US20080232052A1 - Plasma display device - Google Patents
Plasma display device Download PDFInfo
- Publication number
- US20080232052A1 US20080232052A1 US12/081,593 US8159308A US2008232052A1 US 20080232052 A1 US20080232052 A1 US 20080232052A1 US 8159308 A US8159308 A US 8159308A US 2008232052 A1 US2008232052 A1 US 2008232052A1
- Authority
- US
- United States
- Prior art keywords
- chassis base
- pdp
- reinforcing member
- plasma display
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/02—Details
- H01J17/16—Vessels; Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Abstract
A plasma display device includes: a Plasma Display Panel (PDP); a chassis base adapted to support the PDP attached to one surface thereof; a plurality of Integrated Circuit (IC) modules respectively included on driving circuit boards attached to another surface of the chassis base and adapted to control the PDP; and a reinforcing member arranged on the chassis base, one surface of each of the IC modules being in contact with the reinforcing member. The integrated circuit module is attached to the reinforcing member which reinforces the mechanical strength of the chassis base, so that a heat sink is not needed. The thickness of a plasma display device is thereby reduced and the appearance of the plasma display device is improved.
Description
- This application makes reference to, incorporates the same herein, and claims all benefits accruing under 35 U.S.C. §119 from an application for PLASMA DISPLAY DEVICE earlier filed in the Korean Intellectual Property Office on 11 Oct. 2004 and there duly assigned Serial No. 10-2004-0080872.
- 1. Field of the Invention
- The present invention relates to a plasma display device, and more particularly, to a plasma display device having a small thickness and an excellent appearance by bringing an integrated circuit module into contact with a reinforcing member to reinforce the mechanical strength of a chassis base.
- 2. Description of the Related Art
- A plasma display device includes a Plasma Display Panel (PDP) that displays images using a plasma generated by gas discharge, a chassis base that supports the PDP, and a plurality of driving circuit boards that are arranged on a surface of the chassis base opposite to the PDP and connected to display electrodes and address electrodes of the PDP via flexible printed circuits and connectors.
- Since the PDP is formed by bonding two glass substrates with a discharge space interposed therebetween, it has low mechanical impact strength. Therefore, in order to support the PDP, the chassis base is made of a metallic material having a high mechanical strength. The chassis base supports the driving circuit boards, acts as a heat sink of the PDP, and reduces ElectroMagnetic Interference (EMI), in addition to maintaining the mechanical strength of the PDP.
- In order for the chassis base to achieve the above-mentioned functions, the PDP is attached to a front surface of the chassis base with an adhesive interposed therebetween, and the driving circuit boards are attached to a rear surface of the chassis base. These driving circuit boards are attached by setscrews to a plurality of bosses formed on the rear surface of the chassis base.
- The driving circuit boards each have a hybrid circuit module and circuits for controlling display electrodes and address electrodes of the PDP. The hybrid circuit module generates a large amount of heat due to a high frequency switching operation. Therefore, the hybrid circuit module has a heat sink on one surface thereof to dissipate heat generated during the switching operation.
- However, since the heat sink does not have sufficient radiating ability to absorb and dissipate heat generated by the hybrid circuit module, it is necessary to increase a radiating area in order to improve radiation efficiency. However, the width and height of the heat sink increases, which results in an increase in the thickness of the plasma display device.
- An object of the present invention is to provide a plasma display device having a small thickness and excellent appearance by bringing an integrated circuit module into contact with a reinforcing member to reinforce the mechanical strength of a chassis base and to dissipate heat generated by the integrated circuit module without using a heat sink.
- According to one aspect of the present invention, a plasma display device is provided, the device including: a Plasma Display Panel (PDP); a chassis base adapted to support the PDP attached to one surface thereof, a plurality of Integrated Circuit (IC) modules respectively included on driving circuit boards attached to another surface of the chassis base and adapted to control the PDP; and a reinforcing member arranged on the chassis base, one surface of each of the IC modules being in contact with the reinforcing member.
