US20100263432A1 - Methods for planarizing a semiconductor contactor - Google Patents
Methods for planarizing a semiconductor contactor Download PDFInfo
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- US20100263432A1 US20100263432A1 US12/766,101 US76610110A US2010263432A1 US 20100263432 A1 US20100263432 A1 US 20100263432A1 US 76610110 A US76610110 A US 76610110A US 2010263432 A1 US2010263432 A1 US 2010263432A1
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- Prior art keywords
- substrate
- space transformer
- probe card
- contact
- card assembly
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Definitions
- the present invention relates generally to a probe card assembly, and more specifically to achieving a more planar relationship between the contact elements on a probe card assembly and a device under test.
- Individual semiconductor devices are typically produced by creating several identical devices on a semiconductor wafer, using commonly known techniques such as photolithography and deposition. Generally, these processes are intended to create fully functional integrated circuit devices, prior to separating the individual dies from the semiconductor wafer.
- physical defects in the wafer and defects in the processing of the wafer often lead to the presence of some defective dies on the wafer.
- wafer testers or probers are used to make pressure connections to connection pads (bond pads) on the dies. The dies can then be tested for defects.
- a conventional component of a wafer tester is a probe card which has contact elements that effect the pressure connections to the bond pads of the dies.
- a probe card can be part of a probe card assembly, such as that which is described in U.S. Pat. No. 5,974,662, titled “Method of Planarizing Tips of Probe Elements of a Probe Card Assembly,” which is incorporated by reference herein.
- a probe card assembly according to U.S. Pat. No. 5,974,662 typically includes a number of components in addition to the probe card itself, such as in interposer and a space transformer. The interposer is disposed between the probe card and the space transformer and allows the orientation of the space transformer to be adjusted relative to the orientation of the probe card.
- the space transformer permits a plurality of contact structures on one side of the space transformer to make contact with the terminals of an electronic component (e.g. bond pads on a semiconductor device) at a relatively fine pitch, while connections to another side of the space transformer are made at a relatively coarser pitch.
- the contact structures make contact with an active semiconductor device, such as a wafer.
- Such connections can be disrupted by slight variations in the planarity of the space transformer.
- variations in the planarity of the space transformer can occur, for example, when the space transformer is manufactured. For example, an edge of the space transformer might be bent slightly or the center of the space transformer might be bowed.
- FIG. 1 illustrates generally a prior art technique for adjusting the orientation of a space transformer.
- a space transformer 110 is shown with different sets of adjustment points on the bottom of space transformer 110 .
- the adjustment points correspond to the locations of ball bearings that can be pressed against a back surface of space transformer 110 to adjust the orientation of space transformer 110 .
- three adjustment points 112 a - 112 c are used to adjust the orientation of space transformer 110 .
- Adjustment points 112 a - 112 c are located along the periphery of space transformer 110 .
- the adjustment points shown in FIG. 1 can be used to deflect peripheral areas of space transformer 110 , but hey cannot be used to deflect non-peripheral areas, such as the center, of space transformer 110 .
- the three points of adjustment shown in FIG. 1 define a plane which is approximately parallel to the plane of a front surface of space transformer 110 . However, because there are only three adjustment points, they can adjust the orientation, but not the shape, of space transformer 110 ; geometric changes are made on only a low order (1 st order polynomial). Furthermore, using ball bearings in conjunction with the adjustment points provides for the application of only a pushing force against space transformer 110 , and in some instances, the pushing force is opposed by a spring member on an opposite side of space transformer 110 .
- the present invention provides, in one embodiment, a method of adjusting the planarity of a substrate in a probe card assembly, in which the method includes deflecting at least one of a first area of the substrate, a second area of the substrate, a third area of the substrate, and a fourth area of the substrate, and the deflecting includes applying a pulling force to at least one of the first, second, third and fourth areas of the substrate.
- the present invention provides, in another embodiment, a method of achieving a degree of planarity among contact portions of a plurality of contact structures mounted to a substrate, in which the method includes creating the substrate with the plurality of contact structures connected to a first surface of the substrate, the contact portions of the contract structures having a first planar relationship relative to one another, and applying a plurality of forces selectively to the substrate to deform the substrate and achieve a second planar relationship of the contact portions of the contact structures relative to one another
- FIG. 1 illustrates generally a prior art technique for adjusting the planarity of a space transformer in a probe card assembly.
- FIG. 2 illustrates a cross-sectional view of a probe card assembly in accordance with the teachings of the present invention.
- FIGS. 3A and 3B illustrate generally deflections of a substrate in a probe card assembly in accordance with the teachings of the present invention.
- FIG. 4A illustrated a bottomview of a probe card assembly in accordance with the teachings of the present invention.
- FIG. 4B illustrates a bottomview of a substrate in the probe card assembly shown in FIG. 4A .
- FIGS. 5A-5C illustrate different embodiments of a planarizing element for a probe card assembly in accordance with the teachings o the present invention.
- FIG. 6 illustrates multiple adjustable substrates of a probe card assembly.
- FIG. 7A illustrates a top view of a multiple substrate assembly in accordance with the teachings of the present invention.
- FIG. 7B illustrates a side view of the multiple substrate assembly shown in FIG. 7A .
- a probe card assembly includes a probe card, an interposer, a space transformer, a drive plate and a first control member.
- the interposer is located between the probe card and the space transformer.
