US20110048677A1 - Heat-conducting assembly for heat pipes of different diameters and heat sink having the same - Google Patents

Heat-conducting assembly for heat pipes of different diameters and heat sink having the same Download PDF

Info

Publication number
US20110048677A1
US20110048677A1 US12/550,647 US55064709A US2011048677A1 US 20110048677 A1 US20110048677 A1 US 20110048677A1 US 55064709 A US55064709 A US 55064709A US 2011048677 A1 US2011048677 A1 US 2011048677A1
Authority
US
United States
Prior art keywords
heat
conducting
pipes
pipe
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/550,647
Inventor
Kuo-Len Lin
Chen-Hsiang Lin
Ken Hsu
Chih-Hung Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CpuMate Inc
Golden Sun News Techniques Co Ltd
Original Assignee
CpuMate Inc
Golden Sun News Techniques Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CpuMate Inc, Golden Sun News Techniques Co Ltd filed Critical CpuMate Inc
Priority to US12/550,647 priority Critical patent/US20110048677A1/en
Assigned to CPUMATE INC., GOLDEN SUN NEWS TECHNIQUES CO., LTD. reassignment CPUMATE INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, CHIH-HUNG, HSU, KEN, LIN, CHEN-HSIANG, LIN, KUO-LEN
Publication of US20110048677A1 publication Critical patent/US20110048677A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/08—Assemblies of conduits having different features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-conducting assembly, and in particular to a heat-conducting assembly having heat pipes.
  • heat pipes Since heat pipes have many advantages such as a large heat-conducting capacity, light weight, simple structure, low electricity consumption and low price, they have been widely used in the heat conduction of electronic elements.
  • the heat pipes are capable of conducting the heat generated by electronic heat-generating elements rapidly, so that the heat accumulation in the electronic heat-generating elements can be solved.
  • FIG. 1 shows the combination of heat pipes and a heat-conducting base in prior art.
  • a heat-conducting surface 100 a of a heat-conducting base 10 a is provided with a plurality of through troughs 101 a .
  • a partition 102 a is formed between the respective through troughs 101 a , so that the heat pipes 20 a can be arranged on the heat-conducting base 10 a at intervals.
  • the heat-conducting surface 100 a of the heat-conducting base 10 a is adhered to a surface of an electronic heat-generating element (not shown), thereby conducting the heat generated by the electronic heat-generating element.
  • the heat-conducting surface 100 a of the heat-conducting base 10 a accommodates three heat pipes 20 a approximately.
  • two contacting areas 100 b and 100 b located outside the three heat pipes 20 a are wasted because the contacting areas 100 b and 100 c are too small to accommodate a heat pipe. Since the heat-conducting effect of the contacting areas 100 b and 100 c having no heat pipes is inferior to that of the areas having heat pipes, the heat-conducting efficiency of the whole heat-conducting surface 100 a is reduced.
  • the present Inventor proposes a reasonable and novel structure based on his deliberate research and expert experiences.
  • the present invention is to provide a heat-conducting assembly for heat pipes of different diameters, whereby the ratio of heat pipes arranged in the heat-conducting surface of the heat-conducting base can be increased and thus the heat-conducting efficiency thereof is improved.
  • the present invention provides a heat-conducting assembly for heat pipes of different diameters, which includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes.
  • the heat-conducting base has a heat-conducting surface.
  • the heat-conducting surface is provided with a plurality of accommodating troughs.
  • the set of first heat pipes includes at least one first heat pipe.
  • the first heat pipe is disposed in the accommodating trough.
  • the set of second heat pipes includes at least one second heat pipe.
  • the second heat pipe is disposed in the accommodating trough.
  • the diameter of the set of second heat pipes is smaller that of the set of first heat pipes.
