US20100147496A1 - Heat dissipation device with heat pipe - Google Patents

Heat dissipation device with heat pipe Download PDF

Info

Publication number
US20100147496A1
US20100147496A1 US12/463,348 US46334809A US2010147496A1 US 20100147496 A1 US20100147496 A1 US 20100147496A1 US 46334809 A US46334809 A US 46334809A US 2010147496 A1 US2010147496 A1 US 2010147496A1
Authority
US
United States
Prior art keywords
heat
dissipation device
heat dissipation
heat pipe
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/463,348
Inventor
Peng Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIU, PENG
Publication of US20100147496A1 publication Critical patent/US20100147496A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure relates to heat dissipation devices and, particularly, to a heat dissipation device with a heat pipe.
  • a conventional heat dissipation device includes a base contacting a heat generating device, a plurality of parallel fins protruding from a top surface of the base and a heat pipe. In operation, the heat generated from the heat generating device is absorbed by the base and transferred by the fins. However, this conventional heat dissipation device has low heat dissipation efficiency.
  • a heat pipe is applied to transfer the heat from the heat generating device to the fins.
  • an evaporator section of the heat pipe is disposed between the bottom surface of the base and the heat generating device, and a condenser end of the heat pipe extends through the fins.
  • the heat is quickly transferred by the heat pipe from the heat generating device to the fins, whereby the heat is dissipated out rapidly.
  • the heat pipe plays a critical role during heat dissipation process. However, once the heat pipe is invalid or damaged, a heat dissipation efficiency of the whole heat dissipation device will be greatly degraded.
  • FIG. 1 is an isometric, exploded view of a heat dissipation device in accordance with a first embodiment of the disclosure.
  • FIG. 2 is an assembled view of the heat dissipation device of FIG. 1 .
  • FIG. 3 is an isometric, exploded view of a heat dissipation device in accordance with a second embodiment of the disclosure, showing an assembly of a heat sink and a plurality of heat pipes.
  • FIG. 4 is an isometric, exploded view of a heat dissipation device in accordance with a third embodiment of the disclosure, showing the heat dissipation device assembled on a printed circuit board.
  • FIG. 5 is the exploded view of the heat dissipation device of FIG. 4 , viewed from a different angle.
  • a heat dissipation device in accordance with a first embodiment includes a heat conducting base 10 , a heat sink 20 , a heat pipe assembly 30 and a fan 40 .
  • the heat conducting base 10 is made of heat conducting material, such as copper, aluminum, or the like.
  • the heat conducting base 10 includes a top surface 12 thermally connecting with the heat pipe assembly 30 , and a bottom surface 14 thermally contacting a heat generating device (not shown).
  • the top surface 12 is curved corresponding to a curve of the heat pipe assembly 30 .
  • the heat sink 20 is a unitary structure made from a metal block and includes a hollow cylindrical body 22 , and a plurality of fins 24 extending inwardly from an inner surface of the body 22 toward an axis of the body 22 .
  • the fins 24 each have a first end connected to the inner surface of the body 22 and a terminal second end opposite to the first end.
  • Each of the fins 24 is a wedge-shaped plate, and has a thickness gradually decreasing from the first end to the second end thereof.
  • the first ends of the fins 24 are evenly arranged on a circumference of the inner surface of the body 22 , and the second ends of the fins 24 cooperatively define an aperture 200 .
  • the second ends of the fins 24 may be free and spaced from each other or be connected to each other.
  • a plurality of air flow paths 240 is defined by adjacent fins 24 .
  • the second ends of the fins 24 are spaced from each other, and the air flow paths 240 extend inwardly from the inner surface of the body 22 and communicate with the aperture 200 .
  • Each air flow path 240 has a width gradually decreasing along a corresponding radial direction from the inner surface of the body 22 to the aperture 200 .
  • the fins 24 Being arranged on the circumference of the inner surface of the body 22 and extending inwardly from the inner surface of the body 22 , the fins 24 simultaneously transfer heat of the whole annular inner surface of the body 22 from the first end to the second end thereof along various directions. Then the heat at the second ends of the fins 24 can be quickly dissipated by air flowing through the air flow paths 240 . Therefore, the illustrated structure of the heat sink 20 can dissipate the heat absorbed thereby quickly and efficiently.
  • the heat sink 20 can be an assembled structure of the body 22 and the fins 24 .
  • the fins 24 are included in a unitary fin structure.
  • a metallic sheet is bent in sequence to form a zigzag or wave configuration including a number of wedge-shaped protrusions. Each protrusion constructs one fin 24 .
  • the desired unitary fin structure is obtained.
  • the unitary fin structure is assembled on the inner surface of the body 22 by a bolt or a soldering manner, thereby obtaining the assembled heat sink 20 consisting of the body 22 and the fins 24 .
  • the outer surface of the body 22 can protrude or be soldered with a number of fins to increase a heat dissipating area of the body 22 .
  • a number of fins are formed on the outer surface of the body 22 and located between the turn 311 b of the heat pipe 311 and the heat pipe 313 .
  • One or more heat pipe assembly 30 wraps the outer surface of the body 22 of the heat sink 20 to remove the heat from the annular outer surface of the body 22 .
  • the heat pipe assembly 30 has a helical structure obtained by curving one or more elongated flat-type heat pipe. A curvature radius of the helical heat pipe assembly 30 is equal to that of the outer surface of the body 22 to assure that the helical heat pipe can tightly combine with the outer surface of the body 22 .
