US20100224517A1

US20100224517A1 - Disk separator device

Info

Publication number: US20100224517A1
Application number: US12/396,562
Authority: US
Inventors: Clifton C. Haggard
Original assignee: ePAK International Inc
Current assignee: ePAK International Inc
Priority date: 2009-03-03
Filing date: 2009-03-03
Publication date: 2010-09-09

Abstract

A disk separator device for stacking semiconductor wafers includes a first portion having a disk support surface for accepting one side of a disk and a second portion including a guiding surface obliquely oriented to the disk support surface. The guiding surface has a first edge adjacent a curvilinear perimeter of the wafer support surface and a second edge spaced outwardly from the first edge. The separator device is nestingly received adjacent other separators to maintain a desired alignment of a stack of disks and separators.

Description

This invention generally relates to packing disks. More particularly, this invention relates to a separator device for use in packing disks, such as semiconductor wafers.

BACKGROUND

A variety of containers are used for packaging items such as semiconductor wafers. Extreme care must be exercised when handling such items because of their delicate nature. In the case of semiconductor wafers, the silicon structure is very fragile. Various approaches have been taken to ensure the integrity of the semiconductor wafers within such packages.
A typical package or container has a top and a bottom that are selectively secured together. A wafer restraining portion within which the wafers are held during handling and shipping, for example, extends between the top and the bottom. Individual wafers placed adjacent each other typically are separated by an appropriate sheet of material. The conventional approach is to use foam disk pads at the ends of a stack of wafers to provide cushion for the wafers in the container. Sometimes the foam disk pads are inserted between wafers within a stack.
While foam inserts do provide cushion, there are drawbacks and shortcomings associated with their use. Difficulties arise when the wafers are not securely maintained within the package. The wafer restraining portion typically has an inside dimension that is greater than an outside dimension of the wafers. Accordingly, there is the possibility for lateral movement of the wafers relative to each other during handling or shipping. Such lateral movement damages the wafers and often renders the circuitry supported on the wafers useless.
There is a need for an improved way of packaging items such as semiconductor wafers to protect them from damage during shipping and handling. This invention addresses that need by providing a unique separator device for semiconductor wafers placed within a container.

SUMMARY OF THE INVENTION

An exemplary separator device for stacking disks such as semiconductor wafers includes a first portion having a disk support surface for accepting one side of a disk and a second portion including a guiding surface obliquely oriented to the disk support surface. The guiding surface includes a first edge adjacent a curvilinear perimeter of the disk support surface and a second edge spaced outwardly from the first edge.
The various features and advantages of this invention will become apparent to those skilled in the art from the following detailed description. The drawings that accompany the detailed description can be briefly described as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top perspective view of an example separator device.

FIG. 2 is a front perspective view of the example separator device.

FIG. 3 is a bottom perspective view of the example separator device.

FIG. 4 is a cross-sectional view of a disk located on the example separator device.

FIG. 5 is a cross-sectional view of example separator devices in a stacked position.

FIG. 6 is a cross-sectional view of another example separator device in a stacked position.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIGS. 1-4 illustrate an example separator device 10 and a disk 30. In one example, the disk 30 comprises a semiconductor wafer. The separator device 10 includes a first portion 12 that includes a disk supporting surface 14. A protrusion 16 extends from a surface of the first portion 12 in a direction generally opposite the disk supporting surface 14. In this example, the protrusion 16 has a flat outermost surface 18.
A second portion 20 is located radially outward from the first portion 12. The second portion 20 includes a guiding surface 22 obliquely oriented to the disk supporting surface 14 and a nesting surface 24 substantially parallel to the guiding surface 22. The second portion 20 in this example includes a retainer surface 26 that is substantially perpendicular to the disk supporting surface 14.
The disk supporting surface 14 is dimensioned to provide support beneath at least some of a periphery of the disk 30. The example disk supporting surface 14 has an at least partially curvilinear perimeter corresponding to the geometry of the outer periphery of the disk 30. In this example, the separator device 10 is annular.
The guiding surface 22 assists in placing the disk 30 onto the disk supporting surface 14. The obliquely oriented guiding surface 22 provides a centering feature to ensure proper placement of the disk 30 onto the disk supporting surface 14.
This example includes the retainer surface 26 that maintains the disk 30 in a seated position on the disk supporting surface 14. The retainer surface 26 prevents the disk 30 from shifting into another position relative to the separator device 10. The edge 32 of the disk 30 is received adjacent the retainer surface 26.
A reinforcing member 28 is located between the disk supporting surface 14 and the surface 18. The reinforcing member 28 provides some rigidity to resist undesired deformation of the separator device 10.
The separator device 10 is made from a polypropylene material in one example. The polypropylene possesses properties to control electrostatic discharge from the material to prevent damage to highly sensitive circuitry on semiconductor wafers, for example.
FIG. 5 illustrates a plurality of example separator devices 10 and a plurality of disks 30 in a stacked position. The disks 30 are kept from contacting each other because of the separator devices 10 between them.
A first separator device 10 is placed within a container 38. The nesting surface 24 of the second portion 20 guides the separator device 10 into the container 38. The protrusion 16 on the separator device 10 contacts a bottom wall 40 of the container 38 when fully inserted into the container 38. The radially outer portion of the nesting surface 24 and the outer wall 42 cooperate to prevent lateral movement of the separator device 10. The protrusion 16 creates a spacing between the bottom wall 40 of the container 38 and the disk 30.
One disk 30 is placed within the container 38 on top of (according to the drawing) the first separator device 10. The edge 32 of the disk 30 may contact and follow the guiding surface 22 to facilitate seating the disk 30 in a location adjacent the retainer surface 26 and on the disk supporting surface 14 of the separator device 10.
A second separator device 10 is placed in the container 38 as shown. A nesting surface 24 of the second separator device 10 may contact the guiding surface 22 of the first separator device 10. The guiding surface 22 of one separator device 10 and the nesting surface 24 of the second separator device 10 facilitate stacking multiple separator devices 10 in the container 38. The protrusion 16 on the second separator device 10 is located radially inward from the second portion 20 and contacts the first disk 30 already in the container 38 when the second separator device 10 is properly aligned.
Another disk 30 is next placed within the container on top of the second separator device 10. Similarly, a third separator device 10 is placed in the container 38 followed by additional disks and separators.
In another example, the disks 30 and separator devices 10 are pre-stacked and then inserted into the container 38 together.
A plurality of spacers 44 can be placed in the container 38 in a known manner to fill remaining space in the container 38. A lid 46 is placed on the container 38 in a known manner to secure the disks 30 within the container 38.
As best appreciated in FIGS. 1-3, the second portion 20 includes a plurality of slits or cut-away sections 130 that increase the flexibility of the second portion 20. The slits 130 minimize stress on the disk support surface in the event the second portion 20 (e.g., the outer edge on the guiding surface) contacts a container sidewall.
FIG. 6 illustrates another example separator device 110 for stacking disks 30. The example separator device 110 is substantially similar to the separator device 10 of FIGS. 1 through 5 except where noted or shown in FIG. 6. The separator device 110 includes a first portion 112 having a disk supporting surface 114. A protrusion 116 extends from a surface of the first portion 112 in a direction generally opposite the disk supporting surface 114.
A second portion 120 is located radially outward from the first portion 112. The second portion 120 includes a guiding surface 122 obliquely oriented to the disk supporting surface 114 and a nesting surface 124 substantially parallel to the guiding surface 122.
A reinforcing member 128 is located radially inward from the first portion 112. The reinforcing member 128 is located between the disk supporting surface 114 and a surface 118. The reinforcing member 128 provides some rigidity to resist undesired deformation of the separator device 110.
One difference between this example and the example of FIG. 5 is that there is no retainer surface at the location where the guiding surface 122 meets the disk support surface 114.
A plurality of example separator devices 110 and a plurality of disks 30 may be stacked as shown in FIG. 6.
With either example separator device, the contact between the separator devices 10, 110 and the disks 30 is controlled. There is minimal, if any, chance of misalignment that would introduce the possibility of damage to the disks 30. The nesting separator devices and the seating of the disks 30 in each separator device ensures a consistent and reliable alignment within a container. Inserting and removing disks is also better with the disclosed examples.
While preferred embodiments of the invention has been illustrated and described, it is not intended that these embodiments illustrate and describe all possible forms of the invention. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the scope of the invention.

Claims

1. A disk separator device, comprising:

a first portion including a disk support surface that is configured to contact one side of a disk, the disk support surface having an at least partially curvilinear perimeter; and

a second portion including a guiding surface obliquely oriented to the disk support surface, the guiding surface having a first edge adjacent the curvilinear perimeter of the disk support surface and a second edge spaced outwardly from the first edge.

2. The separator device of claim 1, including a reinforcing member located radially inward from the first portion to resist deformation of the first portion.

3. The separator device of claim 2, wherein the reinforcing member is parallel to the disk support surface.

4. The separator device of claim 1, a retainer surface adjacent the wafer support surface that is at least partially substantially perpendicular to the disk support surface.

5. The separator device of claim 1, including a protrusion extending from the first portion.

6. The separator device of claim 5, wherein the protrusion extends from a surface on the first portion opposite the disk supporting surface.

7. The separator device of claim 6, wherein a lower portion of the protrusion is substantially parallel to the disk supporting surface.

8. The separator device of claim 6, wherein the protrusion forms a continuous rim around the first portion.

9. The separator device of claim 1, wherein the separating device is made of polypropylene.

10. The separator device of claim 9, wherein the polypropylene includes properties to control electrostatic discharge.

11. A separator assembly comprising:

a first disk and a second disk each including an edge portion;

a first separator device and a second separator device each including a first portion having a disk supporting surface and a second portion having a guiding surface obliquely oriented to the disk supporting surface spaced radially outward from the first portion, the first disk being received between the first and second separator devices and the second disk being received on, the second portions being nestingly received against each other to maintain a desired alignment of the disks and the separator devices.

12. The separator assembly as recited in claim 11, comprising a retaining surface adjacent to and substantially perpendicular to the disk supporting surface.

13. The separator assembly as recited in claim 11, wherein a protrusion extends from a surface on the first portion generally opposite the disk supporting surface, the protrusion on the second separator device contacting the first disk supported on the first separator device.