- The IC modules preferably include hybrid IC modules.
- The IC modules preferably alternatively include intelligent power modules.
- Each driving circuit board preferably further includes a through hole therein.
- Each IC module is preferably attached to a side of the driving circuit board opposite to the chassis base and is preferably in contact with the reinforcing member exposed by the through hole.
- The plasma display device preferably further includes a thermal conductive material layer arranged between each IC module and the reinforcing member.
- The thermal conductive material layer preferably includes grease or a silicon sheet.
- The plasma display device preferably further comprising a plurality of radiating portions arranged on a side of the reinforcing member facing the chassis base.
- The IC module is preferably attached to a side of the driving circuit board facing the chassis base.
- The plasma display device preferably further includes a thermal conductive material layer arranged between the IC module and the reinforcing member.
- The plasma display device preferably further includes a plurality of radiating portions arranged on a side of the reinforcing member facing the chassis base.
- A more complete appreciation of the present invention, and many of the attendant advantages thereof, will be readily apparent as the present invention becomes better understood by references to the following detailed description when considered in conjunction with the accompanying drawings in which like reference symbols indicate the same or similar components, wherein:
-
FIG. 1 is an exploded perspective view of a plasma display device according to a first embodiment of the present invention; -
FIG. 2 is a cross-sectional view taken along the line II-II ofFIG. 1 ; -
FIG. 3 is a cross-sectional view of an integrated circuit module mounting portion of a PDP according to a second embodiment of the present invention; -
FIG. 4 a cross-sectional view of an integrated circuit module mounting portion of a PDP according to a third embodiment of the present invention; and -
FIG. 5 is a cross-sectional view of an integrated circuit module mounting portion of a PDP according to a fourth embodiment of the present invention. - Hereinafter, exemplary embodiments of the present invention are described with reference to the accompanying drawings.
-
FIG. 1 is an exploded perspective view of a plasma display device according to a first embodiment of the present invention. - The plasma display device includes a
PDP 11 for displaying images using a gas discharge, a radiatingsheet 13 that is provided at a rear surface of thePDP 11 to dissipate heat generated in the plane direction by the gas discharge of thePDP 11,driving circuit boards 15 electrically connected to thePDP 11 to drive the PDP 11 (electrical connections are not shown), and achassis base 17 to support thePDP 11 attached to its front surface and thedriving circuit boards 15 attached to its rear surface. - In the above-mentioned structure, the
PDP 11 displays an image using a gas discharge, and the present invention relates to the connecting relationship between thePDP 11 and other components. Therefore, a detailed description of thePDP 11 has been omitted herein. - The radiating
sheet 13 is provided at the rear surface of thePDP 11 to dissipate heat generated in the plane direction by the gas discharge of thePDP 11. The radiatingsheet 13 can be made of an acryl-based radiating material, a graphite-based radiating material, a metal-based radiating material, or a carbon nanotube-based radiating material. - The
chassis base 17 supports the rear surface of thePDP 11 with the radiatingsheet 13 interposed therebetween, and thedriving circuit boards 15 are attached to another surface of the chassis based 17 opposite to the PDP supporting surface. As shown inFIG. 2 , thedriving circuit boards 15 can be attached bysetscrews 19 tobosses 18 provided on thechassis base 17. In addition, thedriving circuit boards 15 each include various circuits and an integrated circuit module to control display electrodes (not shown) and address electrodes (not shown) of thePDP 11. In this embodiment, ahybrid circuit module 21 is used as an illustrative example of the integrated circuit module. However, an intelligent power module can be used as the integrated circuit module. In addition, a plurality of thehybrid circuit modules 21 can be used, but only onehybrid circuit module 21 is shown inFIG. 1 for the convenience of explanation. - Furthermore, the
PDP 11 is attached to one surface of thechassis base 17, and thedriving circuit boards 15 are attached to the other surface thereof, as shown inFIG. 2 . Therefore, a large load is applied to thechassis base 17. Thus, reinforcingmembers 23 are provided on thechassis base 17 to ensure sufficient mechanical strength to withstand the load. - One surface of the
hybrid circuit module 21 is attached to the reinforcingmember 23. As described above, the reinforcingmember 23 both reinforces the mechanical strength of thechassis base 17 and dissipates heat generated by thehybrid circuit module 21. That is, the reinforcingmember 23 having thehybrid circuit module 21 attached thereto dissipates heat generated by thehybrid circuit module 21 when electrodes corresponding to a reset period, a scanning period, and a holding period are selected and then proper pulse waveforms are supplied to the selected electrodes when thePDP 11 is driven. Thehybrid circuit module 21 is composed of a flat metal substrate (not shown) provided parallel to thedriving circuit board 15, a wiring pattern formed on the metal substrate with an insulating layer interposed therebetween, a plurality of elements formed in the wiring pattern, and a resin layer (not shown) covering the elements. - The
hybrid circuit module 21 can be mounted on the reinforcingmember 23 by various methods. Referring toFIG. 2 , athrough hole 15 a is provided in thedriving circuit board 15, and thehybrid circuit module 21 is provided opposite to thechassis base 17 with thethrough hole 15 a of the driving circuit board interposed therebetween. That is, thehybrid circuit module 21 provided on a side of thedriving circuit board 15 opposite to thechassis base 17 is attached to the reinforcingmember 23 passing through the throughhole 15 a. In other words, one surface of the reinforcingmember 23 is arranged in the throughhole 15 a, and thehybrid circuit module 21 is attached to the one surface of the reinforcing member passing through the throughhole 15 a. Various elements, including thehybrid circuit module 21, are attached to the side of thedriving circuit module 15 opposite to thechassis base 17, thereby forming a circuit for thedriving circuit board 15. - In this way, heat can be effectively dissipated from the reinforcing
member 23 and thechassis base 17 without separately providing a heat sink to dissipate heat generated by thehybrid circuit module 21. As a result, the thickness of the plasma display device of the present invention is reduced by a thickness corresponding to the height of the heat sink, and thus it is possible to improve the appearance of a plasma display device. - Furthermore, according to a second embodiment of the present invention, a thermal
conductive material layer 25 is provided between the reinforcingmember 23 and thehybrid circuit module 21, as shown inFIG. 3 . The thermalconductive material layer 25 prevents an air layer between the reinforcingmember 23 and thehybrid circuit module 21 to improve the thermal conductivity therebetween. The thermalconductive material layer 25 can be made of, for example, grease or a silicon sheet. - Furthermore, the reinforcing
member 23 has a plurality of radiatingportions 23 a provided on a side thereof facing thechassis base 17 to dissipate heat by thermal conduction a and convection b. - Third and fourth embodiments of
FIGS. 4 and 5 correspond to the first and second embodiments, respectively. In the third and fourth embodiments, a description of the same components as those in the first and second embodiments has been omitted, and only components different from those in the first and second embodiments are described. - As shown in
FIGS. 4 and 5 , thehybrid circuit module 21 can be arranged on a side of the drivingcircuit board 15 facing thechassis base 17, and then the reinforcingmember 23 can be attached thereto. The structures ofFIGS. 4 and 5 are respectively formed by mounting, on thechassis base 17, the drivingcircuit board 15, which is the same as that ofFIGS. 2 and 3 except that the throughhole 15 a is not provided, with thehybrid circuit module 21 facing thechassis base 17. Since these structures do not have the throughholes 15 a, it is possible to easily manufacture the drivingcircuit board 15. - Furthermore, the thermal
conductive material layer 25 can be provided between thehybrid circuit module 21 and the reinforcingmember 23, and the reinforcingmember 23 can have a plurality of radiatingportions 23 provided on a side thereof facing thechassis base 17. The thermalconductive material layer 25 of the fourth embodiment is arranged between the drivingcircuit board 15 and thechassis base 17, and the thermalconductive material layer 25 of the second embodiment is arranged on a side of the drivingcircuit board 15 opposite to thechassis base 17. In both cases, the thermal conductive material layers 25 have the same heat conduction effect. - Although exemplary embodiments of the present invention have been described herein, it is to be understood that the present invention is not limited to the above-mentioned embodiments, and that various changes and modifications can be made without departing from the scope and spirit of the invention as defined by the appended claims. In addition, it goes without saying that these modifications and changes are also included in the scope of the present invention.
- As described above, according to a plasma display device according to the present invention, a hybrid circuit module is mounted on a reinforcing member of a chassis base, so that heat generated from the hybrid circuit module is dissipated by convection occurring in the reinforcing member, and is also transmitted to the chassis base to be dissipated by the chassis base. Therefore, it is possible to improve the reliability of heat radiation by the hybrid circuit module. In addition, since a heat sink is not needed, the thickness of a plasma display device is reduced, which makes it possible to improve the appearance of the plasma display device.
Claims (4)
1-4. (canceled)
5. A plasma display device, comprising:
a Plasma Display Panel (PDP):
a chassis base adapted to support the PDP attached to one surface thereof;
a plurality of Integrated Circuit (IC) modules respectively included on driving circuit boards attached to another surface of the chassis base and adapted to control the PDP; and
a reinforcing member arranged between the chassis base and at least one of the IC modules, one surface of the at least one of the IC modules being in thermal contact with the reinforcing member;
wherein each driving circuit board further includes a through hole therein;
wherein each IC module is attached to a side of the driving circuit board opposite to the chassis base and is in contact with the reinforcing member exposed by the through hole; and
wherein the reinforcing member is a heat passage for transferring heat emitted by the IC modules to the chassis base.
6-10. (canceled)
11. A plasma display device, comprising:
a Plasma Display Panel (PDP);
a chassis base adapted to support the PDP attached to one surface thereof;
a plurality of Integrated Circuit (IC) modules respectively included on driving circuit boards attached to another surface of the chassis base and adapted to control the PDP; and
a reinforcing member arranged between the chassis base and at least one of the IC modules, one surface of the at least one of the IC modules being in thermal contact with the reinforcing member;
wherein the IC module is attached to a side of the driving circuit board facing the chassis base;
further includes a plurality of radiating portions arranged on a side of the reinforcing member facing the chassis base; and
wherein the reinforcing member is a heat passage for transferring heat emitted by the IC modules to the chassis base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/081,593 US20080232052A1 (en) | 2004-10-11 | 2008-04-17 | Plasma display device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-0080872 | 2004-10-11 | ||
KR1020040080872A KR100669327B1 (en) | 2004-10-11 | 2004-10-11 | A plasma display device |
US11/174,734 US7391616B2 (en) | 2004-10-11 | 2005-07-06 | Plasma display device |
US12/081,593 US20080232052A1 (en) | 2004-10-11 | 2008-04-17 | Plasma display device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/174,734 Continuation US7391616B2 (en) | 2004-10-11 | 2005-07-06 | Plasma display device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080232052A1 true US20080232052A1 (en) | 2008-09-25 |
Family
ID=36145001
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/174,734 Expired - Fee Related US7391616B2 (en) | 2004-10-11 | 2005-07-06 | Plasma display device |
US12/081,593 Abandoned US20080232052A1 (en) | 2004-10-11 | 2008-04-17 | Plasma display device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/174,734 Expired - Fee Related US7391616B2 (en) | 2004-10-11 | 2005-07-06 | Plasma display device |
Country Status (4)
Country | Link |
---|---|
US (2) | US7391616B2 (en) |
JP (1) | JP4206402B2 (en) |
KR (1) | KR100669327B1 (en) |
CN (1) | CN100489921C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070018577A1 (en) * | 2005-07-21 | 2007-01-25 | Tae-Sin Hwang | Plasma display device |
US20160227642A1 (en) * | 2015-01-30 | 2016-08-04 | e.solutions GmbH | Arrangement and method for electromagnetic shielding |
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KR100669327B1 (en) * | 2004-10-11 | 2007-01-15 | 삼성에스디아이 주식회사 | A plasma display device |
KR100670273B1 (en) * | 2005-01-18 | 2007-01-16 | 삼성에스디아이 주식회사 | Heat radiating assembly for plasma display apparatus and plasma display apparatus comprising the same |
KR100751327B1 (en) * | 2005-03-09 | 2007-08-22 | 삼성에스디아이 주식회사 | Chassis base assembly and the flat display device applying the same |
KR100709181B1 (en) * | 2005-04-26 | 2007-04-18 | 삼성에스디아이 주식회사 | Plasma display device |
JP2006339223A (en) * | 2005-05-31 | 2006-12-14 | Toshiba Tec Corp | Heat dissipation structure of cpu |
KR20060126317A (en) * | 2005-06-04 | 2006-12-07 | 삼성에스디아이 주식회사 | Plasma display panel |
KR100709197B1 (en) * | 2005-10-18 | 2007-04-18 | 삼성에스디아이 주식회사 | Plasma display device and strength member |
KR100807027B1 (en) * | 2006-10-13 | 2008-02-25 | 삼성에스디아이 주식회사 | Plasma display device |
KR20090036853A (en) * | 2007-10-10 | 2009-04-15 | 삼성에스디아이 주식회사 | Printed circuit board assembly and plasma display apparatus with the same |
KR20090123221A (en) * | 2008-05-27 | 2009-12-02 | 삼성에스디아이 주식회사 | Plasma display device |
CN102077262A (en) * | 2008-07-15 | 2011-05-25 | 夏普株式会社 | Reinforcement frame, component unit, and display |
US20100103622A1 (en) * | 2008-10-24 | 2010-04-29 | Keihin Corporation | Electronic control device |
CN102375514A (en) * | 2010-08-19 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | Electronic device |
KR101450950B1 (en) * | 2011-10-04 | 2014-10-16 | 엘지디스플레이 주식회사 | Driver package |
US9357677B2 (en) * | 2012-09-26 | 2016-05-31 | Panasonic Intellectual Property Management Co., Ltd. | Electronic device with efficient heat radiation structure for electronic components |
US10303227B2 (en) | 2013-02-27 | 2019-05-28 | Dell Products L.P. | Information handling system housing heat spreader |
JP6315919B2 (en) * | 2013-08-08 | 2018-04-25 | コイト電工株式会社 | Electronic component unit |
US10206310B2 (en) * | 2017-04-07 | 2019-02-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electronics assemblies incorporating three-dimensional heat flow structures |
US10470321B1 (en) * | 2017-12-22 | 2019-11-05 | Rockwell Collins, Inc. | Reinforced emissive display assembly |
KR20220045479A (en) * | 2020-10-05 | 2022-04-12 | 삼성전자주식회사 | Display apparatus |
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- 2005-07-06 US US11/174,734 patent/US7391616B2/en not_active Expired - Fee Related
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US20070018577A1 (en) * | 2005-07-21 | 2007-01-25 | Tae-Sin Hwang | Plasma display device |
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Also Published As
Publication number | Publication date |
---|---|
JP4206402B2 (en) | 2009-01-14 |
CN100489921C (en) | 2009-05-20 |
KR100669327B1 (en) | 2007-01-15 |
CN1760938A (en) | 2006-04-19 |
KR20060031906A (en) | 2006-04-14 |
US20060077619A1 (en) | 2006-04-13 |
JP2006113538A (en) | 2006-04-27 |
US7391616B2 (en) | 2008-06-24 |
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