  • the helical heat pipe assembly 30 is soldered on the outer surface of the body 22 .
  • a thermal interface material is applied between the outer surface of the body 22 and the helical heat pipe assembly 30 . In operation, the whole annular outer surface of the body 22 exchanges heat with the heat pipe assembly 30 and therefore the heat of the body 22 of the heat sink 20 can be quickly removed by the heat pipe assembly 30 .
  • the outer surface of the body 22 of the heat sink 20 defines a groove to receive the heat pipe assembly 30 therein.
  • the heat pipe assembly 30 can be partially or wholly embedded in the groove of the body 22 .
  • the groove facilitates the heat pipe assembly 30 being easily soldered on the body 22 and tightly combining with the body 22 .
  • the outer surface of the body 22 can define a helical groove to receive the helical heat pipe assembly 30 therein, or define a number of parallel grooves to receive a number of straight heat pipes therein.
  • heat pipe assembly 30 shapes, structures of the heat pipe assembly 30 and the outer surface of the body 22 can be varied, so long as the heat pipe assembly 30 surrounds the outer surface of the body 22 .
  • the helical heat pipe assembly 30 is formed by three elongated flat-type heat pipes 311 , 312 , 313 .
  • the pipe 311 includes multi-turns wrapping the body 22 of the heat sink 20 .
  • Adjacent turns of one of the three heat pipes 311 , 312 , 313 are spaced by the other two of the three heat pipes 311 , 312 , 313 .
  • two adjacent turns 311 a , 311 b of the heat pipe 311 are spaced by the heat pipe 312 and the heat pipe 313 . That is, the heat pipe 312 and the heat pipe 313 are sandwiched between the two adjacent turns 311 a , 311 b of the heat pipe 311 .
  • a distance between the adjacent turns 311 a , 311 b of the heat pipe 311 is relatively long. That is, a section the heat pipe 311 between the adjacent turns 311 a , 311 b can have a relatively low curving degree, thereby avoiding capillary structures therein to be damaged during forming the heat pipe 311 .
  • a length of the helical heat pipe assembly 30 is equal to that of the body 22 of the heat sink 20 , whereby the heat pipe assembly 30 substantially contacts the whole outer surface of the body 22 .
  • the fan 40 is mounted on the another side surface of the body 22 to generate an air flow in the axial direction of the body 22 .
  • the fan 40 includes a cylindrical frame 41 and a blade module 42 fixed to the frame 41 .
  • the blade module 42 includes a shaft 421 and several blades 422 extending outwardly from the shaft 421 .
  • the frame 41 is mounted to the body 22 with the shaft 421 of the blade module 42 corresponding to the aperture 200 and the blades 422 corresponding to the air flow paths 240 .
  • a portion of air flows generated by the blades 422 flow in the air flow paths 240 along a lengthwise direction of the body 22 , simultaneously, another portion of air flow congregates and flows in the aperture 200 along the axial direction of the body 22 .
  • the air flow exchanges heat with the fins 24 and the inner surface of the body 22 of the heat sink 20 to take away the heat.
  • the heat pipe assembly 30 is soldered to the outer surface of the body 22 of the heat sink 20 .
  • An assembly of the heat sink 20 and the heat pipe assembly 30 is mounted on the base 10 by soldering the heat pipe assembly 30 to the top surface 12 of the base 10 .
  • the fan 40 is mounted to the side of the body 22 of the heat sink 20 by a number of bolts.
  • the heat dissipation device of the second embodiment has a structure similar to the heat dissipation device of the first embodiment, differing only in that configuration of a heat pipe is different from that of the heat pipe assembly 30 .
  • the heat pipe includes a number of parallel straight heat pipes 300 disposed on the outer surface of the body 22 and surround the body 22 .
  • the straight heat pipes 300 are parallel to the axis of the body 22 . Adjacent heat pipes 300 can be spaced from or adjoin each other.
  • the heat dissipation device has a structure similar to the heat dissipation device of the first embodiment, differing only in that the heat conducting base 10 is omitted.
  • the body 22 (shown in FIG. 1 ) of the heat sink 20 includes a first side surface thermally contacting a heat generating device 120 and a second side surface opposite to the first side surface.
  • Each of the fins 24 (shown in FIG. 1 ) has a flat surface coplanar with the second side surface of the body 22 .
  • the body 22 is directly mounted to a printed circuit board 110 supporting a heat generating device 120 thereon by a plurality of blots 130 .
  • the body 22 defines a plurality of threaded holes 221
  • the printed circuit board 110 defines a plurality of through holes 111 corresponding to the threaded holes 221
  • the blots 130 extend through the second threaded holes 111 of the printed circuit board 110 and are threaded in the first threaded holes 221 of the body 22 to fasten the body 22 to the printed circuit board 110 , thereby the flat surface of the fins 24 thermally contacting the heat generating device 120 .
  • the flat surface cooperatively formed by all of the fins 24 can be concave or convex relative to the first side surface of the body 22 , so long as the flat surface of the fins 24 easily and tightly thermally combines with the heat generating device 120 .
  • the fan 40 is fixed to the second first side surface of the body 22 .
  • the helical heat pipe assembly 30 surrounds the outer surface of the body 22 of the heat sink 20 and thermally contact the heat conducting base 10 .
  • a large contacting area is obtained between the helical heat pipe assembly 30 and the body 22 of the heat sink 20 , thereby a large heat exchange area between the heat pipe assembly 30 and the body 22 of the heat sink 20 being obtained.
  • the fins 24 positioned in side of the body 22 define a number of air flow paths 240 to allow the air flow generated by the fan 40 flowing therethrough and takes away the heat of the heat sink 20 .