  • the sizes of the accommodating troughs of the heat-conducting base correspond to the diameters of the first heat pipes and the second heat pipes respectively. In this way, the ratio of the heat pipes arranged on the heat-conducting surface can be increased, and thus the heat-conducting efficiency thereof is improved.
  • the present invention provides a heat sink having a heat-conducting assembly for heat-pipes of different diameters, which includes a heat-conducting base, a set of first heat pipes, a set of second heat pipes and a plurality of fins.
  • the heat-conducting base has a heat-conducting surface.
  • the heat-conducting surface is provided with a plurality of accommodating troughs.
  • the set of first heat pipes includes at least one first heat pipe.
  • the first heat pipe has a heat-absorbing section and a condensing section.
  • the heat-absorbing section of the first heat pipe is disposed in the accommodating trough.
  • the set of second heat pipes includes at least one second heat pipe.
  • the second heat pipe has a heat-absorbing section and a condensing section.
  • the heat-absorbing section of the second heat pipe is disposed in the accommodating trough.
  • the diameter of the set of second heat pipes is smaller than that of the set of first heat pipes.
  • the condensing sections of the first heat pipe and the second heat pipe are penetrated by the plurality of parallel fins.
  • the sizes of the accommodating troughs of the heat-conducting base correspond to the diameters of the first heat pipe and the second heat pipe respectively.
  • a plurality of heat pipes of different diameters are connected with the heat-conducting base. Further, the heat-absorbing section of the large-diameter first heat pipe and the heat-absorbing section of the small-diameter second heat pipe are arranged on the heat-conducting surface of the heat-conducting base at intervals. In this way, the ratio of the heat pipes arranged on the heat-conducting surface can be increased. That is, the number or density of the heat pipes arranged in the same heat-conducting surface can be increased, and thus the heat-conducting efficiency can be improved.
  • FIG. 1 is a schematic view showing the external appearance of the heat-conducting assembly in prior art
  • FIG. 2 is an exploded perspective view showing the heat-conducting assembly of the present invention
  • FIG. 3 is an assembled perspective view showing the heat-conducting assembly of the present invention.
  • FIG. 4 is an assembled cross-sectional view showing the heat-conducting assembly of the present invention.
  • FIG. 5 is a schematic view showing the external appearance of the heat sink of the present invention.
  • FIG. 6 is a schematic view showing the operating state of the heat sink of the present invention.
  • FIG. 7 is a view showing the second embodiment of the heat-conducting assembly of the present invention.
  • FIG. 2 is an exploded perspective view showing the heat-conducting assembly of the present invention.
  • FIG. 3 is an assembled perspective view showing the heat-conducting assembly of the present invention.
  • the present invention provides a heat-conducting assembly 1 for heat pipes of different diameters, which includes a heat-conducting base 10 , a set 20 of first heat pipes and a set 30 of second heat pipes.
  • the bottom surface of the heat-conducting base 10 acts as a heat-conducting surface 11 .
  • the heat-conducting surface 11 is provided with a plurality of accommodating troughs 110 .
  • a partition 111 is formed between the respective accommodating troughs 110 .
  • a fixing wing 121 extends from each side of a top surface 12 of the heat-conducting base 10 . The fixing wing 121 is used to fix the heat-conducting base 10 .
  • the set 20 of first heat pipes includes two first heat pipes 21 , 22 .
  • the first heat pipe 21 is formed into a U shape and has a heat-absorbing section 211 and two condensing sections 212 .
  • the condensing sections 212 extend vertically from both ends of the heat-absorbing section 211 .
  • the other first heat pipe 22 is also formed into a U shape and has a heat-absorbing section 221 and two condensing sections 222 .
  • the two first heat pipes 21 , 22 are of the same diameter.
  • the set 20 of first heat pipes may includes the first heat pipes 21 , 22 of different diameters.
  • the set 30 of second heat pipes also includes two second heat pipes 31 , 32 .