- the drive plate is located adjacent to the probe card.
- a protrusion extends from a central area of the bottom surface of the space transformer and through a through hole in the interposer.
- the first control member is coupled to the protrusion and is disposed within the through hole in the interposer and through holes in the probe card and drive plate.
- the first control member has an actuating component rotatably coupled to an end of the first control member that is accessible from an exposed side of the drive plate.
- a spring is supported by the actuating component to be urged against the drive plate.
- the spring is pressed against the drive plate and provides a resistance to the movement of the actuating component.
- the space transformer is pulled toward the interposer via the first control member coupled to the protrusion extending from the space transformer.
- a non-peripheral area of the space transformer is deflected according to a preferred embodiment of the present invention.
- FIG. 2 illustrates a side cross-sectional view of a probe card assembly 200 in accordance with the teachings of the present invention.
- a space transformer 210 is held down at its periphery by a clamping frame 212 .
- the top of space transformer 210 may be substantially flush with the top of frame 212 such that a plurality of resilient contact structures 211 extending from the top of space transformer 210 can extend above the top surface of frame 212 .
- Contact structures 211 each have a contact region for making contact with the terminals of an electronic component (e.g. bond pads on a semiconductor device).
- contact structures 211 are freestanding, springable contact elements. It is appreciated that other contact elements can be used in place of contact structures 211 . It is preferred that such elements are sufficiently coupled to space transformer 210 to benefit from the planarizing action associated with the present invention. For example, posts, pins, pads, terminals and bumps/balls or other contact elements known in the art can be used as contact elements.
- a clamping spring 214 (e.g. leaf spring) is couple to a frame 218 by screws 216 .
- Spring 214 secures frame 212 .
- a printed wiring board 220 such as probe card, is located beneath frame 218 and has a through hole in its center and through holes at points around the center in a regular pattern.
- a drive plate 222 which can also act as a stiffening substrate, is coupled to the bottom of board 220 .
- Drive plate 222 has a set of through holes which align with the through holes in board 220 .
- Screws 224 are placed in the outer through holes in both board 220 and drive plate 222 .
- Ball bearings 226 rest on an end of screws 224 and are pressed against space transformer 210 when screws 224 are screwed toward space transformer 210 .
- An interposer 230 is located between space transformer 210 and board 220 .
- Interposer 230 has a central through hole.
- Resilient contact structures 229 extend from the top of interposer 230 and effect pressure connections with contact pads 228 located on space transformer 210 .
- Resilient contact structures 231 extend from the bottom of interposer 230 and effect pressure connections with contact terminals 234 located on board 220 .
- a threaded protrusion or stud 238 extends from the bottom of space transformer 210 . Stud 238 may be coupled to space transformer 210 or integrally formed with space transformer 210 .
- An extension stud 24 C has a threaded bore in one end which is screwed onto stud 238 .
- Stud 240 is threaded and accommodates an actuating nut 242 .
- Stud 240 is disposed through the central through holes of interposer 230 , board 220 and drive plate 222 .
- a spring element 244 e.g. Belleville washer
- a plurality of resilient contact structures can be provided on the bottom surface of a space transformer (e.g. fabricated on the terminals on the bottom surface of a space transformer) to make direct contact to the terminals on the top surface of a printed wiring board.
- an interposer is optional.
- One alternative to an interposer is a semi-rigid support member that backs a flexible sheet incorporating contact structures.
- the semi-rigid support member, and hence the flexible sheet and contact structures can be planarized in accordance with the teaching of the present invention.
- Other alternatives to an interposer include flex tape, pogo pins and other socket or interconnect constructions.
- planarity of space transformer 210 can be adjusted via peripheral control members (e.g. screws 224 and ball bearings 226 ) and a non-peripheral control member (e.g. stud 240 coupled to stud 238 ).
- peripheral control members e.g. screws 224 and ball bearings 226
- non-peripheral control member e.g. stud 240 coupled to stud 238 .
- screws 224 can be accessed from the bottom side of drive plate 222 to drive them upward and force ball bearings 226 against space transformer 210 .
- space transformer 210 is held by frame 212 and spring 214 , the contact of ball bearings 226 against space transformer 210 subjects space transformer 210 to compressive forces.
- space transformer 210 deflects accordingly.
- ball bearings 226 are located near the periphery of space transformer 210 , only peripheral areas of space transformer 210 are adjusted via screws 224 and ball bearings 226 .
- screws 224 are accessible from an exposed side of drive plate 222 , the planarity of peripheral areas of space transformer 210 is remotely adjustable. It should be noted that screws 224 and ball bearings 226 can be used to deflect space transformer 210 without interfering with interposer 230 .
- a central area of space transformer 210 can be deflected through the actuation of nut 242 .
- spring element 244 is pressed against drive plate 222 by nut 242 .
- Spring element 244 provides a resistance to the upward movement of nut 242 .
- stud 240 is pulled down.
- the area of space transformer 210 where stud 238 is located is also pulled down along with stud 240 .
- such area of space transformer 210 is subjected to a pulling force or tensile force.
- space transformer 210 is bowed (e.g. domed)
- stud 240 can be pulled down through the actuation of nut 242 to adjust the planarity of space transformer 210 .
- nut 242 is accessible from an exposed side of drive plate 222 , the planarity of a non-peripheral area of space transformer 210 is remotely adjustable.