Abstract

A heat dissipation device includes a heat sink and a helical heat pipe assembly. The heat sink includes a hollow cylindrical body and a number of fins extending inwardly from an inner surface of the body to an axis of the body. The helical heat pipe assembly is wrapped on an outer surface of the body and helically extends along an axial direction of the body.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to heat dissipation devices and, particularly, to a heat dissipation device with a heat pipe.
  • 2. Description of Related Art
  • Heat dissipation devices are increasingly used in electronic products. A conventional heat dissipation device includes a base contacting a heat generating device, a plurality of parallel fins protruding from a top surface of the base and a heat pipe. In operation, the heat generated from the heat generating device is absorbed by the base and transferred by the fins. However, this conventional heat dissipation device has low heat dissipation efficiency.
  • In order to improve the heat dissipation efficiency of the heat dissipation device mentioned above, a heat pipe is applied to transfer the heat from the heat generating device to the fins. In detail, an evaporator section of the heat pipe is disposed between the bottom surface of the base and the heat generating device, and a condenser end of the heat pipe extends through the fins. In operation, the heat is quickly transferred by the heat pipe from the heat generating device to the fins, whereby the heat is dissipated out rapidly. Thus, the heat pipe plays a critical role during heat dissipation process. However, once the heat pipe is invalid or damaged, a heat dissipation efficiency of the whole heat dissipation device will be greatly degraded.
  • What is needed, therefore, is a heat dissipation device with a heat pipe overcoming the described limitations.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an isometric, exploded view of a heat dissipation device in accordance with a first embodiment of the disclosure.
  • FIG. 2 is an assembled view of the heat dissipation device of FIG. 1.
  • FIG. 3 is an isometric, exploded view of a heat dissipation device in accordance with a second embodiment of the disclosure, showing an assembly of a heat sink and a plurality of heat pipes.
  • FIG. 4 is an isometric, exploded view of a heat dissipation device in accordance with a third embodiment of the disclosure, showing the heat dissipation device assembled on a printed circuit board.
  • FIG. 5 is the exploded view of the heat dissipation device of FIG. 4, viewed from a different angle.
  • DETAILED DESCRIPTION
  • Referring to FIG. 1 and FIG. 2, a heat dissipation device in accordance with a first embodiment includes a heat conducting base 10, a heat sink 20, a heat pipe assembly 30 and a fan 40. The heat conducting base 10 is made of heat conducting material, such as copper, aluminum, or the like. The heat conducting base 10 includes a top surface 12 thermally connecting with the heat pipe assembly 30, and a bottom surface 14 thermally contacting a heat generating device (not shown). The top surface 12 is curved corresponding to a curve of the heat pipe assembly 30.
  • The heat sink 20 is a unitary structure made from a metal block and includes a hollow cylindrical body 22, and a plurality of fins 24 extending inwardly from an inner surface of the body 22 toward an axis of the body 22. The fins 24 each have a first end connected to the inner surface of the body 22 and a terminal second end opposite to the first end. Each of the fins 24 is a wedge-shaped plate, and has a thickness gradually decreasing from the first end to the second end thereof. The first ends of the fins 24 are evenly arranged on a circumference of the inner surface of the body 22, and the second ends of the fins 24 cooperatively define an aperture 200. The second ends of the fins 24 may be free and spaced from each other or be connected to each other. A plurality of air flow paths 240 is defined by adjacent fins 24. In the illustrated embodiment, the second ends of the fins 24 are spaced from each other, and the air flow paths 240 extend inwardly from the inner surface of the body 22 and communicate with the aperture 200. Each air flow path 240 has a width gradually decreasing along a corresponding radial direction from the inner surface of the body 22 to the aperture 200.