  • the second heat pipe 31 is formed into a U shape and has a heat-absorbing section 311 and two condensing sections 312 .
  • the condensing sections 312 extend vertically from both ends of the heat-absorbing section 311 .
  • the other second heat pipe 32 is also formed into a U shape and has a heat-absorbing section 321 and two condensing sections 322 .
  • the two second heat pipes 31 , 32 are of the same diameter.
  • the set 30 of second heat pipes may includes the second heat pipes 31 , 32 of different diameters. It should be noted that the diameter of the set 30 of second heat pipes is smaller that of the set 20 of first heat pipes (especially the diameter of the heat-absorbing section).
  • FIG. 4 is an assembled cross-sectional view showing the heat-conducting assembly of the present invention.
  • the set 20 of first heat pipes and the set 30 of second heat pipes includes heat pipes of different diameters respectively.
  • the small-diameter second heat pipes 31 , 32 are arranged between the large-diameter first heat pipes 21 , 22 in such a manner that the first heat pipes 21 , 22 and the second heat pipes 31 , 32 are staggered on the heat-conducting surface 11 of the heat-conducting base 10 , thereby increasing the ratio of the heat pipes arranged on the heat-conducting surface 11 . That is, the number or density of the heat pipes arranged on the limited heat-conducting surface 11 can be increased.
  • the accommodating troughs 110 of the heat-conducting base 10 are sized to correspond to the diameters of the set 20 of first heat pipes and the set 30 of second heat pipes respectively.
  • the heat-absorbing sections 211 , 221 , 311 , 321 of the first heat pipes 21 , 22 and the second heat pipes 31 , 32 are coated with a binding agent respectively.
  • a die (not shown) is used to press the heat-absorbing sections 211 , 221 , 311 , 321 so as to form a heat-absorbing plane 210 , 22 , 310 , 320 thereon respectively.
  • the heat-absorbing planes 210 , 220 , 310 , 320 are located at a level higher than that of the heat-conducting surface 11 of the heat-conducting base 10 , or are in flush with the heat-conducting surface 11 of the heat-conducting base 10 . Then, after the heat-absorbing sections 211 , 221 , 311 , 321 are fixed into the accommodating troughs 110 of the heat-conducting base 10 by the binding agent, the heat-conducting assembly 1 can be formed completely.
  • FIG. 5 is a schematic view showing the external appearance of the heat sink of the present invention.
  • the heat-conducting assembly 1 is further assembled with a plurality of fins 40 .
  • the condensing sections 212 , 222 , 312 , 322 of the first heat pipes 21 , 22 and the second heat pipes 31 , 32 are penetrated by the fins 40 that are arranged at intervals and parallel to one another. In this way, the heat-conducting assembly 1 is assembled with the fins 40 to form the heat sink 2 .
  • FIG. 6 is a schematic view showing the operating state of the present invention.
  • a circuit board 50 is provided with an electronic heat-generating element 51 .
  • the heat sink 2 is used to dissipate the heat generated by the electronic heat-generating element 51 .
  • the heat-conducting surface 11 of the heat-conducting base 10 is adhered to the electronic heat-generating element 51 .
  • the heat generated by the electronic heat-generating element 51 is conducted rapidly from the heat-conducting base 10 and the heat-absorbing sections of the set 20 of first heat pipes and the set 30 of second heat pipes to the condensing sections thereof. Then, the heat is dissipated to the outside by the fins 40 with the aid of its large heat-dissipating area.
  • FIG. 7 shows the second embodiment of the heat-conducting assembly of the present invention.
  • the difference between the present embodiment and the first embodiment lies in the arrangement of the set 20 of first heat pipes and the set 30 of second heat pipes.
  • the heat-absorbing sections 311 , 321 of the small-diameter second heat pipes 31 , 32 are disposed in an outer portion of the heat-conducting base 10
  • the heat-absorbing sections 211 , 221 of the large-diameter first heat pipes 21 , 22 are disposed in an inner portion of the heat-conducting base 10 .
  • the diameters and the arrangement of the set 20 of first heat pipes and the set 30 of second heat pipes can be changed according to practical demands.