- studs 238 and 240 can be used to deflect space transformer 210 without interfering with interposer 230 .
- Stud 238 can be located at a variety of positions on the bottom surface of space transformer 210 .
- stud 238 can be located near the center or the edge of the bottom surface of space transformer 210 .
- the planarizing apparatus of the present invention can be used to deflect peripheral areas, as well as non-peripheral areas, of a substrate in a probe card assembly.
- multiple studs can be used.
- a space transformer can be configured to use a system in which as many as all of the studs or other elements fixed to the space transformer provide pushing and pulling forces through an actuating mechanism to effect the desired deformation of a surface of the space transformer.
- Screws 224 and ball bearings 226 cannot be used to pull down a central area of space transformer 210 because they are configure to function with an opposing spring against space transformer 210 .
- the planarizing apparatus of the present invention addresses such a deficiency as described above.
- the planarity of space transformer 210 can be more thoroughly adjusted, particularly on a higher order of adjustment (e.g. 2 nd order polynomial, 3 rd order polynomial, etc.), with the planarizing apparatus of the present invention.
- the planarizing apparatus of the present invention can be used to deflect space transformer 210 such that the contact regions of contact structures 211 are planarized relative to one another.
- the planarization of the contact regions of contact structures 211 allows more uniform contact to be made with the terminals of an electronic component to facilitate testing of the electronic component.
- the deflection of space transformer 210 can effect more uniform contact between contact pads 228 and contact structures 229 , and between terminals 234 and contact structures 231 .
- FIGS. 3A and 3B illustrate generally a bowed substrate 310 , such as a space transformer, which is typically located in a probe card assembly.
- a fore 332 e.g. tensile force
- a central area of substrate 310 can be deflected to a desired planarity.
- a force 334 e.g.
- interposer 330 which does not affect interposer 330 can be applied to substrate 310 to push substrate 310 into a desired position. Specifically, a central area of substrate 310 can be deflected to a desired planarity. Such a pushing force can be applied using an embodiment of the present invention as shown in FIG. 5C .
- FIG. 4A illustrates a bottomview of a probe card assembly fitted with push-only control members 424 , which are similar to screws 224 , and a push-pull control member 440 , which is similar to extension stud 240 .
- a drive plate 422 is coupled to a probe card 420 . Both drive plate 422 and probe card 420 have through holes to accommodate control members 424 and 440 .
- Control members 424 drive ball bearings 426 at corresponding locations of a substrate 410 , as shown in FIG. 4B .
- Substrate 410 such as a space transformer, is typically part of a probe card assembly such as that shown in FIG. 2 .
- a stud 428 extending from the surface of substrate 410 is coupled to central control member 440 to allow a central area of substrate 410 to be deflected by the actuation of a nut 442 relative to control member 440 .
- Control members 424 and 440 can be drive independently to adjust the planarity of substrate 410 in a variety of ways.
- FIGS. 5A-5C illustrate various embodiments of a planarizing apparatus according to the present invention.
- a substrate 510 such as a space transformer, has a stud 538 a coupled to or integrally formed with the bottom surface of substrate 510 .
- Stud 538 a has a threaded bore to accommodate a connector 540 a having threaded ends.
- a nut 542 coupled to one of the threaded ends of connector 540 a supports a spring element 544 a, which can be pressed against a substrate (not shown), such as a drive plate, in a manner similar to that described in conjunction with FIG. 2 .
- Spring element 544 a is shown as a Belleville washer. It is appreciated that other springs elements, such as coil springs and wavy washers could be used in lieu of a Belleville washer. Furthermore, the spring element could be built into the bottom of the drive plate.
- substrate 510 has a threaded stud 539 b coupled to or integrally formed with the bottom surface of substrate 510 .
- a connector 540 b with a threaded bore is coupled to stud 538 b.
- a nut 542 coupled to a threaded end of connector 540 b supports spring elements 544 b - 544 d against a substrate (not shown), such as a drive plate.
- Different spring elements can be used as spring elements 544 b - 544 d to provide varying resistances to nut 542 as nut 542 is twisted along the threads of connector 540 b toward space transformer 510 .
- substrate 510 has a threaded stud 538 c coupled to or integrally formed with the bottom surface of substrate 510 .
- a connector 540 c with a threaded bore is coupled to stud 539 c.
- a threaded end of connector 540 c is coupled to a threaded through hole in a substrate 522 , such as drive plate.
- Connector 540 c is accessible from an exposed side of substrate 522 , which is typically an exterior substrate of a probe card assembly.
- Connector 540 c can be turned clockwise or counter-clockwise to deflect substrate 510 in opposite directions.
- a multipoint adjustment scheme can also be used to modify the orientation (e.g. in x, y and ⁇ directions) of a substrate in a probe card assembly with respect to other substrates in the assembly without interfering with the planarity or orientation of such other substrates.
- a probe card assembly having multiple deformable substrates may be constructed and made planar across the surface defined by their contact elements with respect to a test substrate, while appropriate positions of the contact elements from substrate to substrate are maintained. Such an assembly is shown generally in FIG. 6 .
- Multiple substrates 610 , 620 . . . n are located adjacent to one another in a combined assembly. Each substrate is adjustable with respect to the other substrates in x, y and ⁇ using orienting mechanisms (not shown) well known in the art. A system for deforming substrates in the z direction (out of the page) is also included but is not shown. Such a system may incorporate planarizing elements as disclosed herein.
- the vector r defines the relationship between corresponding contact elements 610 a, 620 a . . . z on multiple substrates 610 , 620 . . . n, respectively. Substrates 610 , 620 . . .
- n are positioned with respect to one another such that r is within a desired degree of accuracy, and deformed such that the contact tips of contact elements 610 a, 620 a . . . z are coplanar within a desired degree of accuracy in the z direction.
- contact elements 711 are secured to insulating support member 705 .
- Contact elements 711 are electrically connected by trances 706 to connecting wires 715 , which are connected in turn to traces 713 and to tester 760 .
- Contact elements 711 are illustrated as solder balls but of course can take many of the forms described herein.
- connecting wires 715 are portions of a multi-stranded flex cable.
- connecting wires 715 can be wirebonded connections.
- insulating support member 705 is polyimide, or other flex materials well known in the art.
- Substrate 704 supports insulating support member 705 . In one preferred embodiment, they are secured together. In another preferred embodiment, they can be in close contact, but can move relative to each other. Substrate 704 is positioned by a push-only control element comprising actuator 730 acting on element 724 and ball 726 to press against substrate 704 , opposed by spring 712 , which in turn is secured to substrate frame 720 . Several of these push control elements can be used; two are shown in FIG. 7B for illustrative purposes. Substrate 704 also is positioned by a push-pull control element comprising actuator 732 , element 740 , and stud 738 , which is secured to substrate 704 . Substrate frame 720 is secured to substrate housing 722 , which in turn is connected to actuators 730 , 732 , forming a closed loop system. By selectively positioning the actuators, the shape of substrate 704 can be controlled.
- Printed wiring board 750 supports housing 752 , which is connected to positioning element 756 , which in turn is connected to substrate housing 722 directly or, as shown, through bridge housing 754 .
- Positioning element 756 is illustrated in stylized form and can include elements as desired to provide x, y, z, and three degrees of positional control over substrate housing 722 .
- FIG. 7B illustrates a second substrate 704 a as well, with elements as described above.
- Each substrate 704 , 704 a can be adjusted to a desired degree of planarity. Equally well, each substrate 704 , 704 a can be adjusted to a desired degree of flatness of the contact region portion of each of contact elements 711 .
- substrates 704 and 704 A can be positioned relative to each other to provide a relatively large array of contact elements 711 .
- Such a probe card assembly constructed of multiple deformable substrates is functionally equivalent to a larger probe card assembly having a much larger (equivalent in area) single substrate. It is important to note that deformation of the monolithic substrate in order to change the spatial relationship of the contact elements residing on it is achieved both by deformation and x, y, z and ⁇ movement of the multiple substrates and supporting structures in which they reside.
- the planarizing apparatus of the present invention can be manually actuated or automatically actuated.
- an actuator mechanism can be connected to a planarizing apparatus (e.g. to the actuating nut) and operated according to signals from a computer system.
- a greater number of control points driven by such automated planarizing apparatuses can shape a substrate to a higher degree of accuracy.
Abstract
A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.
Description
- This application is a division of U.S. patent application Ser. No. 09/527,931, filed Mar. 17, 2000 (pending). The foregoing U.S. patent application Ser. No. 09/527,931 is incorporated herein by reference in its entirety.
- 1. Field of the Invention
- The present invention relates generally to a probe card assembly, and more specifically to achieving a more planar relationship between the contact elements on a probe card assembly and a device under test.
- 2. Background Information
- Individual semiconductor devices (dies) are typically produced by creating several identical devices on a semiconductor wafer, using commonly known techniques such as photolithography and deposition. Generally, these processes are intended to create fully functional integrated circuit devices, prior to separating the individual dies from the semiconductor wafer. However, physical defects in the wafer and defects in the processing of the wafer often lead to the presence of some defective dies on the wafer. it is desirable to be able to identify the defective dies prior to packaging or prior to their separation form the wafer. To perform such identification, wafer testers or probers are used to make pressure connections to connection pads (bond pads) on the dies. The dies can then be tested for defects. A conventional component of a wafer tester is a probe card which has contact elements that effect the pressure connections to the bond pads of the dies.
- A probe card can be part of a probe card assembly, such as that which is described in U.S. Pat. No. 5,974,662, titled “Method of Planarizing Tips of Probe Elements of a Probe Card Assembly,” which is incorporated by reference herein. A probe card assembly according to U.S. Pat. No. 5,974,662 typically includes a number of components in addition to the probe card itself, such as in interposer and a space transformer. The interposer is disposed between the probe card and the space transformer and allows the orientation of the space transformer to be adjusted relative to the orientation of the probe card.
- The space transformer permits a plurality of contact structures on one side of the space transformer to make contact with the terminals of an electronic component (e.g. bond pads on a semiconductor device) at a relatively fine pitch, while connections to another side of the space transformer are made at a relatively coarser pitch. In a preferred embodiment, the contact structures make contact with an active semiconductor device, such as a wafer. Such connections can be disrupted by slight variations in the planarity of the space transformer. Unfortunately, variations in the planarity of the space transformer can occur, for example, when the space transformer is manufactured. For example, an edge of the space transformer might be bent slightly or the center of the space transformer might be bowed.
-
FIG. 1 illustrates generally a prior art technique for adjusting the orientation of a space transformer. Aspace transformer 110 is shown with different sets of adjustment points on the bottom ofspace transformer 110. In one example, the adjustment points correspond to the locations of ball bearings that can be pressed against a back surface ofspace transformer 110 to adjust the orientation ofspace transformer 110. InFIG. 1 , three adjustment points 112 a-112 c are used to adjust the orientation ofspace transformer 110. Adjustment points 112 a-112 c are located along the periphery ofspace transformer 110. - The adjustment points shown in
FIG. 1 can be used to deflect peripheral areas ofspace transformer 110, but hey cannot be used to deflect non-peripheral areas, such as the center, ofspace transformer 110. The three points of adjustment shown inFIG. 1 define a plane which is approximately parallel to the plane of a front surface ofspace transformer 110. However, because there are only three adjustment points, they can adjust the orientation, but not the shape, ofspace transformer 110; geometric changes are made on only a low order (1st order polynomial). Furthermore, using ball bearings in conjunction with the adjustment points provides for the application of only a pushing force againstspace transformer 110, and in some instances, the pushing force is opposed by a spring member on an opposite side ofspace transformer 110. - In many instance, it is desirable to be able to apply a pulling or pushing force at a multiplicity of locations on a space transformer because the space transformer may require deflection or distortion over its surface to achieve better planarity and correct surface variations.
- The present invention provides, in one embodiment, a method of adjusting the planarity of a substrate in a probe card assembly, in which the method includes deflecting at least one of a first area of the substrate, a second area of the substrate, a third area of the substrate, and a fourth area of the substrate, and the deflecting includes applying a pulling force to at least one of the first, second, third and fourth areas of the substrate.
- The present invention provides, in another embodiment, a method of achieving a degree of planarity among contact portions of a plurality of contact structures mounted to a substrate, in which the method includes creating the substrate with the plurality of contact structures connected to a first surface of the substrate, the contact portions of the contract structures having a first planar relationship relative to one another, and applying a plurality of forces selectively to the substrate to deform the substrate and achieve a second planar relationship of the contact portions of the contact structures relative to one another
- Additional features and benefits of the present invention will become apparent upon review of the following description.
- Various embodiment of the present invention will be described in detail with reference to the following drawings in which like reference numerals refer to like elements. The present invention is illustrated by way of example and not limitation in the accompanying figures. It should be noted that many of the features shown in the figures have not been drawn to scale for the purpose of better illustrating such features.
-
FIG. 1 illustrates generally a prior art technique for adjusting the planarity of a space transformer in a probe card assembly. -
FIG. 2 illustrates a cross-sectional view of a probe card assembly in accordance with the teachings of the present invention. -
FIGS. 3A and 3B illustrate generally deflections of a substrate in a probe card assembly in accordance with the teachings of the present invention. -
FIG. 4A illustrated a bottomview of a probe card assembly in accordance with the teachings of the present invention. -
FIG. 4B illustrates a bottomview of a substrate in the probe card assembly shown inFIG. 4A . -
FIGS. 5A-5C illustrate different embodiments of a planarizing element for a probe card assembly in accordance with the teachings o the present invention. -
FIG. 6 illustrates multiple adjustable substrates of a probe card assembly. -
FIG. 7A illustrates a top view of a multiple substrate assembly in accordance with the teachings of the present invention. -
FIG. 7B illustrates a side view of the multiple substrate assembly shown inFIG. 7A . - The following description provides embodiments of the present invention. However, it will be appreciated that other embodiments of the present invention will become apparent to those of ordinary skill in the art upon examination of this description. Thus, the present description and accompanying drawings are for purposes of illustration and are not to be used to construe the invention in a restrictive manner.
- In a preferred embodiment of the present invention, a probe card assembly includes a probe card, an interposer, a space transformer, a drive plate and a first control member. The interposer is located between the probe card and the space transformer. The drive plate is located adjacent to the probe card. A protrusion extends from a central area of the bottom surface of the space transformer and through a through hole in the interposer. The first control member is coupled to the protrusion and is disposed within the through hole in the interposer and through holes in the probe card and drive plate. The first control member has an actuating component rotatably coupled to an end of the first control member that is accessible from an exposed side of the drive plate. A spring is supported by the actuating component to be urged against the drive plate. As the actuating component is rotated and moved toward the drive plate, the spring is pressed against the drive plate and provides a resistance to the movement of the actuating component. During this time, the space transformer is pulled toward the interposer via the first control member coupled to the protrusion extending from the space transformer. Thus, a non-peripheral area of the space transformer is deflected according to a preferred embodiment of the present invention.
-
FIG. 2 illustrates a side cross-sectional view of aprobe card assembly 200 in accordance with the teachings of the present invention. Aspace transformer 210 is held down at its periphery by aclamping frame 212. The top ofspace transformer 210 may be substantially flush with the top offrame 212 such that a plurality ofresilient contact structures 211 extending from the top ofspace transformer 210 can extend above the top surface offrame 212. - Contact
structures 211 each have a contact region for making contact with the terminals of an electronic component (e.g. bond pads on a semiconductor device). In one embodiment,contact structures 211 are freestanding, springable contact elements. It is appreciated that other contact elements can be used in place ofcontact structures 211. It is preferred that such elements are sufficiently coupled tospace transformer 210 to benefit from the planarizing action associated with the present invention. For example, posts, pins, pads, terminals and bumps/balls or other contact elements known in the art can be used as contact elements. - A clamping spring 214 (e.g. leaf spring) is couple to a
frame 218 byscrews 216.Spring 214 securesframe 212. A printedwiring board 220, such as probe card, is located beneathframe 218 and has a through hole in its center and through holes at points around the center in a regular pattern. Adrive plate 222, which can also act as a stiffening substrate, is coupled to the bottom ofboard 220.Drive plate 222 has a set of through holes which align with the through holes inboard 220.Screws 224 are placed in the outer through holes in bothboard 220 and driveplate 222.Ball bearings 226 rest on an end ofscrews 224 and are pressed againstspace transformer 210 whenscrews 224 are screwed towardspace transformer 210. - An
interposer 230 is located betweenspace transformer 210 andboard 220.Interposer 230 has a central through hole.Resilient contact structures 229 extend from the top ofinterposer 230 and effect pressure connections with contact pads 228 located onspace transformer 210.Resilient contact structures 231 extend from the bottom ofinterposer 230 and effect pressure connections withcontact terminals 234 located onboard 220. A threaded protrusion orstud 238 extends from the bottom ofspace transformer 210.Stud 238 may be coupled tospace transformer 210 or integrally formed withspace transformer 210. An extension stud 24C has a threaded bore in one end which is screwed ontostud 238. The other end ofstud 240 is threaded and accommodates anactuating nut 242.Stud 240 is disposed through the central through holes ofinterposer 230,board 220 and driveplate 222. A spring element 244 (e.g. Belleville washer) is supported bynut 242 and is pressed againstdrive plate 222 asnut 242 is moved upstud 240. - It is appreciated that a plurality of resilient contact structures can be provided on the bottom surface of a space transformer (e.g. fabricated on the terminals on the bottom surface of a space transformer) to make direct contact to the terminals on the top surface of a printed wiring board. Thus, the use of an interposer is optional. One alternative to an interposer is a semi-rigid support member that backs a flexible sheet incorporating contact structures. The semi-rigid support member, and hence the flexible sheet and contact structures, can be planarized in accordance with the teaching of the present invention. Other alternatives to an interposer include flex tape, pogo pins and other socket or interconnect constructions.
- More detailed discussion of printed wiring boards (e.g. probe cards), interposers, space transformers, drive plates, resilient contact structures, contact elements and other components of a probe card assembly that can be used in conjunction with the present invention can be found in U.S. Pat. No. 5,974,662, U.S. patent application Ser. No. 08/920,255, titled “Making Discrete Power Connections to a Space Transformer of a Probe Card Assembly,” now U.S. Pat. No. 6,050,829, and U.S. patent application Ser. No. 09/042,606, titled “Probe Card Assembly and Kit” now U.S. Pat. No. 7,064,566, all of which are incorporated by reference herein.
- The planarity of
space transformer 210 can be adjusted via peripheral control members (e.g. screws 224 and ball bearings 226) and a non-peripheral control member (e.g. stud 240 coupled to stud 238). - For example, screws 224 can be accessed from the bottom side of
drive plate 222 to drive them upward and forceball bearings 226 againstspace transformer 210. Becausespace transformer 210 is held byframe 212 andspring 214, the contact ofball bearings 226 againstspace transformer 210subjects space transformer 210 to compressive forces. Thus, whenball bearings 226 are pressed againstspace transformer 210,space transformer 210 deflects accordingly. Becauseball bearings 226 are located near the periphery ofspace transformer 210, only peripheral areas ofspace transformer 210 are adjusted viascrews 224 andball bearings 226. Furthermore, becausescrews 224 are accessible from an exposed side ofdrive plate 222, the planarity of peripheral areas ofspace transformer 210 is remotely adjustable. It should be noted thatscrews 224 andball bearings 226 can be used to deflectspace transformer 210 without interfering withinterposer 230. - A central area of
space transformer 210 can be deflected through the actuation ofnut 242. Asnut 242 is turned and moves upextension stud 240,spring element 244 is pressed againstdrive plate 222 bynut 242.Spring element 244 provides a resistance to the upward movement ofnut 242. Thus, asnut 242 is turned around the threads ofstud 240 and urged againstspring element 244,stud 240 is pulled down. Becausestud 240 is coupled tostud 238, the area ofspace transformer 210 wherestud 238 is located is also pulled down along withstud 240. Thus, such area ofspace transformer 210 is subjected to a pulling force or tensile force. Ifspace transformer 210 is bowed (e.g. domed), thenstud 240 can be pulled down through the actuation ofnut 242 to adjust the planarity ofspace transformer 210. It should be noted that becausenut 242 is accessible from an exposed side ofdrive plate 222, the planarity of a non-peripheral area ofspace transformer 210 is remotely adjustable. It should be further noted thatstuds space transformer 210 without interfering withinterposer 230. -
Stud 238 can be located at a variety of positions on the bottom surface ofspace transformer 210. For example,stud 238 can be located near the center or the edge of the bottom surface ofspace transformer 210. Thus, it is appreciated that the planarizing apparatus of the present invention can be used to deflect peripheral areas, as well as non-peripheral areas, of a substrate in a probe card assembly. Furthermore, multiple studs can be used. A space transformer can be configured to use a system in which as many as all of the studs or other elements fixed to the space transformer provide pushing and pulling forces through an actuating mechanism to effect the desired deformation of a surface of the space transformer. -
Screws 224 andball bearings 226 cannot be used to pull down a central area ofspace transformer 210 because they are configure to function with an opposing spring againstspace transformer 210. The planarizing apparatus of the present invention addresses such a deficiency as described above. Thus, the planarity ofspace transformer 210 can be more thoroughly adjusted, particularly on a higher order of adjustment (e.g. 2nd order polynomial, 3rd order polynomial, etc.), with the planarizing apparatus of the present invention. - In addition to being able to adjust the planarity of
space transformer 210, the planarizing apparatus of the present invention can be used to deflectspace transformer 210 such that the contact regions ofcontact structures 211 are planarized relative to one another. The planarization of the contact regions ofcontact structures 211 allows more uniform contact to be made with the terminals of an electronic component to facilitate testing of the electronic component. Furthermore, the deflection ofspace transformer 210 can effect more uniform contact between contact pads 228 andcontact structures 229, and betweenterminals 234 andcontact structures 231. -
FIGS. 3A and 3B illustrate generally a bowedsubstrate 310, such as a space transformer, which is typically located in a probe card assembly. Ifsubstrate 310 is bowed as shown inFIG. 3A then a fore 332 (e.g. tensile force) which does not directly affect anadjacent interposer 330 can be applied tosubstrate 310 to pullsubstrate 310 into a desired position. Specifically, a central area ofsubstrate 310 can be deflected to a desired planarity. Such a pulling force can be applied as previously described in conjunction withFIG. 2 . Ifsubstrate 310 is bowed as shown inFIG. 3B , then a force 334 (e.g. compressive force) which does not affect interposer 330 can be applied tosubstrate 310 to pushsubstrate 310 into a desired position. Specifically, a central area ofsubstrate 310 can be deflected to a desired planarity. Such a pushing force can be applied using an embodiment of the present invention as shown inFIG. 5C . -
FIG. 4A illustrates a bottomview of a probe card assembly fitted with push-onlycontrol members 424, which are similar toscrews 224, and a push-pull control member 440, which is similar toextension stud 240. Adrive plate 422 is coupled to aprobe card 420. Both driveplate 422 andprobe card 420 have through holes to accommodatecontrol members Control members 424drive ball bearings 426 at corresponding locations of asubstrate 410, as shown inFIG. 4B .Substrate 410, such as a space transformer, is typically part of a probe card assembly such as that shown inFIG. 2 . Astud 428 extending from the surface ofsubstrate 410 is coupled tocentral control member 440 to allow a central area ofsubstrate 410 to be deflected by the actuation of anut 442 relative to controlmember 440.Control members substrate 410 in a variety of ways. -
FIGS. 5A-5C illustrate various embodiments of a planarizing apparatus according to the present invention. InFIG. 5A , a substrate 510, such as a space transformer, has astud 538 a coupled to or integrally formed with the bottom surface of substrate 510.Stud 538 a has a threaded bore to accommodate a connector 540 a having threaded ends. Anut 542 coupled to one of the threaded ends of connector 540 a supports aspring element 544 a, which can be pressed against a substrate (not shown), such as a drive plate, in a manner similar to that described in conjunction withFIG. 2 . The actuation ofnut 542 relative to connector 540 a and the resulting resistance provided byspring element 544 a help drive connector 540 a down, thereby deflecting substrate 510.Spring element 544 a is shown as a Belleville washer. It is appreciated that other springs elements, such as coil springs and wavy washers could be used in lieu of a Belleville washer. Furthermore, the spring element could be built into the bottom of the drive plate. - In
FIG. 5B , substrate 510 has a threaded stud 539 b coupled to or integrally formed with the bottom surface of substrate 510. Aconnector 540 b with a threaded bore is coupled tostud 538 b. Anut 542 coupled to a threaded end ofconnector 540 b supportsspring elements 544 b-544 d against a substrate (not shown), such as a drive plate. Different spring elements can be used asspring elements 544 b-544 d to provide varying resistances tonut 542 asnut 542 is twisted along the threads ofconnector 540 b toward space transformer 510. - In
FIG. 5C , substrate 510 has a threadedstud 538 c coupled to or integrally formed with the bottom surface of substrate 510. Aconnector 540 c with a threaded bore is coupled to stud 539 c. A threaded end ofconnector 540 c is coupled to a threaded through hole in asubstrate 522, such as drive plate.Connector 540 c is accessible from an exposed side ofsubstrate 522, which is typically an exterior substrate of a probe card assembly.Connector 540 c can be turned clockwise or counter-clockwise to deflect substrate 510 in opposite directions. - It should be noted that a multipoint adjustment scheme according to the present invention can also be used to modify the orientation (e.g. in x, y and θ directions) of a substrate in a probe card assembly with respect to other substrates in the assembly without interfering with the planarity or orientation of such other substrates. Accordingly, a probe card assembly having multiple deformable substrates may be constructed and made planar across the surface defined by their contact elements with respect to a test substrate, while appropriate positions of the contact elements from substrate to substrate are maintained. Such an assembly is shown generally in
FIG. 6 . -
Multiple substrates corresponding contact elements multiple substrates Substrates contact elements - Referring to
FIGS. 7A and 7B , which provide more detailed representations of a combined assembly having multiple substrates similar to that shown inFIG. 6 , contactelements 711 are secured to insulatingsupport member 705. Contactelements 711 are electrically connected bytrances 706 to connectingwires 715, which are connected in turn totraces 713 and totester 760. Contactelements 711 are illustrated as solder balls but of course can take many of the forms described herein. In one preferred embodiment, connectingwires 715 are portions of a multi-stranded flex cable. In another preferred embodiment, connectingwires 715 can be wirebonded connections. In still another preferred embodiment, insulatingsupport member 705 is polyimide, or other flex materials well known in the art. -
Substrate 704 supports insulatingsupport member 705. In one preferred embodiment, they are secured together. In another preferred embodiment, they can be in close contact, but can move relative to each other.Substrate 704 is positioned by a push-only controlelement comprising actuator 730 acting on element 724 andball 726 to press againstsubstrate 704, opposed byspring 712, which in turn is secured tosubstrate frame 720. Several of these push control elements can be used; two are shown inFIG. 7B for illustrative purposes.Substrate 704 also is positioned by a push-pull controlelement comprising actuator 732,element 740, andstud 738, which is secured tosubstrate 704.Substrate frame 720 is secured tosubstrate housing 722, which in turn is connected to actuators 730, 732, forming a closed loop system. By selectively positioning the actuators, the shape ofsubstrate 704 can be controlled. - Printed
wiring board 750 supportshousing 752, which is connected topositioning element 756, which in turn is connected tosubstrate housing 722 directly or, as shown, throughbridge housing 754.Positioning element 756 is illustrated in stylized form and can include elements as desired to provide x, y, z, and three degrees of positional control oversubstrate housing 722. -
FIG. 7B illustrates a second substrate 704 a as well, with elements as described above. Eachsubstrate 704, 704 a can be adjusted to a desired degree of planarity. Equally well, eachsubstrate 704, 704 a can be adjusted to a desired degree of flatness of the contact region portion of each ofcontact elements 711. Moreover,substrates contact elements 711. - Such a probe card assembly constructed of multiple deformable substrates is functionally equivalent to a larger probe card assembly having a much larger (equivalent in area) single substrate. It is important to note that deformation of the monolithic substrate in order to change the spatial relationship of the contact elements residing on it is achieved both by deformation and x, y, z and θ movement of the multiple substrates and supporting structures in which they reside.
- The planarizing apparatus of the present invention can be manually actuated or automatically actuated. For example, an actuator mechanism can be connected to a planarizing apparatus (e.g. to the actuating nut) and operated according to signals from a computer system. A greater number of control points driven by such automated planarizing apparatuses can shape a substrate to a higher degree of accuracy.
- Although the present invention has been described with particular reference to probe card assemblies and space transformers in particular, it is appreciated that the present invention is not so limited in its applications.
- In the foregoing detailed description, the apparatus and method of the present invention have been described with reference to specific exemplary embodiments. However, it will be evident that various modifications and changes may be made without departing from the broader scope and spirit of the present invention. The present specification and figures are accordingly to be regarded as illustrative rather than restrictive.
Claims (2)
1. A method of adjusting the planarity of a substrate in a probe card assembly, the method comprising:
deflecting at least one of a first area of the substrate, a second area of the substrate, a third area of the substrate, and a fourth area of the substrate;
said deflecting comprising applying a pulling force to said at least one of said first, second, third, and fourth areas of the substrate.
2-10. (canceled)
Priority Applications (2)
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US12/766,101 US20100263432A1 (en) | 2000-03-17 | 2010-04-23 | Methods for planarizing a semiconductor contactor |
US13/092,709 US8427183B2 (en) | 2000-03-17 | 2011-04-22 | Probe card assembly having an actuator for bending the probe substrate |
Applications Claiming Priority (2)
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US52793100A | 2000-03-17 | 2000-03-17 | |
US12/766,101 US20100263432A1 (en) | 2000-03-17 | 2010-04-23 | Methods for planarizing a semiconductor contactor |
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US12/766,101 Abandoned US20100263432A1 (en) | 2000-03-17 | 2010-04-23 | Methods for planarizing a semiconductor contactor |
US13/092,709 Expired - Lifetime US8427183B2 (en) | 2000-03-17 | 2011-04-22 | Probe card assembly having an actuator for bending the probe substrate |
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US11/846,012 Expired - Fee Related US7737709B2 (en) | 2000-03-17 | 2007-08-28 | Methods for planarizing a semiconductor contactor |
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US13/092,709 Expired - Lifetime US8427183B2 (en) | 2000-03-17 | 2011-04-22 | Probe card assembly having an actuator for bending the probe substrate |
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US8427183B2 (en) | 2000-03-17 | 2013-04-23 | Formfactor, Inc. | Probe card assembly having an actuator for bending the probe substrate |
Also Published As
Publication number | Publication date |
---|---|
US8427183B2 (en) | 2013-04-23 |
US7262611B2 (en) | 2007-08-28 |
US20080048688A1 (en) | 2008-02-28 |
US7737709B2 (en) | 2010-06-15 |
US20040266089A1 (en) | 2004-12-30 |
US20110193583A1 (en) | 2011-08-11 |
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STCB | Information on status: application discontinuation |
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Owner name: HSBC BANK USA, NATIONAL ASSOCIATION, CALIFORNIA Free format text: SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS;ASSIGNORS:FORMFACTOR, INC.;ASTRIA SEMICONDUCTOR HOLDINGS, INC.;CASCADE MICROTECH, INC.;AND OTHERS;REEL/FRAME:039184/0280 Effective date: 20160624 |