  • Being arranged on the circumference of the inner surface of the body 22 and extending inwardly from the inner surface of the body 22, the fins 24 simultaneously transfer heat of the whole annular inner surface of the body 22 from the first end to the second end thereof along various directions. Then the heat at the second ends of the fins 24 can be quickly dissipated by air flowing through the air flow paths 240. Therefore, the illustrated structure of the heat sink 20 can dissipate the heat absorbed thereby quickly and efficiently.
  • Alternatively, the heat sink 20 can be an assembled structure of the body 22 and the fins 24. For example, the fins 24 are included in a unitary fin structure. In detail, a metallic sheet is bent in sequence to form a zigzag or wave configuration including a number of wedge-shaped protrusions. Each protrusion constructs one fin 24. Thus, the desired unitary fin structure is obtained. Then the unitary fin structure is assembled on the inner surface of the body 22 by a bolt or a soldering manner, thereby obtaining the assembled heat sink 20 consisting of the body 22 and the fins 24.
  • Alternatively, the outer surface of the body 22 can protrude or be soldered with a number of fins to increase a heat dissipating area of the body 22. For example, a number of fins are formed on the outer surface of the body 22 and located between the turn 311 b of the heat pipe 311 and the heat pipe 313.
  • One or more heat pipe assembly 30 wraps the outer surface of the body 22 of the heat sink 20 to remove the heat from the annular outer surface of the body 22. The heat pipe assembly 30 has a helical structure obtained by curving one or more elongated flat-type heat pipe. A curvature radius of the helical heat pipe assembly 30 is equal to that of the outer surface of the body 22 to assure that the helical heat pipe can tightly combine with the outer surface of the body 22. In this embodiment, the helical heat pipe assembly 30 is soldered on the outer surface of the body 22. In order to improve heat exchange efficiency between the heat sink 20 and the helical heat pipe assembly 30, a thermal interface material is applied between the outer surface of the body 22 and the helical heat pipe assembly 30. In operation, the whole annular outer surface of the body 22 exchanges heat with the heat pipe assembly 30 and therefore the heat of the body 22 of the heat sink 20 can be quickly removed by the heat pipe assembly 30.
  • Alternatively, the outer surface of the body 22 of the heat sink 20 defines a groove to receive the heat pipe assembly 30 therein. The heat pipe assembly 30 can be partially or wholly embedded in the groove of the body 22. The groove facilitates the heat pipe assembly 30 being easily soldered on the body 22 and tightly combining with the body 22. The outer surface of the body 22 can define a helical groove to receive the helical heat pipe assembly 30 therein, or define a number of parallel grooves to receive a number of straight heat pipes therein.
  • It is understood that shapes, structures of the heat pipe assembly 30 and the outer surface of the body 22 can be varied, so long as the heat pipe assembly 30 surrounds the outer surface of the body 22.
  • In the illustrated embodiment, the helical heat pipe assembly 30 is formed by three elongated flat- type heat pipes 311, 312, 313. The pipe 311 includes multi-turns wrapping the body 22 of the heat sink 20. Adjacent turns of one of the three heat pipes 311, 312, 313 are spaced by the other two of the three heat pipes 311, 312, 313. In this embodiment, two adjacent turns 311 a, 311 b of the heat pipe 311 are spaced by the heat pipe 312 and the heat pipe 313. That is, the heat pipe 312 and the heat pipe 313 are sandwiched between the two adjacent turns 311 a, 311 b of the heat pipe 311. In this structure, a distance between the adjacent turns 311 a, 311 b of the heat pipe 311 is relatively long. That is, a section the heat pipe 311 between the adjacent turns 311 a, 311 b can have a relatively low curving degree, thereby avoiding capillary structures therein to be damaged during forming the heat pipe 311. In order to obtain a relatively high heat exchange efficiency, a length of the helical heat pipe assembly 30 is equal to that of the body 22 of the heat sink 20, whereby the heat pipe assembly 30 substantially contacts the whole outer surface of the body 22.
  • The fan 40 is mounted on the another side surface of the body 22 to generate an air flow in the axial direction of the body 22. The fan 40 includes a cylindrical frame 41 and a blade module 42 fixed to the frame 41. The blade module 42 includes a shaft 421 and several blades 422 extending outwardly from the shaft 421. The frame 41 is mounted to the body 22 with the shaft 421 of the blade module 42 corresponding to the aperture 200 and the blades 422 corresponding to the air flow paths 240. In heat exchanging process, a portion of air flows generated by the blades 422 flow in the air flow paths 240 along a lengthwise direction of the body 22, simultaneously, another portion of air flow congregates and flows in the aperture 200 along the axial direction of the body 22. By the two approaches, the air flow exchanges heat with the fins 24 and the inner surface of the body 22 of the heat sink 20 to take away the heat.
  • In assembly, the heat pipe assembly 30 is soldered to the outer surface of the body 22 of the heat sink 20. An assembly of the heat sink 20 and the heat pipe assembly 30 is mounted on the base 10 by soldering the heat pipe assembly 30 to the top surface 12 of the base 10. The fan 40 is mounted to the side of the body 22 of the heat sink 20 by a number of bolts.
  • Referring to FIG. 3, a heat dissipation device in accordance with a second embodiment is illustrated. The heat dissipation device of the second embodiment has a structure similar to the heat dissipation device of the first embodiment, differing only in that configuration of a heat pipe is different from that of the heat pipe assembly 30. The heat pipe includes a number of parallel straight heat pipes 300 disposed on the outer surface of the body 22 and surround the body 22. The straight heat pipes 300 are parallel to the axis of the body 22. Adjacent heat pipes 300 can be spaced from or adjoin each other.
  • Referring to FIG. 4 and FIG. 5, a heat dissipation device in accordance with a third embodiment is illustrated. The heat dissipation device has a structure similar to the heat dissipation device of the first embodiment, differing only in that the heat conducting base 10 is omitted. The body 22 (shown in FIG. 1) of the heat sink 20 includes a first side surface thermally contacting a heat generating device 120 and a second side surface opposite to the first side surface. Each of the fins 24 (shown in FIG. 1) has a flat surface coplanar with the second side surface of the body 22. The body 22 is directly mounted to a printed circuit board 110 supporting a heat generating device 120 thereon by a plurality of blots 130. The body 22 defines a plurality of threaded holes 221, and the printed circuit board 110 defines a plurality of through holes 111 corresponding to the threaded holes 221. The blots 130 extend through the second threaded holes 111 of the printed circuit board 110 and are threaded in the first threaded holes 221 of the body 22 to fasten the body 22 to the printed circuit board 110, thereby the flat surface of the fins 24 thermally contacting the heat generating device 120. It is understood that the flat surface cooperatively formed by all of the fins 24 can be concave or convex relative to the first side surface of the body 22, so long as the flat surface of the fins 24 easily and tightly thermally combines with the heat generating device 120. The fan 40 is fixed to the second first side surface of the body 22.
  • Regarding the heat dissipation device of the illustrated embodiment, the helical heat pipe assembly 30 surrounds the outer surface of the body 22 of the heat sink 20 and thermally contact the heat conducting base 10. Thus a large contacting area is obtained between the helical heat pipe assembly 30 and the body 22 of the heat sink 20, thereby a large heat exchange area between the heat pipe assembly 30 and the body 22 of the heat sink 20 being obtained. The fins 24 positioned in side of the body 22 define a number of air flow paths 240 to allow the air flow generated by the fan 40 flowing therethrough and takes away the heat of the heat sink 20.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the apparatus and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (17)

1. A heat dissipation device comprising:
a heat sink comprising a hollow cylindrical body and a plurality of fins extending inwardly from an inner surface of the body to an axis of the body; and
a helical heat pipe assembly wrapped on an outer surface of the body and helically extending along the axial direction of the body.
2. The heat dissipation device of claim 1, wherein the fins each have a first end connected to the inner surface of the body and a terminal second end opposite to the first end, and wherein the second ends of the fins cooperatively define an aperture.
3. The heat dissipation device of claim 2, wherein the second ends of the fins are spaced from each other.
4. The heat dissipation device of claim 3, wherein the fins define a plurality of air flow path communicating with the aperture.
5. The heat dissipation device of claim 4, wherein the helical heat pipe assembly is obtained by curving at least one heat pipe.
6. The heat dissipation device of claim 5, wherein the helical heat pipe assembly comprises multi-turns wrapping the outer surface of the body of the heat sink, and wherein the multi-turns are spaced from each other.
7. The heat dissipation device of claim 6, wherein the helical heat pipe assembly is formed by curving a first, second and third heat pipes, and adjacent turns of the first heat pipe are spaced by the second heat pipe and the third heat pipe.
8. The heat dissipation device of claim 7, wherein the outer surface of the body of the heat sink defines a helical groove to receive the helical heat pipe assembly therein.
9. The heat dissipation device of claim 8, wherein the helical heat pipe assembly is partially or wholly embedded in the groove of the body of the heat sink.
10. The heat dissipation device of claim 4, wherein the heat dissipation device further comprises a fan comprising a frame and a blade module fixed to the frame, the blade module comprises a shaft and several blades extending outwardly from the shaft, the frame is mounted to a first side surface of the body with the shaft corresponding to the aperture and the blades corresponding to the air flow paths.
11. The heat dissipation device of claim 10, wherein the body of the heat sink comprises a second side surface opposite to the first side surface, the second side surface is configured for thermally contacting a heat generating device.
12. The heat dissipation device of claim 10, wherein the heat dissipation device further comprises a heat conducting base having a bottom surface for thermally contacting a heat generating device and a top surface thermally connecting with the helical heat pipe assembly.
13. A heat dissipation device comprising:
a heat sink comprising a tubular, cylindrical body and a plurality of fins extending inwardly from an inner surface of the body to an axis of the body, the fins each having a free end unconnected to the inner surface of the body, the free ends of the fins cooperatively defining an aperture communicating with two side surfaces of the body;
a plurality heat pipes disposed on an outer surface of the body and surrounding the outer surface of the body;
a fan mounted to one of the two side surfaces of the body.
14. The heat dissipation device of claim 13, wherein the fins define a plurality of air flow paths communicating with the aperture.
15. The heat dissipation device of claim 14, wherein the plurality heat pipes constructs a helical structure wrapping the outer surface of the body and helically extending a long an axial direction of the body.
16. The heat dissipation device of claim 15, wherein the helical structure is formed by curving a first, second and third heat pipes and comprises a plurality of spaced turns wrapping the outer surface of the body, and wherein adjacent turns of the first heat pipe are spaced by the second heat pipe and the third heat pipe.
17. The heat dissipation device of claim 14, wherein the heat pipes are parallel straight heat pipes disposed on a circumference of the outer surface of the body and extend along an axial direction of the body.
US12/463,348 2008-12-11 2009-05-08 Heat dissipation device with heat pipe Abandoned US20100147496A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2008103061834A CN101754658B (en) 2008-12-11 2008-12-11 Radiating device
CN200810306183.4 2008-12-11

Publications (1)

Publication Number Publication Date
US20100147496A1 true US20100147496A1 (en) 2010-06-17

Family

ID=42239142

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/463,348 Abandoned US20100147496A1 (en) 2008-12-11 2009-05-08 Heat dissipation device with heat pipe

Country Status (2)

Country Link
US (1) US20100147496A1 (en)
CN (1) CN101754658B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140055418A (en) * 2012-10-31 2014-05-09 코웨이 주식회사 Cooling device and cold water storage of water treatment apparatus
US20160290689A1 (en) * 2015-04-01 2016-10-06 Samsung Electronics Co., Ltd. Refrigerator and heat exchanger used therein
CN107062730A (en) * 2017-01-13 2017-08-18 北京热刺激光技术有限责任公司 Air-cooled water cooling machine
US9939859B2 (en) 2016-03-17 2018-04-10 Google Llc Electronic device with a cooling structure
WO2018113374A1 (en) * 2016-12-20 2018-06-28 刘龙芳 Helical line-shaped heat dissipation device
US20210210290A1 (en) * 2018-07-13 2021-07-08 Abb Schweiz Ag Heat sink for a high voltage switchgear
KR102595307B1 (en) * 2023-04-03 2023-10-30 주식회사 삼정이엔씨 Heat exchanger for hydrogen liquefied

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104613443B (en) * 2015-02-03 2018-01-30 东莞市闻誉实业有限公司 Radiator with guide vane
CN113441700A (en) * 2021-07-30 2021-09-28 上海睿昇半导体科技有限公司 Cooling water jacket and processing method thereof
CN114673972B (en) * 2022-05-31 2022-08-30 徐连城 Heat abstractor and fishing lamp

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3100969A (en) * 1960-08-03 1963-08-20 Thore M Elfving Thermoelectric refrigeration
US5533362A (en) * 1990-02-09 1996-07-09 Columbia Gas Of Ohio, Inc. Heat transfer apparatus for heat pumps
US5572885A (en) * 1995-06-06 1996-11-12 Erickson; Donald C. Shrouded coiled crested tube diabatic mass exchanger
US6233146B1 (en) * 1999-07-28 2001-05-15 Dell Usa, L.P. Rotatable portable computer remote heat exchanger with heat pipe
US6315033B1 (en) * 2000-05-22 2001-11-13 Jia Hao Li Heat dissipating conduit
US6640883B2 (en) * 2002-02-14 2003-11-04 Glacialtech Inc. Computer heat sink
US20040226690A1 (en) * 2003-04-23 2004-11-18 Lee Hsieh Kun Tubular heat dissipation device
US6992890B2 (en) * 2004-05-31 2006-01-31 Glacialtech, Inc. Heat sink
US20060185821A1 (en) * 2005-02-24 2006-08-24 Comp Take Technology Co., Ltd. Thermal dissipation device
US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US7163050B2 (en) * 2004-09-17 2007-01-16 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US7312994B2 (en) * 2005-01-19 2007-12-25 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with a heat pipe
US7322404B2 (en) * 2004-02-18 2008-01-29 Renewability Energy Inc. Helical coil-on-tube heat exchanger
US20080142194A1 (en) * 2006-12-13 2008-06-19 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US7597136B2 (en) * 2003-01-31 2009-10-06 Energy Saving Concepts Limited Heat exchanger with helical flow paths
US8096136B2 (en) * 2008-06-20 2012-01-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100341144C (en) * 2002-11-26 2007-10-03 诺亚公司 Central type flow guiding heat radiation device
US7129731B2 (en) * 2003-09-02 2006-10-31 Thermal Corp. Heat pipe with chilled liquid condenser system for burn-in testing
CN100562232C (en) * 2005-09-14 2009-11-18 富准精密工业(深圳)有限公司 Heat-pipe radiating apparatus