Abstract

In a heat-conducting assembly for heat pipes of different diameters and a heat sink having such assembly, the heat-conducting assembly includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes. A heat-conducting surface of the heat-conducting base is provided with a plurality of accommodating troughs. The diameter of the set of second heat pipes is smaller than that of the set of first heat pipes. The first heat pipe and the second heat pipe of different diameters are disposed in the accommodating troughs respectively. The heat pipes penetrate a plurality of fins to form the heat sink. With this arrangement, the ratio of heat pipes arranged on the heat-conducting surface can be increased and the heat-conducting efficiency thereof can be improved.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat-conducting assembly, and in particular to a heat-conducting assembly having heat pipes.
  • 2. Description of Prior Art
  • Since heat pipes have many advantages such as a large heat-conducting capacity, light weight, simple structure, low electricity consumption and low price, they have been widely used in the heat conduction of electronic elements. The heat pipes are capable of conducting the heat generated by electronic heat-generating elements rapidly, so that the heat accumulation in the electronic heat-generating elements can be solved.
  • Please refer to FIG. 1, which shows the combination of heat pipes and a heat-conducting base in prior art. A heat-conducting surface 100 a of a heat-conducting base 10 a is provided with a plurality of through troughs 101 a. A partition 102 a is formed between the respective through troughs 101 a, so that the heat pipes 20 a can be arranged on the heat-conducting base 10 a at intervals. Then, the heat-conducting surface 100 a of the heat-conducting base 10 a is adhered to a surface of an electronic heat-generating element (not shown), thereby conducting the heat generated by the electronic heat-generating element.
  • On the other hand, with the advancement of technology, the size and volume of the electronic element are made much smaller, the contacting area between the electronic element and the heat-conducting base 10 a is thus reduced. As shown in FIG. 1, the heat-conducting surface 100 a of the heat-conducting base 10 a accommodates three heat pipes 20 a approximately. However, in the heat-conducting surface 100 a, two contacting areas 100 b and 100 b located outside the three heat pipes 20 a are wasted because the contacting areas 100 b and 100 c are too small to accommodate a heat pipe. Since the heat-conducting effect of the contacting areas 100 b and 100 c having no heat pipes is inferior to that of the areas having heat pipes, the heat-conducting efficiency of the whole heat-conducting surface 100 a is reduced.
  • Therefore, in order to solve the above-mentioned problems, the present Inventor proposes a reasonable and novel structure based on his deliberate research and expert experiences.
    • SUMMARY OF THE INVENTION
  • The present invention is to provide a heat-conducting assembly for heat pipes of different diameters, whereby the ratio of heat pipes arranged in the heat-conducting surface of the heat-conducting base can be increased and thus the heat-conducting efficiency thereof is improved.
  • The present invention provides a heat-conducting assembly for heat pipes of different diameters, which includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes. The heat-conducting base has a heat-conducting surface. The heat-conducting surface is provided with a plurality of accommodating troughs. The set of first heat pipes includes at least one first heat pipe. The first heat pipe is disposed in the accommodating trough. The set of second heat pipes includes at least one second heat pipe. The second heat pipe is disposed in the accommodating trough. The diameter of the set of second heat pipes is smaller that of the set of first heat pipes. The sizes of the accommodating troughs of the heat-conducting base correspond to the diameters of the first heat pipes and the second heat pipes respectively. In this way, the ratio of the heat pipes arranged on the heat-conducting surface can be increased, and thus the heat-conducting efficiency thereof is improved.
  • The present invention provides a heat sink having a heat-conducting assembly for heat-pipes of different diameters, which includes a heat-conducting base, a set of first heat pipes, a set of second heat pipes and a plurality of fins. The heat-conducting base has a heat-conducting surface. The heat-conducting surface is provided with a plurality of accommodating troughs. The set of first heat pipes includes at least one first heat pipe. The first heat pipe has a heat-absorbing section and a condensing section. The heat-absorbing section of the first heat pipe is disposed in the accommodating trough. The set of second heat pipes includes at least one second heat pipe. The second heat pipe has a heat-absorbing section and a condensing section. The heat-absorbing section of the second heat pipe is disposed in the accommodating trough. The diameter of the set of second heat pipes is smaller than that of the set of first heat pipes. The condensing sections of the first heat pipe and the second heat pipe are penetrated by the plurality of parallel fins. The sizes of the accommodating troughs of the heat-conducting base correspond to the diameters of the first heat pipe and the second heat pipe respectively. With this arrangement, the ratio of the heat pipes arranged on the heat-conducting surface can be increased, and thus the heat-conducting efficiency thereof can be improved.
  • In comparison with prior art, according to the present invention, a plurality of heat pipes of different diameters are connected with the heat-conducting base. Further, the heat-absorbing section of the large-diameter first heat pipe and the heat-absorbing section of the small-diameter second heat pipe are arranged on the heat-conducting surface of the heat-conducting base at intervals. In this way, the ratio of the heat pipes arranged on the heat-conducting surface can be increased. That is, the number or density of the heat pipes arranged in the same heat-conducting surface can be increased, and thus the heat-conducting efficiency can be improved.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic view showing the external appearance of the heat-conducting assembly in prior art;
  • FIG. 2 is an exploded perspective view showing the heat-conducting assembly of the present invention;
  • FIG. 3 is an assembled perspective view showing the heat-conducting assembly of the present invention;
  • FIG. 4 is an assembled cross-sectional view showing the heat-conducting assembly of the present invention;
  • FIG. 5 is a schematic view showing the external appearance of the heat sink of the present invention;
  • FIG. 6 is a schematic view showing the operating state of the heat sink of the present invention; and
  • FIG. 7 is a view showing the second embodiment of the heat-conducting assembly of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The characteristics and technical contents of the present invention will be described with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the present invention.
  • Please refer to FIGS. 2 and 3. FIG. 2 is an exploded perspective view showing the heat-conducting assembly of the present invention. FIG. 3 is an assembled perspective view showing the heat-conducting assembly of the present invention. The present invention provides a heat-conducting assembly 1 for heat pipes of different diameters, which includes a heat-conducting base 10, a set 20 of first heat pipes and a set 30 of second heat pipes.
  • The bottom surface of the heat-conducting base 10 acts as a heat-conducting surface 11. The heat-conducting surface 11 is provided with a plurality of accommodating troughs 110. A partition 111 is formed between the respective accommodating troughs 110. Further, a fixing wing 121 extends from each side of a top surface 12 of the heat-conducting base 10. The fixing wing 121 is used to fix the heat-conducting base 10.
  • The set 20 of first heat pipes includes two first heat pipes 21, 22. The first heat pipe 21 is formed into a U shape and has a heat-absorbing section 211 and two condensing sections 212. The condensing sections 212 extend vertically from both ends of the heat-absorbing section 211. Similarly, the other first heat pipe 22 is also formed into a U shape and has a heat-absorbing section 221 and two condensing sections 222. In the present embodiment, the two first heat pipes 21, 22 are of the same diameter. However, in practice, the set 20 of first heat pipes may includes the first heat pipes 21, 22 of different diameters.
  • The set 30 of second heat pipes also includes two second heat pipes 31, 32. The second heat pipe 31 is formed into a U shape and has a heat-absorbing section 311 and two condensing sections 312. The condensing sections 312 extend vertically from both ends of the heat-absorbing section 311. Similarly, the other second heat pipe 32 is also formed into a U shape and has a heat-absorbing section 321 and two condensing sections 322. In the present embodiment, the two second heat pipes 31, 32 are of the same diameter. However, in practice, the set 30 of second heat pipes may includes the second heat pipes 31, 32 of different diameters. It should be noted that the diameter of the set 30 of second heat pipes is smaller that of the set 20 of first heat pipes (especially the diameter of the heat-absorbing section).
  • Please refer to FIG. 4, which is an assembled cross-sectional view showing the heat-conducting assembly of the present invention. The set 20 of first heat pipes and the set 30 of second heat pipes includes heat pipes of different diameters respectively. In the present embodiment, the small-diameter second heat pipes 31, 32 are arranged between the large-diameter first heat pipes 21, 22 in such a manner that the first heat pipes 21, 22 and the second heat pipes 31, 32 are staggered on the heat-conducting surface 11 of the heat-conducting base 10, thereby increasing the ratio of the heat pipes arranged on the heat-conducting surface 11. That is, the number or density of the heat pipes arranged on the limited heat-conducting surface 11 can be increased.
  • Further, the accommodating troughs 110 of the heat-conducting base 10 are sized to correspond to the diameters of the set 20 of first heat pipes and the set 30 of second heat pipes respectively. The heat-absorbing sections 211, 221, 311, 321 of the first heat pipes 21, 22 and the second heat pipes 31, 32 are coated with a binding agent respectively. A die (not shown) is used to press the heat-absorbing sections 211, 221, 311, 321 so as to form a heat-absorbing plane 210, 22, 310, 320 thereon respectively. The heat-absorbing planes 210, 220, 310, 320 are located at a level higher than that of the heat-conducting surface 11 of the heat-conducting base 10, or are in flush with the heat-conducting surface 11 of the heat-conducting base 10. Then, after the heat-absorbing sections 211, 221, 311, 321 are fixed into the accommodating troughs 110 of the heat-conducting base 10 by the binding agent, the heat-conducting assembly 1 can be formed completely.
  • Please refer to FIG. 5, which is a schematic view showing the external appearance of the heat sink of the present invention. The heat-conducting assembly 1 is further assembled with a plurality of fins 40. The condensing sections 212, 222, 312, 322 of the first heat pipes 21, 22 and the second heat pipes 31, 32 are penetrated by the fins 40 that are arranged at intervals and parallel to one another. In this way, the heat-conducting assembly 1 is assembled with the fins 40 to form the heat sink 2.
  • Please refer to FIG. 6, which is a schematic view showing the operating state of the present invention. As shown in this figure, a circuit board 50 is provided with an electronic heat-generating element 51. The heat sink 2 is used to dissipate the heat generated by the electronic heat-generating element 51. The heat-conducting surface 11 of the heat-conducting base 10 is adhered to the electronic heat-generating element 51. The heat generated by the electronic heat-generating element 51 is conducted rapidly from the heat-conducting base 10 and the heat-absorbing sections of the set 20 of first heat pipes and the set 30 of second heat pipes to the condensing sections thereof. Then, the heat is dissipated to the outside by the fins 40 with the aid of its large heat-dissipating area.
  • Please refer to FIG. 7, which shows the second embodiment of the heat-conducting assembly of the present invention. The difference between the present embodiment and the first embodiment lies in the arrangement of the set 20 of first heat pipes and the set 30 of second heat pipes. In the present embodiment, the heat-absorbing sections 311, 321 of the small-diameter second heat pipes 31, 32 are disposed in an outer portion of the heat-conducting base 10, while the heat-absorbing sections 211, 221 of the large-diameter first heat pipes 21, 22 are disposed in an inner portion of the heat-conducting base 10. However, those skilled in this art may appreciated that the diameters and the arrangement of the set 20 of first heat pipes and the set 30 of second heat pipes can be changed according to practical demands.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (9)

What is claimed is:
1. A heat-conducting assembly for heat pipes of different diameters, comprising:
a heat-conducting base having a heat-conducting surface, the heat-conducting surface being provided with a plurality of accommodating troughs;
a set of first heat pipes including at least one first heat pipe, the first heat pipe being disposed in the accommodating trough; and
a set of second heat pipes including at least one second heat pipe, the second heat pipe being disposed in the accommodating trough, a diameter of the set of second heat pipe being smaller that of the set of first heat pipes,
wherein the sizes of the accommodating troughs of the heat-conducting base correspond to the diameters of the first heat pipe and the second heat pipe respectively, thereby increasing a ratio of the heat pipes arranged on the heat-conducting surface and a heat-conducting efficiency thereof.
2. The heat-conducting assembly for heat pipes of different diameters according to claim 1, wherein each of the first heat pipe and the second heat pipe has a heat-absorbing section, the diameter of the heat-absorbing section of the second heat pipe is smaller than that of the heat-absorbing section of the first heat pipe.
3. The heat-conducting assembly for heat pipes of different diameters according to claim 2, wherein the heat-absorbing sections of the first heat pipe and the second heat pipe are staggered in the accommodating troughs of the heat-conducting base.
4. The heat-conducting assembly for heat pipes of different diameters according to claim 3, wherein the heat-absorbing section of the first heat pipe is disposed in an inner portion of the heat-conducting base, and the heat-absorbing section of the second heat pipe is disposed in an outer portion of the heat-conducting base.
5. The heat-conducting assembly for heat pipes of different diameters according to claim 2, wherein the heat-absorbing sections of the first heat pipe and the second heat pipe are formed with a heat-absorbing plane respectively, and the heat-absorbing planes are in flush with the heat-conducting surface of the heat-conducting base.
6. A heat sink having a heat-conducting assembly for heat pipes of different diameters, comprising:
a heat-conducting base having a heat-conducting surface, the heat-conducting surface being provided with a plurality of accommodating troughs;
a set of first heat pipes including at least one first heat pipe, the first heat pipe having a first heat-absorbing section and a first condensing section, the first heat-absorbing section of the first heat pipe being disposed in the accommodating trough;
a set of second heat pipes including at least one second heat pipe, the second heat pipe having a second heat-absorbing section and a second condensing section, second the heat-absorbing section of the second heat pipe being disposed in the accommodating trough, a diameter of the set of second heat pipe being smaller that of the set of first heat pipe; and
a plurality of fins arranged at intervals and parallel to one another, the fins being penetrated by the condensing sections of the first heat pipe and the second heat pipe;
wherein the sizes of the accommodating troughs of the heat-conducting base correspond to the diameters of the first heat pipe and the second heat pipe respectively, thereby increasing a ratio of the heat pipes arranged on the heat-conducting surface and a heat-conducting efficiency thereof.
7. The heat sink having a heat-conducting assembly for heat pipes of different diameters according to claim 6, wherein the first and the second heat-absorbing sections o are staggered in the accommodating troughs of the heat-conducting base.
8. The heat-conducting assembly for heat pipes of different diameters according to claim 6, wherein the first heat-absorbing section of the first heat pipe is disposed in an inner portion of the heat-conducting base, and the second heat-absorbing section of the second heat pipe is disposed in an outer portion of the heat-conducting base.
9. The heat-conducting assembly for heat pipes of different diameters according to claim 6, wherein the first and the second heat-absorbing sections are formed with a heat-absorbing plane respectively, and the heat-absorbing planes are in flush with the heat-conducting surface of the heat-conducting base.
US12/550,647 2009-08-31 2009-08-31 Heat-conducting assembly for heat pipes of different diameters and heat sink having the same Abandoned US20110048677A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/550,647 US20110048677A1 (en) 2009-08-31 2009-08-31 Heat-conducting assembly for heat pipes of different diameters and heat sink having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/550,647 US20110048677A1 (en) 2009-08-31 2009-08-31 Heat-conducting assembly for heat pipes of different diameters and heat sink having the same

Publications (1)

Publication Number Publication Date
US20110048677A1 true US20110048677A1 (en) 2011-03-03

Family

ID=43623105

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/550,647 Abandoned US20110048677A1 (en) 2009-08-31 2009-08-31 Heat-conducting assembly for heat pipes of different diameters and heat sink having the same

Country Status (1)

Country Link
US (1) US20110048677A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110056658A1 (en) * 2009-09-04 2011-03-10 Kuo-Len Lin Heat pipe assembly and heat dissipation device having the same
US20170102745A1 (en) * 2014-06-04 2017-04-13 Huawei Technologies Co., Ltd. Electronic Device
WO2017173778A1 (en) * 2016-04-06 2017-10-12 广州市浩洋电子股份有限公司 Omni-directional, convectional, active heat sink and stage light using same
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
JP2019071432A (en) * 2018-12-07 2019-05-09 ホアウェイ・テクノロジーズ・カンパニー・リミテッド Electronic device
US20200326131A1 (en) * 2017-12-28 2020-10-15 Furukawa Electric Co., Ltd. Heat sink

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7090001B2 (en) * 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US7117930B2 (en) * 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base
US7165603B2 (en) * 2002-04-15 2007-01-23 Fujikura Ltd. Tower type heat sink
US20080198554A1 (en) * 2005-06-23 2008-08-21 Telefonaktiebolaget Lm Ericsson Cooling Assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7165603B2 (en) * 2002-04-15 2007-01-23 Fujikura Ltd. Tower type heat sink
US7117930B2 (en) * 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base
US7090001B2 (en) * 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US20080198554A1 (en) * 2005-06-23 2008-08-21 Telefonaktiebolaget Lm Ericsson Cooling Assembly

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110056658A1 (en) * 2009-09-04 2011-03-10 Kuo-Len Lin Heat pipe assembly and heat dissipation device having the same
US20170102745A1 (en) * 2014-06-04 2017-04-13 Huawei Technologies Co., Ltd. Electronic Device
EP3131376A4 (en) * 2014-06-04 2017-04-26 Huawei Technologies Co., Ltd. Electronic device
US10409340B2 (en) * 2014-06-04 2019-09-10 Huawei Technologies Co., Ltd. Electronic device
US11144101B2 (en) 2014-06-04 2021-10-12 Huawei Technologies Co., Ltd. Electronic device
US11789504B2 (en) 2014-06-04 2023-10-17 Huawei Technologies Co., Ltd. Electronic device
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
WO2017173778A1 (en) * 2016-04-06 2017-10-12 广州市浩洋电子股份有限公司 Omni-directional, convectional, active heat sink and stage light using same
US10962215B2 (en) * 2016-04-06 2021-03-30 Guangzhou Haoyang Electronic Co., Ltd. Active radiator with omnidirectional air convection and stage lighting fixture using the same
US20200326131A1 (en) * 2017-12-28 2020-10-15 Furukawa Electric Co., Ltd. Heat sink
JP2019071432A (en) * 2018-12-07 2019-05-09 ホアウェイ・テクノロジーズ・カンパニー・リミテッド Electronic device

Similar Documents

Publication Publication Date Title
US7545646B2 (en) Cooling assembly
US7245494B2 (en) Thermal structure for electric devices
US20110048677A1 (en) Heat-conducting assembly for heat pipes of different diameters and heat sink having the same
US7891411B2 (en) Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
US8020611B2 (en) Heat dissipating device having G-shaped heat pipes and heat sinks
US7093648B1 (en) Heat pipe cooling device and method for manufacturing the same
US20090151900A1 (en) Heat sink
US8359745B2 (en) Method for manufacturing a heat sink
US20070091578A1 (en) Circuit board having heat dissipation through holes
US20070047206A1 (en) Composite heat dissipating apparatus
US20070121291A1 (en) Heat sink module of a notebook computer
US20100078154A1 (en) Heat dissipation device
TWM246683U (en) Heat sink assembly
US7511958B2 (en) Heat dissipating assembly of heat dissipating device
US20060005944A1 (en) Thermoelectric heat dissipation device and method for fabricating the same
US7487825B2 (en) Heat dissipation device
US7891414B2 (en) Method for manufacturing heat dissipator having heat pipes and product of the same
US20110265976A1 (en) Heat dissipation device with heat pipe
US6926071B2 (en) Heat dissipation device
US20090161300A1 (en) Circuit board with heat dissipation function
US20070181288A1 (en) Combination of a heat sink and a fan
US20100051236A1 (en) Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base
US20110094711A1 (en) Heat dissipation device with heat pipe
CN101087505A (en) Heat radiator
US20100264790A1 (en) Computer enclosure

Legal Events

Date Code Title Description
AS Assignment

Owner name: GOLDEN SUN NEWS TECHNIQUES CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, KUO-LEN;LIN, CHEN-HSIANG;HSU, KEN;AND OTHERS;REEL/FRAME:023170/0348

Effective date: 20090820

Owner name: CPUMATE INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, KUO-LEN;LIN, CHEN-HSIANG;HSU, KEN;AND OTHERS;REEL/FRAME:023170/0348

Effective date: 20090820

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION