US20090046433A1 - Heat sink for led lamp - Google Patents
Heat sink for led lamp Download PDFInfo
- Publication number
- US20090046433A1 US20090046433A1 US11/870,116 US87011607A US2009046433A1 US 20090046433 A1 US20090046433 A1 US 20090046433A1 US 87011607 A US87011607 A US 87011607A US 2009046433 A1 US2009046433 A1 US 2009046433A1
- Authority
- US
- United States
- Prior art keywords
- heat
- fins
- dissipation device
- short
- walls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
- F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
Definitions
- the present invention relates generally to a heat sink, and more particularly to a heat sink used for an LED lamp.
- LEDs have been widely used in the field of illumination due to their small size and high efficiency. It is well known that an LED lamp with LEDs arranged side-by-side in large density generates a lot of heat when it emits light. If the heat cannot be quickly removed, the LED lamp may become overheated, significantly reducing work efficiency and service life thereof.
- a conventional heat sink which is used to absorb heat of the LED device is shown in U.S. Pat. No. 6,517,218.
- the heat of the LED device is transferred to a base of a heat dissipater at first, and then is dissipated to ambient air in a natural convection manner by fins of the heat dissipater.
- the conventional heat sink always has a great size in order to achieve a large amount of heat dissipation area.
- a heat dissipation device is used for dissipating heat generated by a plurality of LEDs mounted on a circuit board.
- the heat dissipation device comprises two heat sinks mounted on the circuit board via a heat spreader, whereby heat generated by the LEDs is received by the heat sinks via the heat spreader.
- Each of the two heat sinks comprises a plurality of fins stacked together.
- a plurality of short walls are formed at two opposite lateral sides of the two heat sinks.
- a plurality of openings adjacent to bottoms of the two heat sinks are formed between the short walls and the bottoms of the two heat sinks.
- a plurality of cavities are vertically defined in the two heat sinks and communicate with the openings, respectively, whereby an airflow can flow into the cavities via the openings.
- the cavities in the two heat sinks are alternately arranged.
- FIG. 1 is an exploded, isometric view of an LED device including a heat dissipation device and LEDs in accordance with a preferred embodiment of the present invention
- FIG. 2 is one of two heat sinks of the heat dissipation device in FIG. 1 ;
- FIG. 3 is an assembled view of FIG. 1 .
- the LED device comprises an LED module 10 used for emitting light, a heat dissipation device 40 for dissipating heat generated by the LED module 10 .
- the LED module 10 comprises a rectangular circuit board 12 and a plurality of LEDs 15 .
- the LEDs 15 are evenly spaced and electrically mounted on a bottom surface (not labeled) of the circuit board 12 .
- the heat dissipation device 40 comprises a heat spreader 20 and two heat sinks 30 mounted on the heat spreader 20 .
- the heat spreader 20 is rectangular and made of metal such as aluminum, copper or alloy thereof, which has a good thermal conductivity.
- the LED module 10 is attached to a bottom portion 220 of the heat spreader 20 .
- the two heat sinks 30 are attached to a top portion 222 of the heat spreader 20 .
- each of the heat sinks 30 is formed by folding a metal sheet, such as an aluminum or a copper sheet.
- the heat sink 30 comprises a plurality of bended fins 300 stacked together.
- Each of the fins 300 is L-shaped and comprises a vertical long plate 310 and a horizontal short plate 320 .
- the short plate 320 perpendicularly extends from a bottom edge of the long plate 310 .
- the short plate 320 abuts against the bottom edge of the long plate 310 of an adjacent fin 300 .
- a plurality of evenly spaced short walls 350 are formed at a lateral side of the heat sink 30 and a plurality of evenly spaced long walls 352 are formed at an opposite lateral side of the heat sink 30 .
- the short walls 350 and the long walls 352 are arranged in an alternative fashion. Two adjacent fins 300 are connected with each other by the short walls 350 or the long walls 352 extending from side edges of the long plates 310 .
- the short walls 350 are distributed on an upper portion of the lateral side of the heat sink 30 .
- Each of the short walls 350 has a height L that is shorter than a height H of the long plate 310 .
- a plurality of rectangular openings 330 are formed below the short walls 350 in the lateral side of the heat sink 30 . Each of the openings 330 is enclosed by a bottom edge of a corresponding short wall 350 , lower portions of side edges of two corresponding adjacent long plates 310 and a side edge of a corresponding short plate 320 .
- Each of the long walls 352 has a same height with that of the long plate 310 .
- the two heat sinks 30 are mounted to the heat spreader 20 and parallel to each other.
- the short walls 350 of the two heat sinks 30 are positioned distant from each other and located at two opposite lateral sides of the two heat sinks 30 , while the long walls 352 are positioned close to each other.
- the short plates 320 of the two heat sinks 30 are attached to the top portion 222 of the heat spreader 20 by soldering.
- the long plates 310 of the heat sinks 30 are perpendicularly to the top portion 222 of the heat spreader 20 .
- the long walls 352 of one of the two heat sinks 30 alternatively connect with the long walls 352 of the other one of the two heat sinks 30 so that a continuing wall 370 is formed by the long walls 352 at a middle of the two heat sinks 30 .
- the short walls 350 of the one heat sink 30 are opposing to the long walls 352 of the other one of the heat sinks 30 ; thus, the short walls 350 cooperate with the long plates 310 , the short plates 320 and the long walls 352 to enclose a plurality of cavities 360 each of which is communicated with a corresponding opening 330 .
- heat generated by the LED module 10 is firstly absorbed by the heat spreader 20 ; then, the heat is conveyed to bottom portions 380 of the two heat sinks 30 , which are constructed by the short plates 320 of the fins 300 .
- Ambient airflow around the heat sinks 30 flow into the cavities 360 through the openings 330 and reach the bottom portions 380 of the two heat sinks 30 substantially where a large amount of heat accumulates.
- the airflow exchanges heat with the bottom portions 380 and becomes heated.
- the heated airflow floats upwardly and is guided to ambient above the two heat sinks 30 by the cavities 360 . It is obvious that heat-dissipation efficiency of the two heat sinks 30 having the short walls 350 is enhanced, when compared with the one without the short walls 350 .
- the heat sinks 30 enable more air to flow into the bottom portions 380 and substantially exchange heat with the fins 300 ; thus, the heat accumulating in the bottom portions 380 can be taken away to surrounding environment by the air more quickly and efficiently.
- the height L of the short wall 350 is determined by the height H of the heat sink 30 in order to optimize the heat dissipating efficiency of the heat dissipation device 40 .
Abstract
Description
- 1. Field of the Invention
- The present invention relates generally to a heat sink, and more particularly to a heat sink used for an LED lamp.
- 2. Description of Related Art
- With the continuing development of scientific technology and the raise of people's consciousness of energy saving, LEDs have been widely used in the field of illumination due to their small size and high efficiency. It is well known that an LED lamp with LEDs arranged side-by-side in large density generates a lot of heat when it emits light. If the heat cannot be quickly removed, the LED lamp may become overheated, significantly reducing work efficiency and service life thereof.
- A conventional heat sink which is used to absorb heat of the LED device is shown in U.S. Pat. No. 6,517,218. The heat of the LED device is transferred to a base of a heat dissipater at first, and then is dissipated to ambient air in a natural convection manner by fins of the heat dissipater. However, it is difficult to dissipate a large amount of heat accumulating in a bottom portion between the base and the fins, because airflow can not substantially flow through the bottom portion in the natural convection manner. Moreover, the conventional heat sink always has a great size in order to achieve a large amount of heat dissipation area.
- What is needed, therefore, is a heat sink used in an LED device which has an improved heat dissipation efficiency.
- A heat dissipation device is used for dissipating heat generated by a plurality of LEDs mounted on a circuit board. The heat dissipation device comprises two heat sinks mounted on the circuit board via a heat spreader, whereby heat generated by the LEDs is received by the heat sinks via the heat spreader. Each of the two heat sinks comprises a plurality of fins stacked together. A plurality of short walls are formed at two opposite lateral sides of the two heat sinks. A plurality of openings adjacent to bottoms of the two heat sinks are formed between the short walls and the bottoms of the two heat sinks. A plurality of cavities are vertically defined in the two heat sinks and communicate with the openings, respectively, whereby an airflow can flow into the cavities via the openings. The cavities in the two heat sinks are alternately arranged.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
- Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of an LED device including a heat dissipation device and LEDs in accordance with a preferred embodiment of the present invention; -
FIG. 2 is one of two heat sinks of the heat dissipation device inFIG. 1 ; and -
FIG. 3 is an assembled view ofFIG. 1 . - Referring to
FIG. 1 , an LED device in accordance with a preferred embodiment of the present invention adapted for a lighting purpose is shown. The LED device comprises anLED module 10 used for emitting light, aheat dissipation device 40 for dissipating heat generated by theLED module 10. TheLED module 10 comprises arectangular circuit board 12 and a plurality ofLEDs 15. TheLEDs 15 are evenly spaced and electrically mounted on a bottom surface (not labeled) of thecircuit board 12. Theheat dissipation device 40 comprises aheat spreader 20 and twoheat sinks 30 mounted on theheat spreader 20. - The
heat spreader 20 is rectangular and made of metal such as aluminum, copper or alloy thereof, which has a good thermal conductivity. TheLED module 10 is attached to abottom portion 220 of theheat spreader 20. The twoheat sinks 30 are attached to atop portion 222 of theheat spreader 20. - Referring to
FIG. 2 , each of theheat sinks 30 is formed by folding a metal sheet, such as an aluminum or a copper sheet. Theheat sink 30 comprises a plurality ofbended fins 300 stacked together. Each of thefins 300 is L-shaped and comprises a verticallong plate 310 and a horizontalshort plate 320. Theshort plate 320 perpendicularly extends from a bottom edge of thelong plate 310. Theshort plate 320 abuts against the bottom edge of thelong plate 310 of anadjacent fin 300. A plurality of evenly spacedshort walls 350 are formed at a lateral side of theheat sink 30 and a plurality of evenly spacedlong walls 352 are formed at an opposite lateral side of theheat sink 30. Theshort walls 350 and thelong walls 352 are arranged in an alternative fashion. Twoadjacent fins 300 are connected with each other by theshort walls 350 or thelong walls 352 extending from side edges of thelong plates 310. Theshort walls 350 are distributed on an upper portion of the lateral side of theheat sink 30. Each of theshort walls 350 has a height L that is shorter than a height H of thelong plate 310. A plurality ofrectangular openings 330 are formed below theshort walls 350 in the lateral side of theheat sink 30. Each of theopenings 330 is enclosed by a bottom edge of a correspondingshort wall 350, lower portions of side edges of two corresponding adjacentlong plates 310 and a side edge of a correspondingshort plate 320. Each of thelong walls 352 has a same height with that of thelong plate 310. - Referring to
FIG. 3 , the twoheat sinks 30 are mounted to theheat spreader 20 and parallel to each other. Theshort walls 350 of the twoheat sinks 30 are positioned distant from each other and located at two opposite lateral sides of the twoheat sinks 30, while thelong walls 352 are positioned close to each other. Theshort plates 320 of the twoheat sinks 30 are attached to thetop portion 222 of theheat spreader 20 by soldering. Thelong plates 310 of theheat sinks 30 are perpendicularly to thetop portion 222 of theheat spreader 20. Thelong walls 352 of one of the two heat sinks 30 alternatively connect with thelong walls 352 of the other one of the twoheat sinks 30 so that a continuingwall 370 is formed by thelong walls 352 at a middle of the twoheat sinks 30. Theshort walls 350 of the oneheat sink 30 are opposing to thelong walls 352 of the other one of theheat sinks 30; thus, theshort walls 350 cooperate with thelong plates 310, theshort plates 320 and thelong walls 352 to enclose a plurality ofcavities 360 each of which is communicated with acorresponding opening 330. - In use, heat generated by the
LED module 10 is firstly absorbed by theheat spreader 20; then, the heat is conveyed tobottom portions 380 of the twoheat sinks 30, which are constructed by theshort plates 320 of thefins 300. Ambient airflow around the heat sinks 30 flow into thecavities 360 through theopenings 330 and reach thebottom portions 380 of the two heat sinks 30 substantially where a large amount of heat accumulates. The airflow exchanges heat with thebottom portions 380 and becomes heated. The heated airflow floats upwardly and is guided to ambient above the twoheat sinks 30 by thecavities 360. It is obvious that heat-dissipation efficiency of the two heat sinks 30 having theshort walls 350 is enhanced, when compared with the one without theshort walls 350. The heat sinks 30 enable more air to flow into thebottom portions 380 and substantially exchange heat with thefins 300; thus, the heat accumulating in thebottom portions 380 can be taken away to surrounding environment by the air more quickly and efficiently. The height L of theshort wall 350 is determined by the height H of theheat sink 30 in order to optimize the heat dissipating efficiency of theheat dissipation device 40. - It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (17)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710076401.5 | 2007-08-17 | ||
CN2007100764015A CN101368713B (en) | 2007-08-17 | 2007-08-17 | Heat radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
US7492599B1 US7492599B1 (en) | 2009-02-17 |
US20090046433A1 true US20090046433A1 (en) | 2009-02-19 |
Family
ID=40349346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/870,116 Expired - Fee Related US7492599B1 (en) | 2007-08-17 | 2007-10-10 | Heat sink for LED lamp |
Country Status (2)
Country | Link |
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US (1) | US7492599B1 (en) |
CN (1) | CN101368713B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100177519A1 (en) * | 2006-01-23 | 2010-07-15 | Schlitz Daniel J | Electro-hydrodynamic gas flow led cooling system |
TWI391609B (en) * | 2009-09-28 | 2013-04-01 | Yu Nung Shen | Light emitting diode lighting device |
US20130207542A1 (en) * | 2012-01-26 | 2013-08-15 | Aps Japan Co., Ltd. | Lighting device |
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DE102007054856A1 (en) * | 2007-11-16 | 2009-05-20 | Osram Gesellschaft mit beschränkter Haftung | Lighting device with a substrate plate and a heat sink |
CN101487583B (en) * | 2008-01-16 | 2010-09-29 | 富士迈半导体精密工业(上海)有限公司 | Illuminating apparatus |
TW201005213A (en) * | 2008-07-24 | 2010-02-01 | Advanced Optoelectronic Tech | Passive heat sink and LED illumination device using the same |
US20100046168A1 (en) * | 2008-08-21 | 2010-02-25 | Green Lighting, Inc. | Heat dissipating device |
WO2011043390A1 (en) * | 2009-10-09 | 2011-04-14 | Apsジャパン株式会社 | Lighting device |
US20110232877A1 (en) * | 2010-03-23 | 2011-09-29 | Celsia Technologies Taiwan, Inc. | Compact vapor chamber and heat-dissipating module having the same |
CN102022650B (en) * | 2010-12-08 | 2012-10-03 | 大连金三维科技有限公司 | Light-emitting diode (LED) lamp and LED lighting equipment |
CN102221146A (en) * | 2011-04-08 | 2011-10-19 | 田宝祥 | High condition and heat dissipation light-emitting device and manufacturing method thereof |
CN102770003B (en) * | 2011-05-06 | 2016-09-07 | 富瑞精密组件(昆山)有限公司 | Heat abstractor |
US8740421B2 (en) | 2011-06-14 | 2014-06-03 | Litelab Corp. | Luminaire with enhanced thermal dissipation characteristics |
US8995131B2 (en) | 2011-08-29 | 2015-03-31 | Aerovironment, Inc. | Heat transfer system for aircraft structures |
US9756764B2 (en) | 2011-08-29 | 2017-09-05 | Aerovironment, Inc. | Thermal management system for an aircraft avionics bay |
US9184108B2 (en) * | 2011-12-08 | 2015-11-10 | Oracle International Corporation | Heat dissipation structure for an integrated circuit (IC) chip |
TWM431348U (en) * | 2012-01-20 | 2012-06-11 | Ceramate Technical Co Ltd | Heat dissipation body structure with thermal conduction, thermal convection and thermal radiation |
CN104176281A (en) * | 2014-08-15 | 2014-12-03 | 北京卫星环境工程研究所 | Runner-type stainless steel expanding board heat sink |
FR3025293B1 (en) * | 2014-08-29 | 2021-02-19 | Valeo Vision | COOLING UNIT FOR LIGHTING AND / OR SIGNALING SYSTEMS |
CN104235654B (en) * | 2014-09-19 | 2017-02-01 | 浙江宏恩智能装备技术有限公司 | Radiating LED (light-emitting diode) lamp |
CZ2014761A3 (en) * | 2014-11-06 | 2016-01-06 | Varroc Lighting Systems, s.r.o. | Light source |
FR3041080B1 (en) * | 2015-09-14 | 2020-05-29 | Valeo Vision | THERMAL DISSIPATION DEVICE FOR A LIGHT MODULE OF A MOTOR VEHICLE |
KR101794007B1 (en) * | 2016-04-06 | 2017-11-07 | (주)휴맥스 | Eradiation module assembly and set top box having the same |
JP2017195514A (en) * | 2016-04-20 | 2017-10-26 | キヤノン株式会社 | Head mount device and gripping device |
CN106322332A (en) * | 2016-09-04 | 2017-01-11 | 芜湖纯元光电设备技术有限公司 | Heat dissipating device for lighting system of curing machine |
EP3376837A1 (en) * | 2017-03-17 | 2018-09-19 | Valeo Iluminacion | Lighting module with heat dissipation means on pcb and method for producing thereof |
JP7139684B2 (en) * | 2018-05-18 | 2022-09-21 | 富士通株式会社 | Cooling equipment and electronic equipment |
US10966335B2 (en) * | 2019-04-29 | 2021-03-30 | Semiconductor Components Industries, Llc | Fin frame assemblies |
CN112432086B (en) * | 2020-11-25 | 2022-06-17 | 浙江北光科技股份有限公司 | LED (light-emitting diode) down lamp |
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US4729076A (en) * | 1984-11-15 | 1988-03-01 | Tsuzawa Masami | Signal light unit having heat dissipating function |
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US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
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US20100177519A1 (en) * | 2006-01-23 | 2010-07-15 | Schlitz Daniel J | Electro-hydrodynamic gas flow led cooling system |
WO2010117813A2 (en) * | 2009-03-31 | 2010-10-14 | Ventiva, Inc. | Electro-hydrodynamic gas flow led cooling system |
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TWI391609B (en) * | 2009-09-28 | 2013-04-01 | Yu Nung Shen | Light emitting diode lighting device |
US20130207542A1 (en) * | 2012-01-26 | 2013-08-15 | Aps Japan Co., Ltd. | Lighting device |
US10151468B2 (en) * | 2012-01-26 | 2018-12-11 | Aps Japan Co., Ltd. | Lighting device |
Also Published As
Publication number | Publication date |
---|---|
CN101368713A (en) | 2009-02-18 |
US7492599B1 (en) | 2009-02-17 |
CN101368713B (en) | 2010-11-10 |
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Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YU, GUANG;LAI, CHENG-TIEN;REEL/FRAME:019941/0277 Effective date: 20071008 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YU, GUANG;LAI, CHENG-TIEN;REEL/FRAME:019941/0277 Effective date: 20071008 |
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