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3100969A (en) * 1960-08-03 1963-08-20 Thore M Elfving Thermoelectric refrigeration
US5533362A (en) * 1990-02-09 1996-07-09 Columbia Gas Of Ohio, Inc. Heat transfer apparatus for heat pumps
US5572885A (en) * 1995-06-06 1996-11-12 Erickson; Donald C. Shrouded coiled crested tube diabatic mass exchanger
US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US6233146B1 (en) * 1999-07-28 2001-05-15 Dell Usa, L.P. Rotatable portable computer remote heat exchanger with heat pipe
US6315033B1 (en) * 2000-05-22 2001-11-13 Jia Hao Li Heat dissipating conduit
US6640883B2 (en) * 2002-02-14 2003-11-04 Glacialtech Inc. Computer heat sink
US7597136B2 (en) * 2003-01-31 2009-10-06 Energy Saving Concepts Limited Heat exchanger with helical flow paths
US20040226690A1 (en) * 2003-04-23 2004-11-18 Lee Hsieh Kun Tubular heat dissipation device
US6988536B2 (en) * 2003-04-23 2006-01-24 Hon Hai Precision Ind. Co., Ltd Tubular heat dissipation device
US7322404B2 (en) * 2004-02-18 2008-01-29 Renewability Energy Inc. Helical coil-on-tube heat exchanger
US6992890B2 (en) * 2004-05-31 2006-01-31 Glacialtech, Inc. Heat sink
US7163050B2 (en) * 2004-09-17 2007-01-16 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US7312994B2 (en) * 2005-01-19 2007-12-25 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device with a heat pipe
US20060185821A1 (en) * 2005-02-24 2006-08-24 Comp Take Technology Co., Ltd. Thermal dissipation device
US20080142194A1 (en) * 2006-12-13 2008-06-19 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US7870889B2 (en) * 2006-12-13 2011-01-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe
US8096136B2 (en) * 2008-06-20 2012-01-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140055418A (en) * 2012-10-31 2014-05-09 코웨이 주식회사 Cooling device and cold water storage of water treatment apparatus
KR102037682B1 (en) 2012-10-31 2019-10-29 웅진코웨이 주식회사 Cooling device and cold water storage of water treatment apparatus
US20160290689A1 (en) * 2015-04-01 2016-10-06 Samsung Electronics Co., Ltd. Refrigerator and heat exchanger used therein
US9939859B2 (en) 2016-03-17 2018-04-10 Google Llc Electronic device with a cooling structure
US10656689B2 (en) 2016-03-17 2020-05-19 Google Llc Electronic device with a cooling structure
WO2018113374A1 (en) * 2016-12-20 2018-06-28 刘龙芳 Helical line-shaped heat dissipation device
CN107062730A (en) * 2017-01-13 2017-08-18 北京热刺激光技术有限责任公司 Air-cooled water cooling machine
US20210210290A1 (en) * 2018-07-13 2021-07-08 Abb Schweiz Ag Heat sink for a high voltage switchgear
US11521807B2 (en) * 2018-07-13 2022-12-06 Abb Schweiz Ag Heat sink for a high voltage switchgear
KR102595307B1 (en) * 2023-04-03 2023-10-30 주식회사 삼정이엔씨 Heat exchanger for hydrogen liquefied

Also Published As

Publication number Publication date
CN101754658B (en) 2013-06-05
CN101754658A (en) 2010-06-23

Similar Documents

Publication Publication Date Title
US20100147496A1 (en) Heat dissipation device with heat pipe
US4204246A (en) Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
US7440279B2 (en) Heat dissipation device
US4120019A (en) Apparatus for cooling electrical components
US7509996B2 (en) Heat dissipation device
CN100456461C (en) Heat sink of heat pipe
US20040163798A1 (en) Compact thermosiphon for dissipating heat generated by electronic components
US20090194255A1 (en) Cooler device
US7487825B2 (en) Heat dissipation device
US20090314471A1 (en) Heat pipe type heat sink and method of manufacturing the same
US20110265976A1 (en) Heat dissipation device with heat pipe
US20090151899A1 (en) Cooling apparatus
US8579016B2 (en) Heat dissipation device with heat pipe
US6397931B1 (en) Finned heat exchanger
US20080289799A1 (en) Heat dissipation device with a heat pipe
US7672131B2 (en) Heat sink assembly and method manufacturing the same
US7969737B2 (en) Heat dissipation apparatus
US10378836B2 (en) Water-cooling radiator assembly
JP4728522B2 (en) heatsink
CN101415312A (en) Radiating device
CN101039567B (en) Spring plate fixing structure and heat radiation module having the same
CN101115368A (en) Heat radiating device
TWI686130B (en) Cooling module
US20100051231A1 (en) Heat dissipation apparatus having a heat pipe inserted therein
JP2001251079A (en) Method for producing heat sink using heat pipe and method for producing heat pipe

Legal Events

Date Code Title Description
AS Assignment

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,C

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, PENG;REEL/FRAME:022661/0336

Effective date: 20090429

Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, PENG;REEL/FRAME:022661/0336

Effective date: 20090429

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION