the plurality of fins 22 are varied with respect to their height measured from fin contact side 26, as well as their spacing from one another. According to several embodiments, multiple fins having a maximum fin height “C” are positioned on fin contact side 26 proximate to but oppositely facing with respect to the position of electrical component support 32 on component attachment side 30. According to several embodiments, first, second, third, fourth, and fifth maximum height fins 46, 48, 50, 52, 54 are positioned in a side-by-side relationship with respect to a proximate one of each of the maximum height fins 46, 48, 50, 52, 54.
  • It has been determined that in addition to positioning the maximum height fins 46, 48, 50, 52, 54 proximate to electrical component support 32, each of the maximum height fins 46, 48, 50, 52, 54 are also commonly spaced at a maximum height fin spacing “D” which is minimized with respect to the spacing of any other ones of the fins 22. For example, a first reduced height fin 56 positioned to the right as viewed in FIG. 3 of fifth maximum height fin 54, and a second reduced height fin 58 positioned to the left of first maximum height fin 46 as viewed in FIG. 3 are spaced from their respective maximum height fin by a fin spacing “E” which is greater than maximum height fin spacing “D”.
  • Each of the fins 22 beginning at first reduced height fin 56 has a sequentially reduced height from each fin to a proximate fin outward to a first minimum height fin 60 positioned proximate to first end wall 18. Similarly, each of the fins 22 starting at second reduced height fin 58 extending toward the left as viewed in FIG. 3 has a sequentially reduced fin height extending toward a second minimum height fin 64 positioned proximate to second end wall 20. The first and second minimum height fins 60, 64 can each have a minimum fin height “F” which is substantially equal to either first end wall 18 or second end wall 20, respectively. A minimum height fin spacing “G” between the minimum height fins, for example between first minimum height fin 60 and a descending height fin 62 have a minimum height fin spacing “G” which is greater than either maximum height fin spacing “D” or fin spacing “E”.
  • To structurally account for the removal of material of heat sink plate 16 proximate to the receiving slots 28, a plate reinforcement portion 68 can be provided proximate to any one of the receiving slots 28. A height of an intermediate height fin 66 associated with one of the plate reinforcement portions 68 can be adjusted accordingly to maintain the sequentially decreasing height of fins 22 as they extend away from electrical component support 32. The height of each of the fins 22 can be measured with respect to a plane 70 centrally disposed through heat sink plate 16. The fin geometry shown in FIG. 3 which positions the maximum height fins proximate to electrical component support 32 minimizes fin spacing of the maximum height fins, and continuously reduces the height of each successive one of the fins 22 extending toward either the first end wall 18 or the second end wall 20, maximizes a temperature of each of the fins 22. The present fin geometry maximizes an overall efficiency and heat removal capability of heat sink plate 16. The overall weight and number of fins 22 is also reduced by increasing fin spacing for the fins extending away from electrical component support 32 toward either first or second end wall 18, 20. A first spacing “X” between electronic component support 32 and first end wall 18 can be greater than, equal to, or less than a second spacing “Z” between electronic component support 32 and second end wall 20 depending on the quantity of fins in each of the first or second groups of fins “W” and “Y”.
  • According to several embodiments and for exemplary purposes only, maximum fin height “C” can be approximately 573 mm (2.25 in), and minimum fin height “F” can be 3.43 cm (1.35 in). Maximum height fin spacing “D” can be approximately 7.2 mm (0.28 in), and minimum height fin spacing “G” can be approximately 12.0 mm (0.47 in). The above exemplary dimensions have been found to maintain a maximum temperature differential of approximately 26° C. between third maximum height fin 50 and each of first minimum height fin 60 and second minimum height fin 64 when the maximum temperature is approximately 108° C. due to the heat load from electrical component support 32, operating in an ambient temperature of 50° C.
  • Referring to FIG. 4, multiple engagement slots 72 can be located at opposite ends of the heat sink unit 14 as well as centrally located. According to several embodiments an engagement slot 72 is centrally positioned between a first and a second center fin 74, 76. The engagement slot 72 opens outward via first and second tapered surfaces 78, 80 which homogenously join with first and second center fins 74, 76. First tapered surface 78 defines an angle alpha (α) with respect to an axis oriented parallel to first and second center fins 74, 76, and a second tapered surface 80 defines an angle beta (β) which is similarly created with respect to an axis oriented parallel to first and second center fins 74, 76. A second engagement slot 82 is similarly created between first minimum height fin 60 and first end wall 18 and a second engagement slot 82′ is created between first minimum height fin 60 and second end wall 20. Each of the second engagement slots 82, 82′ include a third and fourth tapered surface 84, 86 similar to first and second tapered surfaces 78, 80. An angle gamma (γ) is defined by third tapered surface 84 and an axis oriented parallel to first end wall 18. Similarly, an angle delta (δ) is defined by fourth tapered surface 86 with respect to an axis oriented parallel to first end wall 18. According to several embodiments, angles α, β, γ, and δ are each approximately 60 degrees. A reinforced wall portion 88 which has a reinforcement thickness “T” is provided proximate to receiving slot 28′ and similarly provided approximate to receiving slot 28″″. Reinforcement thickness “T” as previously noted is provided to reinforce heat sink plate 16 proximate to individual ones of the receiving slots 28.
  • Referring to FIG. 5, each of the plurality of fins 22 can further include a plurality of raised elements or ribs 90 on both or opposed sides of each fin 22. Elements or ribs 90 can be oriented in a transverse direction “H” with respect to a height of each individual fin 22. A wave height “J” can be approximately 50% to 60% of a fin thickness “K” of each of the fins 22. The plurality of ribs 90 can be created during the casting or manufacturing step which creates fins 22. The plurality of ribs 90 increases a total heat convection surface area “L” of each of the fins 22 without requiring a further increase in the fin height. The addition of ribs 90 can reduce the temperature at any location of the plurality of fins 22 by approximately 3° C. to 5° C. which can increase the heat transfer efficiency of fins 22 by approximately 3% to 7% compared to identically sized fins lacking ribs 90.
  • Referring to FIG. 6, a heat exchanger or heat sink 92 can be formed such as by casting a metal such as aluminum to create a heat sink plate 94 having a plurality of raised fins 96 oriented substantially parallel to each other. Each of the plurality of fins 96 at tapering fin ends 100 taper toward a contact point with a plate surface 98. An opposite raised fin end 102 can be provided for each of the plurality of fins 96. Individual groups of fins such as center fins 104, 106, 108 can be taller or shorter than proximate fins 110, 112. Center fins 104, 106, 108 can also have a spacing “R” which can be less than, equal to, or greater than a spacing “S” between the remaining fins of the plurality of fins 96.
  • Referring to FIG. 7 and again to FIG. 5, as an alternative to being oriented in the transverse direction “H”, ribs 90 can also be angularly oriented with respect to transverse direction “H”. Ribs 90 can be oriented at an angle epsilon (ε) ranging from approximately 120 degrees to approximately 150 degrees with respect to a plane 114 defined by heat sink plate 16.
  • According to several embodiments and referring again to FIGS. 2-3, heat sink unit 14 includes a heat sink plate 16 and at least one heat generating electrical component support 32 mounted to the first or component attachment side 30 of the heat sink plate 16. A plurality of fins 22 is connected and oriented perpendicular to the second or fin contact side 26 of the heat sink plate 16. The plurality of fins 22 include a maximum height fin 46 positioned on the second side 26 proximate to a position on the first side 30 of the electrical component support 32. A minimum height fin 60 is connected to the heat sink plate 16. A first group of fins “W” is positioned between the maximum height fin 54 and the minimum height fin 60. Each fin of the first group of fins “W” progressively decreases in height from a height “C” of the maximum height fin 54 to a height “F” of the minimum height fin 60. A first spacing “E” between the maximum height fin 54 and a proximate one or reduced height fin 56 of the fins of the first group of fins “W” is less than or equal to a second spacing “N” between any two consecutive ones of the first group of fins “W”.
  • According to other embodiments and with further reference to FIGS. 2-3, first and second end walls 18, 20 are connected to and are oriented perpendicular to the heat sink plate 16. The plurality of fins 22 is positioned between the first and second end walls 18, 20. A second group of fins “Y” includes at least one second maximum height fin 46, 48, 50, 52 positioned proximate the maximum height fin 54, and a second minimum height fin 64 positioned proximate the second end wall 20. Consecutive fins of the second group “Y” progressively decrease in height from the height “C” of the second maximum height fin 46, 48, 50, or 52 to the height “F” of the second minimum height fin 64.
  • Referring to FIG. 8, according to still other embodiments, a heat sink unit 116 can have two or more electrical component supports 32′, 32″ which are slidably disposed in two or more individual ones of the receiving slots 28″, 28″″ on a component attachment side 30′ of a heat sink plate 118. In these embodiments, at least one of the maximum height fins 54′, 54″ is positioned on the fin contact side 26′ of heat sink plate 118 proximate to the placement of each of the electrical component supports 32′, 32″. Additional fins such as intermediate height fins 66′, 66″, 66′″, 66″″ of a first or second group of fins “W1”, “Y1”, or “W2”, “Y2” are positioned between proximate ones of the electrical component supports 32′, 32″, and the height of the fins of the first or second groups of fins “W1”, “Y1”, or “W2”, “Y2” can define a wave shape such as an approximately sinusoidal shape, having a minimum height at positions centrally located between the electrical component supports 32′, 32″. Local indentations 120, 122 can be provided at the outward ends of reinforcement areas such as plate reinforcement portion 68′. Local indentations 120, 122 maximize a length of the local fin such as intermediate height fin 66″″ and minimize a plate reinforcement portion 68′ weight.
  • Referring to FIG. 9 and again to FIG. 5, each of the plurality of raised elements created on the fins 22 can further be in the shape of a plurality of raised waves 124 created in each fin 22. Elements or waves 124 can also be oriented in the transverse direction “H” with respect to a height of each individual fin 22 or oriented at an angle with respect to transverse direction “H”. A wave height “J” can be a percentage of the fin thickness of each of the fins 22. Waves 124 can have a sinusoidal shape having oppositely directed peaks 126 and valleys 128. The plurality of waves 124 can be created during a casting or manufacturing step which creates fins 22. The plurality of waves 124, similar to the plurality of ribs 90, increases the total heat convection surface area “L” of each of the fins 22 without requiring a further increase in the fin height. The addition of waves 124 can also reduce the temperature at any location of the plurality of fins 22 by approximately 3° C. to 5° C. which can increase the heat transfer efficiency of fins 22 by approximately 3% to 7% compared to identically sized fins lacking waves 124.
  • According to several embodiments and referring again to FIGS. 2-3, a method is provided for arranging a plurality of cooling fins 22 of a heat sink 14. The heat sink 14 includes a heat sink plate 16, at least one heat generating electrical component 40′, and a plurality of fins 22 including a maximum height fin 54, a minimum height fin 60, and a first group of fins “W”. The method includes steps of: 1) mounting the at least one heat generating electrical component 40′ to a first side 30 of the heat sink plate 16; 2) extending the plurality of fins 22 perpendicular to the fin contact or second side 26 of the heat sink plate 16; 3) positioning the maximum height fin 54 proximate to the electrical component 40′; 4) spatially separating the minimum height fin 60 from the maximum height fin 54 and the electrical component 40′; 5) interposing the first group of fins between the maximum height fin and the minimum height fin; and 6) progressively decreasing a height of each fin of the first group of fins “W” from a height “C” of the maximum height fin 54 to a height “F” of the minimum height fin 60.
  • Referring again to FIG. 3, according to further embodiments, minimum height fin 60 is connected to the heat sink plate 16 as previously provided. The first group of fins “W” is positioned between the maximum height fin 54 and the minimum height fin 60. The second group of fins “Y” is positioned between the first maximum height fin 46 and the second minimum height fin 64. Each fin of the first group of fins “W” and the second group of fins “Y” progressively decreases in height from height “C” of the maximum height fins 46 through 54 to height “F” of the first and second minimum height fins 60, 64. In these embodiments, the first spacing “E” between the maximum height fin 54 and the proximate one (first reduced height fin 56) of the fins of the first group of fins “W” is greater than or equal to second spacing “N” between any two consecutive ones of the first group of fins “W”. Similar spacing can also be provided between first maximum height fin 46 (or the left hand end-most one of the maximum height fins and second reduced height fin 58 of the second group of fins “Y”.
  • A heat sink of the present disclosure offers several advantages. By predetermining a total number of fins, a maximum height of each of fin, a quantity of ribs or waves and the orientation of those ribs or waves created on each of the fins, and varying both the height and spacing of the fins, the overall heat transfer efficiency of the heat sink is improved by maximizing the temperature of each of the fins during operation including those furthest from the heat source. Fins having a maximum height are positioned approximate to the source of heat and each fin positioned away from those maximum height fins steadily decreases in height outward to a minimum height fin. At the same time, the spacing between the maximum height fins is minimized and the spacing between each consecutive fin extending away from the maximum height fin or fins can be increased. The use of ribs or waves on the fins of the present disclosure also maximizes an efficiency of the fins while minimizing the fin height required for achieving maximum efficiency. Although a metal such as aluminum is disclosed for certain embodiments of the present disclosure the present disclosure is not limited to the use of metal for the heat sink material. Other materials capable of conductive to convective heat transfer can be used for the fin designs of the present disclosure.
  • The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the invention, and all such modifications are intended to be included within the scope of the invention.

Claims (32)

1. A heat sink, comprising:
a heat sink plate;
at least one heat generating electrical component mounted to a first side of the heat sink plate;
a plurality of fins connected and oriented perpendicular to a second side of the heat sink plate, the plurality of fins including:
at least one maximum height fin positioned on the second side proximate to a position on the first side of the electrical component;
a minimum height fin spatially separated from the at least one maximum height fin and the electrical component; and
a first group of fins positioned between the at least one maximum height fin and the minimum height fin, each fin of the first group of fins progressively decreasing in height from a height of the at least one maximum height fin to a height of the minimum height fin.
2. The heat sink of claim 1, further including first and second end walls connected to and oriented perpendicular to the heat sink plate wherein the plurality of fins is positioned between the first and second end walls.
3. The heat sink of claim 2, further including an electrical component support directly connected to the first side of the heat sink plate between the first and second end walls, wherein the at least one heat generating electrical component is directly mounted to the electrical component support.
4. The heat sink of claim 2, wherein the plurality of fins is positioned between the first and second end walls having individual ones of the plurality of fins homogenously connected to the heat sink plate.
5. The heat sink of claim 2, wherein the at least one minimum height fin comprises first and second minimum height fins each homogenously connected to the second side of the heat sink plate proximate to one of the first and second end walls.
6. The heat sink of claim 1, wherein the at least one heat generating electrical component is directly mounted in a slot created in the first side of the heat sink plate between the first and second end walls.
7. The heat sink of claim 2, further including:
a second group of fins;
a second minimum height fin positioned proximate the second end wall;
wherein the at least one maximum height fin includes at least first and second maximum height fins positioned proximate to each other; and
wherein consecutive fins of the second group of fins progressively decrease in height from a height of the second maximum height fin to a height of the second minimum height fin.
8. The heat sink of claim 7, further including a first spacing between the first and second maximum height fins being less than or equal to a second spacing between the second maximum height fin and a proximate one of the fins of the second group of fins.
9. The heat sink of claim 1, further including a plurality of raised elements created on opposed sides of all fins of the plurality of fins.
10. The heat sink of claim 9, wherein the raised elements have a height ranging from approximately fifty percent to sixty percent of a fin thickness.
11. The heat sink of claim 1,
wherein the at least one maximum height fin includes at least first and second maximum height fins positioned proximate to each other; and
wherein a first spacing between the first and second maximum height fins and a proximate one of the fins of the first group of fins is less than or equal to a second spacing between any two consecutive ones of the first group of fins.
12. The heat sink of claim 1,
wherein the at least one maximum height fin includes at least first and second maximum height fins positioned proximate to each other; and
wherein a first spacing between the first and second maximum height fins and a proximate one of the fins of the first group of fins is greater than or equal to a second spacing between any two consecutive ones of the first group of fins.
13. A heat sink, comprising:
a heat sink plate;
an electrical component support directly connected to a first side of the heat sink plate having at least one heat generating electrical component mounted to the electrical component support;
a plurality of fins connected and oriented perpendicular to a second side of the heat sink plate, the plurality of fins including:
at least one maximum height fin positioned proximate to the electrical component;
first and second minimum height fins each oppositely positioned with respect to the at least one maximum height fin and spatially separated from the electrical component;
a first group of fins positioned between the at least one maximum height fin and the first minimum height fin, each fin of the first group of fins progressively decreasing in height from a height of the at least one maximum height fin to a height of the first minimum height fin; and
a second group of fins positioned between the at least one maximum height fin and the second minimum height fin, each fin of the second group of fins progressively decreasing in height from the height of the at least one maximum height fin to a height of the second minimum height fin.
14. The heat sink of claim 13, further including a first spacing between the at least one maximum height fin and a proximate one of the fins of the first group of fins being less that a second spacing between any two consecutive ones of the first group of fins.
15. The heat sink of claim 14, further including a second spacing between the at least one maximum height fin and a proximate one of the fins of the second group of fins being less that a third spacing between any two consecutive ones of the second group of fins.
16. The heat sink of claim 15, wherein the at least one maximum height fin includes first, second, and third maximum height fins, each having a height equal to the other ones of the maximum height fins.
17. The heat sink of claim 16, further including a third spacing between the first and second maximum height fins and between the second and third maximum height fins, the third spacing being less than the first and second spacings.
18. The heat sink of claim 13, further including first and second end walls connected to and oriented perpendicular to the heat sink plate wherein the plurality of fins is positioned between the first and second end walls.
19. A heat sink, comprising:
a heat sink plate;
at least one heat generating electrical component mounted to a first side of the heat sink plate;
a plurality of fins connected and oriented perpendicular to a second side of the heat sink plate, the plurality of fins including:
at least one maximum height fin positioned proximate to the at least one electrical component;
at least one minimum height fin spatially separated from the at least one maximum height fin and the at least one electrical component;
a first group of fins positioned between the at least one maximum height fin and the at least one minimum height fin, each fin of the first group of fins progressively decreasing in height from a height of the at least one maximum height fin to a height of the at least one minimum height fin; and
a plurality of raised elements created on opposed sides of each fin of the plurality of fins.
20. The heat sink of claim 19, wherein the raised elements define waves having a wave height ranging from approximately fifty percent to sixty percent of a fin thickness.
21. The heat sink of claim 19, wherein the waves are angularly oriented with respect to a transverse direction of each fin.
22. The heat sink of claim 21, wherein the waves are oriented from approximately 120° to approximately 150° with respect to a plane centrally defined through the heat sink plate.
23. The heat sink of claim 21, wherein the waves are oriented in a transverse direction with respect to a height of the fins.
24. The heat sink of claim 21, wherein the at least one heat generating electrical component comprises two spatially separated heat generating electrical components, the at least one maximum height fin includes two maximum height fins having an individual one of the two maximum height fins positioned proximate to one of the two maximum height fins, and the plurality of fins defines a sinusoidal shape.
25. The heat sink of claim 19, wherein the raised elements define a plurality of oppositely facing ribs on each fin.
26. The heat sink of claim 25, wherein the ribs have a rib height ranging from approximately fifty percent to sixty percent of a fin thickness.
27. A heat sink assembly, comprising:
a heat sink plate;
at least one heat generating electrical component mounted to a first side of the heat sink plate;
a plurality of fins connected and oriented perpendicular to a second side of the heat sink plate, the plurality of fins including:
a maximum height fin positioned proximate to the electrical component;
a minimum height fin spatially separated from the maximum height fin and the electrical component;
a first group of fins positioned between the maximum height fin and the minimum height fin, each fin of the first group of fins progressively decreasing in height from a height of the maximum height fin to a height of the minimum height fin; and
a cover box releasably connected to the heat sink plate and adapted to enclose the at least one heat generating electrical component and the first side of the heat sink plate.
28. The heat sink assembly of claim 27, wherein the heat sink plate further includes at least one engagement slot located on the second side adapted to fastenably connect the cover box to the heat sink plate.
29. The heat sink assembly of claim 28, wherein the at least one engagement slot is defined between opposed tapered surfaces extending away from the at least one engagement slot.
30. The heat sink assembly of claim 28, further including first and second end walls connected to and oriented perpendicular to the heat sink plate wherein the plurality of fins is positioned between the first and second end walls, the heat sink plate and the first and second end walls together with the cover box collectively defining an outer perimeter surface enclosing the at least one heat generating electrical component.
31. A method for arranging a plurality of cooling fins of a heat sink, the heat sink including a heat sink plate, at least one heat generating electrical component, and a plurality of fins including a maximum height fin, a minimum height fin, and a first group of fins, the method comprising:
mounting the at least one heat generating electrical component to a first side of the heat sink plate;
extending the plurality of fins perpendicular to a second side of the heat sink plate;
positioning the maximum height fin proximate to the electrical component;
spatially separating the minimum height fin from the maximum height fin and the electrical component;
interposing the first group of fins between the maximum height fin and the minimum height fin; and
progressively decreasing a height of each fin of the first group of fins from a height of the maximum height fin to a height of the minimum height fin.
32. The method of claim 31, further comprising:
separating the maximum height fin from a proximate one of the fins of the first group of fins by a first spacing; and
separating any two consecutive ones of the first group of fins by a second spacing greater than or equal to the first spacing.
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US20120261108A1 (en) * 2011-04-13 2012-10-18 Siemens Aktiengesellschaft Coupling system between a waste-heat generator and a waste-heat receiver
US9591788B2 (en) * 2011-04-13 2017-03-07 Siemens Aktiengesellschaft Coupling system between a waste-heat generator and a waste-heat receiver
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US11489175B2 (en) 2012-08-14 2022-11-01 Loop Energy Inc. Fuel cell flow channels and flow fields
US10734661B2 (en) 2012-08-14 2020-08-04 Loop Energy Inc. Fuel cell components, stacks and modular fuel cell systems
US11060195B2 (en) 2012-08-14 2021-07-13 Loop Energy Inc. Reactant flow channels for electrolyzer applications
US10686199B2 (en) 2012-08-14 2020-06-16 Loop Energy Inc. Fuel cell flow channels and flow fields
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US9958721B2 (en) 2015-03-19 2018-05-01 Panasonic Intellectual Property Management Co., Ltd. Curved display device
EP3076427A1 (en) * 2015-03-30 2016-10-05 General Electric Technology GmbH Electrical assembly
WO2016156331A1 (en) * 2015-03-30 2016-10-06 General Electric Technology Gmbh Electrical assembly
US11901591B2 (en) 2016-03-22 2024-02-13 Loop Energy Inc. Fuel cell flow field design for thermal management
US10930942B2 (en) 2016-03-22 2021-02-23 Loop Energy Inc. Fuel cell flow field design for thermal management
CN106793690A (en) * 2016-12-19 2017-05-31 四川长虹空调有限公司 Convertible frequency air-conditioner heat spreader structures
JP2020529132A (en) * 2017-07-28 2020-10-01 ツェットカーヴェー グループ ゲーエムベーハー Vehicle floodlight cooler
US11085606B2 (en) * 2017-07-28 2021-08-10 Zkw Group Gmbh Heat sink and vehicle headlight
US20200232621A1 (en) * 2017-07-28 2020-07-23 Zkw Group Gmbh Heat Sink and Vehicle Headlight
US10998253B1 (en) 2019-12-23 2021-05-04 Google Llc Fluid diverting heat sink
US11149937B2 (en) 2020-01-30 2021-10-19 Toyota Motor Engineering & Manufacturing North America, Inc. Functionally graded manifold microchannel heat sinks
US11039550B1 (en) 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures
US11574850B2 (en) 2020-04-08 2023-02-07 Google Llc Heat sink with turbulent structures
WO2022035676A1 (en) * 2020-08-12 2022-02-17 Hgci, Inc, Light fixture including a housing for a ballast
WO2023023816A1 (en) * 2021-08-25 2023-03-02 Arlec Australia Pty Ltd Heater panel
GB2613699A (en) * 2021-11-30 2023-06-14 Eta Green Power Ltd Heatsink
GB2613542A (en) * 2021-11-30 2023-06-14 Eta Green Power Ltd Heatsink
GB2613699B (en) * 2021-11-30 2024-04-10 Eta Green Power Ltd Heatsink
GB2613542B (en) * 2021-11-30 2024-04-10 Eta Green Power Ltd Heatsink
WO2023133318A3 (en) * 2022-01-08 2023-08-10 Hgci, Inc. Light fixture including heat sink for supporting lighting module

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